CN108450036A - 摄像元件安装用基板及摄像装置 - Google Patents
摄像元件安装用基板及摄像装置 Download PDFInfo
- Publication number
- CN108450036A CN108450036A CN201680072511.1A CN201680072511A CN108450036A CN 108450036 A CN108450036 A CN 108450036A CN 201680072511 A CN201680072511 A CN 201680072511A CN 108450036 A CN108450036 A CN 108450036A
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- Prior art keywords
- photographing element
- circuit board
- inorganic substrate
- element mounting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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Abstract
摄像元件安装用基板具备无机基板、布线基板和接合材料。无机基板具有在上表面的中央区域安装摄像元件的摄像元件安装部。无机基板在包围摄像元件安装部的周边区域具有向上方***的突起部。布线基板被设置于无机基板的上表面,是包围摄像元件安装部、并且下表面的一部分与突起部相接的框状。布线基板在上表面具有透镜安装部。接合材料被设置于无机基板与布线基板之间。
Description
技术领域
本发明涉及安装摄像元件、例如CCD(Charge Coupled Device,电荷耦合器件)型或CMOS(Complementary Metal Oxide Semiconductor,互补金属氧化物半导体)型等的摄像元件的布线基板及摄像装置。
背景技术
如JP特开2008-187554号公报所公开的,公知由无机基板与布线基板构成的摄像元件安装用基板。无机基板与布线基板一般来说通过接合材料来接合。再有,通过将摄像元件及透镜支架安装于该摄像元件安装用基板,从而成为摄像装置。
发明内容
-发明所要解决的技术问题-
然而,将布线基板与无机基板接合的接合材料的厚度容易产生偏差,有时在布线基板与无机基板设置更高精度的平行度颇为困难。由此,有时获取安装于布线基板上的透镜支架与无机基板的平行度颇为困难。
-用于解决技术问题的手段-
本发明的一种形态所涉及的摄像元件安装用基板具备无机基板、布线基板和接合材料。无机基板具有在上表面的中央区域安装摄像元件的摄像元件安装部。无机基板在包围摄像元件安装部的周边区域具有向上方***的突起部。布线基板被设置于无机基板的上表面,是包围摄像元件安装部、并且下表面的一部分与突起部相接的框状。布线基板在上表面具有透镜安装部。接合材料被设置于无机基板与布线基板之间。
本发明的一种形态所涉及的摄像装置,具备:被安装到摄像元件安装用基板的无机基板的摄像元件安装部的摄像元件;以及被固定在布线基板的透镜安装部的透镜支架。
附图说明
图1(a)是表示本发明的第1实施方式所涉及的摄像元件安装用基板及摄像装置的外观的俯视图,图1(b)是图1(a)的A-A线所对应的纵剖视图。
图2(a)是表示本发明的第1实施方式的其他形态所涉及的摄像装置的外观的俯视图,图2(b)是图2(a)的B-B线所对应的纵剖视图。
图3是表示本发明的第1实施方式的其他形态所涉及的电元件安装用基板的外观的仰视图。
图4(a)及图4(b)是表示本发明的第1实施方式的其他形态所涉及的电元件安装用基板的外观的仰视图。
图5(a)是表示本发明的第2实施方式所涉及的摄像元件安装用基板及摄像装置的外观的俯视图,图5(b)是图5(a)的C-C线所对应的纵剖视图。
图6(a)是表示本发明的第3实施方式所涉及的摄像元件安装用基板及摄像装置的外观的俯视图,图6(b)是图6(a)的D-D线所对应的纵剖视图。
图7(a)是表示本发明的第4实施方式所涉及的摄像元件安装用基板及摄像装置的外观的俯视图,图7(b)是图7(a)的E-E线所对应的纵剖视图。
图8(a)及图8(b)是表示本发明的第4实施方式的其他形态所涉及的摄像元件安装用基板的外观的仰视图。
具体实施方式
以下,参照附图对本发明的几个例示性的实施方式进行说明。其中,在以下的说明中,将摄像元件被安装于摄像元件安装用基板、并在摄像元件安装用基板的上表面接合了盖体的结构设为摄像装置。摄像元件安装用基板及摄像装置虽然将任意的方向设为上方或者下方都可以,但为了方便,定义正交坐标系xyz,并且把z方向的正侧设为上方。
(第1实施方式)
参照图1~图4来说明本发明的第1实施方式中的摄像装置21、及摄像元件安装用基板1。本实施方式中的摄像装置21虽然具备摄像元件安装用基板1、摄像元件10和透镜支架19,但图1省略透镜支架19。
摄像元件安装用基板1具备无机基板4、布线基板2和接合材料15。无机基板4具有在上表面的中央区域安装摄像元件10的摄像元件安装部11。无机基板4在包围摄像元件安装部11的周边区域具有向上方***的突起部4a。布线基板2被设置于无机基板4的上表面,是包围摄像元件安装部11并且下表面的一部分与突起部4a相接的框状。布线基板2在上表面具有透镜安装部。接合材料15被设置于无机基板4与布线基板2之间。
摄像元件安装用基板1具有无机基板4,其具有在上表面安装摄像元件10的摄像元件安装部11。
构成无机基板4的材料可使用例如具有较高的导热率的材料。作为形成无机基板4的材料,虽然可列举例如氮化铝质烧结体、氮化硅质烧结体或硅(Si)等,但也可以是其他材料。另外,作为形成无机基板4的材料、例如在为氮化铝质晶体或氮化硅质晶体等的情况下,无机基板4也可以是由多个绝缘层构成的层叠体。再有,无机基板4也可以使导电层覆盖于由多个绝缘层构成的层叠体的表面。
再有,作为无机基板4的材料也能使用金属材料,作为金属材料,虽然可列举例如不锈钢(SUS)、Fe-Ni-Co合金、42合金、铜(Cu)、科瓦铁镍钴合金(kovar)或铜合金等,但也可以是其他金属材料。例如,在布线基板2为具有约5×10-6/℃~10×10-6/℃的热膨胀率的氧化铝质烧结体的情况下,无机基板4能够采用具有约10×10-6/℃的热膨胀率的不锈钢(SUS304)。该情况下,由于布线基板2与无机基板4的热收缩差/热膨胀差减小,故能够降低摄像元件安装部11的变形。结果,能够抑制摄像元件10与透镜的光轴偏移,能够良好地维持图像的鲜明度。还有,在无机基板4包含金属材料时,其材料为非磁性体,由此能够降低无机基板4磁化的状况。由此,能够降低无机基板4妨碍透镜驱动等的外部设备的工作的状况。
摄像元件安装用基板1具有被设置于无机基板4的上表面且为包围摄像元件安装部11的框状的布线基板。再有,布线基板具有在上表面具有透镜安装部的布线基板2。
布线基板2由绝缘层构成,也可以在上表面设置摄像元件连接用焊盘3。再有,虽然未图示,但也可以在布线基板2的下表面设置多个与外部电路或无机基板4连接的外部电路连接用电极。构成布线基板2的绝缘层的材料例如能使用电绝缘性陶瓷或树脂(塑料)等。
作为形成布线基板2的绝缘层的材料而能使用的电绝缘性陶瓷,可列举例如氧化铝质烧结体、莫来石质烧结体、碳化硅质烧结体、氮化铝质烧结体、氮化硅质烧结体或玻璃陶瓷烧结体等,但也可以是其他材料。
作为形成布线基板2的绝缘层的材料而能使用的树脂,可列举例如环氧树脂、聚酰亚胺树脂、丙烯酸树脂、酚醛树脂或氟系树脂等。作为氟系树脂,虽然可列举例如聚酯树脂或四氟乙烯树脂,但也可以是其他材料。
形成布线基板2的绝缘层也可以将包含前述材料的绝缘层多个上下层叠来形成。形成布线基板2的绝缘层既可以如图1~图2所示那样由3层的绝缘层形成,也可以由单层、2层或4层以上的绝缘层来形成。再有,也可以如图1~图2所示的例子那样,使形成布线基板2的绝缘层的开口部的大小不同并在上表面形成台阶部,在台阶部设置多个摄像元件连接用焊盘3。
再有,也可以在布线基板2的上表面、侧面或下表面设置外部电路连接用电极。外部电路连接用电极是对布线基板2与外部电路基板、或者摄像装置21与外部电路基板进行电连接的部件。
也可以在布线基板2的内部设置形成于绝缘层间的内部布线、将内部布线彼此上下连接的贯通导体。这些内部布线或贯通导体也可以露出于布线基板2的表面。也可以通过该内部布线或贯通导体而将外部电路连接用电极及摄像元件连接用焊盘3电连接。
在布线基板2包括电绝缘性陶瓷的情况下,摄像元件连接用焊盘3、外部电路连接用电极、内部布线及贯通导体,包括钨(W)、钼(Mo)、锰(Mn)、银(Ag)或者铜(Cu)或含有从这些金属中被选出的至少1种以上的金属材料的合金等。再有,在布线基板2包含树脂的情况下,摄像元件连接用焊盘3、外部电路连接用电极、内部布线及贯通导体包含铜(Cu)、金(Au)、铝(Al)、镍(Ni)、钼(Mo)或者钛(Ti)或含有从这些金属被选出的至少1种以上的金属材料的合金等。
也可以在摄像元件连接用焊盘3、外部电路连接用电极、内部布线及贯通导体的露出表面设置镀层。根据该结构,可保护摄像元件连接用焊盘3、外部电路连接用电极、内部布线及贯通导体的露出表面并抑制氧化。再有,根据该结构,能够经由引线接合等的连接构件13而将摄像元件连接用焊盘3与摄像元件10良好地电连接。镀层例如也可以覆盖厚度0.5~10μm的Ni镀层、或依次覆盖该Ni镀层及厚度0.5~3μm的金(Au)镀层。
摄像元件安装用基板1具有被设置在无机基板4与布线基板2之间的接合材料15。其中,接合材料15的上下方向的厚度被被设定为突起部4a从无机基板4的上表面向上方***的大小、例如被设定为10μm~200μm。
作为构成接合材料15的材料例如能使用热固化性树脂或钎料等。作为形成接合材料15的材料而被使用的热固化性树脂,可列举例如双酚A型液状环氧树脂等。再有,作为形成接合材料15的材料而被使用的钎料,可列举例如焊料、铅、玻璃等。
接合材料15既可以具有导电性、也可以不具有导电性。作为具有导电性的接合材料15,例如存在银环氧、焊料、各向异性导电树脂(ACF)或各向异性导电薄膜(ACP)等。接合材料15具有导电性,由此能够对布线基板2与无机基板4进行电接合。例如通过使布线基板2与无机基板4以与接地电极相同的电位进行电接合,从而能够使无机基板4具有将摄像元件10与来自外部的噪声隔离开的屏蔽的作用。再有,作为不具有导电性的接合材料15,例如有热固化性树脂等。
无机基板4在包围摄像元件安装部11的周边区域具有向上方***的突起部4a,突起部4a与布线基板2的下表面的一部分相接。
一般来说,摄像装置21被要求高像素化。为了满足该要求,在无机基板4上的摄像元件10与布线基板2上的透镜支架19之间谋求较高的平行度。然而,将布线基板2与无机基板4接合的接合材料15的厚度容易产生偏差,在布线基板2与无机基板4设置更高精度的平行度颇为困难。由此,较难获取被安装于布线基板2上的透镜支架19与无机基板4的平行度,甚至担心图像品质的劣化。相对于此,通过在无机基板4设置包围摄像元件安装部11、且与布线基板2的下表面的一部分相接的突起部4a,从而能够使得布线基板2与无机基板4之间的厚度恒定。由此,无论接合材料15的厚度的偏差如何,都能够降低布线基板2与无机基板4的倾斜度。由此,能够在布线基板2与无机基板4设置更高精度的平行度。换言之,在被搭载于无机基板4的摄像元件10与被设置于布线基板2的上表面的透镜支架19之间能够使倾斜度产生的状况降低。
突起部4a设置于无机基板4的上表面。此时,无机基板4的下表面、即在俯视透视下与突起部4a重叠的位置既可以是平坦的,也可以在与突起部4a重叠的位置设置凹部。通过在无机基板4的下表面在与突起部4a重叠的位置设置凹陷部,从而在从下表面观察摄像装置21的情况下也能作为确认方向性等的索引来使用。再有,在仰视中由于能目视辨认突起部4a,故也能够作为安装无机基板4的工序的对准标记来使用。
突起部4a既可以在无机基板4的上表面接合同种材料或不同种材料来设置,也可以利用后述的方法等通过将无机基板4堆高来形成。
再有,也可以在俯视下将突起部4a设置于摄像元件安装部11的左右对称位置。由此,在安装无机基板4之际能够在左右的平衡良好的状态下进行安装。由此,能够使得透镜支架19的透镜与被设置在无机基板4的上表面的摄像元件10的平行度更加良好。
如图1所示的例子,无机基板4的外缘也可以在俯视下比布线基板2的外缘更位于外侧。无机基板4的外缘在俯视下比布线基板2的外缘更位于外侧,由此利用无机基板4易于托挡落下等的冲击,能够进一步降低对布线基板2施加冲击。
再有,如图2所示,无机基板4的外缘也可以与布线基板2的外缘相比在俯视下更位于内侧或位于相同的位置。无机基板4的外缘与布线基板2的外缘相比在俯视下更位于内侧或位于相同的位置,由此能够实现摄像装置21的小型化。再有,在将摄像装置21连接于外部模块时能够降低在无机基板4的端部将布线等损坏的可能性。
图3~图4是仰视本实施方式中的摄像装置21的图。
如图3所示的例子,突起部4a也可以多个设置于无机基板4的上表面,至少设置于摄像元件安装部11的两侧。由此,在布线基板2偏心的情况下、或即便布线基板2与无机基板4接合时的来自上表面的应力产生了差,在无机基板4与布线基板2之间倾斜度也会变得不易产生。由此,与将突起部4a设置于1处或夹着摄像元件10的角部进行设置的情况相比较,能够更高地保持无机基板4与布线基板2的平行度。再有,如图4(a)所示的例子,突起部4a在无机基板4的上表面设置多个、且分别设置于摄像元件10的3条边的近旁,由此在布线基板2偏心的情况下、或者即便布线基板2与无机基板4接合时的来自上表面的应力产生了差,在无机基板4与布线基板2之间倾斜度也会进一步变得不易产生。由此,能够更高地保持无机基板4与布线基板2的平行度。
再有,如图4(b)所示的例子,突起部4a也可以是相连成将摄像元件安装部11围起来的框状。由此,能够更高地保持无机基板4与布线基板2的平行度。
图2表示未将透镜支架19省略的摄像装置21。
摄像装置21具备摄像元件安装用基板1、摄像元件10和透镜支架19。摄像元件10被安装于摄像元件安装用基板1的无机基板4的摄像元件安装部11。透镜支架19被固定于布线基板2的透镜安装部。
摄像元件10被安装于摄像元件安装用基板1的无机基板4的摄像元件安装部11。摄像元件10例如可采用CCD(Charge Coupled Device)型或CMOS(Complementary MetalOxide Semiconductor)型等。其中,摄像元件10也可以经由粘接材料16而被配置于无机基板4的上表面。该粘接材料16例如能使用银环氧或热固化性树脂等。
摄像装置21为了密封,则也可以在布线基板2的上表面设置盖体12。盖体12例如为平板形状。再有,盖体12可采用玻璃材料等的透明度较高的构件。盖体12例如借助包含热固化性树脂或低熔点玻璃或金属成分等的钎料等的接合构件14而被接合于布线基板2的上表面。
透镜支架19被固定于布线基板2的透镜安装部。
如图2所示的例子,摄像装置21具有透镜支架19,从而能够辅助摄像。再有,通过具有透镜支架19,从而能够进一步提高气密性或降低来自外部的应力直接地被施加于摄像元件安装用基板1的状况。
透镜支架19例如是包含树脂等的壳体、和包含树脂、液体、玻璃或水晶等的透镜被接合到1个以上的壳体的结构。再有,透镜支架19也可以附加透镜进行上下左右的驱动的驱动装置等并与布线基板2电连接。这样,通过如本发明那样在布线基板2与无机基板4之间的倾斜度小的摄像元件安装用基板1设置透镜支架19,从而能够使被设置于透镜支架19的透镜与摄像元件10之间的倾斜度降低,能够降低图像品质的劣化。
另外,在图2所示的例子中虽然未图示,但透镜支架19也可以在俯视的情况下在4方向的至少一条边设置开口部。而且,也可以从透镜支架19的开口部***外部电路并与布线基板2电连接。再有,透镜支架19的开口部也可以在外部电路与布线基板2电连接后用树脂等密封材料等将开口部的间隙封闭,由此摄像装置21的内部被气密。
摄像装置21也可以设置在突起部4a与透镜支架19的脚部在平面透视下重叠的位置。由此,能够使得透镜支架19的透镜与设置在无机基板4的上表面的摄像元件10的平行度更加良好。
接着,对本实施方式的摄像元件安装用基板1及摄像装置21的制造方法的一例进行说明。其中,下面所示的制造方法的一例是布线基板2采用了多连片布线基板的制造方法。
(1)首先,形成构成布线基板2的陶瓷生片。例如,在获得作为氧化铝(Al2O3)质烧结体的布线基板2的情况下,作为烧结辅助材料而向Al2O3的粉末添加二氧化硅(SiO2)、氧化镁(MgO)或氧化钙(CaO)等的粉末,进一步添加适当的粘合剂、溶剂及增塑剂,接着将这些材料的混合物捏合,以形成浆状。然后,通过以往公知的刮刀成膜法或压延成膜法等成型方法,获得多连片用的陶瓷生片。
另外,在布线基板2例如包含树脂的情况下,采用可成型为给定形状的金属模具,利用转移模塑法或注射模塑法等来成型,由此能够形成布线基板2。
再有,布线基板2也可以是例如玻璃环氧树脂那样使树脂含浸于包含玻璃纤维的基材而得的材料。该情况下,使环氧树脂的前体含浸于包含玻璃纤维的基材,在给定的温度下使该环氧树脂前体热固化,由此可形成布线基板2。
(2)接着,通过丝网印刷法等,在上述(1)的工序中得到的陶瓷生片上对成为摄像元件连接用焊盘3、外部电路连接用电极、内部布线及贯通导体的部分涂敷或填充金属膏。
该金属膏是通过在前述的包含金属材料的金属粉末中加入适当的溶剂及粘合剂并进行混合搅拌,从而调制为适度的粘度而制作的。其中,为了提高与布线基板2的接合强度,金属膏当然也可以包含玻璃或陶瓷。
(3)接下来,通过金属模具等对前述的生片进行加工。在成为布线基板2的生片的中央部形成开口部。
(4)接着,将成为各绝缘层的陶瓷生片层叠并进行加压,由此制作成为布线基板2的陶瓷生片层叠体。再有,在本工序中,例如也可以在成为各个层的生片设置贯通孔,将两者层叠并进行加压,由此制作成为布线基板2的生片层叠体。
(5)接下来,在约1500~1800℃的温度下对该陶瓷生片层叠体进行烧成,获得排列了多个布线基板2的多连片布线基板。其中,通过该工序,前述的金属膏和成为布线基板2的陶瓷生片同时被烧成,由此成为摄像元件连接用焊盘3、外部电路连接用电极、内部布线及贯通导体。
(6)接着,将进行烧成而得到的多连片布线基板断开为多个布线基板2。在该断开中,能够采用:沿着成为布线基板2的外缘的部位在多连片布线基板预先形成分割槽,沿着该分割槽使之断裂并进行分割的方法;或通过切片法等,沿着成为布线基板2的外缘的部位进行切断的方法等。其中,分割槽虽然能够通过在烧成后利用切片装置比多连片布线基板的厚度小地切入来形成,但也可以通过将刀具刀刃压抵于多连片布线基板用的陶瓷生片层叠体、或借助切片装置比陶瓷生片层叠体的厚度小地切入来形成。
(7)接下来,准备被接合于布线基板2的下表面的无机基板4。无机基板4在包含金属材料的情况下,通过对包含金属材料的板材进行以往公知的采用镀处理金属模具的冲压加工或蚀刻加工等来制作。再有,即便在由其他材料构成的情况下也能同样地通过适合于各自的材质的冲压加工等来制作。还有,在无机基板4包含作为金属材料的Fe-Ni-Co合金、42合金、Cu或铜合金等金属的情况下,也可以在其表面覆盖镍镀层及金镀层。由此,能够有效地抑制无机基板4的表面的氧化腐蚀。
再有,在无机基板4包含电绝缘性陶瓷等、且表面印刷有导体图案的情况下,同样也可以在其表面覆盖镍镀层及金镀层。由此,能够有效地抑制无机基板4的表面的氧化腐蚀。
另外,此时采用金属模具等从成为突起部4a的位置的下表面侧开始按压,由此能够在无机基板4的上表面设置突起部4a。再有,也能在无机基板4的上表面准备成为突起部4a的单个体,经由钎料等进行接合,由此制作突起部4a。例如,突起部4a从无机基板4的上表面起向上方***5μm~100μm。再有,突起部4a也可以从无机基板4的上表面起向上方***10μm~200μm。而且,多个突起部4a彼此形成为上下方向的差为50μm以下。还有,突起部4a既可以在俯视下为圆形状、并以5μm~100μm的直径形成,也可以是宽度为5μm~200μm的框状或矩形状。
(8)接着,经由接合材料15来接合布线基板2与无机基板4。接合材料15是利用丝网印刷法或分配法等将膏状的热固化性树脂(粘接构件)涂敷于布线基板2或无机基板4的任一方或两方的接合面。而且,在使热固化性树脂干燥后,在已将布线基板2与无机基板4重叠的状态下,使之通过隧道式的气氛炉或烤炉等,进行加压并进行加热,由此使接合材料热固化,使布线基板2与无机基板4牢固地粘接。
接合材料15是通过以下方法而得到的,即在例如包含双酚A型液状环氧树脂、双酚F型液状环氧树脂、酚醛清漆型液状树脂等的主剂中添加包含球状的氧化硅等的填充材料、以四氢邻苯二甲酸酐等的酸酐等为主的固化剂及作为着色剂的碳粉末等,采用离心式搅拌机等进行混合或混合搅拌,由此形成膏状。
再有,作为接合材料15,除此之外还能够使用例如在双酚A型环氧树脂、双酚A型改性环氧树脂、双酚F型环氧树脂、酚醛清漆型环氧树脂、甲阶酚醛清漆型环氧树脂、特殊的酚醛清漆型环氧树脂、酚衍生物环氧树脂、双酚骨架型环氧树脂等的环氧树脂中添加了咪唑系、胺系、磷系、肼系、咪唑加合物系、胺加合物系、阳离子聚合系或双氰胺系等的固化剂而得的材料等。
(9)接着,将摄像元件10安装于无机基板4的摄像元件安装部11。摄像元件10通过引线接合等而与布线基板2电接合。另外,此时当然也可以在摄像元件10或无机基板4设置粘接材料16等并固定于无机基板4。还有,也可以在将摄像元件10安装到无机基板4的摄像元件安装部后,利用接合材料来接合盖体12。
(10)接下来,将透镜支架19安装于布线基板2的上表面。此时,既可以利用导电性的接合材料来接合设置在布线基板2的上表面的电极和透镜支架19,并使其电气地导电,也可以利用非导电性的接合材料来接合透镜支架19。
如上所述,通过组装布线基板2与无机基板4,从而能够制作摄像装置21。通过上述(1)~(10)的工序,能得到摄像装置21。其中,上述(1)~(10)的工序顺序并未被指定。
(第2实施方式)
接下来,参照图5对本发明的第2实施方式的摄像元件安装用基板1及摄像装置21进行说明。在本实施方式中的摄像元件安装用基板1及摄像装置21中,与第1实施方式的摄像元件安装用基板1及摄像装置21的不同之处在于,突起部4a在剖视的情况下被接合材料15包围。其中,本实施方式中的摄像装置21虽然具备摄像元件安装用基板1、摄像元件10和透镜支架19,但图5将透镜支架19省略。
图5所示的本实施方式中,被设置在无机基板4的上表面的突起部4a在剖视的情况下被接合材料15包围。由此,即便是例如突起部4a作为单个体而被接合到无机基板4的上表面的构造,通过被接合材料15包围,从而也能够降低无机基板4与突起部4a偏离的状况。再有,能够在突起部4a与布线基板2之间捕集尘土等。
再有,在图5所示的例子中,摄像元件10与布线基板2通过连接构件13(引线接合)而被电接合,突起部4a在俯视的情况下位于连接构件13的端部近旁。一般来说,在对连接构件13进行连接之际局部性地向布线基板2传较强的应力导。由于该应力,担心布线基板2产生裂缝、或布线基板2变形而在上表面产生倾斜度。此时,突起部4a与连接构件13在俯视情况下位于较近的位置,由此能够从下表面支承布线基板2。由此,能够降低对连接构件13进行连接时的应力所引起的布线基板2的裂缝的产生。还有,通过支承布线基板2,从而能够使布线基板2的变形降低,能够降低布线基板2的上表面产生倾斜度的状况。由此,能够使布线基板2的上表面的透镜支架19和摄像元件10的平行度更加良好。
(第3实施方式)
接下来,参照图6对本发明的第3实施方式的摄像元件安装用基板1及摄像装置21进行说明。在本实施方式中的摄像元件安装用基板1及摄像装置21中,与第1实施方式的摄像元件安装用基板1及摄像装置21的不同之处在于,突起部4a在剖视的情况下被设置于摄像元件安装部11的周围。其中,本实施方式中的摄像装置21虽然具备摄像元件安装用基板1、摄像元件10和透镜支架19,但图6将透镜支架19省略。
图6所示的本实施方式中,无机基板4的突起部4a在俯视的情况下被设置于摄像元件安装部11的周围。由此,例如即便在涂敷接合材料15的工序中涂敷量产生偏差、接合的工序中接合材料15被压出至摄像元件安装部11侧,突起部4a也会成为障碍,由此能够降低接合材料15向摄像元件安装部11内部飞溅的状况。由此,在安装摄像元件10的工序中,能够降低由于飞溅出的接合材料15而导致摄像元件10无法安装、或被倾斜安装的状况。再有,此时突起部4a被相连地设置成将摄像元件安装部11的周围围起来、或被设置成多个突起部4a彼此的间隙减小,由此能够进一步降低接合材料15向摄像元件安装部11飞溅的状况。
再有,在本实施方式中,能够缩小对置的突起部4a彼此的距离。一般来说会担心由于安装摄像元件10的工序或加热的工序而使得无机基板4的摄像元件安装部11挠曲。如本实施方式那样通过缩小对置的突起部4a彼此间的距离,从而能够使对置的突起部4a与突起部4a之间的挠曲量降低。
(第4实施方式)
接着,参照图7及图8对本发明的第4实施方式的摄像元件安装用基板1及摄像装置21进行说明。在本实施方式中的摄像元件安装用基板1及摄像装置21中,与第1实施方式的摄像元件安装用基板1及摄像装置21的不同之处在于,突起部4a在俯视的情况下被设置于无机基板4的外缘部。其中,本实施方式中的摄像装置21虽然具备摄像元件安装用基板1、摄像元件10和透镜支架19,但图7将透镜支架19省略。
图7所示的本实施方式中,突起部4a设置于无机基板4的外缘部。由此在对无机基板4施加了落下时等的应力时,突起部4a成为支点,从而能够降低无机基板4产生挠曲等应力的状况。由此,能够降低无机基板4产生断裂、或裂缝等的状况。再有,能够降低无机基板4产生变形的状况,能够更加良好地保持被安装在无机基板4的上表面的摄像元件10与透镜支架19的平行度。
再有,既可以如图8(a)所示的例子那样将突起部4a设置成从无机基板4的外缘向外侧突出,也可以如图8(b)所示的例子那样在无机基板4的外缘设置切口,突出部4a设置于切口的内侧,若如图8(a)所示的例子那样将突出部4a设置成从无机基板4的外缘向外侧突出,则能够简化在无机基板4设置突出部4a的工序。进一步,在无机基板4以多个相连的形状形成的情况下,能够利用突出部4a彼此将相邻的无机基板4连接并加以保持。这样,通过利用突出部4a彼此将相邻的无机基板4连接,从而能够进一步简化将多个相连的无机基板4分割为单片的工序。还有,如图8(b)所示的例子那样,通过在无机基板4的外缘设置切口、并在切口的内部设置突出部4a,从而能够使无机基板4的大小成为最小限度。由此,即便在因工序误差等而使无机基板4的安装位置偏离开的情况下,也能够降低在俯视的情况下无机基板4的外缘自布线基板2的外缘起向外侧突出的状况。由此,摄像装置21的小型化成为可能。
另外,若如图8(a)及(b)所示的例子那样将突起部4a设置在3个部位以上,则能够更加良好且简易地保持无机基板4与布线基板2的平行度。
此外,如图7(b)所示的例子那样,也可以使突起部4a的厚度在剖视的情况下比无机基板4的厚度小。通过使突起部4a的厚度比其他无机基板4的厚度小,从而使突出部4a在剖视的情况下易于向上表面侧弯曲。再有,如图8(a)所示的例子那样将突出部4a设置于外周部,如上述在多个无机基板4通过突出部4a彼此而被连接保持时,在分割为单片的工序中能够更容易地进行分割。
作为图7所示的例子那样的形成突出部4a的方法,例如能够通过采用金属模具等从成为突出部4a的无机基板4的下表面侧进行按压,从而使突出部4a从无机基板4突出。
-符号说明-
1····摄像元件安装用基板
2····布线基板
3····摄像元件连接用焊盘
4····无机基板
4a…突起部
10…摄像元件
11…摄像元件安装部
12…盖体
13…连接构件
14…接合构件
15···接合材料
16···粘接剂
19···透镜支架
21···摄像装置。
Claims (6)
1.一种摄像元件安装用基板,其特征在于,具备:
无机基板,其具有在上表面的中央区域安装摄像元件的摄像元件安装部、和在包围所述摄像元件安装部的周边区域向上方***的突起部;
布线基板,其设置于所述无机基板的上表面,是包围所述摄像元件安装部并且下表面的一部分与所述突起部相接的框状,该布线基板在上表面具有透镜安装部;以及
接合材料,其被设置在所述无机基板与所述布线基板之间。
2.根据权利要求1所述的摄像元件安装用基板,其特征在于,
所述突起部在所述无机基板的上表面被设置有多个,且至少被设置于所述摄像元件安装部的两侧。
3.根据权利要求2所述的摄像元件安装用基板,其特征在于,
所述突起部被设置于所述摄像元件安装部的左右对称位置。
4.根据权利要求1所述的摄像元件安装用基板,其特征在于,
在所述无机基板的下表面,在与所述突起部重叠的位置设置有凹部。
5.根据权利要求1~4中任一项所述的摄像元件安装用基板,其特征在于,
所述突起部被设置于所述无机基板的外缘部。
6.一种摄像装置,其特征在于,具备:
权利要求1~5中任一项所述的摄像元件安装用基板;
被安装在所述摄像元件安装用基板的所述无机基板的所述摄像元件安装部的摄像元件;以及
被固定在所述布线基板的所述透镜安装部的透镜支架。
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JP2007165486A (ja) * | 2005-12-12 | 2007-06-28 | Shinko Electric Ind Co Ltd | 放熱板及び半導体装置 |
CN102893593A (zh) * | 2010-06-28 | 2013-01-23 | 京瓷株式会社 | 布线基板及摄像装置以及摄像装置模块 |
JP2015146380A (ja) * | 2014-02-03 | 2015-08-13 | 株式会社ニコン | 撮像ユニット及び撮像装置 |
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JP2002231851A (ja) * | 2001-02-01 | 2002-08-16 | Sanken Electric Co Ltd | 回路基板及びこの回路基板を用いた混成集積回路 |
JP4184125B2 (ja) * | 2002-04-26 | 2008-11-19 | 富士フイルム株式会社 | 撮像素子チップモジュール |
TWI234884B (en) * | 2003-12-31 | 2005-06-21 | Advanced Semiconductor Eng | Image sensor package and method for manufacturing the same |
KR100652554B1 (ko) * | 2005-01-07 | 2006-12-01 | 재단법인서울대학교산학협력재단 | 에스아이-범프를 이용한 마더보드 및 그 제조 방법 |
JP5010244B2 (ja) * | 2005-12-15 | 2012-08-29 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置 |
JP5595066B2 (ja) * | 2009-03-25 | 2014-09-24 | 京セラ株式会社 | 撮像装置および撮像モジュール |
US9480133B2 (en) * | 2010-01-04 | 2016-10-25 | Cooledge Lighting Inc. | Light-emitting element repair in array-based lighting devices |
KR101387295B1 (ko) * | 2012-05-14 | 2014-04-18 | 삼성전기주식회사 | 카메라 모듈의 제조 장치 및 방법 |
JP5928222B2 (ja) * | 2012-07-30 | 2016-06-01 | 株式会社ソシオネクスト | 半導体装置および半導体装置の製造方法 |
TW201409621A (zh) * | 2012-08-22 | 2014-03-01 | Hon Hai Prec Ind Co Ltd | 影像感測器模組及取像模組 |
JP2014170893A (ja) * | 2013-03-05 | 2014-09-18 | Taiyo Yuden Co Ltd | カメラモジュール |
JP2015185622A (ja) * | 2014-03-22 | 2015-10-22 | 京セラ株式会社 | 電子素子実装用基板及び電子装置 |
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2016
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- 2016-12-14 JP JP2017558063A patent/JP6574854B2/ja active Active
- 2016-12-14 WO PCT/JP2016/087264 patent/WO2017110627A1/ja active Application Filing
- 2016-12-14 CN CN201680072511.1A patent/CN108450036B/zh active Active
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JPH1050928A (ja) * | 1996-05-27 | 1998-02-20 | Toshiba Corp | 半導体装置およびその製造方法 |
JP2007165486A (ja) * | 2005-12-12 | 2007-06-28 | Shinko Electric Ind Co Ltd | 放熱板及び半導体装置 |
CN102893593A (zh) * | 2010-06-28 | 2013-01-23 | 京瓷株式会社 | 布线基板及摄像装置以及摄像装置模块 |
JP2015146380A (ja) * | 2014-02-03 | 2015-08-13 | 株式会社ニコン | 撮像ユニット及び撮像装置 |
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WO2017110627A1 (ja) | 2017-06-29 |
US20180376041A1 (en) | 2018-12-27 |
JP6574854B2 (ja) | 2019-09-11 |
CN108450036B (zh) | 2023-03-28 |
JPWO2017110627A1 (ja) | 2018-10-18 |
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