CN108412060B - Open thermal buffer and method thereof - Google Patents
Open thermal buffer and method thereof Download PDFInfo
- Publication number
- CN108412060B CN108412060B CN201810021012.0A CN201810021012A CN108412060B CN 108412060 B CN108412060 B CN 108412060B CN 201810021012 A CN201810021012 A CN 201810021012A CN 108412060 B CN108412060 B CN 108412060B
- Authority
- CN
- China
- Prior art keywords
- thermal
- thermal diffusivity
- diffusivity
- anisotropic
- open
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 65
- 230000009466 transformation Effects 0.000 claims abstract description 22
- 238000009792 diffusion process Methods 0.000 claims abstract description 14
- 230000008859 change Effects 0.000 claims abstract description 8
- 230000003139 buffering effect Effects 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000004794 expanded polystyrene Substances 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 3
- 230000001052 transient effect Effects 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 abstract description 3
- 230000001131 transforming effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 8
- 239000012774 insulation material Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000011449 brick Substances 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006248 expandable polystyrene Polymers 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Images
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
- E04B1/76—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/08—Thermal analysis or thermal optimisation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/90—Passive houses; Double facade technology
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Architecture (AREA)
- Evolutionary Computation (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Acoustics & Sound (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses an open type thermal buffer device and a method thereof, and particularly comprises a step of stretching and transforming a material with anisotropic thermal diffusivity; and a step of subjecting the stretched plate-like material to annular deformation to obtain a thermal diffusion coefficient after coordinate transformation. The invention can smooth the drastic change of the external temperature, quickly reach the average temperature of the outside, is not isolated from the outside and can communicate with the outside. The invention is a passive device, saves energy and protects environment, and the heat source and the cold source are all taken from the external environment, thus being widely applied to the condition of converting periodic heat pulse into uniform heat flow.
Description
Technical Field
The invention belongs to the field of light conversion, and particularly relates to a heat buffer device with an opening structure.
Background
Thermal buffering is generally applied in situations where there is a substantial change in ambient temperature, and ideally a thermal buffer element will absorb heat at higher temperatures to ensure that the interior space is kept from excessive temperatures, and will give off heat at lower temperatures to provide the necessary temperature to the interior space. The interior space is the area where we want to avoid the effects of extreme temperatures, typically indoors or in various boxes.
At present, two methods for providing a relatively stable temperature in a room or a box are available, one is to artificially regulate the internal temperature by using active equipment, such as an air conditioner. Another is to use a heat insulating material so that the temperature inside is not disturbed by the outside.
The first active device has the disadvantage of energy consumption, and a passive and energy-saving device is needed under the condition of energy conservation and environmental protection advocated at present.
The second insulation material has the disadvantages that the second insulation material is completely insulated, so that the second insulation material cannot be consistent with the temperature equalization of the outside, and a small gap or a small hole can obviously influence the performance of heat buffering, but a scene that a space is completely insulated is difficult to be widely applied, such as a room or any constant temperature space, and a door window or an opening communicated with the external environment is required.
Disclosure of Invention
1. The invention aims to provide a novel method.
The invention provides an open type thermal buffer device and a novel thermal buffer technology of a manufacturing method thereof, thereby solving the problems of high energy consumption, isolation from the outside, easy influence by holes and the like in the existing thermal buffer technology. The thermal buffering technology of the invention is passive, is slightly influenced by the holes, and keeps consistent with the external temperature equalization while smoothing the external temperature fluctuation.
2. The technical scheme adopted by the invention is disclosed.
The invention provides an open type thermal buffering method, which is carried out according to the following steps:
the surface of the material with anisotropic thermal diffusivity is vertical to an x axis under a Cartesian coordinate system, the distance is delta, the distance between every two surfaces with anisotropic thermal diffusivity is changed into a plate-type material of M & delta after stretching, and M is a stretching factor;
considering transient heat conduction, in addition to thermal conductivity κ, the thermal capacity c and mass density ρ are also considered, and the coordinate transformation is reflected by a change in the thermal diffusivity α ═ κ/ρ c:
αbto the thermal diffusion coefficient of the common thermal material before transformation, Λ is the transformation matrix:
the thermal diffusivity after transformation can be expressed as:
wherein alpha is⊥Is the thermal diffusion coefficient in the direction of the ring normal, alpha//Is the thermal diffusion coefficient in the annular tangential direction; the stretch factor M determines the degree of anisotropy of the thermal diffusivity of the material.
In a further embodiment, the method further comprises step 3 of selecting a material with various thermal diffusivities according to the thermal diffusivity to arrange the thermal buffer material.
In a further embodiment, the material with anisotropic thermal diffusivity can be one material with anisotropic thermal diffusivity, or two or more materials with different thermal diffusivity are alternately layered.
In a further embodiment, the one material having anisotropic thermal diffusivity is graphite.
In a further embodiment, the two materials with different thermal diffusivity are copper and expanded polystyrene.
An open thermal buffer is prepared by the thermal buffer method.
In a further embodiment, the material with anisotropic thermal diffusivity can be one material with anisotropic thermal diffusivity, or two or more materials with different thermal diffusivity are alternately layered.
In a further embodiment, the one material having anisotropic thermal diffusivity is graphite.
In a further embodiment, the two materials with different thermal diffusivity are copper and expanded polystyrene.
3. The technical effect produced by the invention.
(1) The invention effectively solves the contradiction that the heat insulation material is required to be strictly sealed but the practical environment cannot be strictly sealed, and the one or more openings of the invention are more beneficial to the heat exchange and the heat energy storage between the buffer layer and the outside.
(2) The present invention can smooth the drastic change of the external temperature. The physical mechanism of heat release at low external temperatures provides a relatively smooth temperature inside the buffer structure by storing heat at high external temperatures.
(3) The invention can quickly reach the average temperature of the outside. Without thermal isolation from the outside, the average value of the temperature change of each period can be used as a heat source to heat the inside (the average value is lower than the inside temperature and is used for refrigeration), so that the temperature of the inside can be quickly equalized to the outside.
(4) The invention is not isolated from the outside and can communicate with the outside. In many cases, an open environment is required while maintaining the temperature of the interior constant, such as door opening and window opening in a room. The invention has the advantages of having the thermal buffering effect while not being isolated from the outside, which cannot be achieved by a thermal isolation device.
(5) The invention is a passive device, and is energy-saving and environment-friendly. The heat source and the cold source are all taken from the external environment, and can be widely applied to the condition of converting periodic heat pulse into uniform heat flow
From the principle of heat conduction, the thermal diffusivity of the closed thermal insulation material is very low, and heat can be effectively prevented from flowing into the inside of the closed thermal insulation material structure from the outside, but if the thermal insulation material is not closed well, heat flow can flow into the inside of the structure from small holes. The material used in the present invention has a very high tangential diffusivity which is much greater than the diffusivity of air at the small holes, so that heat flow will preferentially enter the buffer layer of the present invention. And the radial thermal diffusivity is very small, so the heat flow is equivalently limited in the buffer layer, and the problem that the heat flow flows to the inner space of the buffer structure is effectively solved.
Drawings
FIG. 1 is a flow chart of the inventive method.
FIG. 2 is a partial composition diagram of a device fill material.
Fig. 3 is a top view of the structure of the embodiment.
Fig. 4 is a top view of a structure of a comparative example.
Fig. 5 is a graph showing the temperature change at the center point inside the device.
Detailed Description
Example 1
In order to make the technical spirit and advantages of the present invention more clearly understandable, the following embodiments are described in detail, but the description of the embodiments is not a limitation to the technical solution of the present invention, and any equivalent changes made according to the inventive concept, which are merely in form and not in material, should be regarded as the technical solution of the present invention.
The following description of the embodiments refers to the accompanying drawings.
The invention uses a novel artificial thermal material to manufacture the annular thermal buffer, and the parameters of the annular thermal buffer can be deduced by stretching transformation in the thermal transformation. The resulting derived material may be composed of alternating (12121212) two (or more) natural materials of different thermal diffusivity (such as 1 copper and 2 expanded polystyrene) or of a natural occurring anisotropic thermal diffusivity material (such as graphite).
As shown in fig. 1, the specific steps are as follows:
s1 isotropic thermal material
Considering two surfaces (made of common isotropic thermal materials) a and a' that are equally shaped perpendicular to the x-axis and are very close together (separation distance a → 0) in a cartesian coordinate system,
s2 stretching transformation
A stretch transform is made along the x-axis, the transform being as follows:
where (x, y, z) and (x ', y ', z ') denote the coordinate systems after and before transformation, respectively, M is the stretch factor, and the separation of the two surfaces after stretching becomes M · Δ.
S3, bending to form a relatively closed columnar structure with one or more openings in its cross section, and changing the thermal diffusivity.
In considering transient heat conduction, we also consider heat capacity c and mass density ρ in addition to thermal conductivity κ, where we reflect our coordinate transformation with a change in thermal diffusivity α ═ κ/ρ c:
αbthe thermal diffusivity of a common thermal material prior to transformation. Λ is a transformation matrix:
wherein alpha is⊥Is the thermal diffusion coefficient in the direction of the ring normal, alpha//The coefficient of thermal diffusion in the tangential direction of the annulus. The stretch factor M determines the degree of anisotropy of the thermal diffusivity of the material. Typically, a large value for M (e.g., greater than 100 for copper and expanded polystyrene) is used to ensure that the resulting material has a high degree of thermal anisotropy.
Although we have obtained a flat plate along the x-axis after the stretching transformation, we can bend it into any shape to meet the practical requirements, such as a circular ring or a square ring. The heat buffer element of the invention may have one or more openings, which may be air or other material (door, window). The opening has the advantage of enhancing the heat exchange of the buffer layer with the outside. The structure is filled with the above-derived thermal material with high anisotropy by the annular region. The material can be formed by alternately arranging two isotropic materials with large difference in thermal diffusivity, and then closely adhering or extruding the two isotropic materials, for example, the material with high thermal diffusivity can be copper, and the material with low thermal diffusivity can be expanded polystyrene.
Fig. 2 shows the composition and structure of the device fill material. Black 1 and white 2 represent two materials with different thermal diffusivity, respectively. 1: high thermal diffusivity (Cu) and thermal conductivity of 401 W.m-1·K-1(ii) a 2: low thermal diffusivity material (foamed polystyrene) with thermal conductivity of 0.03 W.m-1·K-1. For clarity, we only show 9 layers, and in practice more layers can be made as required.
Fig. 3 shows a top view of the structure of the embodiment. The material shown in figure 1 was made into open square walls. The single-sided heat source 3 is above the open side. The center of the structure 4 is a temperature detection point.
Fig. 4 shows a top view of a structure of a comparative example. The open square wall material is brick 5 with a thermal conductivity of 0.6 W.m-1·K-1. The single-sided heat source 3 in the comparative example is the same as the single-sided heat source 3 in the embodiment. The temperature probe is also the centre of the structure 4.
The dimensions of the other structures of the embodiment and the comparative embodiment are the same except for the difference in the materials. Including the heat source type: a periodic heat source with a temperature difference of 60 degrees from minus 10 degrees to 50 degrees, and the period is 24 hours. The side length of the wall structure is 1 meter, and the wall thickness is 0.1 meter. It is thermally insulated in all directions except for one side in contact with a heat source.
Figure 5 shows the variation of the temperature inside the wall structure simulated by the software. It can be seen that with brick walls the temperature difference within the structure can be reduced to 24 degrees (8-32 degrees), whereas with thermal buffer structure walls the temperature difference within the structure is 4 degrees (18-22 degrees).
In this embodiment, our thermal buffer device can be used as a wall of a house or as a sandwich of walls, and the anisotropic thermal material of the device is composed of alternating copper layers and expanded polystyrene layers. Windows and doors may be considered openings and may not be used with the anisotropic material of the present invention. The ambient temperature outside the house will be low at night and high at noon, with temperature differences sometimes as high as more than 50 degrees. Because the buffer effect of the common wall body on heat is very small, especially the existence of the door and the window increases the heat exchange inside and outside, people in the common house feel uncomfortable (the temperature is too high or too low). If the thermal buffer structure is used as a wall or a wall interlayer, heat energy can be stored in the thermal buffer structure (1,2) in the daytime, so that the indoor temperature is not too high, and at night, the heat energy in the thermal buffer structure can neutralize the external low temperature, so that the indoor temperature is still appropriate (not too low). So that the people in the room will not feel too cold or too hot for 24 hours.
