CN108461510A - A kind of camera module and preparation method thereof - Google Patents
A kind of camera module and preparation method thereof Download PDFInfo
- Publication number
- CN108461510A CN108461510A CN201710096767.2A CN201710096767A CN108461510A CN 108461510 A CN108461510 A CN 108461510A CN 201710096767 A CN201710096767 A CN 201710096767A CN 108461510 A CN108461510 A CN 108461510A
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- protection cap
- plane
- area
- camera module
- sensing chip
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- 230000003287 optical effect Effects 0.000 claims abstract description 245
- 238000004519 manufacturing process Methods 0.000 claims abstract description 37
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- 238000000034 method Methods 0.000 claims description 37
- 238000012545 processing Methods 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 8
- 238000011049 filling Methods 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 28
- 238000005538 encapsulation Methods 0.000 description 19
- 230000006870 function Effects 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 13
- 238000012856 packing Methods 0.000 description 11
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- 238000013459 approach Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
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- 238000004806 packaging method and process Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
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- 229910052759 nickel Inorganic materials 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
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- 229910052710 silicon Inorganic materials 0.000 description 4
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- 239000010936 titanium Substances 0.000 description 4
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- 238000001259 photo etching Methods 0.000 description 3
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The embodiment of the invention discloses a kind of camera module, the camera module includes：Protection cap and optical sensing chip；Wherein：Optical lens structure is provided at the first area of first plane of the protection cap, the protection cap and the optical lens structure are integrated；The optical sensing chip is arranged in the first area of the second plane of the protection cap；Wherein, second plane is face opposite with first plane in the protection cap, and the central point of the first area of first plane is with the central point of the first area of second plane on the same straight line vertical with first plane.The embodiment of the present invention also discloses a kind of production method of camera module simultaneously.
Description
Technical field
The present invention relates to the encapsulation technology of the camera module in field of semiconductor package more particularly to a kind of camera shooting head moulds
Group and preparation method thereof.
Background technology
With the high speed development of science and technology, mobile device tends to simplify and minimize, therefore it is required that component is more next
It is smaller, thickness is more and more thinner.In the mobile devices such as smart mobile phone, tablet computer, camera module, which can provide, takes pictures, images
Etc. functions.In the prior art, camera module is typically to be assembled by the optical sensing chip and lens group that encapsulate；
The encapsulation step that the encapsulating structure of existing camera module needs is more, relatively low so as to cause finished product yield；Moreover, formed
Product is thicker.
In existing solution technical solution, usually optical sensing chip is embedded in package substrate or replaces filter with cut film
Mating plate improves yields and reduces the thickness of camera module.Although existing solution technical solution improves to a certain extent
The yields of product, the thickness for reducing product, but there is no the apparent thickness for reducing product, and also there is still a need for optics
Sensing chip is packaged respectively with lens group, then optical sensing chip and the lens group after encapsulation are carried out secondary encapsulation ability
Obtain camera module.
Invention content
In order to solve the above technical problems, an embodiment of the present invention is intended to provide camera module and preparation method thereof, solve
The problem of needing to carry out secondary encapsulation between optical sensing chip and lens group in the prior art, simplify the encapsulation of camera module
Process reduces production process, reduces the thickness of camera module.
In order to achieve the above objectives, the technical solution of the embodiment of the present invention is realized in：
A kind of camera module, the camera module include：Protection cap and optical sensing chip；Wherein：
Optical lens structure, the protection cap and the light are provided at the first area of first plane of the protection cap
It is integrated to learn lens arrangement；
The optical sensing chip is arranged in the first area of the second plane of the protection cap；Wherein, described second is flat
Face is face opposite with first plane in the protection cap, the central point of the first area of first plane and described the
The central point of the first area of two planes is on the same straight line vertical with first plane.
Optionally, it is arranged in the protection cap fluted；Wherein：
The groove is arranged in the first area of the second plane of the protection cap；
The optical sensing chip is arranged in the groove；Wherein, the optical sensing chip is close to the optical lens
The face of mirror structure is for acquiring optical information.
Optionally, at least one default chip is additionally provided in the groove；Wherein：
At least one default chip is arranged in the face far from the optical lens structure of the optical sensing chip
On；
Wherein, at least one default chip is connect with the optical sensing chip；The function of the default chip with
The function of the optical sensing chip is different.
Optionally, the camera module further includes：Conducting wire and pad；Wherein：
The conducting wire is arranged in the second area of the second plane of the protection cap and presetting for the first area
Position；Wherein, the second area is the region in addition to the first area in the second plane of the protection cap；
One end of the pad is connect with the pin of the optical sensing chip；The other end of the pad and the conduction
Connection.
Optionally, the camera module further includes：Filled media；Wherein：
The filled media is filled in the groove；
The filled media, for chip to be fixed in the groove；Wherein, the chip includes the optical sensing
Chip, or including the optical sensing chip and at least one default chip.
Optionally, which is characterized in that
The filled media is additionally arranged on the second area of the second plane of the protection cap, and covers the protection
The conducting wire on the second area of second plane of lid.
Optionally, the camera module further includes：Soldered ball；Wherein：
The soldered ball is arranged in the filled media of the second area of second plane, and with the conductor wire
Road connects.
Optionally, the camera module further includes：Metal wiring layer；Wherein：
The metal wiring layer is arranged in the filled media of the first area of the second plane of the protection cap；
The metal wiring layer is connect with the conducting wire；
The soldered ball is additionally arranged on the metal wiring layer.
A kind of production method of camera module, the production method include：
Protection cap is provided；
Processing is carried out to the protection cap and forms optical lens at the first area of the first plane of the protection cap
Structure；Wherein, the protection cap and the optical lens structure are integrated；
Optical sensing core is set in the protection cap at the first area of the second plane opposite with first plane
Piece；Wherein, the central point of the first area of the central point of the first area of first plane and second plane with institute
It states on the vertical same straight line of the first plane.
Optionally, the setting optical sensing chip at the first area of the second plane of the protection cap, including：
Groove is formed on the first area of the second plane of the protection cap；
The optical sensing chip is set in the groove.
Optionally, described that the optical sensing chip is set in the groove, including：
Carrying tablet is provided；
First plane of the protection cap is fit together with the carrying tablet, and being fixed on for the protection cap is held
On slide glass；
The optical sensing chip is set in the groove；Wherein, the optical sensing chip is close to the optical lens
The face of mirror structure is for acquiring optical information.
Optionally, described to be arranged in the groove before the optical sensing chip, further include：
Second area and the first area in the second plane of the protection cap in addition to the first area it is pre-
If conducting wire is arranged in position.
Optionally, the method further includes：
The conducting wire and the pin of the optical sensing chip are linked together using pad.
Optionally, the method further includes：
At least one default chip is set on the face of the optical sensing chip far from the optical lens structure；
Wherein, at least one default chip is connect with the optical sensing chip；The function of the default chip with
The function of the optical sensing chip is different.
Optionally, the method further includes：
Filled media is set on the second area of the second plane of the groove and protection cap of the protection cap, it is described
Filled media covers the conducting wire；
According to preset requirement in the predetermined position of the second area of the second plane of the protection cap, it is arranged and is led with described
The soldered ball that the other end of electric line is connected；
Detach the carrying tablet in the first plane of the protection cap.
Optionally, before the carrying tablet in the first plane of the separation protection cap, further include：
On the surface of the filled media of the first area of the second plane of the protection cap, setting connects with the conducting wire
The metal wiring layer connect；
In the predeterminated position of the metal wiring layer, soldered ball is set.
The camera module and preparation method thereof that the embodiment of the present invention is provided, the first of the first plane of protection cap
Optical lens structure is provided at region, protection cap and optical lens structure are integrated, and then optical sensing chip is arranged
In the first area of the second plane of protection cap；In this way, optical lens structure is made in protection cap, and in protection cap fixed bit
It sets and places optical sensing chip, without being packaged to optical lens structure, direct packing protection lid and optical sensing chip,
It solves the problems, such as to need to carry out secondary encapsulation in the prior art between optical sensing chip and lens group, reduces production process,
Reduce the thickness of camera module.
Description of the drawings
Fig. 1 is a kind of a kind of structural schematic diagram of camera module provided in an embodiment of the present invention；
Fig. 2 is a kind of another structural schematic diagram of camera module provided in an embodiment of the present invention；
Fig. 3 is a kind of another structural schematic diagram of camera module provided in an embodiment of the present invention；
Fig. 4 is a kind of yet another construction schematic diagram of camera module provided in an embodiment of the present invention；
Fig. 5 is a kind of structural schematic diagram of another camera module provided in an embodiment of the present invention；
Fig. 6 is another structural schematic diagram of another camera module provided in an embodiment of the present invention；
Fig. 7 is another structural schematic diagram of another camera module provided in an embodiment of the present invention；
Fig. 8 is the yet another construction schematic diagram of another camera module provided in an embodiment of the present invention；
Fig. 9 is a kind of a kind of flow diagram of the production method of camera module provided in an embodiment of the present invention；
Figure 10 is a kind of another flow diagram of the production method of camera module provided in an embodiment of the present invention；
Figure 11 is a kind of structural schematic diagram of the protection cap of camera module provided in an embodiment of the present invention；
Figure 12 is the structural schematic diagram of the camera module after a kind of setting optical lens provided in an embodiment of the present invention；
Figure 13 is the structural schematic diagram of the camera module after a kind of setting groove provided in an embodiment of the present invention；
Figure 14 is the structural schematic diagram of the camera module after a kind of setting conducting wire provided in an embodiment of the present invention；
Figure 15 is a kind of structural schematic diagram for placing camera module on carrying tablet provided in an embodiment of the present invention；
Figure 16 is a kind of structural representation for placing the camera module after optical sensing chip provided in an embodiment of the present invention
Figure；
Figure 17 is provided in an embodiment of the present invention a kind of by taking the photograph after pad connection optical sensing chip and conducting wire
As the structural schematic diagram of head mould group；
Figure 18 is the structural schematic diagram of the camera module after a kind of setting filled media provided in an embodiment of the present invention；
Figure 19 is the structural schematic diagram of the camera module after a kind of setting soldered ball provided in an embodiment of the present invention；
Figure 20 is a kind of structural schematic diagram of segmentation camera module provided in an embodiment of the present invention；
Figure 21 is a kind of another flow diagram of the production method of camera module provided in an embodiment of the present invention；
Figure 22 is a kind of another flow diagram of the production method of camera module provided in an embodiment of the present invention；
Figure 23 is a kind of flow diagram of the production method of another camera module provided in an embodiment of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes.
A kind of camera module that the embodiment of the present invention provides is applied in the camera system of mobile device, simplifies
Camera module, referring to Fig.1 shown in, which includes：Protection cap 11 and optical sensing chip 12, wherein：
Optical lens structure 111, protection cap 11 and optical lens are provided at the first area of first plane of protection cap 11
Mirror structure is integrated.
Wherein, protection cap can be laminated structure either platy structure transparent material, such as can be glass or
Sapphire etc..The specific size of optical lens structure can be used common by specifically being determined using design conditions
Optical lens processing technology processes the optical lens structure for obtaining meeting specific requirement in protection cap, such as can be burn into
The methods of plasma etching or laser ablation.
Optical sensing chip 12 is arranged in the first area of the second plane of protection cap 11.
Wherein, the second plane is face opposite with the first plane in protection cap 11, the center of the first area of the first plane
Point is with the central point of the first area of the second plane on the same straight line vertical with the first plane.
Optical sensing chip can be existing packaged optical sensing chip, and there are optical sensors for chip surface
Region.
The camera module that the embodiment of the present invention is provided is provided at the first area of the first plane of protection cap
Optical lens structure, protection cap and optical lens structure are integrated, and then optical sensing chip is arranged the of protection cap
The first area of two planes；In this way, making optical lens structure in protection cap, and optics is placed on protection cap fixed position
Sensing chip, without being packaged to optical lens structure, direct packing protection lid and optical sensing chip solve existing skill
The problem of needing to carry out secondary encapsulation between optical sensing chip and lens group in art, reduces production process, reduce camera
The thickness of module.
A kind of camera module that the embodiment of the present invention provides is applied in the camera system of mobile device, simplifies
Camera module, with reference to shown in Fig. 2, which includes：Protection cap 11, optical sensing chip 12 and groove 112,
In：
Optical lens structure 111, protection cap 11 and optical lens are provided at the first area of first plane of protection cap 11
Mirror structure is integrated.
Groove 112 is arranged in the first area of the second plane of protection cap 11.
The size of groove can determine that the shape of groove is according to actual applied field according to the size of optical sensing chip
Scape determines, does not do any restriction herein.Groove can be using the methods of burn into plasma etching or laser ablation system
What work was formed.
Optical sensing chip 12 is arranged in groove 112.
Wherein, optical sensing chip 12 is used to acquire optical information close to the face of optical lens structure 111.
Specifically, with reference to shown in Fig. 3, which further includes：Conducting wire 13 and pad 14, wherein：
The predeterminated position in the second area and first area of the second plane of protection cap 11 is arranged in conducting wire 13.
Wherein, second area is the region in addition to first area in the second plane of protection cap 11.
Conducting wire can be by carrying out seed layer physical vapour deposition (PVD) on adhesion layer, photoresist coating, photoetching, showing
Shadow the process such as is electroplated, removes photoresist and obtain seed layer, and carrying out what the techniques such as adhesion layer metal etch were formed on adhesion layer,
It can also be formed by coating conducting resinl in photomask definition region, can also be other conducting wire forming methods, conductor wire
The material on road can be conductive material, such as can be one or more of metal materials such as titanium, copper, nickel, gold, aluminium.First
The predeterminated position in region can be the side wall of groove and the section bottom region of groove, specifically, the section bottom area of groove
Domain can be used for placing pad.
One end of pad 14 is connect with the pin of optical sensing chip 12.
The other end of pad 14 is connect with conducting wire 13.
Connection between pad and optical sensing chip and conducting wire can be by the side such as Reflow Soldering, conductive adhesive
Method is realized.
Specifically, with reference to shown in Fig. 4, camera module further includes：Filled media 15, wherein：
Filled media 15 is filled in groove 112.
Filled media 15, for optical sensing chip 12 to be fixed in groove 112.
Further, which is additionally arranged on the second area of the second plane of protection cap 11, and covering protection
Conducting wire 13 on the second area of second plane of lid.
Filled media can be insulating materials, and it can be rotation that filled media, which is filled to the fill method used in groove,
The methods of apply, press.Wherein, the thickness of filled media can be determined according to specifically service condition, for example, filled media is filled out
The conducting wire on the second area of the second plane of protection cap can be completely covered in the thickness filled, formed and the second plane of protection cap
Parallel horizontal filled media plane.
Specifically, referring to Figure 5, camera module further includes：Soldered ball 16, wherein：
Soldered ball 16 is arranged in the filled media 15 of the second area of the second plane, and is connect with conducting wire 13.
The material of soldered ball can be made of an electrically conducting material, such as can be by metal materials such as titanium, copper, nickel, gold, aluminium
One or more of be made.It the installation position of soldered ball can be according to the system board for the terminal being connected with camera module
Link position determines, does not do specific restriction to the installation position of soldered ball herein, the number of soldered ball can be according to optical sensing
The pin number of chip determines.
The camera module that the embodiment of the present invention is provided is provided at the first area of the first plane of protection cap
Optical lens structure, protection cap and optical lens structure are integrated, and then optical sensing chip is arranged the of protection cap
The first area of two planes；In this way, making optical lens structure in protection cap, and optics is placed on protection cap fixed position
Sensing chip, without being packaged to optical lens structure, direct packing protection lid and optical sensing chip solve existing skill
The problem of needing to carry out secondary encapsulation between optical sensing chip and lens group in art, reduces production process, reduce camera
The thickness of module..
Based on previous embodiment, with reference to shown in Fig. 6, camera module further includes：Metal wiring layer 17, wherein：
Metal wiring layer 17 is arranged in the filled media 15 of the first area of the second plane of protection cap 11.
Metal wiring layer 17 is connect with conducting wire 13.
Specifically, in the structure of example shown in Fig. 6, metal wiring layer 17 can be connected by connecting line and conducting wire 13
It connects, wherein connecting line can be wire bonding line, and the position that connecting line connects in Fig. 6 is only made to illustrate, the company of being not limited to
The installation position of wiring.
It should be noted that other connection types can also be used to realize the connection between metal wiring layer and conducting wire,
The connection type being not limited in the present embodiment.
Soldered ball 16 is additionally arranged on metal wiring layer 17.
Metal wiring layer can be formed by techniques such as plating, photoetching, and the soldered ball being arranged on metal wiring layer can be with
Corresponding metal soldered ball array is formed by planting the techniques such as ball, plating.
It, can be in the first area of the second plane of protection cap since conducting wire is connect with optical sensing chip
Locate that metal soldered ball array is arranged on the metal wiring layer of setting, and then the signal output interface of optical sensing chip can be increased.
The camera module that the embodiment of the present invention is provided is provided at the first area of the first plane of protection cap
Optical lens structure, protection cap and optical lens structure are integrated, and then optical sensing chip is arranged the of protection cap
The first area of two planes；In this way, making optical lens structure in protection cap, and optics is placed on protection cap fixed position
Sensing chip, without being packaged to optical lens structure, direct packing protection lid and optical sensing chip solve existing skill
The problem of needing to carry out secondary encapsulation between optical sensing chip and lens group in art, reduces production process, reduce camera
The thickness of module；Meanwhile the signal output interface of optical sensing chip can be increased.
Based on the corresponding embodiments of Fig. 5, with reference to shown in Fig. 7, in another embodiment of the invention, camera module it is recessed
At least one default chip 18 is additionally provided in slot 112, wherein：
At least one default chip 18 is arranged on the face of the separate optical lens structure 111 of optical sensing chip 12.
Wherein, at least one default chip 18 is connect with optical sensing chip 12.The function of default chip 18 is passed with optics
The function of sense chip 12 is different.
Wherein, illustrated so that setting in the groove of camera module is there are one default chip as an example in Fig. 7.
Default chip can be the chips such as digital processing chip, picture processing chip, power supply managing chip.Default core
Piece can pass through the technologies such as wire bonding line, silicon hole technology (Through Silicon Via, TSV) and optical sensing chip
Realize communication or electrical connection.
Filled media 15, is filled in groove.
Filled media 15 is additionally operable to optical sensing chip and at least one default chip being fixed in groove.
Therefore, at least one default chip is also disposed in the groove for being already provided with optical sensing chip, Ke Yiti
The density of the encapsulation of high integrated chip.
The camera module that the embodiment of the present invention is provided is provided at the first area of the first plane of protection cap
Optical lens structure, protection cap and optical lens structure are integrated, and then optical sensing chip is arranged the of protection cap
The first area of two planes；In this way, making optical lens structure in protection cap, and optics is placed on protection cap fixed position
Sensing chip, without being packaged to optical lens structure, direct packing protection lid and optical sensing chip solve existing skill
The problem of needing to carry out secondary encapsulation between optical sensing chip and lens group in art, reduces production process, reduce camera
The thickness of module, meanwhile, it is capable to improve the density of integration packaging.
Further, the camera module provided based on the corresponding embodiments of Fig. 7, with reference to shown in Fig. 8, camera module is also wrapped
It includes：Metal wiring layer 17, wherein：
Metal wiring layer 17 is arranged in the filled media 15 of the first area of the second plane of protection cap 11.
Metal wiring layer 17 is connect with conducting wire 13.
Specifically, the structure of example, metal wiring layer 17 can be connected by connecting line and conducting wire 13 as shown in Figure 8
It connects.
Soldered ball 16 is additionally arranged on metal wiring layer 17.
Default chip can also be communicated or be electrically connected with optical sensing chip by technology wiring layer.
Wherein, illustrated so that setting in the groove of camera module is there are one default chip as an example in Fig. 8.
Specifically, optical sensing chip and at least one default chip are already provided in the groove of protection cap at this time, into
Metal wiring layer is arranged in the filled media of the first area of the second plane of protection cap in one step, and is arranged on metal wiring layer
Soldered ball can increase signal output interface while improving chip package density.
The camera module that the embodiment of the present invention is provided is provided at the first area of the first plane of protection cap
Optical lens structure, protection cap and optical lens structure are integrated, and then optical sensing chip is arranged the of protection cap
The first area of two planes；In this way, making optical lens structure in protection cap, and optics is placed on protection cap fixed position
Sensing chip, without being packaged to optical lens structure, direct packing protection lid and optical sensing chip solve existing skill
The problem of needing to carry out secondary encapsulation between optical sensing chip and lens group in art, reduces production process, reduce camera
The thickness of module meanwhile, it is capable to improve the density of integration packaging, and increases the signal output interface of optical sensing chip.
The embodiment of the present invention provides a kind of production method of camera module, can be applied to the corresponding embodiments of Fig. 1 and provides
A kind of camera module in, with reference to shown in Fig. 9, this approach includes the following steps：
Step 201 provides protection cap.
Specifically, protection cap can be laminated structure either platy structure transparent material, such as can be glass or
Person's sapphire etc..
Step 202 carries out protection cap processing and forms optical lens at the first area of the first plane of protection cap
Structure.
Wherein, protection cap and optical lens structure are integrated.
Specifically, the specific size of optical lens structure can be used by specifically being determined using design conditions
Common optical lens processing technology processes the optical lens structure for obtaining meeting specific requirement in protection cap, such as can be
The methods of burn into plasma etching or laser ablation.
Step 203, the second plane opposite with the first plane in protection cap first area at be arranged optical sensing core
Piece.
Wherein, the central point of the central point of the first area of the first plane and the first area of the second plane with it is first flat
On the vertical same straight line in face.
Specifically, optical sensing chip can be existing packaged optical sensing chip, chip surface exists
Optical sensor region.
The production method for the camera module that the embodiment of the present invention is provided carries out processing and in protection cap to protection cap
The first plane first area at form optical lens structure, then the second plane opposite with the first plane in protection cap
First area at be arranged optical sensing chip；In this way, optical lens structure is made in protection cap, and in protection cap fixed bit
It sets and places optical sensing chip, without being packaged to optical lens structure, direct packing protection lid and optical sensing chip,
It solves the problems, such as to need to carry out secondary encapsulation in the prior art between optical sensing chip and lens group, reduces production process,
Reduce the thickness of camera module.
An embodiment of the present invention provides a kind of production methods of camera module, can be applied to the corresponding embodiments of Fig. 2-5
In a kind of camera module provided, referring to Fig.1 shown in 0, this approach includes the following steps：
Step 301 provides protection cap.
Specifically, structure as shown in figure 11 can be formed after providing protection cap.
Step 302 carries out protection cap processing and forms optical lens at the first area of the first plane of protection cap
Structure.
Wherein, protection cap and optical lens structure are integrated.
Specifically, being illustrated for it can make 3 optical lenses simultaneously in the protection cap in offer, in Figure 11 institutes
Structure as shown in figure 12 can be formed after 3 optical lenses made in the protection cap shown.
Step 303 forms groove on the first area of the second plane of protection cap.
Specifically, the size of groove can determine that the shape of groove is according to reality according to the size of optical sensing chip
Application scenarios determine, do not do any restriction herein.Groove can use burn into plasma etching or laser ablation
The methods of make formed.Illustratively, the groove being arranged on the protection board of optical lens is arranged shown in Figure 12 can be with shape
At structure as shown in fig. 13 that.
The default position of step 304, the second area in the second plane of protection cap in addition to first area and first area
Install conducting wire.
Specifically, conducting wire can be by carrying out seed layer physical vapour deposition (PVD), photoresist coating, light on adhesion layer
It the process such as carves, develop, being electroplated, removing photoresist and obtaining seed layer, and carrying out the techniques shapes such as adhesion layer metal etch on adhesion layer
At, it can also be formed by coating conducting resinl in photomask definition region, can also be other conducting wire forming methods, example
Structure as shown in figure 14 such as can be formed using above-mentioned conducting wire forming method based on Figure 13.The material of conducting wire can be with
It is conductive material, such as can is one or more of metal materials such as titanium, copper, nickel, gold, aluminium.The default position of first area
Set may include groove side wall and the section bottom region of groove, wherein the section bottom region of groove can be used for placing
Pad.
Optical sensing chip is arranged in step 305 in groove.
Specifically, step 305 can be realized by following steps：
Step 305a, carrying tablet is provided.
Specifically, carrying tablet can be a workbench made of the materials such as silicon, glass, stainless steel.
Step 305b, the first plane of protection cap is fit together with carrying tablet, and protection cap is fixed on carrying
On piece.
Specifically, can be the first plane and carrying tablet of protection cap using glue is bonded made of the materials such as resin temporarily
It fits together, protection cap is made to be fixed on carrying tablet.Such as Figure 14 protection caps obtained are fixed on carrying tablet can be as
Shown in Figure 15, in fig.15,21 be carrying tablet, and 22 be interim bonding glue.
Optical sensing chip is set step 305c, in groove.
Specifically, optical sensing chip is used to acquire optical information close to the face of optical lens structure.Illustratively, scheming
15 setting optical sensing chips can form structure shown in Figure 16.
Step 306 is linked together conducting wire and the pin of optical sensing chip using pad.
Specifically, the connection between pad and optical sensing chip and conducting wire can be by Reflow Soldering, conducting resinl
The methods of bonding is realized.Illustratively, optical sensing chip shown in Figure 16 is connect with conducting wire by pad
Structure shown in Figure 17 can be formed by getting up.
Filled media is arranged on the second area of the second plane of the groove and protection cap of protection cap in step 307, filling
Dielectric overlay conducting wire.
Specifically, filled media can be insulating materials, filled media is filled can to the fill method used in groove
To be the methods of spin coating, pressing.Wherein, the thickness of filled media can be determined according to specifically service condition, for example, filling
The thickness of media filler can be completely covered the conducting wire on the second area of the second plane of protection cap, be formed and protection cap the
The parallel horizontal filled media plane of two planes, wherein structure shown in Figure 18 can be formed based on Figure 17 settings filled media.
Step 308, according to preset requirement in the predetermined position of the second area of the second plane of protection cap, be arranged and lead
The soldered ball that the other end of electric line is connected.
Specifically, preset requirement in the predeterminated position of the second area of the second plane of protection cap can be and image head mould
The position that the link position of the system board for the terminal that group is connected determines.The material of soldered ball can be made of an electrically conducting material
, such as can be made of one or more of metal materials such as titanium, copper, nickel, gold, aluminium.The installation position of soldered ball can be with
It is determined according to the link position of the system board for the terminal being connected with camera module, herein not to the installation position of soldered ball
Specific restriction is done, the number of soldered ball can be determined according to the pin number of optical sensing chip.Illustratively, can scheme
The soldered ball being connect with the conducting wire other end is set at position shown in 19.
Carrying tablet in step 309, the first plane of separation protection cap.
Specifically, carrying tablet can be workbench made of the materials such as silicon, glass, stainless steel.By optical sensing chip
When being placed in the groove of the protection cap with optical lens structure and conducting wire, prison wafer-level packaging can be used
(Wafer Level Package, WLP) method carries out the encapsulation process between optical sensing chip and protection cap.
It should be noted that large-sized protection cap is carried out according to the dimensional parameters of protection cap needed for single camera module
It divides, pre-sets and divide position, it in this way can be simultaneously in large-sized protection cap to each division region corresponding position
Optical lens structure processing is carried out, and processes in corresponding position to obtain groove, then in groove after encapsulating optical sensing chip,
The methods of laser cutting can be used to pre-set the punishment of division position and cut large-sized protection cap, while largely being taken the photograph
As head mould group.Illustratively, can in fig. 20 shown in the corresponding protection cap of dotted line position at pre-set divide position,
And cut in the division position, obtain single camera module.
It should be noted that the explanation in the present embodiment with same steps in other embodiments or concept, is referred to
Description in other embodiments, details are not described herein again.
The production method for the camera module that the embodiment of the present invention is provided carries out processing and in protection cap to protection cap
The first plane first area at form optical lens structure, then the second plane opposite with the first plane in protection cap
First area at be arranged optical sensing chip；In this way, optical lens structure is made in protection cap, and in protection cap fixed bit
It sets and places optical sensing chip, without being packaged to optical lens structure, direct packing protection lid and optical sensing chip,
It solves the problems, such as to need to carry out secondary encapsulation in the prior art between optical sensing chip and lens group, reduces production process,
Reduce the thickness of camera module.
An embodiment of the present invention provides a kind of production methods of camera module, can be applied to the corresponding embodiments of Fig. 6 and carry
In a kind of camera module supplied, with reference to shown in Figure 21, this approach includes the following steps：
Step 401 provides protection cap.
Step 402 carries out protection cap processing and forms optical lens at the first area of the first plane of protection cap
Structure.
Wherein, protection cap and optical lens structure are integrated.
Step 403 forms groove on the first area of the second plane of protection cap.
The default position of step 404, the second area in the second plane of protection cap in addition to first area and first area
Install conducting wire.
Step 405 provides carrying tablet.
The first plane and carrying tablet of protection cap are fit together, and protection cap are fixed on carrying tablet by step 406
On.
Optical sensing chip is arranged in step 407 in groove.
Wherein, optical sensing chip is used to acquire optical information close to the face of optical lens structure.
Step 408 is linked together conducting wire and the pin of optical sensing chip using pad.
Filled media is arranged on the second area of the second plane of the groove and protection cap of protection cap in step 409, filling
Dielectric overlay conducting wire.
Step 410, according to preset requirement in the predetermined position of the second area of the second plane of protection cap, be arranged and lead
The soldered ball that the other end of electric line is connected.
Step 411, protection cap the second plane first area filled media surface, setting with conducting wire connect
The metal wiring layer connect.
Specifically, metal wiring layer can be formed by techniques such as plating, photoetching.Wherein, metal wiring layer can be with
It is realized and is connected with conducting wire by conducting wire or TSV technology, wherein conducting wire can be wire bonding line.
Step 412, the predeterminated position setting soldered ball in metal wiring layer.
Specifically, the soldered ball being arranged on metal wiring layer can form corresponding metal welding by planting the techniques such as ball, plating
Ball array.
Carrying tablet in step 413, the first plane of separation protection cap.
It should be noted that the explanation in the present embodiment with same steps in other embodiments or concept, is referred to
Description in other embodiments, details are not described herein again.
The production method for the camera module that the embodiment of the present invention is provided carries out processing and in protection cap to protection cap
The first plane first area at form optical lens structure, then the second plane opposite with the first plane in protection cap
First area at be arranged optical sensing chip；In this way, optical lens structure is made in protection cap, and in protection cap fixed bit
It sets and places optical sensing chip, without being packaged to optical lens structure, direct packing protection lid and optical sensing chip,
It solves the problems, such as to need to carry out secondary encapsulation in the prior art between optical sensing chip and lens group, reduces production process,
The thickness of camera module is reduced, meanwhile, the signal output interface of optical sensing chip can be increased.
An embodiment of the present invention provides a kind of production methods of camera module, can be applied to the corresponding embodiments of Fig. 7 and carry
In a kind of camera module supplied, with reference to shown in Figure 22, this approach includes the following steps：
Step 501 provides protection cap.
Step 502 carries out protection cap processing and forms optical lens at the first area of the first plane of protection cap
Structure.
Wherein, protection cap and optical lens structure are integrated.
Step 503 forms groove on the first area of the second plane of protection cap.
The default position of step 504, the second area in the second plane of protection cap in addition to first area and first area
Install conducting wire.
Step 505 provides carrying tablet.
The first plane and carrying tablet of protection cap are fit together, and protection cap are fixed on carrying tablet by step 506
On.
Optical sensing chip is arranged in step 507 in groove.
Wherein, optical sensing chip is used to acquire optical information close to the face of optical lens structure.
Step 508 is linked together conducting wire and the pin of optical sensing chip using pad.
At least one default chip is arranged in step 509 on face of the optical sensing chip far from optical lens structure.
Wherein, at least one default chip is connect with optical sensing chip；The function and optical sensing chip of default chip
Function it is different.
Specifically, default chip can be the cores such as digital processing chip, picture processing chip, power supply managing chip
Piece.Default chip can realize communication with optical sensing chip by technologies such as wire bonding line, TSV technologies or be electrically connected.
Filled media is arranged on the second area of the second plane of the groove and protection cap of protection cap in step 510, filling
Dielectric overlay conducting wire.
Step 511, according to preset requirement in the predetermined position of the second area of the second plane of protection cap, be arranged and lead
The soldered ball that the other end of electric line is connected.
Carrying tablet in step 512, the first plane of separation protection cap.
It should be noted that the explanation in the present embodiment with same steps in other embodiments or concept, is referred to
Description in other embodiments, details are not described herein again.
The camera module that the embodiment of the present invention is provided carries out processing and in the first plane of protection cap to protection cap
First area at form optical lens structure, the then first area of the second plane opposite with the first plane in protection cap
Place's setting optical sensing chip；In this way, making optical lens structure in protection cap, and light is placed on protection cap fixed position
Sensing chip is learned, without being packaged to optical lens structure, direct packing protection lid and optical sensing chip solve existing
The problem of needing to carry out secondary encapsulation between optical sensing chip and lens group in technology, reduces production process, reduce camera shooting
The thickness of head mould group, meanwhile, it is capable to improve the density of integration packaging.
An embodiment of the present invention provides a kind of production methods of camera module, can be applied to the corresponding embodiments of Fig. 8
In the camera module of offer, with reference to shown in Figure 23, this approach includes the following steps：
Step 601 provides protection cap.
Step 602 carries out protection cap processing and forms optical lens at the first area of the first plane of protection cap
Structure.
Wherein, protection cap and optical lens structure are integrated.
Step 603 forms groove on the first area of the second plane of protection cap.
The default position of step 604, the second area in the second plane of protection cap in addition to first area and first area
Install conducting wire.
Step 605 provides carrying tablet.
The first plane and carrying tablet of protection cap are fit together, and protection cap are fixed on carrying tablet by step 606
On.
Optical sensing chip is arranged in step 607 in groove.
Wherein, optical sensing chip is used to acquire optical information close to the face of optical lens structure.
Step 608 is linked together conducting wire and the pin of optical sensing chip using pad.
At least one default chip is arranged in step 609 on face of the optical sensing chip far from optical lens structure.
Wherein, at least one default chip is connect with optical sensing chip；The function and optical sensing chip of default chip
Function it is different.
Filled media is arranged on the second area of the second plane of the groove and protection cap of protection cap in step 610, filling
Dielectric overlay conducting wire.
Step 611, according to preset requirement in the predetermined position of the second area of the second plane of protection cap, be arranged and lead
The soldered ball that the other end of electric line is connected.
Step 612, protection cap the second plane first area filled media surface, setting with conducting wire connect
The metal wiring layer connect.
Step 613, the predeterminated position setting soldered ball in metal wiring layer.
Carrying tablet in step 614, the first plane of separation protection cap.
It should be noted that the explanation in the present embodiment with same steps in other embodiments or concept, is referred to
Description in other embodiments, details are not described herein again.
The camera module that the embodiment of the present invention is provided carries out processing and in the first plane of protection cap to protection cap
First area at form optical lens structure, the then first area of the second plane opposite with the first plane in protection cap
Place's setting optical sensing chip；In this way, making optical lens structure in protection cap, and light is placed on protection cap fixed position
Sensing chip is learned, without being packaged to optical lens structure, direct packing protection lid and optical sensing chip solve existing
The problem of needing to carry out secondary encapsulation between optical sensing chip and lens group in technology, reduces production process, reduce camera shooting
The thickness of head mould group meanwhile, it is capable to improve the density of integration packaging, and increases the output signal interface of optical sensing chip.
It should be understood by those skilled in the art that, the embodiment of the present invention can be provided as method, system or computer program
Product.Therefore, the shape of hardware embodiment, software implementation or embodiment combining software and hardware aspects can be used in the present invention
Formula.Moreover, the present invention can be used can use storage in the computer that one or more wherein includes computer usable program code
The form for the computer program product implemented on medium (including but not limited to magnetic disk storage and optical memory etc.).
The present invention be with reference to according to the method for the embodiment of the present invention, the flow of equipment (system) and computer program product
Figure and/or block diagram describe.It should be understood that can be realized by computer program instructions every first-class in flowchart and/or the block diagram
The combination of flow and/or box in journey and/or box and flowchart and/or the block diagram.These computer programs can be provided
Instruct the processor of all-purpose computer, special purpose computer, Embedded Processor or other programmable data processing devices to produce
A raw machine so that the instruction executed by computer or the processor of other programmable data processing devices is generated for real
The device for the function of being specified in present one flow of flow chart or one box of multiple flows and/or block diagram or multiple boxes.
These computer program instructions, which may also be stored in, can guide computer or other programmable data processing devices with spy
Determine in the computer-readable memory that mode works so that instruction generation stored in the computer readable memory includes referring to
Enable the manufacture of device, the command device realize in one flow of flow chart or multiple flows and/or one box of block diagram or
The function of being specified in multiple boxes.
These computer program instructions also can be loaded onto a computer or other programmable data processing device so that count
Series of operation steps are executed on calculation machine or other programmable devices to generate computer implemented processing, in computer or
The instruction executed on other programmable devices is provided for realizing in one flow of flow chart or multiple flows and/or block diagram one
The step of function of being specified in a box or multiple boxes.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the scope of the present invention.
Claims (16)
1. a kind of camera module, which is characterized in that the camera module includes：Protection cap and optical sensing chip；Wherein：
Optical lens structure, the protection cap and the optical lens are provided at the first area of first plane of the protection cap
Mirror structure is integrated；
The optical sensing chip is arranged in the first area of the second plane of the protection cap；Wherein, second plane is
The face opposite with first plane in the protection cap, the central point of the first area of first plane and described second flat
The central point of the first area in face is on the same straight line vertical with first plane.
2. camera module according to claim 1, which is characterized in that be arranged in the protection cap fluted；Wherein：
The groove is arranged in the first area of the second plane of the protection cap；
The optical sensing chip is arranged in the groove；Wherein, the optical sensing chip is close to the optical lens knot
The face of structure is for acquiring optical information.
3. camera module according to claim 2, which is characterized in that be additionally provided at least one default core in the groove
Piece；Wherein：
At least one default chip is arranged on the face far from the optical lens structure of the optical sensing chip；
Wherein, at least one default chip is connect with the optical sensing chip；The function of the default chip with it is described
The function of optical sensing chip is different.
4. camera module according to claim 2 or 3, which is characterized in that the camera module further includes：Conductor wire
Road and pad；Wherein：
The second area in the second plane of the protection cap and the default position of the first area is arranged in the conducting wire
It sets；Wherein, the second area is the region in addition to the first area in the second plane of the protection cap；
One end of the pad is connect with the pin of the optical sensing chip；The other end of the pad and the conducting wire
Connection.
5. camera module according to claim 4, which is characterized in that the camera module further includes：Filled media；
Wherein：
The filled media is filled in the groove；
The filled media, for chip to be fixed in the groove；Wherein, the chip includes the optical sensing core
Piece, or including the optical sensing chip and at least one default chip.
6. camera module according to claim 5, which is characterized in that
The filled media is additionally arranged on the second area of the second plane of the protection cap, and covers the protection cap
The conducting wire on the second area of second plane.
7. camera module according to claim 6, which is characterized in that the camera module further includes：Soldered ball；Its
In：
The soldered ball is arranged in the filled media of the second area of second plane, and connects with the conducting wire
It connects.
8. camera module according to claim 7, which is characterized in that the camera module further includes：Metal line
Layer；Wherein：
The metal wiring layer is arranged in the filled media of the first area of the second plane of the protection cap；
The metal wiring layer is connect with the conducting wire；
The soldered ball is additionally arranged on the metal wiring layer.
9. a kind of production method of camera module, which is characterized in that the production method includes：
Protection cap is provided；
Processing is carried out to the protection cap and forms optical lens structure at the first area of the first plane of the protection cap；
Wherein, the protection cap and the optical lens structure are integrated；
Optical sensing chip is set in the protection cap at the first area of the second plane opposite with first plane；Its
In, the central point of the first area of the central point of the first area of first plane and second plane is with described first
On the vertical same straight line of plane.
10. the production method of camera module according to claim 9, which is characterized in that described in the protection cap
Optical sensing chip is set at the first area of the second plane, including：
Groove is formed on the first area of the second plane of the protection cap；
The optical sensing chip is set in the groove.
11. the production method of camera module according to claim 10, which is characterized in that described to be set in the groove
The optical sensing chip is set, including：
Carrying tablet is provided；
First plane of the protection cap is fit together with the carrying tablet, and the protection cap is fixed on carrying tablet
On；
The optical sensing chip is set in the groove；Wherein, the optical sensing chip is close to the optical lens knot
The face of structure is for acquiring optical information.
12. the production method of the camera module according to claim 10 or 11, which is characterized in that described in the groove
Before the interior setting optical sensing chip, further include：
The default position of second area and the first area in the second plane of the protection cap in addition to the first area
Install conducting wire.
13. according to the method for claim 11, which is characterized in that the method further includes：
The conducting wire and the pin of the optical sensing chip are linked together using pad.
14. the production method of camera module according to claim 11, which is characterized in that the method further includes：
At least one default chip is set on the face of the optical sensing chip far from the optical lens structure；
Wherein, at least one default chip is connect with the optical sensing chip；The function of the default chip with it is described
The function of optical sensing chip is different.
15. the production method of the camera module according to claim 13 or 14, which is characterized in that the method is also wrapped
It includes：
Filled media, the filling are set on the second area of the second plane of the groove and protection cap of the protection cap
Conducting wire described in dielectric overlay；
According to preset requirement in the predetermined position of the second area of the second plane of the protection cap, it is arranged and the conductor wire
The soldered ball that the other end on road is connected；
Detach the carrying tablet in the first plane of the protection cap.
16. the production method of camera module according to claim 15, which is characterized in that the separation protection cap
The first plane on the carrying tablet before, further include：
On the surface of the filled media of the first area of the second plane of the protection cap, what setting was connect with the conducting wire
Metal wiring layer；
In the predeterminated position of the metal wiring layer, soldered ball is set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710096767.2A CN108461510A (en) | 2017-02-22 | 2017-02-22 | A kind of camera module and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710096767.2A CN108461510A (en) | 2017-02-22 | 2017-02-22 | A kind of camera module and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108461510A true CN108461510A (en) | 2018-08-28 |
Family
ID=63220692
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710096767.2A Pending CN108461510A (en) | 2017-02-22 | 2017-02-22 | A kind of camera module and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111200701A (en) * | 2018-11-20 | 2020-05-26 | 中芯集成电路（宁波）有限公司 | Camera shooting assembly and packaging method thereof, lens module and electronic equipment |
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| WO2015087599A1 (en) * | 2013-12-09 | 2015-06-18 | ソニー株式会社 | Image pickup unit, lens barrel and portable device |
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| CN1169034A (en) * | 1996-06-14 | 1997-12-31 | Lg半导体株式会社 | Charge coupled device (CCD) semiconductor chip package |
| US20110115974A1 (en) * | 2004-02-20 | 2011-05-19 | Vidyadhar Sitaram Kale | Integrated lens and chip assembly for a digital camera |
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