CN108447961A - A kind of paster type light emitting type and electronic equipment - Google Patents
A kind of paster type light emitting type and electronic equipment Download PDFInfo
- Publication number
- CN108447961A CN108447961A CN201810341039.8A CN201810341039A CN108447961A CN 108447961 A CN108447961 A CN 108447961A CN 201810341039 A CN201810341039 A CN 201810341039A CN 108447961 A CN108447961 A CN 108447961A
- Authority
- CN
- China
- Prior art keywords
- metallic support
- light emitting
- type light
- colloid
- paster
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000084 colloidal system Substances 0.000 claims abstract description 46
- 239000002184 metal Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000004568 cement Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004297 night vision Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention belongs to LED production technical fields, more particularly to a kind of paster type light emitting type and electronic equipment, chip illuminator is directly arranged on the first metallic support in the paster type light emitting type, and it is connect with the second metallic support by conducting wire, and it is set on plastic shell frequently with chip illuminator in the prior art, compared to the prior art, the present invention abandons using plastic shell, chip illuminator is directly placed on electric conductor, keep the connection of chip illuminator and electric conductor more firm, it is bad to overcome the light emitting diode contacts often occurred in the prior art, not the problem of light emitting diode does not work.In addition, compared to the prior art, the paster type light emitting type in the present invention is only made of metal, colloid and chip, simple in structure, colloid shell sealing metallic support, conducting wire and chip illuminator by the way of press mold encapsulation are integrally formed, stable structure, production efficiency are high.
Description
Technical field
The invention belongs to LED (Light Emitting Diode, light emitting diode) production technical fields more particularly to one
Kind paster type light emitting type and electronic equipment.
Background technology
Currently, since infrared LED has many advantages, such as that long lifespan, low energy consumption, it is fast to start, it is widely used in security protection video camera
The fields such as the night vision illumination of industry.
Include the plastic shell 10 that a center has recessed cup as shown in Figure 1, existing infrared adopting surface mounted LED, outside plastic cement
10 lower section of shell is provided with two pieces of conductive plates 20, and one of conductive plate 20 is connect with power supply positive electrode, another piece and power supply negative electricity
Pole connects.Single-chip illuminator 30 is provided in the recessed cup of plastic shell 10, and the end of two pieces of conductive plates 20 extends into
To be electrically connected with single-chip illuminator 30 in recessed cup, wherein the single-chip illuminator 30 is directly led with one of in recessed cup
The electrical connection of battery plate 20 is fixed, and the bonding wire point on a conducting wire 40 to another piece of conductive plate 20 is connected from the chip light emitting body 30
On, make the single-chip illuminator 30 connect to form access with two pieces of conductive plates 20 respectively.Chip is covered by spherical surface colloid 50
Illuminator 30.This structure is complicated due to comprising metal, plastic cement and colloid, and it is bad to be susceptible to interior contact.
Invention content
The technical problems to be solved by the invention are to provide a kind of paster type light emitting type and electronic equipment, it is intended to be solved
Paster type light emitting type in the prior art is complicated, the problem of being susceptible to poor contact.
In order to solve the above technical problems, the invention is realized in this way, a kind of patch type for mating plate imaging technique is sent out
Optical diode, including：
Metallic support, conducting wire, colloid shell and at least one chip illuminator, the metallic support include mutually separating
First metallic support and the second metallic support, first metallic support and the second metallic support respectively with the positive and negative electrode of power supply
Connection；
The chip illuminator is set on the first metallic support, and the chip illuminator passes through the conducting wire and the second gold medal
Belong to holder connection, the colloid shell wraps up the metallic support, the conducting wire and the chip illuminator.
Further, the upper surface of first metallic support offers bowl-type concave structure, and the chip illuminator is set
It is placed in the bowl-type concave structure.
Further, the surface of the bowl-type concave structure is reflective surface.
Further, the both ends of the metallic support are respectively provided with an oval through slot, the corresponding portion of the colloid shell
Divide and is wrapped up across the oval through slot with being formed to the metallic support.
Further, the both ends of the metallic support expose to the colloid shell.
Further, the both ends for exposing to the metallic support of colloid shell are bent downward, and with the colloid shell
Bottom is concordant.
