CN108436682B

CN108436682B - Grinding disc for processing sheet wafer and special grinding machine

Info

Publication number: CN108436682B
Application number: CN201810294070.0A
Authority: CN
Inventors: 韩赛
Original assignee: Individual
Current assignee: Anhui Guomao Electrical Equipment Co ltd
Priority date: 2018-04-03
Filing date: 2018-04-03
Publication date: 2020-06-19
Anticipated expiration: 2038-04-03
Also published as: CN108436682A

Abstract

The invention discloses a grinding machine special for thinning and processing sheet wafers, which comprises a machine tool carrying platform, wherein a carrier for clamping a product is detachably arranged on the machine tool carrying platform, a grinding disc is arranged above the carrier, the grinding disc comprises a body, the lower end surface of the body is provided with a mounting groove, a sub grinding block is arranged in the mounting groove, a plurality of liquid supply grooves are uniformly distributed on the lower end surface of the body along the circumferential direction of the mounting groove and used for accommodating mortar, the inner side wall, corresponding to the direction opposite to the rotating direction of the body, in the inner wall of each liquid supply groove is in transitional connection with the lower end surface of the body through an arc surface, and the grinding disc is arranged on a machine tool driving shaft and rotates along with. The invention provides a grinding machine special for thinning and processing a flaky wafer, which has simple and reliable clamping process, low fragment rate caused by clamping, good grinding precision of a grinding disc, and no direct hard contact between the grinding disc and a product, so that the processing precision of the product is good and the qualification rate is high.

Description

Grinding disc for processing sheet wafer and special grinding machine

Technical Field

The invention relates to the technical field of wafer processing, in particular to a grinding disc and a special grinding machine for processing a sheet wafer.

Background

The sheet wafer, especially the sheet wafer with a thickness less than 1mm, often needs to be temporarily bonded on a wafer carrier during the processing process, so as to improve the strength of the functional wafer, so as to facilitate the processing treatment, such as thinning, polishing, etching, cutting, etc., and finally, the functional wafer is separated from the wafer carrier to complete the processing of the functional wafer.

In addition, in order to facilitate separation of the functional wafer and the carrier wafer in the prior art and reduce processing cost, the carrier wafer is mostly made of engineering plastics, and the carrier wafer made of the engineering plastics is cut synchronously along with the cutting process of the functional wafer, so that the carrier wafer made of the engineering plastics in the prior art is mostly disposable consumables.

However, in the prior art, the product obtained by temporarily bonding the functional wafer and the slide glass wafer is easily cracked in the process of clamping through a conventional mechanical included angle on a processing machine tool, so that the processing difficulty is high. And the engineering plastics with better strength and hardness performance are selected, so that the processing cost is increased, and the enterprise production and operation are not facilitated.

Disclosure of Invention

The present invention is directed to solve at least some of the problems of the related art: the grinding disc for processing the sheet wafer is polished between the grinding disc and a product through grinding particles contained in mortar, so that the grinding disc is not in direct hard contact with the product, the fragment rate is low, the processing precision of the final product is good, and the qualification rate is high.

The present invention is directed to solve at least the second technical problem in the related art to some extent: the grinding machine special for thinning and processing the flaky wafer is simple and reliable in clamping process, the fragment rate caused by clamping is low, the grinding precision of the grinding disc is good, and the grinding disc is not in direct hard contact with a product, so that the processing precision of the product is good, and the qualification rate is high.

Therefore, an object of the present invention is to provide a grinding disc for processing a sheet wafer, including a disc-shaped main body, wherein a mounting groove is disposed at a central position of a lower end surface of the main body, a sub grinding block is disposed in the mounting groove, a plurality of liquid supply grooves are uniformly distributed on the lower end surface of the main body along a circumferential direction of the mounting groove for accommodating mortar, and inner side walls of inner walls of the liquid supply grooves, which correspond to opposite directions of a rotation direction of the main body, are transitionally connected to the lower end surface of the main body through an arc surface. Make the lower terminal surface of body and the surface of treating of product form the mortar layer through the mortar, through the surface of treating of mortar layer grinding product, not only can be fine completion is to the attenuate grinding of product from this, does not have direct hard contact between mill and the product moreover, consequently, has avoided mill and the impact force of product contact initial stage and has leaded to the thin slice product cracked.

According to one example of the invention, a liquid supply pipeline is arranged in the body corresponding to each liquid supply groove, and the liquid supply pipeline is communicated with the liquid supply grooves.

According to an example of the invention, a backflow groove is arranged between any two adjacent liquid supply grooves on the lower end surface of the body, an annular main backflow channel is arranged on the lower end surface of the body, and all backflow grooves radially extend to be communicated with the main backflow channel. Can retrieve the mortar after the grinding through backward flow groove and main return passage, also make the pressure of the mortar layer between body lower extreme face and the product obtain dynamic balance simultaneously.

According to an example of the invention, a positioning groove for controlling the gap between the lower end surface of the body and the surface to be processed of the product is arranged on the lower end surface of the body and close to the outer edge of the body, and a pipeline for supplying a high-pressure medium to the positioning groove is arranged in the body. The high-pressure medium in the positioning groove can keep a certain gap between the grinding disc body and the product all the time.

According to one example of the invention, the sub grinding block is in sliding fit with the mounting groove, an adjusting cavity is formed between the sub grinding block and the inner wall of the mounting groove in a surrounding manner, and a pipeline communicated with the adjusting cavity is arranged in the body. The surfaces to be processed of the products are polished by the sub grinding blocks pushed by the adjusting cavities.

Therefore, the invention also aims to provide a grinding machine special for thinning and processing sheet-shaped wafers, which comprises a machine tool carrier, wherein a carrier for clamping a product is detachably arranged on the machine tool carrier, and a grinding disc is arranged above the carrier, is arranged on a machine tool driving shaft and rotates along with the machine tool driving shaft.

According to an example of the present invention, the carrier includes a housing with an upward opening, an adjusting mechanism for adjusting a horizontal tilt angle of the product is disposed in the housing, magnetorheological fluid is filled into the housing, so that the adjusting mechanism is immersed in the magnetorheological fluid, when a lower portion of the product is connected to the adjusting mechanism, the adjusting mechanism drives the product to swing to a set position and then to stand, and a portion of the product to be processed is located above a liquid level of the magnetorheological fluid, and a magnetic field generator is disposed on the housing for driving the magnetorheological fluid in the housing to solidify or to return to a fluid state. The adjusting mechanism adjusts the product to enable the product to swing to a position to be processed and to be static, then the magnetorheological fluid is solidified through the magnetic field generator, and the solidified magnetorheological fluid fixes and limits the product which is partially immersed in the magnetorheological fluid originally, so that the product is clamped. In the process, the functional wafer of the product is exposed above the liquid level of the magnetorheological fluid, so that the processing of the functional wafer is not influenced.

According to an example of the invention, the adjusting mechanism comprises at least three cylinders, all the cylinders are arranged at intervals along the horizontal direction, the lower end of each cylinder is connected with the shell, a central channel is arranged in each cylinder, a piston rod is matched in the central channel in a sliding manner, the lower end surface of each piston rod and the inner surface of the corresponding central channel surround to form a control cavity, the upper end of each piston rod is exposed above the corresponding cylinder along the vertical direction, and a connecting piece used for being connected with or disconnected from a product is arranged at the end, exposed above the corresponding cylinder, of each piston rod. The product is adjusted and positioned by using the three connecting pieces as three fulcrums.

According to an example of the invention, a partition board is arranged in the shell, the partition board and the inner side wall of the shell surround to form a closed storage cavity, a transfusion channel communicated with the inner cavity of the shell is arranged at the bottom of the storage cavity, the transfusion channel is positioned below the liquid level of the magnetorheological fluid in the shell, and an air nozzle used for discharging air in the storage cavity or filling air into the storage cavity is arranged on the side wall of the storage cavity. The air is flushed through the air nozzle, so that the magnetorheological fluid in the storage cavity is supplied to the inner cavity of the shell through the infusion channel, the liquid level of the magnetorheological fluid in the shell overflows, and the surface impurities of the magnetorheological fluid in the shell are removed by the overflow to drive the surface liquid level to flow.

According to an example of the invention, the outer side wall of the shell is provided with an overflow groove, and the overflow groove extends along the circumferential direction of the shell to form an annular structure. Impurity particles generated by wafer processing and overflowing magnetorheological fluid can be converged and discharged through the overflow groove.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

The technical scheme has the following advantages or beneficial effects: firstly, the grinding disc and the product are ground by mortar, so that the grinding disc and the product are not in direct hard contact, the product is not easy to be cracked due to overlarge impact force, secondly, the carrier in the grinding machine adopts the solidification of the magnetorheological fluid to form a die cavity, thereby leading the part of the product to be embedded, not only having firm positioning, but also not leading the product to deform and crack because of overlarge local clamping force, the requirement on the strength and rigidity of the wafer on the product is low, so the material cost of the wafer is low, the processing cost of the whole product is reduced, and finally, impurity particles on the surface layer are removed along with the overflow of the magnetorheological fluid surface layer through the supplement of the magnetorheological fluid in the storage cavity, therefore, continuous processing can be realized, extra labor intensity caused by manual cleaning of surface impurities after multiple times of production is avoided, and the efficiency of continuous production is further improved.

Drawings

Fig. 1 is a schematic structural diagram of a grinding machine special for thinning and processing a sheet-shaped wafer according to the invention.

Fig. 2 is a schematic structural view of the grinding machine in fig. 1 in another working state.

Fig. 3 is a partially enlarged view of the region "a" in fig. 2.

Fig. 4 is a partially enlarged view of the region "B" in fig. 3.

Figure 5 is a schematic view of the structure of the grinding disc portion of the present invention.

FIG. 6 is a schematic view of the structure in the direction "C-C" in FIG. 5.

FIG. 7 is a schematic view of the structure in the direction "D-D" in FIG. 5.

The device comprises a shell, a product, a functional wafer, a carrier wafer, a bonding adhesive, a connecting pipe, a regulating mechanism, a cylinder, a piston rod, a control cavity, a sucker, a control pipe, a connecting pipe, a 3.6, a step surface, a magnetorheological fluid, a control pipe, a 6, a universal joint, a 7, a groove, a 8, a partition plate, a 9, a storage cavity, a 10, a liquid conveying channel, a 11, an air nozzle, a 12, a liquid inlet pipe, a 13, a main excitation device, a 14, an auxiliary excitation winding, a 15, an overflow groove, a 16, a pump, a 17, a pressure sensor, a 18, a body, a 19, a mounting groove, a 20, a sub grinding block, a 21, a liquid supply groove, a 22, an arc surface, a 23, a liquid supply pipeline, a 24, a backflow groove, a 25, a main backflow channel, a 26, a positioning groove, a 27, a regulating cavity, a 28 and a machine tool driving shaft.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.

A grinding machine dedicated to sheet-like wafer thinning processing according to an embodiment of the present invention is described in detail below with reference to the accompanying drawings.

The first embodiment is as follows:

preferably, the grinding disc includes a disc-shaped body 18, a mounting groove 19 is disposed at a central position of a lower end surface of the body 18, a sub grinding block 20 is disposed in the mounting groove 19, a plurality of liquid supply tanks 21 are uniformly distributed on the lower end surface of the body 18 along a circumferential direction of the mounting groove 19 and are used for accommodating mortar, and an inner side wall of an inner wall of each liquid supply tank 21, which corresponds to a direction opposite to a rotation direction of the body 18, is transitionally connected to the lower end surface of the body 18 through an arc surface 22.

The mortar mentioned above means a suspension of grinding particles, for example, a grinding fluid containing quartz sand particles. In the process that the body 18 rotates relative to the product 2, mortar in the liquid supply tank 21 is squeezed between the lower end face of the body 18 and the upper end face of the product 2 from the position of the arc surface 22 in the process that the body 18 rotates, so that a mortar layer is formed between the lower end face of the body 18 and the upper end face of the product 2, and finally grinding and thinning are completed through friction between the mortar layer and the upper end face of the product 2.

Example two:

the general structure of the embodiment is the same, and the difference is that: the body 18 is provided with a liquid supply pipeline 23 corresponding to each liquid supply groove 19, and the liquid supply pipeline 23 is communicated with the liquid supply grooves 19. The supply line 23 communicates with an external mortar storage tank through an external hose so that the mortar in the storage tank is pumped into the supply tank 19.

Example three:

the structure is the same as the general structure of the second embodiment, and the difference is that: as shown in fig. 5, a backflow groove 24 is provided between any two adjacent liquid supply grooves 21 on the lower end surface of the body 18, an annular main backflow channel 25 is provided on the lower end surface of the body 18, and all backflow grooves 24 extend in the radial direction to communicate with the main backflow channel 25.

Example four:

the three general structures are the same as the three general structures of the embodiment, and the differences are that: a positioning groove 26 for controlling a gap between the lower end surface of the body 18 and the surface to be processed of the product 2 is arranged on the lower end surface of the body 18 close to the outer edge of the body 18, and a pipeline for supplying a high-pressure medium to the positioning groove 26 is arranged in the body 18. The high-pressure medium can be high-pressure cooling liquid or compressed air and is pumped into the positioning groove 26 through the booster pump, so that a gap is formed between the upper end face of the product 2 and the lower end face of the grinding disc body 18 by the high-pressure medium, the gap between the upper end face of the product 2 and the lower end face of the grinding disc body 18 can be well adjusted by adjusting the pressure value of the high-pressure medium in the positioning groove 26, and the high-pressure medium plays a role in buffering at the initial stage of descending of the grinding disc body 18, so that the product is prevented from being cracked due to the fact that the product is impacted by the.

Example five:

the four general structures are the same as the four general structures of the embodiment, and the differences are that: the sub-grinding block 20 is in sliding fit with the mounting groove 19, an adjusting cavity 27 is formed between the sub-grinding block 20 and the inner wall of the mounting groove 19 in a surrounding mode, and a pipeline communicated with the adjusting cavity 27 is arranged in the body 18. The adjusting cavity 27 can be communicated with an external metering pump through a control hose, and the pressure value of the adjusting cavity 27 is adjusted through a controller, so that the descending or ascending resetting control of the sub grinding block 20 is finally realized.

Example six:

preferably, the carrier comprises a shell 1 with an upward opening direction, the shell 1 is detachably mounted on a machine tool carrying platform, an adjusting mechanism 3 for adjusting the horizontal inclination angle of the product 2 is arranged in the shell 1, magnetorheological fluid 4 is filled in the shell 1, so that the adjusting mechanism 3 is immersed in the magnetorheological fluid 4, when the lower part of the product 2 is connected to the adjusting mechanism 3, the adjusting mechanism 3 drives the product 2 to swing to a set position and then stand, the part to be processed of the product 2 is located above the liquid level of the magnetorheological fluid 4, and a magnetic field generator is arranged on the shell 1 and used for driving the magnetorheological fluid 4 in the shell 1 to be solidified or reset to be in a fluid state.

The preset position refers to a position of a product to be machined on the machine tool, for example, a wafer is thinned through the grinding disc, and the preset position of the product refers to that a surface of the product to be machined swings to be parallel to a grinding surface of the grinding disc. In general, the above-described plurality of set positions are positions where the reference plane of the product is horizontal, but it is needless to say that the machining of the inclined surface can be completed also in the case of a multi-axis machine tool.

Fig. 1, 2 and 3 show that the product 2 is a sheet-shaped functional wafer 2.1, and the functional wafer 2.1 is attached to a slide wafer 2.2 from top to bottom, so that the strength of the functional wafer 2.1 is improved, and the functional wafer 2.1 is conveniently subjected to surface processing, such as thinning and etching. Specifically, the functional wafer 2.1 and the carrier wafer 2.2 are bonded through a bonding glue 2.3.

The horizontal inclination angle refers to an included angle between a reference plane on the product 2 and a horizontal plane, the reference plane may be an upper end surface of the product 2, and since more functional wafers 2.1 in the product 2 are made of a transparent material, the reference plane may also be an attaching surface between the functional wafer 2.1 and the slide glass wafer 2.2, specifically, an attaching surface between the functional wafer 2.1 and the cured bonding adhesive 2.3.

Example seven:

the same as the sixth bulk structure of the example, except that: the adjusting mechanism 3 comprises at least three cylinders 3.1, preferably four cylinders 3.1, all the cylinders 3.1 are arranged at intervals in the horizontal direction, the lower end of each cylinder 3.1 is connected with the shell 1, a central channel is arranged in each cylinder 3.1, a piston rod 3.2 is in sliding fit in the central channel, the lower end face of the piston rod 3.2 and the inner surface of the central channel surround to form a control cavity 3.3, the upper end of the piston rod 3.2 is exposed above the cylinder 3.1 in the vertical direction, and a connecting piece used for being connected with or disconnected from the product 2 is arranged at the end part of the piston rod 3.2 exposed above the cylinder 3.1.

The same as the sixth bulk structure of the example, except that: adjusting mechanism 3 includes a barrel 3.1, and barrel 3.1's lower extreme and 1 fixed connection of casing, barrel 3.1's upper end extend up along vertical direction, be equipped with a center channel in the barrel 3.1, sliding fit has a piston rod 3.2 in the center channel, and the lower terminal surface of piston rod 3.2 encloses with the internal surface of center channel and forms control chamber 3.3, and the upper end of piston rod 3.2 is exposed in barrel 3.1 top along vertical direction, and the tip that the piston rod 3.2 exposes in barrel 3.1 top is equipped with the arbitrary plane wobbling manipulator that can follow piston rod 3.2 axis place, is equipped with the suction head of being connected or disjointing with product 2 on the manipulator.

The same as the sixth bulk structure of the example, except that: the adjusting mechanism 3 can be a waterproof mechanical arm, and the mechanical arm is used for grasping the product and adjusting the product to a horizontal position, so that the magnetorheological fluid can be used for fixing and clamping the product.

The same as the sixth bulk structure of the example, except that: the adjusting mechanism 3 may be a standard base platform fixedly installed in the casing 1, the upper end surface of the base platform is a reference surface, and when the lower portion of the product 2 is immersed in the magnetorheological fluid 4 of the casing 1, the lower end surface of the product 2, i.e., the lower end surface of the carrier wafer 2.2 of the product 2, is attached to the upper end surface of the base platform, so as to complete automatic calibration of the horizontal inclination angle of the product 2.

Example eight:

the structure is the same as the seventh general structure, and the difference is that: the connecting piece is a sucker 3.4 with an upward opening direction.

Example nine:

the same bulk structure as in the example eight, the difference is that: the inner part of the piston rod 3.2 is provided with a connecting pipe 3.5, the upper end of the connecting pipe 3.5 is communicated with the inner cavity of the sucker 3.4, the lower end of the connecting pipe 3.5 is communicated with the control cavity 3.3, and the control cavity 3.3 is connected with a pressure adjusting system outside the shell 1 through the control pipe 5. As shown in fig. 1 and 2, the pressure regulating system includes a pump 16 and a pressure sensor 17, one end of the control tube 5 is communicated with the control chamber 3.3, the other end of the control tube 5 is communicated with an output end of the pump 16, the pressure sensor 17 is mounted on the control tube 5 for detecting a pressure value in the control tube, of course, a solenoid valve (not shown) for regulating a flow rate and a pressure value of the control tube 5 may be further provided on the controller, and the pressure sensor 17 transmits a detection signal to the controller (not shown) for regulating a power and/or the solenoid valve of the pump 16 through the controller.

Example ten:

the structure is the same as the nine-body structure of the embodiment, and the difference is that: the sucking disc 3.4 and the piston rod 3.2 formula structure as an organic whole, the lower extreme of barrel 3.1 passes through

universal joint

6 and 1 normal running fit of casing.

Preferably, the suction cup 3.4 and the piston rod 3.2 are made of hard materials, and the edge of the opening of the suction cup 3.4, which is far away from the piston rod 3.2, is coated with an elastic sealant. The sucking effect of the sucking disc is increased through the elastic sealant, and the sucking state between the sucking disc and the product can be kept through the deformation of the elastic sealant when the piston rod 3.2 swings for a certain angle so that the sucking disc 3.4 and the lower end face of the product form an included angle state, so that the self-adaption is realized.

Preferably, the suction cup 3.4 is hinged with the piston rod 3.2 through a spherical joint. The ball joint can also be understood as a universal joint, so that the suction cup 3.4 can be rotated relative to the piston rod 3.2.

Preferably, the suction cup 3.4 is connected with the piston rod 3.2 through an elastic member. For example by integrally vulcanised rubber.

Example eleven:

the structure is the same as the structure of the embodiment, and the difference is that: the top surface of the control cavity 3.3 is upwards and inwards concave along the vertical direction to form a groove 7 with an opening direction downwards, magnetorheological fluid 4 in the shell 1 is sequentially poured into the control cavity 3.3 through the suction disc 3.4 and the connecting pipe 3.5 in the piston rod 3.2, and the magnetorheological fluid 4 in the control cavity 3.3 forms a liquid seal in the notch position of the groove 7 or the groove 7, so that an air cavity for temporarily storing air is formed in the groove 7.

As shown in fig. 4, the central passage is located on the inner side wall corresponding to the control chamber 3.3 and is inscribed in the horizontal direction to form an annular step surface, and the step surface is upwardly and inwardly concave along the vertical direction to form a groove 7 with an opening facing downward.

Preferably, the top surface may also refer to a lower end surface of the piston rod 3.2, the lower end surface of the piston rod 3.2 is recessed upwards along a vertical direction to form a groove 7 with a downward opening direction, when the connecting pipe 3.5 is arranged in the piston rod 3.2, the groove 7 is an annular groove, and the annular groove 7 is sleeved outside the connecting pipe 3.5 along a horizontal direction.

Example twelve:

the same as the sixth bulk structure of the example, except that: be equipped with a baffle 8 in the casing 1, baffle 8 encloses with the inside wall of casing 1 and forms an inclosed reserve chamber 9, and the bottom of reserve chamber 9 is equipped with the infusion passageway 10 with the inner chamber intercommunication of casing 1, just infusion passageway 10 be located the liquid level below of magnetorheological suspensions 4 in casing 1, be equipped with on the lateral wall of reserve chamber 9 and be used for discharging the air in the reserve chamber 9 or towards filling into the air cock 11 in the reserve chamber 9.

Preferably, an upper liquid level sensor for detecting an upper liquid level limit and a lower liquid level sensor for detecting a lower liquid level limit are arranged in the storage cavity 9, the lower liquid level sensor is higher than the position of the infusion channel 10 along the vertical direction, and the upper liquid level sensor is lower than the position of the air faucet 11 along the vertical direction.

Example thirteen:

the structure is the same as the twelve general structures of the embodiment, and the difference is that: a liquid inlet pipe 12 is arranged on the side wall of the storage cavity 9, and the liquid inlet pipe 12 is communicated with the storage cavity 9 and used for injecting magnetorheological fluid into the storage cavity 9.

Example fourteen:

the structure is the same as that of the thirteen embodiment, and the difference is that: the magnetic field generator comprises a primary excitation means 13 housed in the housing 1 and a secondary excitation winding 14 integrated in the partition 8. When the main excitation device 13 and the auxiliary excitation winding 14 are powered on to generate a magnetic field, the magnetorheological fluid in the shell 1 is driven to solidify through the magnetic field, and when the main excitation device 13 and the auxiliary excitation winding 14 are powered off, the magnetorheological fluid in the shell 1 is reset to be in a fluid state.

Example fifteen:

the same as the sixth bulk structure of the example, except that: an overflow groove 15 is arranged on the outer side wall of the shell 1, and the overflow groove 15 extends along the circumferential direction of the shell 1 to form an annular structure. The magnetorheological fluid in the overflow groove 15 is purified and then is communicated with the liquid inlet pipe 12 through a three-way valve.

It should be noted that, in the description of the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship indicated based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

Various alterations and modifications will no doubt become apparent to those skilled in the art after having read the above description. Therefore, the appended claims should be construed to cover all such variations and modifications as fall within the true spirit and scope of the invention. Any and all equivalent ranges and contents within the scope of the claims should be considered to be within the intent and scope of the present invention.

Claims

1. The utility model provides a mill that slice wafer processing used which characterized in that: the mortar grinding machine comprises a disc-shaped body (18), wherein a mounting groove (19) is formed in the center of the lower end face of the body (18), a sub grinding block (20) is arranged in the mounting groove (19), a plurality of liquid supply grooves (21) are uniformly distributed on the lower end face of the body (18) along the circumferential direction of the mounting groove (19) and used for containing mortar, and the inner side wall, corresponding to the opposite direction of the rotation direction of the body (18), in the inner wall of each liquid supply groove (21) is in transitional connection with the lower end face of the body (18) through an arc surface (22);

liquid supply pipelines (23) are arranged in the body (18) at positions corresponding to the liquid supply tanks (21), and the liquid supply pipelines (23) are communicated with the liquid supply tanks (21);

a backflow groove (24) is formed between any two adjacent liquid supply grooves (21) on the lower end face of the body (18), an annular main backflow channel (25) is formed on the lower end face of the body (18), and all the backflow grooves (24) radially extend to be communicated with the main backflow channel (25);

a positioning groove (26) for controlling a gap between the lower end face of the body (18) and the surface to be processed of the product (2) is formed in the position, close to the outer edge of the body (18), of the lower end face of the body (18), and a pipeline for supplying a high-pressure medium to the positioning groove (26) is arranged in the body (18);

the grinding block body is characterized in that the grinding block body (20) is in sliding fit with the mounting groove (19), an adjusting cavity (27) is formed between the grinding block body (20) and the inner wall of the mounting groove (19) in a surrounding mode, and a pipeline communicated with the adjusting cavity (27) is arranged in the body (18).

2. The utility model provides a grinding machine of slice wafer attenuate processing is exclusively used in, includes the lathe microscope carrier, its characterized in that: the machine tool carrying platform is detachably provided with a carrier for clamping a product (2), a grinding disc in the claim 1 is arranged above the carrier, and the grinding disc is arranged on a machine tool driving shaft (28) and rotates along with the machine tool driving shaft (28).

3. The grinding machine special for thinning and processing of the sheet-shaped wafer according to claim 2, characterized in that: the carrier includes casing (1) that the opening direction is up, is equipped with adjustment mechanism (3) that are used for adjusting product (2) horizontal inclination in casing (1), pour into magnetorheological suspensions (4) in casing (1), so that adjustment mechanism (3) submergence is in magnetorheological suspensions (4), when the sub-unit connection of product (2) is on adjustment mechanism (3) order about product (2) to swing and place after setting for the position, just the part of treating of product (2) is located the top of magnetorheological suspensions (4) liquid level, be equipped with magnetic field generator on casing (1) for order about magnetorheological suspensions (4) solidification in casing (1) or reset to being fluid state.

4. A grinder special for thinning sheet-like wafers as claimed in claim 3, wherein: adjustment mechanism (3) include at least three barrel (3.1), and whole barrel (3.1) set up along the horizontal direction interval, and the lower extreme of each barrel (3.1) all is connected with casing (1), be equipped with a central channel in barrel (3.1), sliding fit has a piston rod (3.2) in the central channel, and the lower terminal surface of piston rod (3.2) encloses with the internal surface of central channel and forms control chamber (3.3), and the upper end of piston rod (3.2) is along vertical direction exposure in barrel (3.1) top, and piston rod (3.2) expose the tip above barrel (3.1) and be equipped with and be used for being connected or the connecting piece that breaks away from with product (2).

5. A grinder special for thinning sheet-like wafers as claimed in claim 3, wherein: be equipped with a baffle (8) in casing (1), baffle (8) surround with the inside wall of casing (1) and form an inclosed reserve chamber (9), the bottom of reserve chamber (9) is equipped with infusion passageway (10) with the inner chamber intercommunication of casing (1), just infusion passageway (10) be located the liquid level below of magnetorheological suspensions (4) in casing (1), be equipped with on the lateral wall of reserve chamber (9) and be used for discharging air in reserve chamber (9) or fill into air cock (11) of air in reserve chamber (9) towards.

6. A grinder special for thinning sheet-like wafers as claimed in claim 3, wherein: an overflow groove (15) is arranged on the outer side wall of the shell (1), and the overflow groove (15) extends along the circumferential direction of the shell (1) to form an annular structure.