CN108444921B - Additive manufacturing component online detection method based on signal correlation analysis - Google Patents

Additive manufacturing component online detection method based on signal correlation analysis Download PDF

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CN108444921B
CN108444921B CN201810224121.2A CN201810224121A CN108444921B CN 108444921 B CN108444921 B CN 108444921B CN 201810224121 A CN201810224121 A CN 201810224121A CN 108444921 B CN108444921 B CN 108444921B
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胡宏伟
曾慧婕
何绪晖
王向红
尹来容
张明军
刘文杰
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Changsha University of Science and Technology
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Abstract

The invention discloses an additive manufacturing component online detection method based on signal correlation analysis. The method comprises the three steps of constructing a laser ultrasonic automatic detection system, exciting and collecting laser ultrasonic signals, calculating the dissimilarity coefficient of the ultrasonic signals and identifying and positioning defects. The method has the technical effects that through gridding the detection area of the surface of the component, the ultrasonic signals transmitted along the X direction and the Y direction are obtained by using the laser ultrasonic automatic detection system, and the calculation of the dissimilarity coefficient is carried out, so that the online rapid positioning of the defects of the additive manufacturing component is realized, and the detection efficiency is effectively improved.

Description

Additive manufacturing component online detection method based on signal correlation analysis
Technical Field
The invention belongs to the field of nondestructive testing, and particularly relates to an additive manufacturing component online detection method based on signal correlation analysis.
Background
Additive manufacturing is a technology which is based on a digital three-dimensional CAD model file, and applies a high-energy beam source or other modes to stack and bond special materials such as liquid, melt, powder, silk, sheets and the like layer by layer, and finally, the special materials are overlapped and molded to directly construct an entity. The technology has the advantages of saving materials, realizing the manufacture of complex structures which are difficult or impossible to process by the traditional process, and the like, and is widely applied to important industries such as aerospace, medical treatment and the like. However, at the same time, additive manufacturing has defects caused by improper control of process parameters, mainly including holes, warping deformation, spheroidization, existence of unmelted particles, and the like. These defects can seriously affect the service performance of the component, and restrict the practical industrial application of the additive manufacturing technology.
In order to effectively detect defects and improve the product quality, an off-line or on-line nondestructive detection technology can be adopted. The off-line detection technology is only used for finished product detection after manufacturing is completed, and for example, patent documents with application publication number CN 104597125 a and publication date 2015, 5 and 6 disclose an ultrasonic detection control method and device for 3D printed products, which can improve the signal-to-noise ratio and defect detection rate of detection signals of 3D printed products by controlling a probe of ultrasonic detection equipment to scan according to the incident angle of a detection position corresponding to each point to be detected. However, the operation is complicated, the point to be detected needs to be determined, and the defect of the formed product can only be detected, and the parameters cannot be adjusted in time to control the manufacturing quality of the product.
The online detection can timely find the defects and automatically or manually intervene in the manufacturing process, so that the quality of the additive manufacturing component is improved. In the existing additive manufacturing process, the online detection method mainly comprises a laser ultrasonic method, an infrared thermal imaging method, a CCD imaging method and the like. The laser ultrasonic has the advantages of non-contact, high sensitivity, capability of detecting a component with a complex shape and the like, and is particularly suitable for online real-time detection in the additive manufacturing process, for example, patent documents with application publication number CN106018288A and publication date of 2016, 10, month and 12 disclose a method for online nondestructive detection of an additive manufacturing part by laser ultrasonic.
Disclosure of Invention
In order to improve the detection efficiency of laser ultrasound in the additive manufacturing process and realize the rapid identification and positioning of defects. The invention provides an additive manufacturing component online detection method based on signal correlation analysis.
In order to achieve the technical purpose, the technical scheme of the invention is that,
an additive manufacturing component online detection method based on signal correlation analysis comprises the following steps:
the method comprises the following steps: and constructing a laser ultrasonic automatic detection system, wherein the system comprises a motion scanning mechanism, two sets of laser ultrasonic detection devices and a data acquisition and processing system. The motion scanning mechanism comprises an X/Z axis automatic scanning frame, a Y/Z axis automatic scanning frame and a motion control device; the two sets of laser ultrasonic detection devices comprise pulse lasers and laser interferometers; the data acquisition and processing system comprises a data acquisition card and a computer.
Step two: the method comprises the steps of carrying out laser ultrasonic signal excitation and signal acquisition on a component in the additive manufacturing process, establishing a space rectangular coordinate system OXYZ by taking the center of the surface of a substrate as an origin and the surface of the substrate as an XOY surface, and setting initial positions of a pulse laser and a laser interferometer. And determining the moving steps of the pulse laser and the laser interferometer in the Z direction according to the overall height H of the three-dimensional model of the component and the thickness Delta H of the sliced layer. And determining the moving step pitch of the pulse laser and the laser interferometer in the direction X, Y according to the width and the length of the three-dimensional model of the component and the detection precision requirement. Ultrasonic signals are excited through the pulse laser, the laser interferometer receives the signals, and the data acquisition and processing system acquires ultrasonic data and stores the ultrasonic data in the computer.
Step three: and (3) calculating the dissimilarity coefficient of the ultrasonic signals and identifying and positioning defects, firstly extracting ultrasonic data acquired in the X direction and the Y direction in the step two, firstly calculating the covariance and the standard deviation of the acquired signals of different position points in the X direction and the dissimilarity coefficient of every two acquired signals after the completion of each laser ultrasonic detection, and then calculating the covariance and the standard deviation of the acquired signals of different position points in the Y direction and the dissimilarity coefficient of every two acquired signals. Then, the sum of the different coefficients accumulated by the detection points at different positions in the X direction and the Y direction can be obtained according to the different coefficients, the area with the defect is obtained according to a given threshold value, and finally, the position of the defect is judged according to the common area with the defect in the X direction and the Y direction.
In the second step of the method, the step of exciting the laser ultrasonic signal and acquiring the signal of the component comprises the following steps:
step 1: setting initial positions of a pulse laser and a laser interferometer, wherein the distance between the pulse laser and the surface of the substrate is d1, the distance between the laser interferometer and the surface of the substrate is d2, adjusting the directions of the pulse laser and the laser interferometer, ensuring the distance d3 between the incident point of the laser and the boundary of the substrate, and enabling the ultrasonic signal received by the laser interferometer at the moment to be the maximum value.
Step 2: determining the value range [ d1, H ] of the distance H of the pulse laser and the laser interferometer moving in the Z-axis direction according to the overall height H of the three-dimensional model of the component and the thickness Delta H of the sliced layerz]Wherein h iszDividing H into K equal parts, namely selecting K laser ultrasonic excitation positions in the Z-axis direction, and determining the Z-axis direction of the pulse laser and the laser interferometerAn upward movement step Δ Z; Δ Z is determined according to the component specific height and the detection accuracy requirements.
And step 3: according to the width and length of a three-dimensional model of a component and the requirement of detection precision, a two-dimensional plane detected by the model at the kth time is divided into M equal parts along the X direction, N equal parts along the Y direction, the moving step distance delta X of a pulse laser and a laser interferometer in the X direction and the moving step distance delta Y of the pulse laser and the laser interferometer in the Y direction are determined, two sets of laser ultrasonic detection devices are controlled to move in the X direction and the Y direction in sequence in the XY plane, and meanwhile, the pulse laser realizes laser ultrasonic signal excitation and the laser interferometer realizes signal receiving. During the first detection, the computer stores the ultrasonic signals at each detection point position in the X direction and the Y direction in real time, and the obtained signals are recorded as S1,m、E1,nAfter the signals are stored, the pulse laser and the laser interferometer ascend by a step length delta Z along the Z direction, when the set new one-time processing layer number is finished, the second detection is started, the pulse laser and the laser interferometer continue to excite and receive ultrasonic signals in the X direction and the Y direction, and new signals S are obtained2,m、E2,nAnalogously, i.e. obtaining the signal S in the X direction sequentially1,m,S2,m,…,Sk,mSignal E in Y direction1,n,E2,n,…,Ek,nAnd (3) until the component processing is finished, wherein M is 1,2, …, and M, N is 1,2, …, and N.
In the method, in the third step, the ultrasonic signal dissimilarity coefficient calculation and defect identification and positioning step includes:
step 1: calculating the dissimilarity coefficient of the ultrasonic signals when the collected signals are Sk,m(M is 1,2, …, M), S is first obtainedK,iAnd SK,j(where i, j. epsilon. 1, M)]And i ≠ j) correlation coefficient:
Figure BDA0001600797840000031
Figure BDA0001600797840000032
then calculate SK,iAnd SK,jThe dissimilarity coefficient of (a):
αK,i,j＝1-ρK,i,j
when the collected signal is EK,n(N is 1,2, …, N), E is first determinedk,iAnd Ek,j(where i, j ∈ [1, N ]]And i ≠ j) correlation coefficient:
Figure BDA0001600797840000041
Figure BDA0001600797840000042
then calculate EK,iAnd EK,jThe dissimilarity coefficient of (a):
βk,i,j＝1-δk,i,j
step 2: identifying and positioning the defect, and extracting the dissimilarity coefficient alpha stored in the third stepk,i,jAnd betak,i,jAnd the sum calculation is performed on the above-mentioned signals respectively,
Figure BDA0001600797840000043
Figure BDA0001600797840000044
setting a threshold value epsilon when gammak,i>When epsilon, there is a defect on the scanning path corresponding to the i point in the X direction in the k detection, when sigma isk,j>When epsilon, the scanning path corresponding to the j point in the Y direction in the k-th detection has a defect, and the specific position of the defect can be determined by combining the paths of the defects at the different position points in the X, Y direction (S)k,i，Ek,j)。
The method has the technical effects that through gridding the detection area of the surface of the component, the ultrasonic signals transmitted along the X direction and the Y direction are obtained by using the laser ultrasonic automatic detection system, and the calculation of the dissimilarity coefficient is carried out, so that the online rapid positioning of the defects of the additive manufacturing component is realized, and the detection efficiency is effectively improved.
The invention will be further explained with reference to the drawings.
Drawings
FIG. 1 is a schematic view of a detection system according to the present invention;
FIG. 2 is a schematic structural view of a scanning mechanism of the laser ultrasonic detection system of the present invention;
FIG. 3 is a schematic view of a laser ultrasonic scan path of the present invention;
FIG. 4 is a schematic flow chart of the present invention;
FIG. 5 is a schematic diagram of a laser ultrasonic scan path in accordance with an embodiment of the present invention;
in the figure 2, 1 is an X/Z axis automatic scanning frame, 2 is a Y/Z axis automatic scanning frame, 3 is a pulse laser, 4 is a laser interferometer, 5 is a substrate and 6 is a component.
Detailed Description
Referring to fig. 1, a laser ultrasonic automatic detection system is constructed as a first step, and comprises a motion scanning mechanism, two sets of laser ultrasonic detection devices and a data acquisition and processing system. The motion scanning mechanism comprises an X/Z axis automatic scanning frame, a Y/Z axis automatic scanning frame, a supporting frame and a motion control device; the X/Z axis automatic scanning frame and the Y/Z axis automatic scanning frame are controlled by servo motors, the X/Y, Y/Z axis realizes the transmission of motion through a ball screw pair, and the motion precision is 0.05 mm; the support frame can respectively realize rotation at a certain angle along the X-axis direction and the Y-axis direction, the precision of the rotary motion is 0.1 degree, and the motion control of X/Z and Y/Z is realized through a computer and a motion control device; the pulse laser and the laser interferometer are arranged on the support frame, the specific types of the laser and the laser interferometer can be correspondingly adjusted according to the actual measured component, and in the detection example, Nd: YAG laser, F-P laser interferometer, PCIe9852 data acquisition card with sampling frequency of 200MHz collects ultrasonic signal data.
Step two, laser ultrasonic signal excitation and signal acquisition
(1) Setting initial positions of a pulse laser and a laser interferometer, wherein the distance between the pulse laser and the surface of the substrate is d1, the distance between the laser interferometer and the surface of the substrate is d2, and the directions of the pulse laser and the laser interferometer are adjusted to ensure that the incident point of the laser is at the distance d3 from the boundary of the substrate, so that the ultrasonic signal received by the laser interferometer at the moment is the maximum value. And adjusting the angle of the support frame to ensure that the included angle theta between the laser emission line of the pulse laser and the normal line of the surface of the component is changed within the range of 0-90 degrees. In this example, d 1-d 2-d 3-5 mm.
(2) Determining the value range [ d1, H ] of the distance H of the pulse laser and the laser interferometer moving in the Z-axis direction according to the overall height H of the three-dimensional model of the component and the thickness Delta H of the sliced layerz]Wherein h iszDividing H into K equal parts, namely selecting K laser ultrasonic excitation positions in the Z-axis direction, and determining the moving step distance delta Z in the Z-axis direction of the pulse laser and the laser interferometer; Δ Z is determined according to the component specific height and the detection accuracy requirements. In this example, H is 80mm, Δ H is 0.05mm, k is 160 mm, and Δ Z is 0.5 mm.
(3) According to the width and length of a three-dimensional model of a component and the requirement of detection precision, dividing a two-dimensional plane detected by the model for the 1 st time into 1700 equal parts along the X direction and 1500 equal parts along the Y direction, determining a moving step distance delta X of a pulse laser and a laser interferometer in the X direction and a moving step distance delta Y of the pulse laser and the laser interferometer in the Y direction, controlling two sets of laser ultrasonic detection devices to move in the X direction and the Y direction in sequence in the XY plane, and simultaneously realizing laser ultrasonic signal excitation by the pulse laser and signal receiving by the laser interferometer. In this example, Δ X is 0.05mm, and Δ Y is 0.05 mm.
(4) During the first detection, the computer stores the ultrasonic signals at each detection point position in the X direction and the Y direction in real time, and the obtained signals are recorded as S1,m、E1,nAfter the signals are stored, the pulse laser and the laser interferometer ascend by a step length of 0.5mm along the Z-axis direction, when the set new 10 layers of processing layers are finished, the second detection is started, the pulse laser and the laser interferometer continue to excite and receive ultrasonic signals in the X direction and the Y direction, and new signals S are obtained2,m、E2,nAnalogously, i.e. obtaining the signal S in the X direction sequentially1,m,S2,m,…,S160,mSignal E in Y direction1,n,E2,n,…,E160,nAnd (3) until the component processing is finished, wherein M is 1,2, …, and M, N is 1,2, …, and N. In this example, the 1 st detection yields a signal in the X direction of
S1,1,S1,2,…,S1,1700Y-direction signal is E1,1,E1,2,…,E1,1500。
Step three, calculating the dissimilarity coefficient of the ultrasonic signals and identifying and positioning the defects
Firstly, extracting ultrasonic data acquired in the X direction and the Y direction in the second step, firstly calculating the covariance and the standard deviation of the acquired signals of different position points in the X direction and the dissimilarity coefficient of the acquired signals in pairs after each laser ultrasonic detection is completed, and then calculating the covariance and the standard deviation of the acquired signals of different position points in the Y direction and the dissimilarity coefficient of the acquired signals in pairs. Then, the sum of the different coefficients accumulated by the detection points at different positions in the X direction and the Y direction can be obtained according to the different coefficients, the area with the defect is obtained according to a given threshold value, and finally, the position of the defect is judged according to the common area with the defect in the X direction and the Y direction.
The ultrasonic signal dissimilarity coefficient calculation and defect identification and positioning method comprises the following steps of:
when the collected signal is Sk,m(M is 1,2, …, M), S is first obtainedK,iAnd SK,j(where i, j. epsilon. 1, M)]And i ≠ j) correlation coefficient:
Figure BDA0001600797840000061
Figure BDA0001600797840000062
then calculate SK,iAnd SK,jThe dissimilarity coefficient of (a):
αK,i,j＝1-ρK,i,j
when the collected signal is EK,n(N is 1,2, …, N), E is first determinedK,iAnd EK,j(where i, j ∈ [1, N ]]And i ≠ j) correlation coefficient:
Figure BDA0001600797840000071
Figure BDA0001600797840000072
then calculate EK,iAnd EK,jThe dissimilarity coefficient of (a):
βk,i,j＝1-δk,i,j
extracting the dissimilarity coefficient alpha stored in the third stepk,i,jAnd betak,i,jAnd the sum calculation is performed on the above-mentioned signals respectively,
Figure BDA0001600797840000073
Figure BDA0001600797840000074
setting the threshold value epsilon to 0.6 when gamma isk,i>When epsilon, there is a defect on the scanning path corresponding to the i point in the X direction in the k detection, when sigma isk,j>When epsilon, the scanning path corresponding to the j point in the Y direction in the k-th detection has a defect, and the specific position of one defect can be determined by combining the paths of the defects at the different position points in the X, Y direction (S)1,10，E1,20)。

Claims (1)

1. An additive manufacturing component online detection method based on signal correlation analysis is characterized by comprising the following steps:
the method comprises the following steps: constructing a laser ultrasonic automatic detection system, wherein the system comprises a motion scanning mechanism, two sets of laser ultrasonic detection devices and a data acquisition and processing system; the motion scanning mechanism comprises an X/Z axis automatic scanning frame, a Y/Z axis automatic scanning frame and a motion control device, the two sets of laser ultrasonic detection devices comprise pulse lasers and laser interferometers, and the data acquisition and processing system comprises a data acquisition card and a computer;
step two: performing laser ultrasonic signal excitation and signal acquisition on a component in the additive manufacturing process, establishing a space rectangular coordinate system OXYZ by taking the center of the surface of a substrate as an origin and the surface of the substrate as an XOY surface, and setting initial positions of a pulse laser and a laser interferometer; determining the moving step length of the pulse laser and the laser interferometer in the Z direction according to the overall height H of the three-dimensional model of the component and the thickness delta H of the sliced layer; determining the moving step length of the pulse laser and the laser interferometer in the direction X, Y according to the width and the length of the three-dimensional model of the component and the detection precision requirement; the method comprises the following steps that ultrasonic signals are excited through a pulse laser, a laser interferometer receives the signals, a data acquisition and processing system acquires ultrasonic data and stores the ultrasonic data in a computer, and the specific data acquisition and processing steps are as follows:
step 1: setting initial positions of a pulse laser and a laser interferometer, wherein the distance between the pulse laser and the surface of the substrate is d1, the distance between the laser interferometer and the surface of the substrate is d2, adjusting the directions of the pulse laser and the laser interferometer, ensuring the distance d3 between the incident point of the laser and the boundary of the substrate, and enabling the ultrasonic signal received by the laser interferometer at the moment to be the maximum value;
step 2: determining the value range [ d1, H ] of the distance H of the pulse laser and the laser interferometer moving in the Z direction according to the overall height H of the three-dimensional model of the component and the thickness Delta H of the sliced layerz]Wherein h iszDividing H into equal parts of K-1, namely selecting K laser ultrasonic wave excitation positions in the Z direction, and determining the moving step length delta Z of the pulse laser and the laser interferometer in the Z direction, wherein the delta Z is determined according to the specific height of a component and the detection precision requirement;
and step 3: dividing the two-dimensional plane model detected at the kth time into M-1 equal parts along the X direction and N-1 equal parts along the Y direction according to the width, the length and the detection precision requirements of the three-dimensional model of the component, and determining the moving step length delta X of the pulse laser and the laser interferometer in the X direction and the moving step length delta X of the pulse laser and the laser interferometer in the Y directionThe two sets of laser ultrasonic detection devices are controlled to move in the X direction and the Y direction in the XY plane in sequence, and meanwhile, a pulse laser realizes laser ultrasonic signal excitation and a laser interferometer realizes signal receiving; during the first detection, the computer stores the ultrasonic signals at each detection point position in the X direction and the Y direction in real time, and the obtained signals are recorded as S1,m、E1,nAfter the signals are stored, the pulse laser and the laser interferometer ascend by a step length delta Z along the Z direction, when the set new one-time processing layer number is finished, the second detection is started, the pulse laser and the laser interferometer continue to excite and receive ultrasonic signals in the X direction and the Y direction, and new signals S are obtained2,m、E2,nSequentially obtaining the signal S in the X direction at the time of the k detectionk,mAnd signal E in the Y directionk,nUntil the component processing is completed, wherein M is 1,2, …, M, N is 1,2, …, N, K is 1,2, …, K;
step three: calculating the dissimilarity coefficient of the ultrasonic signal and identifying and positioning the defect, firstly extracting the ultrasonic data acquired in the X direction and the Y direction in the second step, after each laser ultrasonic detection is completed, firstly calculating the covariance and the standard deviation between the acquired signals of different position points in the X direction and the dissimilarity coefficient between every two acquired signals, then calculating the covariance and the standard deviation between the acquired signals of different position points in the Y direction and the dissimilarity coefficient between every two acquired signals, then obtaining the sum of the dissimilarity coefficients accumulated by the detection points of different positions in the X direction and the Y direction according to the dissimilarity coefficients, then obtaining the region with the defect according to a given threshold, and finally judging the position of the defect by the common region with the defect in the X direction and the Y direction, wherein the specific dissimilarity coefficient calculating and defect identifying and positioning algorithm comprises the following steps:
step 1: calculating the dissimilarity coefficient of ultrasonic signals by calculating the dissimilarity coefficient between every two signals collected at different positions in X direction, i.e. the collected signal is Sk,mWhen it comes, S is first obtainedk,iAnd Sk,jCorrelation coefficient of (1) ("rho")k,i,jWherein i, j is E [1, M ∈]And i is not equal to j,
Figure FDA0002805776160000021
Figure FDA0002805776160000022
then calculate Sk,iAnd Sk,jCoefficient of dissimilarity of alphak,i,j：
αk,i,j＝1-ρk,i,j
Secondly, the difference coefficient between every two collected signals at different position points in the Y direction is calculated, namely the collected signals are Ek,nWhen it is needed, first, E is obtainedk,iAnd Ek,jCorrelation coefficient ofk,i,jWhere i, j is E [1, N)]And i is not equal to j,
Figure FDA0002805776160000023
Figure FDA0002805776160000031
then calculate Ek,iAnd Ek,jCoefficient of dissimilarity of betak,i,j：
βk,i,j＝1-δk,i,j
Step 2: identifying and positioning the defect, and extracting the dissimilarity coefficient alpha stored in the third stepk,i,jAnd betak,i,jAnd respectively carrying out summation and average calculation on the following components:
Figure FDA0002805776160000032
Figure FDA0002805776160000033
setting a threshold value epsilon when gammak,i>When epsilon, at this time, a defect exists on a scanning path corresponding to the point i in the X direction in the k-th detection, namely a defect exists on the ith row; when sigma isk,j>When epsilon, at this time, a defect exists on the scanning path corresponding to the j point in the Y direction in the k detection, namely a defect exists in the j row; from this, the specific location of the defect can be determined as (S)k,i，Ek,j) I.e. where i row and j column intersect in the kth test.
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