Further, the part for exposing to the colloid shell of first metallic support is bent to form the first package section
With the second package section, the part for exposing to the colloid shell of second metallic support is bent to form third package section and the
Four wrap up sections, the first package section, the second package section, third package section and the 4th package section formation pair
The package space of the bottom of the colloid shell, and the second package section and the 4th package section and the colloid shell
Bottom is concordant.
Further, the end of the metallic support being encapsulated in colloid shell offers fin.
Further, the material of the colloid shell is translucent material, and the exterior contour at top is in spherical crown shape.
The present invention also provides a kind of electronic equipment, including above-mentioned paster type light emitting type.
Compared with prior art, the present invention advantageous effect is：Paster type light emitting type in the present invention, chip shine
Body is directly arranged on the first metallic support, and is connect with the second metallic support by conducting wire, and in the prior art frequently with crystalline substance
Piece illuminator is set on plastic shell, and compared to the prior art, the present invention abandons using plastic shell, chip illuminator direct
It is placed on electric conductor, keeps the connection of chip illuminator and electric conductor more firm, overcome the hair often occurred in the prior art
The problem of optical diode poor contact, light emitting diode does not work.In addition, compared to the prior art, the patch type hair in the present invention
Optical diode is only made of metal, colloid and chip, simple in structure, colloid shell sealing metal branch by the way of press mold encapsulation
Frame, conducting wire and chip illuminator are integrally formed, stable structure, and production efficiency is high.
Description of the drawings
Fig. 1 is the structural schematic diagram of the paster type light emitting type of the prior art；
Fig. 2 is the structural schematic diagram of paster type light emitting type provided in an embodiment of the present invention；
Fig. 3 is the vertical view of Fig. 2.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
As shown in Figures 2 and 3, it is a kind of paster type light emitting type provided in an embodiment of the present invention, including metallic support 1,
Chip illuminator 2, conducting wire 3 and colloid shell 4, metallic support 1 include the first metallic support 11 and the second gold medal mutually separated
Belong to holder 12, the first metallic support 11 and the second metallic support 12 are connect with the positive and negative electrode (not shown) of power supply respectively.
It should be understood that not limiting the quantity of chip illuminator 2 in the present invention, in the present embodiment, with one
It is illustrated for chip illuminator 2.
Chip illuminator 2 is set on the first metallic support 11, and chip illuminator 2 passes through conducting wire 3 and the second metallic support
12 connections, 4 coated metal holder 1 of colloid shell, conducting wire 3 and chip illuminator 2.
The upper surface of above-mentioned first metallic support 11 offers bowl-type concave structure 111, and chip illuminator 2 is set to bowl-type
In concave structure 111, which is reflective surface in bowl-type and surface, can effectively be gathered the light that chip illuminator 2 is sent out
Hold together, improves the luminous efficiency of paster type light emitting type.The material of above-mentioned colloid shell 4 is translucent material, and the outside at top
Profile is in spherical crown shape, and the paster type light emitting type is made to reach preferably illumination effect.
Above-mentioned first metallic support 11 due to offering the bowl-type concave structure 111 for chip illuminator 2 to be arranged,
Its area is much larger than the second metallic support 12, typically constitutes from 70% or more of 1 area of metallic support.
The both ends of metallic support 1 are respectively provided with an oval through slot 13, and the corresponding portion of colloid shell 4 is passed through across ellipse
Straight slot 13 is wrapped up with being formed to metallic support 1, which is used to improve the success rate of press mold encapsulation, improves product
Yield rate.
The both ends of above-mentioned metallic support 1 expose to colloid shell 4, and exposed parts are bent downward, and with the bottom of colloid shell 4
Portion is concordant.The exposed parts of metallic support 1 block colloid shell 4, increase the binding force that metallic support 1 is connect with colloid shell 4,
Improve the stability of product structure.The bottom of metallic support 1 is exposed, and concordant with the bottom of colloid shell 4, convenient for welding.Tool
Body, the part for exposing to colloid shell 4 of the first metallic support 11 is bent to form the first package section 112 and second package section
113, the part for exposing to colloid shell 4 of the second metallic support 12 is bent to form third package section 121 and the 4th and wraps up section
122, the first package section 112, second wraps up section 113, third package section 121 and the 4th is wrapped up section 122 and formed to colloid shell 4
Bottom package space, and second package section 113 and the 4th wrap up section 122 it is concordant with the bottom of colloid shell 4.
The end of above-mentioned metallic support 1 being encapsulated in colloid shell 4 offers fin 14, the stabilization for improving structure
Property.
The present invention also provides a kind of electronic equipment, above-mentioned paster type light emitting type is applied in the electronic equipment.It should
Electronic equipment can be, but not limited to：Indicator light, display, illuminated keyboard and various lamps and lanterns.
The paster type light emitting type and electronic equipment of the present embodiment, chip illuminator is straight in the paster type light emitting type
It connects and is set on the first metallic support, and connect with the second metallic support by conducting wire, and sent out in the prior art frequently with chip
Body of light is set on plastic shell, and compared to the prior art, the present invention abandons that plastic shell, chip illuminator is used directly to dispose
In on electric conductor, making the connection of chip illuminator and electric conductor more firm, luminous two often occurred in the prior art are overcome
The problem of pole pipe poor contact, light emitting diode does not work.In addition, compared to the prior art, the patch type luminous two in the present invention
Pole pipe is only made of metal, colloid and chip, simple in structure, colloid shell using press mold encapsulation by the way of sealing metallic support,
Conducting wire and chip illuminator are integrally formed, stable structure, and production efficiency is high.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement etc., should all be included in the protection scope of the present invention made by within refreshing and principle.
Claims (10)
1. a kind of paster type light emitting type, which is characterized in that including：
Metallic support, conducting wire, colloid shell and at least one chip illuminator, the metallic support include first mutually separated
Metallic support and the second metallic support, first metallic support and the second metallic support connect with the positive and negative electrode of power supply respectively
It connects；
The chip illuminator is set on the first metallic support, and the chip illuminator passes through the conducting wire and the second metal branch
Frame connects, and the colloid shell wraps up the metallic support, the conducting wire and the chip illuminator.
2. paster type light emitting type according to claim 1, which is characterized in that the upper surface of first metallic support
Bowl-type concave structure is offered, the chip illuminator is set in the bowl-type concave structure.
3. paster type light emitting type according to claim 2, which is characterized in that the surface of the bowl-type concave structure is
Reflective surface.
4. paster type light emitting type according to claim 1, which is characterized in that the both ends of the metallic support are respectively provided with
The corresponding portion of one oval through slot, the colloid shell passes through the oval through slot to be formed to the metallic support
Package.
5. paster type light emitting type according to claim 1, which is characterized in that the both ends of the metallic support expose to
The colloid shell.
6. paster type light emitting type according to claim 5, which is characterized in that expose to the metallic support of colloid shell
Both ends bend downward, and it is concordant with the bottom of colloid shell.
7. paster type light emitting type according to claim 6, which is characterized in that first metallic support exposes to
The part of the colloid shell is bent to form the first package section and the second package section, and exposing to for second metallic support is described
The part of colloid shell is bent to form third package section and the 4th package section, the first package section, the second package section, institute
State the package space of third package section and the 4th package section formation to the bottom of the colloid shell, and second packet
It wraps up in section and the 4th package section is concordant with the bottom of colloid shell.
8. paster type light emitting type according to claim 1, which is characterized in that the metallic support is encapsulated in colloid
End in shell offers fin.
9. according to claim 1-8 any one of them paster type light emitting types, which is characterized in that the material of the colloid shell
Matter is translucent material, and the exterior contour at top is in spherical crown shape.
10. a kind of electronic equipment, which is characterized in that include the patch type light-emitting diodes described in any one of claim 1 to 9
Pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810341039.8A CN108447961B (en) | 2018-04-17 | SMD light emitting diode and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810341039.8A CN108447961B (en) | 2018-04-17 | SMD light emitting diode and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108447961A true CN108447961A (en) | 2018-08-24 |
| CN108447961B CN108447961B (en) | 2024-07-16 |
Family
ID=
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119517A (en) * | 2018-09-12 | 2019-01-01 | 宁波升谱光电股份有限公司 | A kind of adopting surface mounted LED and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202025798U (en) * | 2011-04-06 | 2011-11-02 | 广东银雨芯片半导体有限公司 | SMD (Surface Mounted Device) LED (Light Emitting Diode) bracket and LED adopting same |
| CN202434510U (en) * | 2011-12-14 | 2012-09-12 | 四川柏狮光电技术有限公司 | Full color SMD (Surface Mount Device) LED (Light-Emitting Diode) |
| CN202839741U (en) * | 2012-10-18 | 2013-03-27 | 深圳市斯迈得光电子有限公司 | Surface-mounted light emitting diode support |
| CN203536465U (en) * | 2013-07-19 | 2014-04-09 | 佛山市国星光电股份有限公司 | Top emission type LED bracket and top emission type LED device |
| CN104124328A (en) * | 2013-04-26 | 2014-10-29 | 四川柏狮光电技术有限公司 | Novel waterproof SMD (surface mounted device) LED and production technology thereof |
| CN204927338U (en) * | 2015-09-17 | 2015-12-30 | 深圳成光兴光电技术股份有限公司 | Paster LED packaging structure |
| CN208045534U (en) * | 2018-04-17 | 2018-11-02 | 深圳成光兴光电技术股份有限公司 | A kind of paster type light emitting type and electronic equipment |
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202025798U (en) * | 2011-04-06 | 2011-11-02 | 广东银雨芯片半导体有限公司 | SMD (Surface Mounted Device) LED (Light Emitting Diode) bracket and LED adopting same |
| CN202434510U (en) * | 2011-12-14 | 2012-09-12 | 四川柏狮光电技术有限公司 | Full color SMD (Surface Mount Device) LED (Light-Emitting Diode) |
| CN202839741U (en) * | 2012-10-18 | 2013-03-27 | 深圳市斯迈得光电子有限公司 | Surface-mounted light emitting diode support |
| CN104124328A (en) * | 2013-04-26 | 2014-10-29 | 四川柏狮光电技术有限公司 | Novel waterproof SMD (surface mounted device) LED and production technology thereof |
| CN203536465U (en) * | 2013-07-19 | 2014-04-09 | 佛山市国星光电股份有限公司 | Top emission type LED bracket and top emission type LED device |
| CN204927338U (en) * | 2015-09-17 | 2015-12-30 | 深圳成光兴光电技术股份有限公司 | Paster LED packaging structure |
| CN208045534U (en) * | 2018-04-17 | 2018-11-02 | 深圳成光兴光电技术股份有限公司 | A kind of paster type light emitting type and electronic equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119517A (en) * | 2018-09-12 | 2019-01-01 | 宁波升谱光电股份有限公司 | A kind of adopting surface mounted LED and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101389196B1 (en) | Semiconductor Light Source For Illuminating A Physical Space Including A 3-dimensional Lead Frame | |
| CN103791286A (en) | Linear LED light source, linear LED lamp and manufacturing method for linear LED light source | |
| CN208460790U (en) | A kind of LED component and LED light | |
| WO2015144030A1 (en) | Led lamp wick and manufacturing method for led filament monomer thereof | |
| CN202930426U (en) | LED device capable of realizing application effect of different light-emitting directions | |
| CN208045534U (en) | A kind of paster type light emitting type and electronic equipment | |
| CN104896324B (en) | Illumination light source and lighting device | |
| CN108447961A (en) | A kind of paster type light emitting type and electronic equipment | |
| CN101707197B (en) | Omnibearing luminous LED device | |
| CN211208477U (en) | L ED bracket adopting novel die bonding mode | |
| CN213394676U (en) | LED lamp bead | |
| CN209389031U (en) | A kind of LED component | |
| CN207179213U (en) | The wide LED of light emitting region | |
| CN209084435U (en) | A kind of integrated lamp bulb that angle is fine-tuning | |
| CN207555233U (en) | A kind of multi-electrode type Omnibearing luminous LED light source and its stent | |
| CN108447961B (en) | SMD light emitting diode and electronic equipment | |
| WO2011035490A1 (en) | Led device for three-dimensional illumination | |
| CN210778587U (en) | Eight-foot RGBW high-power packaging lamp bead | |
| CN211574805U (en) | LED bulb | |
| CN110121769A (en) | Light emission diode package member component and light emitting diode bulb including it | |
| CN215220750U (en) | Ceramic structure omnibearing luminous LED three-dimensional light source with good heat conduction performance | |
| CN109630913A (en) | The manufacturing method of light emitting device | |
| CN211376663U (en) | High-light-efficiency direct-insertion type 0.1-watt low-power LED lamp bead | |
| CN205595367U (en) | Screw -tupe LED support, LED lamp and LED lamps and lanterns | |
| CN209101108U (en) | A kind of adjustable LED wall-mounted lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |