CN108470708B - Wafer carrier, wafer cleaning system and method - Google Patents
Wafer carrier, wafer cleaning system and method Download PDFInfo
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- CN108470708B CN108470708B CN201810315961.XA CN201810315961A CN108470708B CN 108470708 B CN108470708 B CN 108470708B CN 201810315961 A CN201810315961 A CN 201810315961A CN 108470708 B CN108470708 B CN 108470708B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of semiconductors and discloses a wafer carrier, a wafer cleaning system and a wafer cleaning method, wherein the wafer carrier comprises a carrier body, and the carrier body is provided with a bearing surface and a fixing surface which are opposite; the bearing surface is used for bearing the wafer, and the fixing surface is used for fixing the carrier; the edge of the bearing surface is also provided with a plurality of first clamps for fixing the wafer. When the wafer is cleaned, the wafer can be fixed on the bearing surface of the carrier in advance, and then the fixing surface of the carrier is fixed in the cleaning cavity. In the cleaning process, the wafer can be firmly fixed on the carrier instead of being directly fixed in the cleaning cavity, so that the problem that the wafer is not firmly adsorbed due to the fact that the wafer is directly adsorbed in the cleaning cavity in the traditional mode to cause flying piece breakage is avoided, and the yield of the wafer is improved. And when the wafer is conveyed on the cleaning assembly line, the wafer can be fixed on the carrier, so that the safety of the wafer in the conveying process is ensured.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer carrier, a wafer cleaning system and a wafer cleaning method.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. As integrated circuit feature sizes move into the deep sub-micron regime, the cleanliness of the wafer surface required in integrated circuit wafer fabrication processes becomes increasingly critical. Therefore, wafer cleaning is a very important step in semiconductor manufacturing.
The conventional wafer cleaning process generally includes the following steps: directly grabbing the wafer by a manipulator and transmitting the wafer among units; when the wafer arrives at the cleaning unit, the wafer is directly adsorbed on the chuck in the cleaning cavity; and step three, further cleaning the wafer. In the process, due to the warping of the wafer, the wafer is easy to slide and break in the transmission process, and in the cleaning process, because the wafer is directly adsorbed on the chuck, the wafer is easy to break due to the fact that the wafer is not firmly adsorbed in the vacuum, and the yield of the product is affected.
Meanwhile, the existing single-wafer type cleaning equipment can only clean wafers with the conventional thickness, wherein the conventional thickness generally means that the thickness value is between 500 mu m and 1mm, and the cleaning specification requirements of wafers with the unconventional thickness (less than 500 mu m or more than 1mm) cannot be met. If the cleaning equipment with unmatched thickness specifications is used for cleaning, the possibility of wafer breakage in the cleaning cavity is obviously increased, and the wafer yield is greatly reduced.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is that in the prior art, the wafer is easy to break in the cleaning cavity.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
according to a first aspect, embodiments of the present invention provide a wafer carrier, including a carrier body having a carrying surface and a fixing surface opposite to the carrying surface; the bearing surface is used for bearing a wafer, and the fixing surface is used for fixing the carrier; the edge of the bearing surface is also provided with a plurality of first clamps for fixing the wafer.
Optionally, the first clamp comprises a retractable assembly that is retractable in the thickness direction of the wafer.
Optionally, the thickness value of the wafer is less than 500 μm, or more than 1mm, or between 500 μm and 1 mm.
Optionally, a plurality of second clamps and/or magnetic assemblies and/or vacuum adsorption assemblies for fixing the carrier body are arranged on the fixing surface.
According to a second aspect, an embodiment of the present invention provides a wafer cleaning system, including:
the storage unit is used for storing the wafer;
a carrier unit for storing the carrier;
the cleaning unit is used for cleaning the wafer loaded on the carrier, and the fixed surface is fixed on a chuck in the cleaning unit;
and the transmission unit is used for carrying the wafers to move among the storage unit, the carrier unit and the cleaning unit.
Optionally, the transmission unit comprises:
the manipulator is used for grabbing the wafer or the carrier;
and the driving unit is connected with the mechanical arm and used for driving the mechanical arm to move along the horizontal direction and the vertical direction.
Optionally, the wafer loader further comprises an alignment unit, wherein the alignment unit is used for aligning the wafer loaded on the carrier and detecting flatness.
According to a third aspect, an embodiment of the present invention provides a wafer cleaning method, including the following steps:
the wafer to be cleaned is transmitted from the storage unit to the carrier unit through the transmission unit, and the wafer is loaded on the carrier;
transmitting the wafer to a cleaning unit through the transmission unit;
fixing the fixed surface of the carrier on a chuck in the cleaning unit, and cleaning the wafer;
the cleaned wafer is transmitted to the carrier unit through the transmission unit, and the wafer is unloaded from the carrier;
and transmitting the wafer to the storage unit through the transmission unit.
Optionally, after the step of loading the wafer on the carrier, the method further includes:
and carrying out alignment and flatness detection on the wafer.
The technical scheme of the invention has the following advantages:
according to a first aspect, embodiments of the present invention provide a wafer carrier, wherein the carrying surface is used for carrying a wafer, and the fixing surface is used for fixing the carrier. When the wafer is cleaned, the wafer can be fixed on the bearing surface of the carrier in advance, and then the fixing surface of the carrier is fixed in the cleaning cavity. In the cleaning process, the wafer can be firmly fixed on the carrier instead of being directly fixed in the cleaning cavity, so that the problem that the wafer is not firmly adsorbed due to the fact that the wafer is directly adsorbed in the cleaning cavity in the traditional mode to cause flying piece breakage is avoided, and the yield of the wafer is improved. And when the wafer is conveyed on the cleaning assembly line, the wafer can be fixed on the carrier, so that the safety of the wafer in the conveying process is ensured. In addition, the edge of the bearing surface is provided with a plurality of first clamps for fixing the wafer, so that the firmness between the wafer and the bearing surface is ensured.
According to a first aspect, in the wafer carrier provided by the embodiments of the present invention, the first clamp includes a retractable component that can be retracted along the thickness direction of the wafer, that is, the retractable component can be retracted to a proper position according to the thickness of the wafer, so that the wafer carrier can meet the use requirements of wafers with various thicknesses, and breaks through the current situation that the current wafer cleaning equipment can only clean wafers with conventional thicknesses, thereby effectively enhancing the use compatibility of the wafer carrier and the cleaning equipment, and avoiding wafer breakage caused by the mismatch between the thickness of the wafer and the specification of the cleaning equipment.
According to a first aspect, in the wafer carrier provided in the embodiments of the present invention, the fixing surface is provided with a plurality of second clamps and/or magnetic assemblies and/or vacuum adsorption assemblies for fixing the carrier body, and the second clamps, the magnetic assemblies and the vacuum adsorption assemblies can be all arranged on the fixing surface to function as a fixing carrier.
According to a second aspect, a wafer cleaning system provided by an embodiment of the present invention includes a storage unit, a carrier unit, a cleaning unit, and a transmission unit. The wafer cleaning device comprises a storage unit, a carrier unit, a cleaning unit, a fixing surface and a transmission unit, wherein the storage unit is used for storing wafers, the carrier unit is used for storing carriers, the cleaning unit is used for cleaning the wafers loaded on the carriers, the fixing surface is fixed on a chuck in the cleaning unit, and the transmission unit is used for carrying the wafers to move among the storage unit, the carrier unit and the cleaning unit. The carrier unit is arranged to store the carrier, and a platform is provided for loading the wafer on the carrier, so that the wafer and the carrier form a whole after being loaded on the carrier, the wafer is transmitted to the cleaning unit through the transmission unit and is cleaned integrally, and therefore the safety of the wafer in the transmission process and the cleaning process is guaranteed, and the wafer is not prone to flying breakage.
According to a second aspect, the wafer cleaning system provided by the embodiments of the present invention includes a transmission unit including a robot and a driving unit, wherein the driving unit drives the robot to move in a horizontal direction and a vertical direction, and the robot is responsible for grabbing the wafer or the carrier. Therefore, the automation degree of the transmission unit is enhanced, the transmission efficiency is improved, and the high efficiency of wafer cleaning is further ensured.
According to a second aspect, the wafer cleaning system provided in the embodiments of the present invention further includes an alignment unit for performing alignment and flatness detection on the wafer loaded on the carrier, so as to further ensure that the wafer can be stably placed on the carrier, and enhance the usability of the wafer cleaning system.
According to a third aspect, in the wafer cleaning method provided by the embodiment of the present invention, first, the wafer to be cleaned is transferred from the storage unit to the carrier unit through the transmission unit, and the wafer is loaded on the carrier; then the wafer is transmitted to a cleaning unit through a transmission unit, and the fixed surface of the carrier is fixed on a chuck in the cleaning unit to clean the wafer; after cleaning, the cleaned wafer is transmitted to the carrier unit through the transmission unit, and the wafer is unloaded from the carrier; and finally, the wafer is transmitted to the storage unit through the transmission unit.
When cleaning operation is carried out, the wafer is not directly fixed on the chuck, but is loaded on the carrier firstly, and then the carrier is fixed on the chuck, namely the wafer and the carrier are cleaned as a whole, so that the problem that the wafer is not firmly adsorbed due to the fact that the wafer is directly adsorbed in the cleaning cavity in the traditional mode to cause flying piece breakage is avoided, and the yield of the wafer is improved. And when the wafer is transmitted on the production line, the wafer is also fixed on the carrier, so that the safety of the wafer in the transmission process is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a wafer carrier according to embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of another embodiment of a wafer carrier according to embodiment 1 of the present invention;
fig. 3 is a schematic structural diagram of a wafer cleaning system according to embodiment 2 of the present invention;
fig. 4 is a schematic structural diagram of another embodiment of a wafer cleaning system according to embodiment 2 of the present invention;
fig. 5 is a flowchart illustrating a wafer cleaning method according to embodiment 3 of the present invention;
reference numerals:
1-a carrier body; 11-a bearing surface; 12-a fixed surface; 13-a first clamp; 14-a second clamp; 2-a storage unit; 3-a carrier unit; 4-a cleaning unit; 5-a transmission unit; 6-aligning the unit.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1
An embodiment of the invention provides a wafer carrier, as shown in fig. 1, including a carrier body 1, the carrier body 1 having a carrying surface 11 and a fixing surface 12 opposite to each other; the bearing surface 11 is used for bearing a wafer, and the fixing surface 12 is used for fixing the carrier; the edge of the carrying surface 11 is further provided with a plurality of first clamps 13 for fixing the wafer. The bearing surface 11 and the fixing surface 12 are both smooth surfaces, and the size of the bearing surface 11 is adapted to the size of the wafer.
As an alternative, the carrying surface 11 may be sized to be not compatible with the size of the wafer, and the first clamp 13 may be disposed not at the edge of the carrying surface 11 but at the periphery of the area of the carrying surface 11 compatible with the size of the wafer, as long as the first clamp 13 is ensured to be able to clamp the wafer.
In this embodiment, the fixing surface 12 may be fixed at any position on the wafer processing line, for example, the fixing surface 12 may be fixed on a chuck in a cleaning chamber, and during cleaning, the wafer and the carrier are cleaned as a whole. When it is desired to transfer a wafer on the production line, the holding surface 12 is released from the chuck and the wafer and carrier are transferred as a unit.
In the embodiment of the present invention, when cleaning the wafer, the wafer may be fixed on the carrying surface 11 of the carrier in advance, and then the fixing surface 12 of the carrier is fixed in the cleaning chamber. In the cleaning process, the wafer can be firmly fixed on the carrier instead of being directly fixed in the cleaning cavity, so that the problem that the wafer is not firmly adsorbed due to the fact that the wafer is directly adsorbed in the cleaning cavity in the traditional mode to cause flying piece breakage is avoided, and the yield of the wafer is improved. And when the wafer is conveyed on the cleaning assembly line, the wafer can be fixed on the carrier, so that the safety of the wafer in the conveying process is ensured. In addition, the edge of the carrying surface 11 is provided with a plurality of first clamps 13 for fixing the wafer, thereby ensuring the firmness between the wafer and the carrying surface.
As a preferred embodiment of the present invention, the first chuck 13 includes a retractable member that can be extended and retracted in the thickness direction of the wafer. Generally, in the present embodiment, the thickness of the wafer is less than 500 μm, or greater than 1mm, or between 500 μm and 1 mm. The telescopic component can be stretched to a proper position according to the thickness of the wafer, so that the wafer carrier can meet the use requirements of wafers with different thicknesses, the current situation that the current wafer cleaning equipment can only clean the wafer with the conventional thickness is broken through, the use compatibility of the wafer carrier and the cleaning equipment is effectively enhanced on one hand, and the wafer breakage caused by the mismatch of the thickness of the wafer and the specification of the cleaning equipment is avoided on the other hand.
As a preferred embodiment of the present invention, as shown in fig. 2, a plurality of second clamps 14 for fixing the carrier body 1 are provided on the fixing surface 12, and the carrier is fixed on the clamps of the cleaning chamber or other positions on the production line by the second clamps 14. As an alternative embodiment, the fixing surface 12 may be provided with a magnetic component for fixing the carrier body 1, and the carrier body 1 is fixed by magnetic attraction. As another alternative, a vacuum suction component for fixing the carrier body 1 may be disposed on the fixing surface 12, and the carrier body 1 is fixed by vacuum suction. It should be noted that the second clamp 14, the magnetic assembly and the vacuum absorption assembly may be combined or individually disposed, and how to specifically dispose the components may be set according to actual requirements, so that the flexibility is strong.
Example 2
An embodiment of the invention provides a wafer cleaning system, as shown in fig. 3, including a storage unit 2, a carrier unit 3, a cleaning unit 4 and a transmission unit 5. The storage unit 2 is used for storing wafers; the carrier unit 3 is used for storing the carrier provided in the above embodiment 1; the cleaning unit 4 is used for cleaning the wafer loaded on the carrier, wherein the fixed surface 12 is fixed on a chuck in the cleaning unit 4; the transmission unit 5 is used for carrying wafers to move among the storage unit 2, the carrier unit 3 and the cleaning unit 4.
The carrier unit 3 is arranged to store the carrier, and provide a platform for loading the wafer on the carrier, when the wafer is loaded on the carrier, the wafer and the carrier form a whole, and the whole is transferred to the cleaning unit 4 through the transmission unit 5 and cleaned, so that the safety of the wafer in the transferring process and the cleaning process is ensured, and the wafer is not easy to break.
As a preferred embodiment of the present invention, the transmission unit 5 includes a robot and a driving unit. The manipulator is used for grabbing the wafer or the carrier; the driving unit is connected with the mechanical arm and used for driving the mechanical arm to move along the horizontal direction and the vertical direction. Therefore, the automation degree of the transmission unit 5 is enhanced, the transmission efficiency is improved, and the high efficiency of wafer cleaning is further ensured.
As a preferred embodiment of the present invention, as shown in fig. 4, the wafer cleaning system further includes an alignment unit 6, and the alignment unit 6 is used for aligning and detecting flatness of the wafer loaded on the carrier. Further ensure that the wafer can be stably placed on the carrier, and enhance the service performance of the wafer cleaning system.
Example 3
An embodiment of the present invention provides a wafer cleaning method, as shown in fig. 5, including the following steps:
step S31, the wafer to be cleaned is transferred from the storage unit 2 to the carrier unit 3 through the transfer unit 5, and the wafer is loaded on the carrier. Specifically, the wafer to be cleaned is picked from the storage unit 2 by the robot and transferred to the carrier unit 3, and in the carrier unit 3, the wafer and the carrier are mounted, and the mounting process can be manual operation or automatic operation.
Step S32, the wafer is transferred to the cleaning unit 4 through the transfer unit 5. This step transfers the wafer and carrier as a whole.
Step S33 is to fix the carrier fixing surface 12 to the chuck in the cleaning unit 4, and clean the wafer. The fixing surface 12 of the carrier may be fixed by a clamp, a vacuum adsorption manner, a magnetic adsorption manner, or other fixing manners, which can achieve the object of the present invention.
Step S34, the cleaned wafer is transferred to the carrier unit 3 through the transmission unit 5, and the wafer is unloaded from the carrier. The removal can be performed manually or automatically.
Step S35, the wafer is transferred to the storage unit 2 through the transfer unit 5.
When cleaning operation is carried out, the wafer is not directly fixed on the chuck, but is loaded on the carrier firstly, and then the carrier is fixed on the chuck, namely the wafer and the carrier are cleaned as a whole, so that the problem that the wafer is not firmly adsorbed due to the fact that the wafer is directly adsorbed in the cleaning cavity in the traditional mode to cause flying piece breakage is avoided, and the yield of the wafer is improved. And when the wafer is transmitted on the production line, the wafer is also fixed on the carrier, so that the safety of the wafer in the transmission process is ensured.
As a preferred embodiment of the present invention, between step S31 and step S32, the method further includes: and carrying out alignment and flatness detection on the wafer.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (7)
1. A wafer carrier is characterized by comprising a carrier body (1), wherein the carrier body (1) is provided with a bearing surface (11) and a fixing surface (12) which are opposite; the bearing surface (11) is used for bearing a wafer, and the fixing surface (12) is used for fixing the carrier; the edge of the bearing surface (11) is also provided with a plurality of first clamps (13) used for fixing the wafer, each first clamp (13) comprises a telescopic component capable of stretching along the thickness direction of the wafer, and the thickness value of the wafer is less than 500 mu m or more than 1 mm.
2. The wafer carrier according to claim 1, characterized in that the fixing surface (12) is provided with a plurality of second clamps (14) for fixing the carrier body (1) and/or magnetic components and/or vacuum adsorption components.
3. A wafer cleaning system, comprising:
the storage unit (2) is used for storing the wafer;
a carrier unit (3) for storing the carrier of claim 1 or 2;
a cleaning unit (4) for cleaning the wafer loaded on the carrier, wherein the fixing surface (12) is fixed on a chuck in the cleaning unit (4);
a transmission unit (5) for carrying the wafers to move among the storage unit (2), the carrier unit (3) and the cleaning unit (4).
4. Wafer cleaning system according to claim 3, characterized in that the transmission unit (5) comprises:
the manipulator is used for grabbing the wafer or the carrier;
and the driving unit is connected with the mechanical arm and used for driving the mechanical arm to move along the horizontal direction and the vertical direction.
5. The wafer cleaning system according to claim 3, further comprising an alignment unit (6), wherein the alignment unit (6) is configured to align and inspect flatness of the wafers loaded on the carriers.
6. A wafer cleaning method is characterized by comprising the following steps:
transferring the wafers to be cleaned from the storage units (2) to the carrier units (3) by means of the transmission units (5) and loading said wafers on said carriers, the carrier units (3) being adapted to store carriers according to claim 1 or 2;
transferring the wafer to a cleaning unit (4) through the transmission unit (5);
fixing a fixing surface (12) of the carrier on a chuck in the cleaning unit (4) to clean the wafer;
transferring the cleaned wafer to the carrier unit (3) through the transmission unit (5), and unloading the wafer from the carrier;
the wafers are transferred to the storage unit (2) by the transfer unit (5).
7. The method of claim 6, wherein the step of loading the wafer on the carrier is followed by the step of: and carrying out alignment and flatness detection on the wafer.
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| CN201810315961.XA CN108470708B (en) | 2018-04-10 | 2018-04-10 | Wafer carrier, wafer cleaning system and method |
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| CN201810315961.XA CN108470708B (en) | 2018-04-10 | 2018-04-10 | Wafer carrier, wafer cleaning system and method |
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| CN108470708B true CN108470708B (en) | 2020-12-04 |
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| CN111640685A (en) * | 2020-06-04 | 2020-09-08 | 北京北方华创微电子装备有限公司 | Semiconductor device and workpiece state detection method |
| CN114093752B (en) * | 2021-11-10 | 2022-07-26 | 新阳硅密（上海）半导体技术有限公司 | Method for reducing influence of carrier on wafer surface cleaning |
| CN114850162B (en) * | 2022-03-31 | 2024-02-20 | 上海哥瑞利软件股份有限公司 | Method and system for designing automatic flow of FOUP Clean in semiconductor 12-inch MES system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101681191B1 (en) * | 2015-09-30 | 2016-12-12 | 세메스 주식회사 | Transfer unit, Apparatus for treating substrate, and Method for treating substrate |
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| CN2838780Y (en) * | 2005-10-09 | 2006-11-22 | 微硕自动化股份有限公司 | Light cover sheet cleaning rotary mechanism |
| CN103464401A (en) * | 2012-06-08 | 2013-12-25 | 盛美半导体设备（上海）有限公司 | Method and device for cleaning flip chips |
| CN205436432U (en) * | 2016-02-24 | 2016-08-10 | 富港电子(昆山)有限公司 | Automatic clearing device |
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