The novel thermal buffer device can realize the real-time thermal buffer characteristic, thereby achieving a passive temperature regulation effect. Compared with a thermal isolation or active device, the technology is more energy-saving and more suitable for the regulation of the indoor temperature with doors and windows.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
In the description of the present invention, it is to be understood that the terms indicating an orientation or positional relationship are based on the orientation or positional relationship shown in the drawings only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Claims (8)
1. An open type thermal buffering method is characterized by comprising the following steps:
step 1, carrying out stretching transformation on a material with anisotropic thermal diffusivity:
the surface of the material with anisotropic thermal diffusivity is vertical to an x axis under a Cartesian coordinate system, the distance is delta, the distance between every two surfaces with anisotropic thermal diffusivity is changed into a plate-type material of M & delta after stretching, and M is a stretching factor;
step 2, performing annular deformation on the stretched plate-type material to obtain a thermal diffusion coefficient after coordinate transformation:
considering transient heat conduction, in addition to thermal conductivity κ, the thermal capacity c and mass density ρ are also considered, and the coordinate transformation is reflected by a change in the thermal diffusivity α ═ κ/ρ c:
αbto the thermal diffusion coefficient of the common thermal material before transformation, Λ is the transformation matrix:
the thermal diffusivity after transformation can be expressed as:
wherein alpha is⊥Is the thermal diffusion coefficient in the direction of the ring normal, alpha//Is the thermal diffusion coefficient in the annular tangential direction; the stretching factor M determines the degree of anisotropy of the thermal diffusion coefficient of the material;
and 3, selecting a material with various anisotropic thermal diffusivities according to the thermal diffusivity to set the thermal buffer material.
2. The method of claim 1, wherein the material with anisotropic thermal diffusivity is one material with anisotropic thermal diffusivity, or two or more materials with different thermal diffusivity are alternately layered.
3. The open thermal buffering method according to claim 2, wherein: the material with anisotropic thermal diffusivity is graphite.
4. The open thermal buffering method according to claim 2, wherein: the two materials with different thermal diffusion coefficients are copper and expanded polystyrene.
5. An open thermal buffer element, comprising: prepared using the thermal buffering process of claim 1.
6. The open thermal buffer of claim 5, wherein: the material with anisotropic thermal diffusivity can be a material with anisotropic thermal diffusivity, or more than two materials with different thermal diffusivity are alternately layered.
7. The open thermal buffer of claim 6 wherein said material having anisotropic thermal diffusivity is graphite.
8. The open thermal buffer of claim 6, wherein: the two materials with different thermal diffusion coefficients are copper and expanded polystyrene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810021012.0A CN108412060B (en) | 2018-01-10 | 2018-01-10 | Open thermal buffer and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810021012.0A CN108412060B (en) | 2018-01-10 | 2018-01-10 | Open thermal buffer and method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108412060A CN108412060A (en) | 2018-08-17 |
| CN108412060B true CN108412060B (en) | 2020-01-14 |
Family
ID=63125424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810021012.0A Active CN108412060B (en) | 2018-01-10 | 2018-01-10 | Open thermal buffer and method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108412060B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112325955A (en) * | 2020-11-11 | 2021-02-05 | 麦克传感器股份有限公司 | Multipurpose heat conduction type flow switch and its preparation method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH073359A (en) * | 1992-12-23 | 1995-01-06 | Nouv De Metallisation Ind Sa:Soc | Heat barrier, its preparation and material used |
| CN101134678A (en) * | 2006-05-04 | 2008-03-05 | Sgl碳股份公司 | High-temperature resistant composite material |
| CN102661005A (en) * | 2012-05-17 | 2012-09-12 | 上海理想家园工程营造有限公司 | Level-A fireproof thermal insulation polyphenyl foam particle and processing method thereof |
| CN103669622A (en) * | 2013-12-09 | 2014-03-26 | 南京工业大学 | Anisotropic phase change energy storage composite board |
| CN103700638A (en) * | 2013-12-26 | 2014-04-02 | 北京航天时代光电科技有限公司 | Phase change material thermal buffering device and method for dissipating heat of high-power device |
| CN104153471A (en) * | 2014-08-10 | 2014-11-19 | 复旦大学 | Composite layered structure thermal insulation material high in thermal insulation efficiency |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2343183B1 (en) * | 2010-01-07 | 2015-07-22 | Armacell Enterprise GmbH & Co. KG | Elastomeric low temperature insulation |
-
2018
- 2018-01-10 CN CN201810021012.0A patent/CN108412060B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH073359A (en) * | 1992-12-23 | 1995-01-06 | Nouv De Metallisation Ind Sa:Soc | Heat barrier, its preparation and material used |
| CN101134678A (en) * | 2006-05-04 | 2008-03-05 | Sgl碳股份公司 | High-temperature resistant composite material |
| CN102661005A (en) * | 2012-05-17 | 2012-09-12 | 上海理想家园工程营造有限公司 | Level-A fireproof thermal insulation polyphenyl foam particle and processing method thereof |
| CN103669622A (en) * | 2013-12-09 | 2014-03-26 | 南京工业大学 | Anisotropic phase change energy storage composite board |
| CN103700638A (en) * | 2013-12-26 | 2014-04-02 | 北京航天时代光电科技有限公司 | Phase change material thermal buffering device and method for dissipating heat of high-power device |
| CN104153471A (en) * | 2014-08-10 | 2014-11-19 | 复旦大学 | Composite layered structure thermal insulation material high in thermal insulation efficiency |
Non-Patent Citations (1)
| Title |
|---|
| 变换光学及其应用;刘一超;《中国博士学位论文数据库基础科学辑》;20170215(第02期);第13-22页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108412060A (en) | 2018-08-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Balaji et al. | Thermal performance of the building walls | |
| Huang et al. | Effects of key factors on the heat insulation performance of a hollow block ventilated wall | |
| CN101476753B (en) | Construction thermal environment and construction energy-saving control method in heating building | |
| CN108412060B (en) | Open thermal buffer and method thereof | |
| US20160076827A1 (en) | Variable thermal insulation | |
| Kaynakli et al. | Determination of optimum insulation thickness for different insulation applications considering condensation | |
| Kong et al. | Experimental study on the performance of a stepped phase-change radiation terminal integrated with a building used in summer and winter | |
| Yang et al. | Building envelope with phase change materials | |
| Rimar et al. | Influence of Heat Accumulation of the Object on the Operation of the Cooled Ceilings Cooling System | |
| CN209202738U (en) | A kind of Multifunction sandwiched-type cloth cellular construction of shelter sound-insulating and heat-insulating | |
| Ali et al. | Application of water flowing PVC pipe and EPS foam bead as insulation for wall panel | |
| Kaynakli | Optimum thermal insulation thicknesses and payback periods for building walls in Turkey | |
| Abuzaid et al. | An assessment of utilizing Phase Change Materials (PCM) towards energy performance in building enclosures | |
| KR20180001315A (en) | Composite Insulated Panel | |
| Bricka et al. | Evaluation of thermal energy storage potential in low-energy buildings in France | |
| Zhao et al. | Experimental investigation on the thermal performance of heat storage walls coupled with active solar systems | |
| Wu et al. | Numerical study on energy consumption characteristics for wall insulation structure in hot summer and cold winter zone | |
| CN112613182B (en) | Calculation method for heat absorption and heat release process of inner wall surface of large-space layered air conditioner building | |
| Thongtha et al. | Integration of phase change material into fiber cement roof for reduction of heat accumulation in buildings | |
| CN206769096U (en) | Exterior insulation external wall system | |
| Cherier et al. | Studies and choice of local building materials for improving interior temperatures of a building located in Ghardaïa region | |
| Haowei et al. | Heat Absorption and Release Characteristics on Heat Storage Walls with Different Materials | |
| CN218346452U (en) | Self-insulation device for external wall of green building | |
| Mageed et al. | A Numerical Study to Determine the Effect of an Insulator Location on the Transient Heat Transfer | |
| Bademli̇oğlu | Determination of optimum insulation thickness for different insulation applications considering condensation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |