CN108465971A - A kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys - Google Patents
A kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys Download PDFInfo
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- CN108465971A CN108465971A CN201810166333.XA CN201810166333A CN108465971A CN 108465971 A CN108465971 A CN 108465971A CN 201810166333 A CN201810166333 A CN 201810166333A CN 108465971 A CN108465971 A CN 108465971A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a kind of preparation method of low melting point Sn Zn Bi brazing filler metal alloys, wherein each constituent element of alloy is composed of the following components by mass percentage：Sn 83.0% 93.1%, Zn4.9% 5.1%, Bi 1.8% 12.1%, the sum of above constituent mass percentage is 100%.The invention discloses preparation methods.Brazing filler metal alloy fusing point of the present invention is low, and conductivity is good, and brazing property is good, meets photovoltaic battery panel soldering processes requirement.
Description
Technical field
The invention belongs to non-ferrous alloy and photovoltaic welding belt technical fields, and in particular to a kind of low melting point Sn-Zn-Bi solders conjunction
The preparation method of gold.
Background technology
With the prosperity and development of modern times industry, the fossil fuel energies such as traditional coal, oil, natural gas consume day increasingly
Play, so that the reserves of fossil fuel drastically decline in the earth's crust, world energy sources crisis is more prominent.New cleaning fuel is ground
Study carefully and develops extremely urgent, solar energy, wind energy, water energy, nuclear energy etc..Compared with water energy, wind energy, nuclear energy etc., solar energy exists
There is no any discharge and noise when being converted into other energy, therefore solar energy is most potential fossil in numerous clean energy resourcies
One of replacement of fuel energy.The application technology relative maturity of solar energy at present, and it is safe and reliable.Photovoltaic welding belt also known as plates Sn copper
Band plates last layer Sn base solders that is, on oxygen-free copper stripe, is hinge sections important in solar cell module, play transmission and
The current generated key effect of cell piece is converged, the quality of welding quality imitates the collection for directly influencing photovoltaic module electric current
Rate influences the power of photovoltaic module very big.The coating of photovoltaic welding belt is in order to realize the connection with cell silicon chip, because of battery
Piece can undergo instantaneous cooling after brazing, so larger contraction distortion is generated in cooling procedure, and silicon materials, silver paste and weldering
The coefficient of thermal expansion mismatch of band can cause to generate prodigious stress between welding and cell piece, thus can be to the intensity of cell piece
Generate large effect.Effect after welding due to this power can cause the arch of cell piece, and this arch is subsequent
Hidden split or fragment is probably developed into during laying, lamination and use；In addition it is welded in the monolithic of solar battery sheet
In the interconnection process connect with piece, the temperature change of material is simultaneously uneven, and welding region locally also will appear the larger temperature difference, also can
Cause cell piece stress raisers apparent, eventually leads to the broken of cell piece in welding process.
Invention content
The object of the present invention is to provide a kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys, Sn-Zn-Bi solders close
Gold utensil has that fusing point is low, the high feature of conductivity.
The technical solution adopted in the present invention is a kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys, wherein closing
Each constituent element of gold is composed of the following components by mass percentage：Sn83.0%-93.1%, Zn 4.9%-5.1%, Bi 1.8%-
12.1%, the sum of above constituent mass percentage is 100%.
Another technical solution of the present invention is a kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys,
It is as follows：
Step 1：Weigh Sn particles 83.0%-93.1%, the Zn particle that purity is 99.99% respectively by mass percentage
4.9%-5.1%, Bi particle 1.8%-12.1%, the sum of above constituent mass percentage are 100%；
Step 2：Sn particles that step 1 is weighed, Zn particles, the hydrochloric acid that Bi particle mass concentrations are 10%, quality are dense
The NaOH solution of degree 10% is alternately washed, then clean with distilled water flushing until material surface brighting, then with anhydrous second
Alcohol is through ultrasonic cleaning 15-20min, last cold wind drying；
Step 3：By Sn particle of the step 2 after ultrasonic cleaning and the heating fusing of Zn particles；
Step 4：Wait for that all after fusing, Bi particle of the step 2 after ultrasonic cleaning is added in the Sn in step 3, Zn particles,
It is then heated to 450-500 DEG C, 30-40min is kept the temperature after all melting；
Step 5：By the Sn-Zn-Bi alloy castings in step 4 at alloy pig.
In step 4：To make brazing filler metal alloy homogenize, stirred once every 5min quartz pushrods.
In step 4：Liquid solder alloy oxidation in order to prevent uses mass ratio for 1.25 in smelting process:1 KCl and
LiCl fused salts are protected.
In step 3：Sn particles and Zn particles are covered with rosin in heating process, and wherein rosin is as protective agent.
The beneficial effects of the invention are as follows：
A kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys of the present invention, Sn-Zn-Bi brazing filler metal alloys have fusing point
Low, conductivity is preferable, and brazing property is excellent；Wettability and spreadability of the Sn-Zn-Bi brazing filler metal alloys of the present invention on copper base
Can be excellent, be conducive to the preparation of photovoltaic welding belt；The preparation method of Sn-Zn-Bi brazing filler metal alloys of the present invention is simple, easy to operate, can
For mass production.
Description of the drawings
Fig. 1 is the metallographic structure of Sn93.1Zn5.1Bi1.8 alloys；
Fig. 2 is the metallographic structure of Sn91.3Zn5.0Bi3.7 alloys；
Fig. 3 is the metallographic structure of Sn89.6Zn5.0Bi5.4 alloys；
Fig. 4 is the metallographic structure of Sn86.3Zn4.9Bi8.8 alloys；
Fig. 5 is the metallographic structure of Sn83.0Zn4.9Bi12.1 alloys.
Specific implementation mode
The following describes the present invention in detail with reference to the accompanying drawings and specific embodiments.
A kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys of the present invention, wherein each constituent element of alloy are by mass percentage
It is composed of the following components：Sn 83.0%-93.1%, Zn 4.9%-5.1%, Bi 1.8%-12.1%, the above constituent mass hundred
It is 100% to divide the sum of ratio.
The effect of each component and function are as follows in the alloy：
Main functions of the Sn in solder：There is good affine force effect between metal Sn and copper base, therefore by means of
Low activity solder flux can reach good wetting；Metal Sn easily generates Cu in brazing process with substrate copper6Sn5Change between metal
Nitride layer is closed, the intensity for improving soldered fitting is conducive to；Sn-Pb eutectic alloy fusing points are low (183 DEG C), meet photovoltaic battery panel soldering
Technological requirement.
Effects of the Zn in solder：After Zn can reduce the fusing point of Sn, but the mass fraction of Zn is higher than 9%, fusing point carries again
It is high；Raw material Zn's derives from a wealth of sources, and Costco Wholesale is relatively low；The fusing point of eutectic Sn-Zn lead-free brazings and Sn-Pb eutectic solder phases
Closely, it is easy to carry out unleaded production on existing equipment.
Effects of the Bi in solder：Since the fusing point of Bi is low (271.3 DEG C), it is mainly used to reduce alloy in brazing filler metal alloy
Fusing point；Surface tension is reduced using Bi, increases solder spreading property；Bi is added in solder helps to improve brazing filler metal alloy
Mobility.
A kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys, is as follows：
Step 1：Weigh Sn particles 83.0%-93.1%, the Zn particle that purity is 99.99% respectively by mass percentage
4.9%-5.1%, Bi particle 1.8%-12.1%, the sum of above constituent mass percentage are 100%；
Step 2：Sn particles that step 1 is weighed, Zn particles, the hydrochloric acid that Bi particle mass concentrations are 10%, quality are dense
The NaOH solution of degree 10% is alternately washed, then clean with distilled water flushing until material surface brighting, then with anhydrous second
Alcohol is through ultrasonic cleaning 15-20min, last cold wind drying；
Step 3：By Sn particle of the step 2 after ultrasonic cleaning and the heating fusing of Zn particles；
Step 4：Wait for that all after fusing, Bi particle of the step 2 after ultrasonic cleaning is added in the Sn in step 3, Zn particles,
It is then heated to 450-500 DEG C, 30-40min is kept the temperature after all melting；
Step 5：By the Sn-Zn-Bi alloy castings in step 4 at alloy pig.
In step 4：To make brazing filler metal alloy homogenize, stirred once every 5min quartz pushrods.
In step 4：Liquid solder alloy oxidation in order to prevent uses mass ratio for 1.25 in smelting process:1 KCl and
LiCl fused salts are protected.
In step 3：Sn particles and Zn particles are covered with rosin in heating process, and wherein rosin is as protective agent.
Embodiment 1
Step 1：Weigh the Sn particles 93.1% that purity is 99.99% respectively by mass percentage, Zn particles 5.1%,
Bi particles 1.8%, the sum of above constituent mass percentage are 100%；
Step 2：Sn particles that step 1 is weighed, Zn particles, the hydrochloric acid that Bi particle mass concentrations are 10%, quality are dense
The NaOH solution of degree 10% is alternately washed, then clean with distilled water flushing until material surface brighting, then with anhydrous second
Alcohol is through ultrasonic cleaning 15-20min, last cold wind drying；
Step 3：By Sn particle of the step 2 after ultrasonic cleaning and the heating fusing of Zn particles；
Step 4：After Sn, Zn particle in step 3 all fusing, Bi particle of the step 2 after ultrasonic cleaning is added,
It is then heated to 450-500 DEG C, 30-40min is kept the temperature after all melting；
Step 5：By the Sn-Zn-Bi alloy castings in step 4 at alloy pig.
In step 4：To make brazing filler metal alloy homogenize, stirred once every 5min quartz pushrods.
In step 4：Liquid solder alloy oxidation in order to prevent uses mass ratio for 1.25 in smelting process:1 KCl and
LiCl fused salts are protected.
In step 3：Sn particles and Zn particles are covered with rosin in heating process, and wherein rosin is as protective agent.
Sn93.1Zn5.1Bi1.8 brazing filler metal alloys metallographic structure made from embodiment 1 is as shown in Figure 1, be first precipitated phase amount very
Few, fusing point is 190 DEG C, conductivity 6.01Ms/m.Performance meets photovoltaic battery panel soldering processes requirement.
Embodiment 2
Step 1：Weigh the Sn particles 91.3% that purity is 99.99% respectively by mass percentage, Zn particles 5.0%,
Bi particles 3.7%, the sum of above constituent mass percentage are 100%；
Step 2：Sn particles that step 1 is weighed, Zn particles, the hydrochloric acid that Bi particle mass concentrations are 10%, quality are dense
The NaOH solution of degree 10% is alternately washed, then clean with distilled water flushing until material surface brighting, then with anhydrous second
Alcohol is through ultrasonic cleaning 15-20min, last cold wind drying；
Step 3：By Sn particle of the step 2 after ultrasonic cleaning and the heating fusing of Zn particles；
Step 4：After Sn, Zn particle in step 3 all fusing, Bi particle of the step 2 after ultrasonic cleaning is added,
It is then heated to 450-500 DEG C, 30-40min is kept the temperature after all melting；
Step 5：By the Sn-Zn-Bi alloy castings in step 4 at alloy pig.
In step 4：To make brazing filler metal alloy homogenize, stirred once every 5min quartz pushrods.
In step 4：Liquid solder alloy oxidation in order to prevent uses mass ratio for 1.25 in smelting process:1 KCl and
LiCl fused salts are protected.
In step 3：Sn particles and Zn particles are covered with rosin in heating process, and wherein rosin is as protective agent.
Sn91.3Zn5.0Bi3.7 brazing filler metal alloys metallographic structure made from embodiment 2 as shown in Fig. 2, first be precipitated phase amount compared with
Fig. 1 is increased, and fusing point is 186 DEG C, conductivity 6.12Ms/m.Performance meets photovoltaic battery panel soldering processes requirement.
Embodiment 3
Step 1：Weigh the Sn particles 89.6% that purity is 99.99% respectively by mass percentage, Zn particles 5.0%,
Bi particles 5.4%, the sum of above constituent mass percentage are 100%；
Step 2：Sn particles that step 1 is weighed, Zn particles, the hydrochloric acid that Bi particle mass concentrations are 10%, quality are dense
The NaOH solution of degree 10% is alternately washed, then clean with distilled water flushing until material surface brighting, then with anhydrous second
Alcohol is through ultrasonic cleaning 15-20min, last cold wind drying；
Step 3：By Sn particle of the step 2 after ultrasonic cleaning and the heating fusing of Zn particles；
Step 4：After Sn, Zn particle in step 3 all fusing, Bi particle of the step 2 after ultrasonic cleaning is added,
It is then heated to 450-500 DEG C, 30-40min is kept the temperature after all melting；
Step 5：By the Sn-Zn-Bi alloy castings in step 4 at alloy pig.
In step 4：To make brazing filler metal alloy homogenize, stirred once every 5min quartz pushrods.
In step 4：Liquid solder alloy oxidation in order to prevent uses mass ratio for 1.25 in smelting process:1 KCl and
LiCl fused salts are protected.
In step 3：Sn particles and Zn particles are covered with rosin in heating process, and wherein rosin is as protective agent.
Sn89.6Zn5.0Bi5.4 brazing filler metal alloys metallographic structure made from embodiment 3 as shown in figure 3, first be precipitated phase amount compared with
Fig. 2 is increased, and fusing point is 183 DEG C, conductivity 6.31Ms/m.Performance meets photovoltaic battery panel soldering processes requirement.
Embodiment 4
Step 1：Weigh the Sn particles 86.3% that purity is 99.99% respectively by mass percentage, Zn particles 4.9%,
Bi particles 8.8%, the sum of the above constituent mass percentage be 100%；
Step 2：Sn particles that step 1 is weighed, Zn particles, the hydrochloric acid that Bi particle mass concentrations are 10%, quality are dense
The NaOH solution of degree 10% is alternately washed, then clean with distilled water flushing until material surface brighting, then with anhydrous second
Alcohol is through ultrasonic cleaning 15-20min, last cold wind drying；
Step 3：By Sn particle of the step 2 after ultrasonic cleaning and the heating fusing of Zn particles；
Step 4：After Sn, Zn particle in step 3 all fusing, Bi particle of the step 2 after ultrasonic cleaning is added,
It is then heated to 450-500 DEG C, 30-40min is kept the temperature after all melting；
Step 5：By the Sn-Zn-Bi alloy castings in step 4 at alloy pig.
In step 4：To make brazing filler metal alloy homogenize, stirred once every 5min quartz pushrods.
In step 4：Liquid solder alloy oxidation in order to prevent uses mass ratio for 1.25 in smelting process:1 KCl and
LiCl fused salts are protected.
In step 3：Sn particles and Zn particles are covered with rosin in heating process, and wherein rosin is as protective agent.
Sn86.3Zn4.9Bi8.8 brazing filler metal alloys metallographic structure made from embodiment 4 as shown in figure 4, first be precipitated phase amount compared with
Fig. 3 is increased, and fusing point is 178 DEG C, conductivity 6.19Ms/m.Performance meets photovoltaic battery panel soldering processes requirement.
Embodiment 5
Step 1：Weigh the Sn particles 83.0% that purity is 99.99% respectively by mass percentage, Zn particles 4.9%,
Bi particles 12.1%, the sum of above constituent mass percentage are 100%；
Step 2：Sn particles that step 1 is weighed, Zn particles, the hydrochloric acid that Bi particle mass concentrations are 10%, quality are dense
The NaOH solution of degree 10% is alternately washed, then clean with distilled water flushing until material surface brighting, then with anhydrous second
Alcohol is through ultrasonic cleaning 15-20min, last cold wind drying；
Step 3：By Sn particle of the step 2 after ultrasonic cleaning and the heating fusing of Zn particles；
Step 4：After Sn, Zn particle in step 3 all fusing, Bi particle of the step 2 after ultrasonic cleaning is added,
It is then heated to 450-500 DEG C, 30-40min is kept the temperature after all melting；
Step 5：By the Sn-Zn-Bi alloy castings in step 4 at alloy pig.
In step 4：To make brazing filler metal alloy homogenize, stirred once every 5min quartz pushrods.
In step 4：Liquid solder alloy oxidation in order to prevent uses mass ratio for 1.25 in smelting process:1 KCl and
LiCl fused salts are protected.
In step 3：Sn particles and Zn particles are covered with rosin in heating process, and wherein rosin is as protective agent.
Sn83.0Zn4.9B12.1 brazing filler metal alloys metallographic structure made from embodiment 5 as shown in figure 5, first be precipitated phase amount compared with
Fig. 4 is increased, and fusing point is 174 DEG C, conductivity 6.07Ms/m.Performance meets photovoltaic battery panel soldering processes requirement.
A kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys of the present invention, Sn-Zn-Bi brazing filler metal alloy fusing points are low, lead
Electric rate is preferable, and brazing property is excellent；Wettability and spreading property of the Sn-Zn-Bi brazing filler metal alloys of the present invention on copper base are excellent
It is good, be conducive to the preparation of photovoltaic welding belt；The preparation method of Sn-Zn-Bi brazing filler metal alloys of the present invention is simple, easy to operate, can be used for
Mass production.
Claims (5)
1. a kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys, which is characterized in that wherein each constituent element of alloy presses quality hundred
Divide than composed of the following components：Sn 83.0%-93.1%, Zn 4.9%-5.1%, Bi 1.8%-12.1%, above group of sub-prime
It is 100% to measure the sum of percentage.
2. a kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys, which is characterized in that be as follows：
Step 1：Weigh Sn particles 83.0%-93.1%, the Zn particle that purity is 99.99% respectively by mass percentage
4.9%-5.1%, Bi particle 1.8%-12.1%, the sum of above constituent mass percentage are 100%；
Step 2：Sn particles that step 1 is weighed, Zn particles, the hydrochloric acid that Bi particle mass concentrations are 10%, mass concentration
10% NaOH solution is alternately washed, then clean with distilled water flushing until material surface brighting, then uses absolute ethyl alcohol
Through ultrasonic cleaning 15-20min, last cold wind drying；
Step 3：By Sn particle of the step 2 after ultrasonic cleaning and the heating fusing of Zn particles；
Step 4：After Sn, Zn particle in step 3 all fusing, Bi particle of the step 2 after ultrasonic cleaning is added, then
It is heated to 450-500 DEG C, 30-40min is kept the temperature after all melting；
Step 5：By the Sn-Zn-Bi alloy castings in step 4 at alloy pig.
3. a kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys according to claim 2, which is characterized in that described
In step 4：It is stirred once every 5min quartz pushrods in melting process.
4. a kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys according to claim 2, which is characterized in that described
In step 4：Use mass ratio for 1.25 in melting process:1 KCl and LiCl fused salts are protected.
5. a kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys according to claim 2, which is characterized in that described
In step 3：Sn particles and Zn particles are covered with rosin in heating process.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109262160A (en) * | 2018-11-23 | 2019-01-25 | 深圳市唯特偶新材料股份有限公司 | A kind of novel electron welding material |
| CN110402181A (en) * | 2018-12-13 | 2019-11-01 | 北京联金高新科技有限公司 | SnZn series lead-free solder and preparation method thereof |
| CN112548251A (en) * | 2020-12-07 | 2021-03-26 | 镇江百永电气设备有限公司 | High-heat-resistance high-conductivity flexible connection and preparation process thereof |
| CN112621013A (en) * | 2020-12-24 | 2021-04-09 | 常州福伦特无铅焊料有限公司 | Soldering tin bar special for solar photovoltaic solder strip and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1390672A (en) * | 2002-05-10 | 2003-01-15 | 大连理工大学 | Leadfree SnZn-base alloy solder containing rare-earth elements |
| US20050039824A1 (en) * | 2001-06-29 | 2005-02-24 | Tsutomu Nishina | Solder composition |
| CN1586793A (en) * | 2004-07-16 | 2005-03-02 | 北京工业大学 | SnZn series lead-free welding flux |
| CN1775457A (en) * | 2005-12-12 | 2006-05-24 | 黄德欢 | Lead-free soldering tin |
| CN101381826A (en) * | 2008-09-26 | 2009-03-11 | 南昌大学 | Sn-Cu base leadless solder alloy and preparation method |
| CN104018026A (en) * | 2014-06-24 | 2014-09-03 | 南昌大学 | Sn-Zn-S lead-free brazing filler metal alloy and preparation method thereof |
| CN106392365A (en) * | 2016-11-11 | 2017-02-15 | 江苏师范大学 | 3D packaging interconnection solder for MEMS devices |
-
2018
- 2018-02-28 CN CN201810166333.XA patent/CN108465971A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050039824A1 (en) * | 2001-06-29 | 2005-02-24 | Tsutomu Nishina | Solder composition |
| CN1390672A (en) * | 2002-05-10 | 2003-01-15 | 大连理工大学 | Leadfree SnZn-base alloy solder containing rare-earth elements |
| CN1586793A (en) * | 2004-07-16 | 2005-03-02 | 北京工业大学 | SnZn series lead-free welding flux |
| CN1775457A (en) * | 2005-12-12 | 2006-05-24 | 黄德欢 | Lead-free soldering tin |
| CN101381826A (en) * | 2008-09-26 | 2009-03-11 | 南昌大学 | Sn-Cu base leadless solder alloy and preparation method |
| CN104018026A (en) * | 2014-06-24 | 2014-09-03 | 南昌大学 | Sn-Zn-S lead-free brazing filler metal alloy and preparation method thereof |
| CN106392365A (en) * | 2016-11-11 | 2017-02-15 | 江苏师范大学 | 3D packaging interconnection solder for MEMS devices |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109262160A (en) * | 2018-11-23 | 2019-01-25 | 深圳市唯特偶新材料股份有限公司 | A kind of novel electron welding material |
| CN110402181A (en) * | 2018-12-13 | 2019-11-01 | 北京联金高新科技有限公司 | SnZn series lead-free solder and preparation method thereof |
| CN112548251A (en) * | 2020-12-07 | 2021-03-26 | 镇江百永电气设备有限公司 | High-heat-resistance high-conductivity flexible connection and preparation process thereof |
| CN112621013A (en) * | 2020-12-24 | 2021-04-09 | 常州福伦特无铅焊料有限公司 | Soldering tin bar special for solar photovoltaic solder strip and preparation method thereof |
| CN112621013B (en) * | 2020-12-24 | 2021-07-20 | 常州福伦特无铅焊料有限公司 | Soldering tin bar special for solar photovoltaic solder strip and preparation method thereof |
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