CN108389950A - A kind of manufacturing method of the ventilative light transmission COB integrative display panels of permanent protective property - Google Patents
A kind of manufacturing method of the ventilative light transmission COB integrative display panels of permanent protective property Download PDFInfo
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- CN108389950A CN108389950A CN201810144149.5A CN201810144149A CN108389950A CN 108389950 A CN108389950 A CN 108389950A CN 201810144149 A CN201810144149 A CN 201810144149A CN 108389950 A CN108389950 A CN 108389950A
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- wiring board
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- light transmission
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- 238000000034 method Methods 0.000 claims abstract description 14
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- 239000003292 glue Substances 0.000 claims abstract description 11
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- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a kind of manufacturing methods of the ventilative light transmission COB integrative display panels of permanent protective property, include the following steps：Buy LED chip；Multiple pixels are set in the front of printed wiring board, the spacing between two neighboring pixel is 0.01 100mm, and at least one LED chip die bond position is arranged in each pixel；One or more LED chips are set on each LED chip die bond position；Test the electric conductivity of LED chip；Each LED chip is sealed using light transmission solidification glue, forms LED lamp bead, the water proof and dust proof grade of LED lamp bead reaches IP68 and following；Hollow processing is carried out to printed wiring board, forms the LED lamp panel of ventilative light transmission；The driving element welding of driving circuit on a printed-wiring board, or by the driving element of driving circuit is encapsulated in LED lamp bead using Reflow Soldering；Display panel thermal diffusivity made from this method is good, visible angle is big, water proof and dust proof, stability are good, barrier propterty is strong, and manufacturing cost is low, can either be used for interior, and can be used in outdoor.
Description
Technical field
The present invention relates to display area, the manufacture of especially a kind of ventilative light transmission COB integrative display panels of permanent protective property
Method.
Background technology
In recent years, transparence display has been risen in the display screen market LED (Light-Emitting Diode, i.e. light emitting diode)
Screen and grill display screen, the characteristics such as LED transparent display screens are transparent with its, light, novel are favored by numerous users deeply, development
Rapidly, the indoor or semi-outdoor application fields such as show window, lease, building mark have been rapidly entered；LED grill display screens are logical with it
Thoroughly, it radiates, save the characteristics such as installation cost, simple installation, field of LED display enjoys great popularity outdoors.These are emerging to answer
A kind of completely new visual sense of beauty enjoyment is provided with for user, is quickly grown, opening new application for LED display applications leads
Domain.
Indoor application uses LED transparent display screens, had both met indoor or semi-outdoor and has applied required higher pixel density,
The higher demand of transparency is realized again.Transparent display screen at present, there are two types of technical solutions on a display panel, and one is positive patches
Positive luminescence technology, one is positive patch side luminescence technology, two kinds of technical solutions are all made of SMD (Surface Mounted
Devices, i.e. surface mount device) display encapsulation technology, i.e. the SMD lamp beads of display screen enterprise procurement encapsulation enterprise, by every
Multiple solder joints of SMD lamp beads stamp tin cream, are mounted on the driver circuit plate of a part hollow out, by solder reflow process,
High temperature melt tin cream is pasted after cooling on the corresponding pad of driver circuit plate lamp position for adhering to hollow out, to realize lamp bead and drive
The electrical connection of dynamic wiring board.In structure, generally respectively transparent material layer is added to be sandwiched using before and after hollow out display panel
Transparent effect is realized to protect and fix hollow out display panel in centre.
Outdoor application uses LED grill display screens, need to there is higher barrier propterty and ventilation and heat ability, but pixel density
Low, display screen producer mainly uses DIP (Dual Inline Package, i.e. dual-inline package) aobvious in display lamp bar
Show encapsulation technology scheme, i.e. the DIP lamp beads of display screen enterprise procurement encapsulation enterprise, by 2 of every DIP lamp bead or multiple welderings
Foot is inserted into grid and shows on driver circuit plate, by wave soldering processes, lamp bead leg is welded on driver circuit plate lamp position phase
On the pad answered, to realize being electrically connected for lamp bead and driver circuit plate.Also partial grid display screen uses SMD encapsulation technologies,
Wiring board design is not only had to hollow out by operating type and transparent display screen class formula at lamp bar.In structure, lamp bar will be shown
It is fixed on structural member, encapsulating processing is then carried out, to solve the protection question of outdoor application.
Above indoor, outdoor two kinds of LED transparent display screens and grill display screen, it is total on display panel and display lamp bar
With characteristic be：1, SMD and DIP lamp beads are produced by the encapsulation enterprise of profession, are the supplied upstreams of LED display enterprise
Quotient.2, SMD and DIP lamp beads are a main components of LED display.3, SMD or DIP lamp beads need to be welded on driving line
On the plate of road, display function could be realized.
, there is following technical problem underlying on a display panel in above-mentioned LED indoor transparent screen and outdoor grid screen：
1, industrial chain link is more, and technique is cumbersome, and equipment investment is big, the bad control of production process, batch unstable quality, always
Body product quality is not high.Encapsulation enterprise and display screen business accountability define unclear.Encapsulation link increases packaging facilities, packing timber
Expect cost and Product transport cost；
2, SMD and DIP encapsulation technologies are all made of metallic support and are easy to damage lamp during high-temperature soldering as carrier
Pearl causes lamp bead to fail.In practical applications, protection is improper is easy to oxidation of making moist, and lamp bead is caused to fail.It is transporting and is installing
In the process, it collides with and be easy to cause lamp bead and fall off, fastness is bad.Increase holder cost simultaneously.
3, because being limited by holder Lamp cup, between 90-120 °, the crowd outside visible angle cannot understand to be seen visible angle
To display picture, audient crowd is limited.
4, no matter SMD or DIP, all need to be welded on driver circuit plate, rosin joint, dry joint and welding procedure cause
Problem is difficult to avoid, while increasing welding cost.
5, indoor transparent screen can not pass through casting glue sealing metal holder, protective because using SMD encapsulation technology schemes
Difference causes holder to aoxidize even if application is also easy to make moist indoors, lamp bead failure, the stability of product by extreme influence,
So application range is confined to indoor or semi-outdoor environment.
6, SMD and DIP is radiated indirectly by holder pin, and thermal resistance is high, and heat conduction path is long, and heat dissipation effect is all paid no attention to
Think, LED chip light decay is big.
Though 7, transparent display screen has front and back two layers of transparent prevention plate, secured performance to be reinforced, heat dissipation effect is made to dislike
Change, and two layers of transparent prevention plate increases product weight, barrier propterty is not improved still well, therefore is only applicable in
In places such as indoor show window, indoor leases.But large-scale glass wall can cause to show because of the glass partition or wall stud between window
Show that picture is discontinuous, it is imperfect, influence whole display effect；
8, transparent display screen either uses front and back two layers of transparent prevention plate, does not still fill transparent prevention plate, is mounted on glass
In glass show window, it can all cause glass reflecting, picture unclear.
Although 9, grill display screen protective is higher, thermal diffusivity is preferable, and pixel density is not high, and it is aobvious to be only limitted to outdoor large
Display screen application.Be not suitable for being applied to indoor display, lease, and the display screen that outdoor pixel density is more demanding.
COB encapsulation (Chip On Board) is that LED bare chips is conductive or insulating cement (i.e. non-conductive adhesive) is fixed on print
On the pad of brush wiring board lamp position, the soldering of electric property conducting is then carried out, after lighting functional test qualification, then to lamp
The colloid of position light transmission carries out encapsulating solidification.Currently, LED indoor transparent screen and outdoor grid screen are using COB encapsulation not yet
The prior art.
Invention content
Technical problem to be solved by the invention is to provide a kind of systems of the ventilative light transmission COB integrative display panels of permanent protective property
Method is made, is encapsulated using COB and traditional SMD and DIP encapsulation manufacture LED indoor transparent display screen and outdoor grid is replaced to show
Screen, to solve the problems, such as to be mentioned in background technology.
The technical solution adopted by the present invention to solve the technical problems is：A kind of ventilative light transmission COB of permanent protective property is integrated aobvious
The manufacturing method for showing panel, includes the following steps：
A, LED chip is bought；
B, multiple pixels are set in the front of printed wiring board, the spacing between two neighboring pixel is 0.01-
100mm, and at least one LED chip die bond position is set in each pixel；
C, one or more LED chip is set on each LED chip die bond position；
D, the electric conductivity of LED chip is tested；
E, each LED chip is sealed using light transmission solidification glue, forms LED lamp bead, the water proof and dust proof etc. of LED lamp bead
Grade reaches IP68 and following；
F, hollow processing is carried out to printed wiring board, forms the LED lamp panel of ventilative light transmission；
G, using Reflow Soldering by the welding of the driving element of driving circuit on a printed-wiring board, or by the driving of driving circuit
Device is encapsulated in LED lamp bead；
Step A, the sequence of B, C, D, E, F, G is in no particular order.
Further, in step C, the set-up mode of LED chip includes that formal dress, upside-down mounting or formal dress are combined with upside-down mounting,
Wherein, the LED chip of formal dress is electrically connected by bonding wire and the printed circuit in printed wiring board, and the LED chip of upside-down mounting is logical
Attachment welding is crossed to be electrically connected with the printed circuit in printed wiring board.
Further, in step C, LED chip is pasted onto by conducting resinl or non-conductive adhesive on LED chip die bond position.
Further, it completes each face even application of the printed wiring board of step A to G or is invading bubble protective materials.
As a kind of perferred technical scheme：Driving circuit is set to the back side of printed wiring board, the driving of driving circuit
Device is welded on the back side of printed wiring board, and driving element is electrically connected by via with LED lamp bead.
As a kind of perferred technical scheme：Driving circuit is set to the front of printed wiring board, the driving of driving circuit
Device is welded in the front of the printed wiring board between LED lamp bead.
As a kind of perferred technical scheme：Driving circuit section is set to the front of printed wiring board, and another part is set
It is placed in the back side of printed wiring board, the driving element of driving circuit is welded in the front of the printed wiring board between LED lamp bead, another
Part is welded in the back side of printed wiring board.
As a kind of perferred technical scheme：Driving circuit is set to the front of printed wiring board, the driving of driving circuit
Device is welded in LED lamp bead.
Further, coating printing ink in the printed wiring board between LED lamp bead and LED lamp bead.
The beneficial effects of the invention are as follows：1, traditional SMD and DIP encapsulation technologies are to produce LED chip by upstream producer, in
Trip encapsulation producer is packaged into LED lamp bead, then is welded LED lamp bead on a printed-wiring board by downstream display screen producer, and this hair
Bright directly to buy LED chip by display screen producer and be packaged, whole process is completed in a factory, and industrial chain link subtracts
Few, packaging technology simplifies, and equipment always puts into reduction, the more preferable control of quality, occurs when quality problems that responsibility judgment is clear, saves lamp
Packaging facilities, packaging material cost and the intermediate link transportation cost of pearl.
2, COB encapsulation technologies are no support technologies, save holder cost, and skill is encapsulated by all problems COB that holder causes
Art is all not present, while having permanent protective property, water proof and dust proof, moisture proof, salt spray proof, high-low temperature resistant, antiultraviolet, anti-to collide with,
Fastness is good, it is easy to clean the advantages that.
3, the visible angle of display screen is more than 170 °, and audient crowd is more, has wide range of applications.
4, it is not necessarily to lamp bead reflow soldering, rosin joint caused by avoiding lamp bead welding saves welding cost.
5, display screen produced by the present invention had not only solved the problems, such as transparent stuffy, but also solved heat dissipation problem, can be enough
In outdoor, and it can be used in interior, job stability is high, and longer life expectancy, application range is wider, as indoor and outdoor show window, stage are rented
Rent, indoor and outdoor lease, landscape and building are shown, be indoor and outdoor application round-the-clock optimal LED display device.
6, for display screen produced by the present invention because not limited by holder physical size, pixel density can be with higher, protective
Can be more preferable, weight is lighter, for large window wall, may be mounted at outside glass or wall stud, will not be because of the glass between show window
Partition or wall stud cause to show that picture interrupts, ensure that picture is complete, display effect is more preferably.
7, the spacing between display screen LED lamp bead produced by the present invention is changeable, the diameter of LED lamp bead, height, shape
It is unrestricted, both had the characteristic of the small spacing of transparent screen, but also with the permanent protective property of grid screen.
8, encapsulation is integrated, i.e., the encapsulation of more LED lamp beads is integrated, and 2-100000 lamp is completed in same printed wiring board
The matrix or non-matrix integration packaging of pearl.
Description of the drawings
Fig. 1 is the COB integrative display panel front schematic diagrames of embodiment six；
Fig. 2 is the COB integrative display back side of panel schematic diagrames of embodiment six；
Fig. 3 is the COB integrative display panel front schematic diagrames of embodiment seven；
Fig. 4 is the COB integrative display back side of panel schematic diagrames of embodiment seven；
Fig. 5 is the COB integrative display panel front schematic diagrames of embodiment eight；
Fig. 6 is the COB integrative display back side of panel schematic diagrames of embodiment eight；
Fig. 7 is the LED lamp bead schematic cross-sectional view of the COB integrative display panels of embodiment nine；
Fig. 8 is the schematic diagram of the LED lamp bead of the embodiment of the present invention six, seven, eight.
Reference numeral：1-printed wiring board；2-LED lamp beads；3-hollow outs；4-driving elements；5-row's needles；6—LED
Chip；7-conducting resinls or non-conductive adhesive；8-light transmission solidification glues.
Specific implementation mode
Present invention will be further explained below with reference to the attached drawings and examples.
Embodiment one
A kind of manufacturing method of the ventilative light transmission COB integrative display panels of permanent protective property of the present invention, includes the following steps：
LED chip 6 is bought from upstream producer；
Qualified printed wiring board 1 is selected, printed circuit and driving circuit is provided in printed wiring board 1, can print
Row's needle 5 is arranged in the back side of brush wiring board 1, and+5V and ground wire are integrated in row's needle 5, and two row's needles 5 can also be arranged ,+
5V and ground wire are respectively arranged in row's needle 5.In the front of printed wiring board 1, multiple pixels, two neighboring pixel are set
Between spacing be 0.01-100mm, and at least one LED chip die bond position is set in each pixel；LED chip die bond
Position can be one, for placing a kind of LED chip 6 of color；Two can also be arranged to N number of LED die bonds position, two can be placed
A to N number of same color or LED modules with different colors chip 6, wherein N are the integer more than 2.
One or more LED chips 6 are pasted by conducting resinl or non-conductive adhesive 7 on each LED chip die bond position；LED
The set-up mode of chip 6 includes that formal dress, upside-down mounting or formal dress are combined with upside-down mounting, wherein the LED chip 6 of formal dress by bonding wire with
Printed circuit in printed wiring board 1 is electrically connected, and the LED chip 6 of upside-down mounting is by mounting in welding and printed wiring board 1
Printed circuit is electrically connected.
Test the electric conductivity of LED chip 6；
Each LED chip 6 is sealed using light transmission solidification glue 8, LED lamp bead 2 is formed, as shown in figure 8, LED lamp bead 2
It can be arbitrary shape, such as hemispherical, cuboid, the square bodily form, prismatic table shape, truncated cone-shaped, cone, and to ensure LED light
The water proof and dust proof grade of pearl 2 reaches IP68 and following.
Hollow processing is carried out to printed wiring board 1, forms the LED lamp panel of ventilative light transmission；Hollow out 3 can be arbitrary shape, such as
Rectangle, kidney-shaped etc..
Coating printing ink in printed wiring board 1 between LED lamp bead 2 and LED lamp bead 2, ink can be random colors, such as
White, yellow, blue, green, black, secondary colour etc..
The driving element 4 of driving circuit is welded in printed wiring board 1 using Reflow Soldering, driving element 4 and LED lamp bead
2 connections, for controlling lighting or closing for LED lamp bead 2, realization lamp drive unification or lamp drive the circuit design that part is unified and integrate,
The COB integrative display panels of ventilative light transmission are obtained, then COB integrative display panels are tested.
Each face even application of printed wiring board 1 invades bubble protective materials, to protect printed wiring board 1 and component to reach
To high security application grade；It is tested again after glue is dry, qualified then packaging and storage is unqualified to reprocess or eliminate.
Embodiment two
LED chip 6 is bought from upstream producer；
Qualified printed wiring board 1 is selected, printed circuit and driving circuit is provided in printed wiring board 1, can print
Row's needle 5 is arranged in the back side of brush wiring board 1, and+5V and ground wire are integrated in row's needle 5, and two row's needles 5 can also be arranged ,+
5V and ground wire are respectively arranged in row's needle 5.In the front of printed wiring board 1, multiple pixels, two neighboring pixel are set
Between spacing be 0.01-100mm, and at least one LED chip die bond position is set in each pixel；LED chip die bond
Position can be one, for placing a kind of LED chip 6 of color；Two can also be arranged to N number of LED die bonds position, two can be placed
A to N number of same color or LED modules with different colors chip 6, wherein N are the integer more than 2.
One or more LED chips 6 are pasted by conducting resinl or non-conductive adhesive 7 on each LED chip die bond position；LED
The set-up mode of chip 6 includes that formal dress, upside-down mounting or formal dress are combined with upside-down mounting, wherein the LED chip 6 of formal dress by bonding wire with
Printed circuit in printed wiring board 1 is electrically connected, and the LED chip 6 of upside-down mounting is by mounting in welding and printed wiring board 1
Printed circuit is electrically connected.
Test the electric conductivity of LED chip 6；
Each LED chip 6 is sealed using light transmission solidification glue 8, forms LED lamp bead 2, LED lamp bead 2 can be arbitrary shape
Shape, such as hemispherical, cuboid, the square bodily form, prismatic table shape, truncated cone-shaped, cone, and to ensure that the waterproof of LED lamp bead 2 is anti-
Dirt grade reaches IP68 and following.
The driving element 4 of driving circuit is welded in printed wiring board 1 using Reflow Soldering, driving element 4 and LED lamp bead
2 connections, for controlling lighting or closing for LED lamp bead 2, realization lamp drive unification or lamp drive the circuit design that part is unified and integrate,
Then printed wiring board 1 is tested.
Hollow processing is carried out to printed wiring board 1, forms the LED lamp panel of ventilative light transmission；Hollow out 3 can be arbitrary shape, such as
Then rectangle, kidney-shaped etc. again test printed wiring board 1.
Coating printing ink in printed wiring board 1 between LED lamp bead 2 and LED lamp bead 2, ink can be random colors, such as
White, yellow, blue, green, black, secondary colour etc..
Each face even application of printed wiring board 1 invades bubble protective materials, to protect printed wiring board 1 and component to reach
To high security application grade.
Embodiment three
LED chip 6 is bought from upstream producer；
Qualified printed wiring board 1 is selected, printed circuit and driving circuit is provided in printed wiring board 1, can print
Row's needle 5 is arranged in the back side of brush wiring board 1, and+5V and ground wire are integrated in row's needle 5, and two row's needles 5 can also be arranged ,+
5V and ground wire are respectively arranged in row's needle 5.In the front of printed wiring board 1, multiple pixels, two neighboring pixel are set
Between spacing be 0.01-100mm, and at least one LED chip die bond position is set in each pixel；LED chip die bond
Position can be one, for placing a kind of LED chip 6 of color；Two can also be arranged to N number of LED die bonds position, two can be placed
A to N number of same color or LED modules with different colors chip 6, wherein N are the integer more than 2.
The driving element 4 of driving circuit is welded in printed wiring board 1 using Reflow Soldering；Follow-up LED lamp bead 2 is packaged
Afterwards, driving element 4 can be connected to LED lamp bead 2, for controlling lighting or closing for LED lamp bead 2, realize that lamp drives unification or lamp
The circuit design for driving part unification is integrated.
One or more LED chips 6 are pasted by conducting resinl or non-conductive adhesive 7 on each LED chip die bond position；LED
The set-up mode of chip 6 includes that formal dress, upside-down mounting or formal dress are combined with upside-down mounting, wherein the LED chip 6 of formal dress by bonding wire with
Printed circuit in printed wiring board 1 is electrically connected, and the LED chip 6 of upside-down mounting is by mounting in welding and printed wiring board 1
Printed circuit is electrically connected.
Test the electric conductivity of LED chip 6；
Each LED chip 6 is sealed using light transmission solidification glue 8, forms LED lamp bead 2, LED lamp bead 2 can be arbitrary shape
Shape, such as hemispherical, cuboid, the square bodily form, prismatic table shape, truncated cone-shaped, cone, and to ensure that the waterproof of LED lamp bead 2 is anti-
Dirt grade reaches IP68 and following.Then printed wiring board 1 is tested.
Hollow processing is carried out to printed wiring board 1, forms the LED lamp panel of ventilative light transmission；Hollow out 3 can be arbitrary shape, such as
Then rectangle, kidney-shaped etc. again test printed wiring board 1.
Coating printing ink in printed wiring board 1 between LED lamp bead 2 and LED lamp bead 2, ink can be random colors, such as
White, yellow, blue, green, black, secondary colour etc..
Each face even application of printed wiring board 1 invades bubble protective materials, to protect printed wiring board 1 and component to reach
To high security application grade.
Example IV
LED chip 6 is bought from upstream producer；
Qualified printed wiring board 1 is selected, printed circuit and driving circuit is provided in printed wiring board 1, can print
Row's needle 5 is arranged in the back side of brush wiring board 1, and+5V and ground wire are integrated in row's needle 5, and two row's needles 5 can also be arranged ,+
5V and ground wire are respectively arranged in row's needle 5.In the front of printed wiring board 1, multiple pixels, two neighboring pixel are set
Between spacing be 0.01-100mm, and at least one LED chip die bond position is set in each pixel；LED chip die bond
Position can be one, for placing a kind of LED chip 6 of color；Two can also be arranged to N number of LED die bonds position, two can be placed
A to N number of same color or LED modules with different colors chip 6, wherein N are the integer more than 2.
The driving element 4 of driving circuit is welded in printed wiring board 1 using Reflow Soldering；Follow-up LED lamp bead 2 is packaged
Afterwards, driving element 4 can be connected to LED lamp bead 2, for controlling lighting or closing for LED lamp bead 2, realize that lamp drives unification or lamp
The circuit design for driving part unification is integrated.
Hollow processing is carried out to printed wiring board 1, forms the LED lamp panel of ventilative light transmission；Hollow out 3 can be arbitrary shape, such as
Rectangle, kidney-shaped etc.；
One or more LED chips 6 are pasted by conducting resinl or non-conductive adhesive 7 on each LED chip die bond position；LED
The set-up mode of chip 6 includes that formal dress, upside-down mounting or formal dress are combined with upside-down mounting, wherein the LED chip 6 of formal dress by bonding wire with
Printed circuit in printed wiring board 1 is electrically connected, and the LED chip 6 of upside-down mounting is by mounting in welding and printed wiring board 1
Printed circuit is electrically connected.
Test the electric conductivity of LED chip 6；
Each LED chip 6 is sealed using light transmission solidification glue 8, forms LED lamp bead 2, LED lamp bead 2 can be arbitrary shape
Shape, such as hemispherical, cuboid, the square bodily form, prismatic table shape, truncated cone-shaped, cone, and to ensure that the waterproof of LED lamp bead 2 is anti-
Dirt grade reaches IP68 and following.Then printed wiring board 1 is tested.
Coating printing ink in printed wiring board 1 between LED lamp bead 2 and LED lamp bead 2, ink can be random colors, such as
White, yellow, blue, green, black, secondary colour etc..
Each face even application of printed wiring board 1 invades bubble protective materials, to protect printed wiring board 1 and component to reach
To high security application grade.
Embodiment five
LED chip 6 is bought from upstream producer；
Qualified printed wiring board 1 is selected, printed circuit and driving circuit is provided in printed wiring board 1, can print
Row's needle 5 is arranged in the back side of brush wiring board 1, and+5V and ground wire are integrated in row's needle 5, and two row's needles 5 can also be arranged ,+
5V and ground wire are respectively arranged in row's needle 5.In the front of printed wiring board 1, multiple pixels, two neighboring pixel are set
Between spacing be 0.01-100mm, and at least one LED chip die bond position is set in each pixel；LED chip die bond
Position can be one, for placing a kind of LED chip 6 of color；Two can also be arranged to N number of LED die bonds position, two can be placed
A to N number of same color or LED modules with different colors chip 6, wherein N are the integer more than 2.
Hollow processing is carried out to printed wiring board 1, forms the LED lamp panel of ventilative light transmission；Hollow out 3 can be arbitrary shape, such as
Rectangle, kidney-shaped etc.；
One or more LED chips 6 are pasted by conducting resinl or non-conductive adhesive 7 on each LED chip die bond position；LED
The set-up mode of chip 6 includes that formal dress, upside-down mounting or formal dress are combined with upside-down mounting, wherein the LED chip 6 of formal dress by bonding wire with
Printed circuit in printed wiring board 1 is electrically connected, and the LED chip 6 of upside-down mounting is by mounting in welding and printed wiring board 1
Printed circuit is electrically connected.
Test the electric conductivity of LED chip 6；
Each LED chip 6 is sealed using light transmission solidification glue 8, forms LED lamp bead 2, LED lamp bead 2 can be arbitrary shape
Shape, such as hemispherical, cuboid, the square bodily form, prismatic table shape, truncated cone-shaped, cone, and to ensure that the waterproof of LED lamp bead 2 is anti-
Dirt grade reaches IP68 and following.
Coating printing ink in printed wiring board 1 between LED lamp bead 2 and LED lamp bead 2, ink can be random colors, such as
White, yellow, blue, green, black, secondary colour etc..
The driving element 4 of driving circuit is welded in printed wiring board 1 using Reflow Soldering, driving element 4 can be with LED
Lamp bead 2 is connected to, and for controlling lighting or closing for LED lamp bead 2, realizes the circuit design collection that lamp drives unification or lamp drives part unification
At.Then printed wiring board 1 is tested.
Each face even application of printed wiring board 1 invades bubble protective materials, to protect printed wiring board 1 and component to reach
To high security application grade.
Embodiment six
As depicted in figs. 1 and 2, driving circuit is set to the back side of printed wiring board 1, and the driving element 4 of driving circuit welds
It is connected on the back side of printed wiring board 1, and driving element 4 is electrically connected by via with LED lamp bead 2.The setting of LED lamp bead such as Fig. 8
It is shown.
Embodiment seven
As shown in Figure 3 and Figure 4, driving circuit is set to the front of printed wiring board 1, and the driving element 4 of driving circuit welds
It is connected to 1 front of printed wiring board between LED lamp bead 2.The setting of LED lamp bead is as shown in Figure 8.
Embodiment eight
As shown in Figure 5 and Figure 6, driving circuit section is set to the front of printed wiring board 1, and another part is set to printing
The driving element 4 at the back side of wiring board 1, driving circuit is welded in 1 front of printed wiring board between LED lamp bead 2, another part
It is welded in the back side of printed wiring board 1.The setting of LED lamp bead is as shown in Figure 8.
Embodiment nine
As shown in fig. 7, driving circuit is set to the front of printed wiring board 1, the driving element 4 of driving circuit is welded in
In LED lamp bead 2.
In above-described embodiment, embodiment six to nine can arbitrarily be combined with embodiment one to five, obtain different embodiment party
Formula.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (9)
1. a kind of manufacturing method of the ventilative light transmission COB integrative display panels of permanent protective property, which is characterized in that include the following steps：
A, LED chip is bought；
B, multiple pixels being set in the front of printed wiring board, the spacing between two neighboring pixel is 0.01-100mm,
And at least one LED chip die bond position is set in each pixel；
C, one or more LED chip is set on each LED chip die bond position；
D, the electric conductivity of LED chip is tested；
E, each LED chip is sealed using light transmission solidification glue, forms LED lamp bead, the water proof and dust proof grade of LED lamp bead reaches
To IP68 and following；
F, hollow processing is carried out to printed wiring board, forms the LED lamp panel of ventilative light transmission；
G, using Reflow Soldering by the welding of the driving element of driving circuit on a printed-wiring board, or by the driving element of driving circuit
It is encapsulated in LED lamp bead；
Step A, the sequence of B, C, D, E, F, G is in no particular order.
2. a kind of manufacturing method of the ventilative light transmission COB integrative display panels of permanent protective property according to claim 1, feature
It is, in step C, the set-up mode of LED chip includes that formal dress, upside-down mounting or formal dress are combined with upside-down mounting, wherein formal dress
LED chip is electrically connected by bonding wire and the printed circuit in printed wiring board, the LED chip of upside-down mounting by mount welding with
Printed circuit in printed wiring board is electrically connected.
3. a kind of manufacturing method of the ventilative light transmission COB integrative display panels of permanent protective property according to claim 1, feature
It is, in step C, LED chip is pasted onto by conducting resinl or non-conductive adhesive on LED chip die bond position.
4. a kind of manufacturing method of the ventilative light transmission COB integrative display panels of permanent protective property according to claim 1, feature
It is, completes each face even application of the printed wiring board of step A to G or invading bubble protective materials.
5. a kind of manufacturer of the ventilative light transmission COB integrative display panels of permanent protective property according to claim 1,2,3 or 4
Method, which is characterized in that driving circuit is set to the back side of printed wiring board, and the driving element of driving circuit is welded on printed wire
The back side of plate, and driving element is electrically connected by via with LED lamp bead.
6. a kind of manufacturer of the ventilative light transmission COB integrative display panels of permanent protective property according to claim 1,2,3 or 4
Method, which is characterized in that driving circuit is set to the front of printed wiring board, and the driving element of driving circuit is welded in LED lamp bead
Between printed wiring board front.
7. a kind of manufacturer of the ventilative light transmission COB integrative display panels of permanent protective property according to claim 1,2,3 or 4
Method, which is characterized in that driving circuit section is set to the front of printed wiring board, and another part is set to the back of the body of printed wiring board
The driving element in face, driving circuit is welded in the front of the printed wiring board between LED lamp bead, and another part is welded in printed wire
The back side of plate.
8. a kind of manufacturer of the ventilative light transmission COB integrative display panels of permanent protective property according to claim 1,2,3 or 4
Method, which is characterized in that driving circuit is set to the front of printed wiring board, and the driving element of driving circuit is welded in LED lamp bead
It is interior.
9. a kind of manufacturer of the ventilative light transmission COB integrative display panels of permanent protective property according to claim 1,2,3 or 4
Method, which is characterized in that coating printing ink in the printed wiring board between LED lamp bead and LED lamp bead.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810144149.5A CN108389950A (en) | 2018-02-12 | 2018-02-12 | A kind of manufacturing method of the ventilative light transmission COB integrative display panels of permanent protective property |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810144149.5A CN108389950A (en) | 2018-02-12 | 2018-02-12 | A kind of manufacturing method of the ventilative light transmission COB integrative display panels of permanent protective property |
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| CN109003969A (en) * | 2018-08-21 | 2018-12-14 | 佛山市国星光电股份有限公司 | A kind of COB packaging method shown based on high density, system and COB device |
| CN110232872A (en) * | 2019-06-14 | 2019-09-13 | 泸州天诺科技有限公司 | LED display |
| CN111128044A (en) * | 2020-01-15 | 2020-05-08 | 深圳市瑞普创新科技有限公司 | LED fretwork screen |
| CN117037632A (en) * | 2023-08-17 | 2023-11-10 | 深圳御光新材料有限公司 | LED transparent film, film-adhered transparent screen and manufacturing method thereof |
| CN117711279A (en) * | 2023-12-27 | 2024-03-15 | 江苏弘光显示技术有限公司 | Novel holographic transparent screen |
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