CN108449896B - Electronic device and method for manufacturing the same - Google Patents
Electronic device and method for manufacturing the same Download PDFInfo
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- CN108449896B CN108449896B CN201810203485.2A CN201810203485A CN108449896B CN 108449896 B CN108449896 B CN 108449896B CN 201810203485 A CN201810203485 A CN 201810203485A CN 108449896 B CN108449896 B CN 108449896B
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- hinge
- hinge fixing
- fixing base
- electronic device
- shell
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0226—Hinges
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0247—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings comprising more than two body parts
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Signal Processing (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The present disclosure provides an electronic device. The electronic device includes: a hinge, and a first body and a second body connected by the hinge; wherein the first body includes: a housing formed by stamping; and the hinge fixing structure is positioned on the surface of the shell and comprises a hinge fixing base which is formed on the surface of the shell in an injection molding mode, wherein the hinge is fixedly connected with the first body through the hinge fixing structure. The disclosure also provides a preparation method of the electronic device.
Description
Technical Field
The present disclosure relates to an electronic device and a method of manufacturing the same.
Background
With the continuous development of electronic product technology, new technology is continuously added to the preparation of electronic equipment to improve the appearance accuracy and stability of the electronic equipment.
In the process of implementing the invention, the inventor finds that at least the following problems exist in the prior art: the hinge fixing structure of the existing electronic equipment is manufactured independently and then is welded on an electronic equipment shell in a pressing mode, the method causes large fixing tolerance of the hinge fixing structure due to process limitation of a pressing and welding technology, the requirement of product precision is difficult to guarantee, a redundant space can be reserved for fixing the hinge in consideration of the tolerance generally, and the hinge fixing structure is inevitably not beneficial to the miniaturization design of the electronic equipment.
Disclosure of Invention
A first aspect of the present disclosure provides an electronic device. The electronic device includes a hinge and first and second bodies connected by the hinge. Wherein, first body includes: a housing formed by stamping; the hinge fixing structure is positioned on the surface of the shell and comprises a hinge fixing base which is formed on the surface of the shell in an injection molding mode; the hinge is fixedly connected with the first body through the hinge fixing structure.
Optionally, the hinge fixing structure further comprises one or more positioning pillars integrally formed with the hinge fixing base to define a position of the hinge with respect to the first body.
Optionally, the surface of the housing, on which the hinge fixing base is injection molded, has a nano-scale micro-porous structure, so that a part of the hinge fixing base is injection molded in the micro-pores of the nano-scale micro-porous structure.
Optionally, the hinge fixing structure further comprises one or more threaded sleeves to enable the hinge to be in threaded connection with the first body; and, the above-mentioned hinge fixed base injection moulding is in the outward flange of the thread bush.
Optionally, the housing comprises a metal material, and the hinge fixing base comprises a rubber material.
A second aspect of the present disclosure provides a method of manufacturing an electronic device including a hinge, and a first body and a second body connected by the hinge. The preparation method of the electronic equipment comprises the following steps: stamping and forming the shell of the first body; and a hinge fixing base for injection molding the hinge fixing structure on the surface of the shell. The hinge is fixedly connected with the first body through the hinge fixing structure.
Optionally, the hinge fixing structure includes: one or more positioning posts integrally formed with the hinge securing base to define a position of the hinge relative to the first body.
Optionally, in the above method for manufacturing an electronic device, before the injection molding of the hinge fixing base of the hinge fixing structure on the surface of the housing, the method further includes: pretreating the shell to enable the surface of the shell to form a nano-scale microporous structure.
Optionally, the hinge fixing structure further comprises one or more threaded sleeves to enable the hinge to be in threaded connection with the first body; and the hinge fixing base of the hinge fixing structure is injection molded on the outer edge of the threaded sleeve.
Optionally, the housing comprises a metal material, and the hinge fixing base comprises a rubber material.
Drawings
For a more complete understanding of the present disclosure and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:
fig. 1 schematically illustrates an application scenario diagram to which an electronic device and a method for manufacturing the same according to an embodiment of the present disclosure are applied;
fig. 2 schematically shows a partial structural view of a first body in an electronic device according to an embodiment of the present disclosure;
FIG. 3A schematically illustrates a first angle of the hinge securing structure with reference to the first body of FIG. 2;
FIG. 3B schematically illustrates a second angle of the hinge securing structure with reference to the first body of FIG. 2;
FIG. 4 is a schematic diagram illustrating a partial structure of a mold used in injection molding to form the hinge fixing structure shown in FIGS. 3A-3B according to an embodiment of the present disclosure;
FIG. 5 schematically illustrates a microscopic enlarged view of where the hinge securing base joins the first body housing in accordance with an embodiment of the present disclosure;
FIG. 6 schematically illustrates a method of making an electronic device according to an embodiment of the disclosure;
fig. 7 schematically illustrates a method of making an electronic device according to another embodiment of the present disclosure.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The terms "comprises," "comprising," and the like, as used herein, specify the presence of stated features, steps, operations, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, or components.
All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art unless otherwise defined. It is noted that the terms used herein should be interpreted as having a meaning that is consistent with the context of this specification and should not be interpreted in an idealized or overly formal sense.
Where a convention analogous to "at least one of A, B and C, etc." is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., "a system having at least one of A, B and C" would include but not be limited to systems that have a alone, B alone, C alone, a and B together, a and C together, B and C together, and/or A, B, C together, etc.). Where a convention analogous to "A, B or at least one of C, etc." is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., "a system having at least one of A, B or C" would include but not be limited to systems that have a alone, B alone, C alone, a and B together, a and C together, B and C together, and/or A, B, C together, etc.). It will be further understood by those within the art that virtually any disjunctive word and/or phrase presenting two or more alternative terms, whether in the description, claims, or drawings, should be understood to contemplate the possibilities of including one of the terms, either of the terms, or both terms. For example, the phrase "a or B" should be understood to include the possibility of "a" or "B", or "a and B".
The embodiment of the disclosure provides an electronic device and a preparation method thereof. The electronic device includes a hinge, and a first body and a second body connected by the hinge. The first body comprises a stamped shell and a hinge fixing structure located on the surface of the shell. The hinge fixing structure comprises a hinge fixing base which is formed on the surface of the shell in an injection molding mode, and the hinge is fixedly connected with the first body through the hinge fixing structure.
According to the embodiment of the disclosure, compared with the conventional electronic device, the electronic device of the disclosure is formed by a stamping process and an injection molding process, specifically, the base in the hinge fixing structure is injection molded on the surface of the shell, rather than pressure welding in the conventional process, so that the fixing error of the fixing base and the first body shell is at least partially reduced, the redundant space reserved for fixing the hinge can be reduced, and the miniaturization design of the electronic device is facilitated; the shell of the first body is formed in a punch mode, and compared with a traditional milling forming process, the manufacturing cost of the electronic device can be reduced.
Fig. 1 schematically illustrates an application scenario of an electronic device and a manufacturing method thereof according to an embodiment of the present disclosure.
As shown in fig. 1, the application scenario includes a terminal device 100.
The terminal device 100 may be various electronic devices having a hinge structure.
The terminal device 100 may be a portable device having a display screen, such as a netbook, a portable computer, a smart phone, a smart watch, or an electronic dictionary.
The terminal device 100 may have installed thereon various communication client applications, such as a shopping-like application, a web browser application, a search-like application, an instant messaging tool, a mailbox client, social platform software, etc. (by way of example only).
As shown in fig. 1, the terminal device 100 includes a first body 110, a second body 120, and a hinge 130 connecting the first body 110 and the second body 120. The number and position of the hinges 130 can be set according to actual requirements.
The first body 110 and the second body 120 may have hinge slots, and when the first body 110 and the second body 120 are connected via the hinge 130, the hinge slots of the two bodies are located correspondingly, and the hinge 130 is located at the hinge slot.
The first body 110 may have a housing and a display screen, for example, and the housing is used for embedding and fixing the display screen.
The first body may further have a hinge fixing structure through which the hinge is connected with the first body. Similarly, the second body 120 may be provided with a similar hinge fixing structure to connect the hinge and the second body.
The hinge fixing structure comprises a hinge fixing base, a threaded sleeve and the like, wherein the hinge fixing base limits the connecting position of the hinge and the first body/the second body, and the threaded sleeve is used for enabling the first body and/or the second body to be detachably connected with the hinge through bolts, screws and the like.
According to an embodiment of the present disclosure, the hinge 130 may include a rotation shaft, for example, so that the first body can rotate around the rotation shaft to change an angle between the first body and the second body. The angle between the first body and the second body may be, for example, 0 ° to 360 °.
Specifically, in the prior art, in order to connect the hinge 130 and the first body 110, a prepared hinge fixing base is usually press-welded on the housing of the first body, so that the hinge is connected with the first body through the hinge fixing base. However, due to process limitations of the pressure welding technique, the position of the hinge fixing base on the housing of the first body has a certain tolerance, typically +/-0.1mm, from the edge of the hinge slot remote from the hinge fixing structure.
Furthermore, the hinge fixing base of the first body may be riveted with a positioning column for defining the position of the hinge in the hinge slot, but it should be noted that, due to the limitation of the conventional riveting process, the positioning column has a certain riveting tolerance with respect to the edge of the hinge fixing base, the riveting tolerance is about +/-1.5mm, which undoubtedly brings an error to the position of the hinge in the hinge slot.
The tolerance of the two tolerances is about 0.25mm, so when designing an electronic device, the width of the hinge slot is usually designed to be larger than the length of the hinge due to the tolerance, so as to reserve redundant space for fixing the hinge, which inevitably does not facilitate the miniaturization of the electronic device. For example, when the hinge is disposed behind the hinge slot in the prior art, the gap between the hinge and the edge of the hinge slot is about 0.8 ± 0.5 mm.
In order to reduce such accumulated tolerance, a milling process is generally adopted in the prior art to integrally form the housing of the first body and the hinge fixing base, and the milling process requires a long milling time, so that the milling cost is high.
It should be understood that the type of terminal equipment in fig. 1 is merely illustrative. Any type of terminal equipment may be present, depending on implementation needs.
Fig. 2 schematically shows a partial structural diagram of a first body in an electronic device according to an embodiment of the present disclosure.
In order to avoid the above tolerance and reduce the cost, according to an embodiment of the present disclosure, the first body 110 in fig. 1 may include a housing 111 and a hinge fixing structure 112 on a surface of the housing as shown in fig. 2.
Wherein, the housing 111 has a hinge slot 1110, so that the hinge 130 shown in reference to fig. 1 is disposed in the hinge slot 1110, so that the first body 110 of the electronic device can rotate relative to the second body 120 through the hinge 130.
The shell 111 is formed by stamping, that is, an external force is applied to the plate by the press and the die, so that the plate is deformed or separated, and the shape of the shell as shown in fig. 2 is obtained. The shell is formed by punching, so that the shell has the advantages of thin wall, light weight, good rigidity, high surface quality and the like.
The material of the housing 111 may be ABS engineering plastic, metal material, carbon fiber material, etc., wherein the metal material may be aluminum alloy, magnesium aluminum alloy, titanium alloy, etc. with excellent strength, scratch resistance and light weight.
The hinge fixing structure 112 includes a hinge fixing base, which is injection molded on the surface of the housing 111 shown in fig. 2.
The hinge fixing base can be made of plastic, such as ABS, PP, PVC, PC, etc.
Specifically, the hinge fixing structure of the housing surface of the first body 110 includes a hinge fixing base formed on the housing surface by an injection molding technique through a matching mold.
According to an embodiment of the present disclosure, the hinge fixing structure may be further disposed on a housing surface of the second body 120, so that the hinge is connected with the second body through the hinge fixing structure.
In the embodiment, the hinge fixing base on the surface of the shell is formed by adopting the injection molding technology, and the machining error is the tolerance of a mould adopted in the injection molding technology and is about +/-0.05mm, so that the machining error can be obviously reduced compared with a pressure welding process, the miniaturization design of electronic equipment is facilitated, the milling and washing process is avoided, and the preparation cost can be effectively reduced compared with a milling technology.
FIG. 3A schematically illustrates a first angle of the hinge securing structure with reference to the first body of FIG. 2; FIG. 3B schematically illustrates a second angle of the hinge securing structure with reference to the first body of FIG. 2; fig. 4 schematically shows a partial structural view of a mold used in injection molding to form the hinge fixing structure shown in fig. 3A to 3B according to an embodiment of the present disclosure.
As shown in fig. 3A-3B, the hinge fixing structure 112 includes a hinge fixing base 1120. It is to be understood that the shape of the hinge fixing base 1120 described with reference to fig. 3A to 3B is merely an example, and the present disclosure is not limited thereto, and those skilled in the art may provide different shapes of hinge fixing bases according to different types and even different models of electronic devices.
When the hinge fixing base 1120 as shown with reference to fig. 3A to 3B is formed using an injection molding technique, it may be performed using, for example, an injection mold 400 as shown in fig. 4.
Specifically, in the injection molding process, after the housing 111 formed by press molding in fig. 2 is fixed to the injection mold 400, a molten material (material of the hinge fixing base) is injected by pressure into a region of the surface of the injection mold corresponding to the position of the hinge fixing base, and after the injection operation is completed, the structure shown in fig. 2 is obtained by cooling, releasing, and the like, in which the hinge fixing structure is the structure shown in fig. 3A to 3B.
According to an embodiment of the present disclosure, as shown in fig. 3A to 3B, the hinge fixing structure 112 may further include one or more positioning pillars 1121.
Accordingly, the hinge 130 in fig. 1 should be provided with a positioning hole corresponding to the positioning pillar 1121, and when the hinge 130 is placed in the hinge slot 1110 in fig. 2, the positioning pillar 1121 should be inserted into the positioning hole, so as to define the position of the hinge 130 in the hinge slot 1110 relative to the first body 110.
It is understood that positioning post 1121 is also formed by injection molding. Specifically, the injection mold 400 shown in fig. 4 has one or more positioning grooves 410. When the hinge fixing structure is formed by injection molding, molten material is simultaneously injected into the positioning groove 410, and after cooling and releasing, as shown in fig. 3A to 3B, one or more positioning posts 1121 integrally formed with the hinge fixing base 1120 can be obtained.
Since the positioning post 1121 of the hinge fixing structure of the first body, which is used for limiting the position of the hinge in the hinge slot, is integrally formed when the hinge fixing base 1120 is injection molded, there is no riveting tolerance, and the distance tolerance between the positioning post and the edge of the hinge fixing structure is the tolerance of the injection mold.
In summary, the hinge fixing structure has no accumulated tolerance, the overall tolerance is the tolerance of the injection mold, which is about 0.05mm, and compared with 0.25mm in the conventional process, the machining tolerance is greatly reduced, so that after the hinge is arranged in the hinge slot, the gap between the hinge and the hinge slot can be reduced from 0.8 ± 0.5mm in the prior art to 0.6 ± 0.3mm, thereby beautifying the appearance of the electronic device.
According to an embodiment of the present disclosure, as shown in fig. 3A to 3B, the hinge fixing structure 112 may further include one or more threaded sleeves 1122 in addition to the hinge fixing base 1120 and the one or more positioning pillars 1121, so that the hinge 130 and the first body 110 in fig. 1 may be connected by threads, bolts, and the like.
To avoid introducing additional tolerances and improving the stability of the connection of the threaded sleeves to the hinge mounting base, the threaded sleeves may be injection molded by fixing the one or more threaded sleeves 1122 to an injection mold prior to forming the hinge mounting base using injection molding techniques.
As shown in fig. 3B, the screw sleeve 1122 protrudes from the surface of the hinge fixing base and extends through the hinge fixing base, so that the hinge is fixedly connected to the first body through the engagement of the screw sleeve and the screw or bolt.
As shown in fig. 4, the injection mold 400 should include one or more annular grooves 420, the inner ring diameter of the annular groove 420 matching the inner diameter of the threaded sleeve.
Before the housing 111 and the injection mold 400 formed by stamping in fig. 2 are placed in an injection molding apparatus, the one or more thread sleeves 1122 are sleeved outside the inner ring of the one or more annular grooves 420. Then, the hinge fixing base in the hinge fixing structure can be injection molded on the outer edge of the threaded sleeve, so that the threaded sleeve is fixedly connected with the hinge fixing base.
The screw is screwed into the threaded sleeve to test the tension and torsion force of the screw, so that the connection stability of the threaded sleeve and the hinge fixing base can be indirectly judged.
The tension and torsion force test report shows that each screw can meet the harsh requirements that the tension is greater than 20kgf and the torsion is greater than 5kgf, which shows that the threaded sleeve and the hinge fixing base in the hinge fixing structure obtained by the method can be stably connected and have strong stability. Therefore, when the hinge is fixedly connected with the first body through the screw, the stability of the connection between the hinge and the first body can be ensured even if the screw and the threaded sleeve with small height are adopted due to the stable connection between the threaded sleeve and the hinge fixing base, so that the light and thin design of the electronic equipment is facilitated.
Fig. 5 schematically shows a microscopic enlarged view of a joint of the hinge fixing base and the first body case according to an embodiment of the present disclosure.
According to an embodiment of the present disclosure, in order to improve the texture of the electronic device, referring to fig. 2, the housing 111 of the first body 110 may be made of a metal material, and in consideration of the processing cost and the light weight of the overall structure of the electronic device, the hinge fixing structure may be formed by using an injection molding technique, and the hinge fixing base 1120 in fig. 3A to 3B may be made of a plastic material.
Considering that if the plastic material is directly injected on the surface of the common metal material, the defects that the combination of the metal material and the plastic material is poor and the metal and the plastic cannot be stably connected exist, therefore, if the plastic material is directly injected on the surface of the punch-formed shell to form the hinge fixing structure, the hinge fixing structure and the shell are not stably connected, and after the first body rotates for many times relative to the second body, the situation that the first body cannot be positioned at a stable angle relative to the second body may exist.
According to the embodiment of the present disclosure, in order to avoid the above possible defects, the stamped and formed housing surface may have a nano-scale micro-porous structure, so that when the hinge fixing base is formed by using an injection molding process, a part of the hinge fixing base is injection molded in the micro-pores of the nano-scale micro-porous structure.
Specifically, the hinge fixing structure shown with reference to fig. 3A to 3B may be prepared using an nmt (nano moving technology) process. The NMT process is a method of combining metal (e.g., a housing of the first body in the embodiment of the disclosure) and plastic (e.g., a hinge fixing structure in the embodiment of the disclosure) by nanotechnology.
Specifically, the method for preparing the hinge fixing structure in the housing of the first body comprises the following steps: firstly, performing nano treatment on the surface of a shell to form a nano-scale microporous structure on the surface of the shell; then, the melted material (plastic) of the hinge fixing base is directly injected to the metal surface (the surface of the shell) by adopting an injection molding process, so that the shell and the hinge fixing structure can be integrally molded.
The NMT technology can remove rust and grease on the thin metal surface (the surface of the shell), surface treatment is carried out through special solution, the surface of the shell has small holes, and when the shell is placed into an injection mold for injection molding, plastic can enter the small holes for curing, so that the purpose of firmly connecting the shell and the hinge fixing structure is achieved.
As shown in fig. 5, after the hinge fixing structure is prepared by NMT technology in the embodiment of the present disclosure, a microscopic enlarged view of a joint between the hinge fixing base and the housing of the first body is shown, and it can be seen from the figure that a part of the boundary 510 of the hinge fixing base enters into a small hole of the boundary 520 of the housing of the first body, so that the hinge fixing base is tightly connected and strongly combined with the housing of the first body, and the defect that the connection between the housing and the hinge fixing base is not firm due to the fact that the hinge fixing structure is directly formed on the surface of the housing by injection molding technology in the prior art is overcome.
Fig. 6 schematically illustrates a method of making an electronic device according to an embodiment of the disclosure.
Another aspect of the present disclosure also provides a method of manufacturing an electronic device, wherein the electronic device includes a hinge, and a first body and a second body connected by the hinge, and according to an embodiment of the present disclosure, the method of manufacturing an electronic device may be used to manufacture the electronic device as described with reference to fig. 1.
As shown in fig. 6, according to an embodiment of the present disclosure, the preparation method may include operations S610 to S620. In operation S610, press-molding a case of a first body; in operation S620, a hinge fixing base of a hinge fixing structure is injection molded on a surface of the housing. The manufacturing method of the electronic equipment combines the punch forming process and the injection molding process without adopting the pressure welding and milling process in the traditional process, so that the manufacturing error can be at least partially reduced, and the specific lower cost can be realized.
Therefore, the first body comprises a shell and the hinge fixing structure, and the hinge is fixedly connected with the first body through the hinge fixing structure. According to an embodiment of the present disclosure, the first body prepared by the above-described method for preparing an electronic device may be, for example, a structure shown with reference to fig. 2. And will not be described in detail herein.
According to an embodiment of the present disclosure, the hinge fixing structure may be detachably connected to the first body, for example, by screws, bolts, or the like.
According to an embodiment of the present disclosure, the hinge fixing structure further includes: and one or more positioning columns which are integrally formed with the hinge fixing base, correspondingly, one or more positioning holes are arranged on the hinge, and when the hinge is fixedly connected with the first body through the hinge fixing structure, the positioning columns are matched with the positioning holes, so that the position of the hinge relative to the first body is limited.
Wherein, because this one or more reference column is with hinge fixed baseplate integrated into one piece, consequently compare in traditional preparation method, compare reference column and hinge fixed baseplate riveting, can effectively avoid the extra tolerance that the riveting brought for the tolerance of whole electronic equipment first body and hinged joint is injection mold's tolerance, thereby is favorable to beautifying electronic equipment's outward appearance.
According to an embodiment of the present disclosure, the structural schematic diagram of the hinge fixing structure with the positioning column may refer to the structure shown in fig. 3A to 3B, and details are not repeated here.
According to an embodiment of the present disclosure, the hinge fixing structure may further include one or more thread bushings for screwing the hinge with the first body. Specifically, the threaded sleeve may be inserted into a hinge fixing base of the hinge fixing structure, and partially protrudes from the hinge fixing base.
When the hinge fixing structure is formed by injection molding, the injection mold shown in fig. 4 may be adopted, and one or more thread sleeves are respectively sleeved outside the inner ring of the annular groove 420, so that the hinge fixing base may be injection molded on the outer edge of the one or more thread sleeves, so that the one or more thread sleeves and the hinge fixing base are integrally molded, and the fastening connection of the thread sleeves and the hinge fixing base is ensured.
In view of the development of electronic devices becoming thinner and lighter with the development of science and technology, the requirements for the height dimension of the screws or bolts connecting the hinge and the first body are more and more extreme, while the strength requirement (screw tension requirement of 20kgf) cannot be met by the conventional hot-melt screw process after plastic molding, the strength problem can be solved by the conventional stamping and welding process, but the requirement for the electronic devices is difficult to be guaranteed in terms of precision due to the limitation of the precision of the welding process.
According to the electronic equipment formed by the method, the hinge fixing base and the threaded sleeve can be stably connected, and tests show that when the hinge and the first body are connected with the screw or the bolt through the threaded sleeve in a matched mode, the screw or the bolt can meet the harsh requirements that the tensile force is greater than 20kgf and the torsion force is greater than 5kgf, so that even if the threaded sleeve and the screw with small height are combined, the stability of connection between the hinge and the first body can be guaranteed, the light and thin design of the electronic equipment is facilitated, and the defects in the prior art are overcome.
Fig. 7 schematically illustrates a method of making an electronic device according to another embodiment of the present disclosure.
As shown in fig. 7, the method for manufacturing an electronic device according to the embodiment of the present disclosure includes operation S710 in addition to operations S610 to S620. The operation S710 is performed after the operation S610 and before the operation S620.
In operation S710, the shell is pretreated such that a nano-scale micro-pore structure is formed on the surface of the shell.
According to the embodiment of the disclosure, in order to improve the texture of the electronic device, the housing of the first body may be made of a metal material, and in consideration of the processing cost and the light and thin structure of the electronic device, the hinge fixing structure may be formed by an injection molding technique using a plastic material.
Considering that the plastic material is directly injected on the surface of the metal material, the defects that the bonding property of the metal material and the plastic material is poor and the metal and the plastic cannot be stably connected exist. Therefore, before performing operation S620, the housing formed by stamping is preprocessed to form a nano-scale micro-porous structure on the surface of the housing, and when performing operation S620, the plastic material melted by injection molding is injected into the nano-scale micro-porous structure, so that a part of the hinge fixing base is injection molded in the nano-scale micro-porous structure, thereby ensuring the stable connection between the housing and the hinge fixing structure.
Specifically, the first body in the electronic device may be prepared by using an NMT process, the prepared first body may be as shown in fig. 2, correspondingly, the hinge fixing structure of the first body may be as shown in fig. 3A to 3B, and the microscopic enlarged view of the joint of the prepared hinge fixing base and the housing of the first body may be as shown in fig. 5, as can be seen from fig. 5, a part of the boundary 510 of the hinge fixing base enters the small hole of the boundary 520 of the housing of the first body, so that the hinge fixing base is tightly connected and strongly bonded with the housing of the first body, and the defect that the housing and the hinge fixing base are not firmly connected due to the fact that the hinge fixing structure is directly formed on the surface of the housing by using an injection molding technology in the prior art is overcome.
In summary, the manufacturing method of the electronic device according to the embodiment of the present disclosure can integrate the advantages of the punch forming process and the injection molding process, realize the optimization of the quality of the electronic device at a lower cost, and greatly improve the strength and the precision of the manufactured electronic device compared with the conventional process.
Those skilled in the art will appreciate that various combinations and/or combinations of features recited in the various embodiments and/or claims of the present disclosure can be made, even if such combinations or combinations are not expressly recited in the present disclosure. In particular, various combinations and/or combinations of the features recited in the various embodiments and/or claims of the present disclosure may be made without departing from the spirit or teaching of the present disclosure. All such combinations and/or associations are within the scope of the present disclosure.
While the disclosure has been shown and described with reference to certain exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents. Accordingly, the scope of the present disclosure should not be limited to the above-described embodiments, but should be defined not only by the appended claims, but also by equivalents thereof.
Claims (10)
1. An electronic device comprising a hinge, and a first body and a second body connected by the hinge, the first body comprising:
a housing formed by stamping; and
a hinge fixing structure on the surface of the housing, comprising:
the hinge fixing base is formed on the surface of the shell in an injection molding mode; and
the thread sleeve partially protrudes out of the surface of the hinge fixing base and extends into and penetrates through the hinge fixing base,
the hinge is in threaded connection with the first body through the threaded sleeve, and the hinge fixing base is formed on the outer edge of the threaded sleeve in an injection molding mode through an injection mold for fixing the threaded sleeve.
2. The electronic device of claim 1, wherein the hinge securing structure further comprises:
one or more positioning posts integrally formed with the hinge securing base to define a position of the hinge relative to the first body.
3. The electronic device of claim 1, wherein:
the surface of the shell, on which the hinge fixing base is injection molded, is provided with a nano-scale microporous structure, so that part of the hinge fixing base is injection molded in micropores of the nano-scale microporous structure.
4. The electronic device of claim 1, wherein:
the thread bush is one or more thread bushes.
5. The electronic device of claim 1, wherein the housing comprises a metal material and the hinge securing base comprises a rubber material.
6. A method of manufacturing an electronic device comprising a hinge, and a first body and a second body connected by the hinge, wherein the method comprises:
stamping and forming the shell of the first body; and
a hinge fixing base of the hinge fixing structure is injection molded on the surface of the shell by adopting an injection mold for fixing the threaded sleeve so that the hinge fixing base is injection molded on the outer edge of the threaded sleeve,
the hinge fixing structure further comprises a threaded sleeve, wherein the threaded sleeve partially protrudes out of the surface of the hinge fixing base and extends into the hinge fixing base to penetrate through the hinge fixing base, and the hinge is connected with the first body through threads.
7. The method of claim 6, wherein the hinge securing structure further comprises:
one or more positioning posts integrally formed with the hinge securing base to define a position of the hinge relative to the first body.
8. The method of claim 6, further comprising, prior to injection molding a hinge securing base of a hinge securing structure on the housing surface:
pretreating the shell to enable the surface of the shell to form a nano-scale microporous structure.
9. The method of claim 6, wherein:
the thread bush is one or more thread bushes.
10. The method of claim 6, wherein the housing comprises a metal material and the hinge securing base comprises a rubber material.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810203485.2A CN108449896B (en) | 2018-03-12 | 2018-03-12 | Electronic device and method for manufacturing the same |
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| CN201810203485.2A CN108449896B (en) | 2018-03-12 | 2018-03-12 | Electronic device and method for manufacturing the same |
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| CN108449896B true CN108449896B (en) | 2020-12-18 |
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| CN108449896A (en) | 2018-08-24 |
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