CN108389843A - Liquid cooling heat radiation system - Google Patents
Liquid cooling heat radiation system Download PDFInfo
- Publication number
- CN108389843A CN108389843A CN201810373029.2A CN201810373029A CN108389843A CN 108389843 A CN108389843 A CN 108389843A CN 201810373029 A CN201810373029 A CN 201810373029A CN 108389843 A CN108389843 A CN 108389843A
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- China
- Prior art keywords
- cold plate
- hard tube
- refrigeration section
- liquid cooling
- metal hard
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of liquid cooling heat radiation system.Wherein liquid cooling heat radiation system includes：Substrate, multiple heat sources, cold plate, water pump, refrigerator pipes, refrigeration section；Multiple heat sources are mounted on the substrate；Cold plate is arranged on the side for being equipped with the heat source of the substrate；Using rigid connection between cold plate and refrigeration section, the two is made not generate relative displacement.Using rigid connection between cold plate and refrigeration section, simplifies the connection type of water-cooling system, and connection reliability between lift line, reduce risk of leakage.
Description
Technical field
The present invention relates to electronic technology field more particularly to chip liquid cooling heat radiation systems.
Background technology
Chip will produce a large amount of heat in the process of work, such as does radiating treatment to it not in time, works under high temperature
Chip its working efficiency, service life and reliability can all substantially reduce.Therefore, the radiating efficiency of chip is improved to closing weight
It wants.
As the liquid-cooling heat radiation mode to radiate to chip, submergence liquid cooling mode and cold plate liquid exists in the prior art
Cold mode.Compared with cold plate liquid cooling mode, that there are structures is more complicated for submergence liquid cooling mode, and working medium is volatile or infiltration leakage,
The shortcomings of of high cost.
In existing cold plate liquid cooling mode, a kind of common chip water-cooling heat radiating system is as shown in fig. 6, mutual using polylith
Independent cold plate is connected on one piece of pcb board above different chips independently of each other by the way that water-cooled copper is bent to suitable shape
Coldplate, and copper pipe is connected to water pump, water tank, water cooling row or fan etc. to realize the water-cooling of chip.In existing skill
In art, such as CN107731765A uses to be compatible with different equipment forms between cold plate cold head, water pump, heat exchanger fan
Hose is flexibly connected, and facilitates adjustment position.But connection is more complicated, and connector is numerous, also increases the leakage wind of system
Danger.
Invention content
The present invention provides a kind of liquid cooling heat radiation system, and chip can be made to pass through the elastic heat conducting with high-termal conductivity with cold plate
Attachment device is closely attached, and improves the radiating efficiency of chip, reduces the maintenance cost of cooling system.
In order to achieve the above objectives, the present invention provides the following technical solutions：
A kind of liquid cooling heat radiation system, including：Substrate 11, multiple heat sources 12, cold plate 13, water pump 14, refrigerator pipes 15, refrigeration section
16；Multiple heat sources 12 are mounted on the substrate；Cold plate 13, be arranged on the substrate is equipped with the heat source
Side；Using rigid connection between cold plate 13 and refrigeration section 16, the two is made not generate relative displacement.
Preferably, the two is made not generate relative displacement, specially using rigid connection between cold plate 13 and refrigeration section 16
It is rigidly connected by the way of hard tube or welding between cold plate and heat exchanger plates.
Preferably, hard tube mode is used to be rigidly connected between cold plate 13 and refrigeration section 16 specifically, refrigerator pipes 15 is gold
Belong to hard tube comprising the first metal hard tube 151 and the second metal hard tube 152, the first metal hard tube 151 pass through the embedding pipe mode of cold plate
It is arranged in inside cold plate 13, the second metal hard tube 152 is positioned in refrigeration section 16；First metal hard tube 151 and the second metallic hard
Pipe 152 is rigidly connected, so that cold plate 13 by rigid connection by the first metal hard tube 151 and the second metal hard tube 152
Mode is rigidly connected between refrigeration section 16.
Preferably, the first metal hard tube 151 and 152 rigid connection of the second metal hard tube are welding, groove clamping hoop
Connection, flanged joint, silk connects, bell and spigot connects.
Preferably, hard tube mode is used to be rigidly connected between cold plate 13 and refrigeration section 16 specifically, refrigerator pipes 15 is gold
Belong to hard tube, first part's metal hard tube 161 of refrigerator pipes 15 is arranged in by the embedding pipe mode of cold plate inside cold plate 13, second part
Metal hard tube 162 is inserted into refrigeration section 16 and is fixed, so that mode is rigidly connected between cold plate 13 and refrigeration section 16.
Preferably, when being rigidly connected using welding manner between cold plate 13 and refrigeration section 16, refrigerator pipes 171 can be with
It is realized by way of engraving inside cold plate.
Preferably, it is that metal pipe joint is arranged in refrigerator pipes 171 in 13 side of cold plate, for connecting in refrigeration section 16
Refrigeration piping 172.
Preferably, water pump 14 is embedded in refrigerator pipes 15 inside cold plate 13 together.
Preferably, water pump 14 is rigidly fixed by way of hard tube welding with cold plate.
Preferably, fan 17 is set in refrigeration section 16.
One cold plate 13 is only set using multiple heat sources in above-mentioned embodiment, and between cold plate 13 and refrigeration section 16
Using rigid connection, the two is made not generate relative displacement, simplify the connection type of water-cooling system, and connected between lift line
Reliability reduces risk of leakage.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only to show
Some embodiments of example property for those of ordinary skill in the art without creative efforts, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is the structural schematic diagram for the chip liquid cooling heat radiation system for indicating embodiment of the present invention 1；
Fig. 2 is the structural schematic diagram for the chip liquid cooling heat radiation system for indicating embodiment of the present invention 2；
Fig. 3 is the structural schematic diagram for the chip liquid cooling heat radiation system for indicating embodiment of the present invention 3；
Fig. 4 is the structural schematic diagram for the chip cooling technique plate cooling system for indicating embodiment of the present invention 4；
Fig. 5 is the structural schematic diagram for the chip cooling technique plate cooling system for indicating embodiment of the present invention 5；
Fig. 6 is the photo for the chip water-cooling heat radiating system for using cold plate for indicating the prior art；
Specific implementation mode
Exemplary embodiments of the present invention will be illustrated based on attached drawing below, it should be understood that provide these embodiment party
Formula is used for the purpose of making those skilled in the art can better understand that realizing the present invention in turn, and not limit in any way
The scope of the present invention.On the contrary, these embodiments are provided so that the disclosure is more thorough and complete, and can be by this public affairs
The range opened completely is communicated to those skilled in the art.
Furthermore, it is necessary to specification, all directions of the upper and lower, left and right in each attached drawing are only with specific embodiment
The illustration of progress, those skilled in the art part or all by each component shown in attached drawing can change according to actual needs
It changes direction to apply, integrally realizes its function without influencing each component or system, this technical solution for changing direction is still
It belongs to the scope of protection of the present invention.
[embodiment 1]
Fig. 1 shows the structure of the chip liquid cooling heat radiation system of embodiment 1, which includes：Base
Plate 11, multiple heat sources 12, cold plate 13, water pump 14, refrigerator pipes 15 and refrigeration section 16.Here multiple heat sources 12 can be chip, system
Cold pipe 15 forms runner, and refrigeration section 16 can be heat exchanger or radiator.Cold plate 13 can be aluminium sheet, and refrigerator pipes 15 can be
Runner made of copper pipe.Multiple heat sources 12 are installed on the substrate 11；Cold plate 13 is arranged on being equipped with for the substrate
The side of the heat source；Water pump 14 is embedded in refrigerator pipes 15 inside cold plate 13 together；It is used between cold plate 13 and refrigeration section 16
Rigid connection makes the two not generate relative displacement.
Use rigid connection between cold plate and heat exchanger plates using hard between cold plate 13 and refrigeration section 16 in the embodiment 1
Pipe mode is rigidly connected, that is, cold plate 13 and refrigeration section 16 are rigidly connected using refrigerator pipes 15.Cold plate 13 according to Fig. 1
Hard tube mode is used to be rigidly connected between heat exchanger plates 16 specifically, refrigerator pipes 15 is metal hard tubes comprising the first metallic hard
152 two sections of runners of pipe 151 and the second metal hard tube, the first metal hard tube 151 are arranged in by the embedding pipe mode of cold plate in cold plate 13
Portion, the runner being formed in cold plate 13.Second metal hard tube 152 is positioned in refrigeration section 16, and is consolidated with refrigeration section 16
It is fixed, the runner being formed in refrigeration section 16；First metal hard tube 151 and the second metal hard tube 152 are connected by welding manner
It connects, forms complete closure water route.Certain first metal hard tube 151 and the second metal hard tube 152 can also pass through groove clamping hoop
Connection, flanged joint, silk connects, bell and spigot connects etc., and modes are rigidly connected.Pass through the first metal hard tube 151 and the second metal
The rigid connection of hard tube 152, so that being rigidly connected between cold plate 13 and refrigeration section 16 so that cold plate 13 and refrigeration section 16 it
Between position fix.
A cold plate 13 is only arranged in multiple heat sources in the embodiment 1, and using rigid between cold plate 13 and refrigeration section 16
Property connection, both make not generating relative displacement, simplify the connection type of water-cooling system, and connected between lift line reliable
Property, reduce risk of leakage.
Embodiment 2
Fig. 2 illustrates the structure of the chip liquid cooling heat radiation system of embodiment 2, which includes：Base
Plate 11, multiple heat sources 12, cold plate 13, water pump 14, refrigerator pipes 15 and refrigeration section 16.Here multiple heat sources 12 can be chip, system
Cold pipe 15 can be runner, and refrigeration section 16 can be heat exchanger or radiator.Cold plate 13 can be aluminium sheet, and refrigerator pipes 15 can be with
It is runner made of copper pipe.Multiple heat sources 12 are installed on the substrate 11；Cold plate 13 is arranged on the installation of the substrate
There is the side of the heat source；Water pump 14 is embedded in refrigerator pipes 15 inside cold plate 13 together；It is adopted between cold plate 13 and refrigeration section 16
With rigid connection, the two is made not generate relative displacement.
Use rigid connection between cold plate and heat exchanger plates using hard between cold plate 13 and refrigeration section 16 in embodiment 2
Pipe mode is rigidly connected, that is, cold plate 13 and refrigeration section 16 are rigidly connected using refrigerator pipes 15.Cold plate 13 according to Fig.2,
Hard tube mode is used to be rigidly connected between heat exchanger plates 16 specifically, refrigerator pipes 15 is metal hard tubes, their own constitutes closure
First part's metal hard tube 161 in water route, refrigerator pipes 15 is arranged in by the embedding pipe mode of cold plate inside cold plate 13, second part gold
Category hard tube 162, which is inserted into refrigeration section 16, to be fixed, so that mode is rigidly connected between cold plate 13 and refrigeration section 16.It is logical
It crosses a refrigerator pipes 15 to fix with cold plate 13 and refrigeration section 16 respectively, so that between cold plate 13 and refrigeration section 16 rigidly connecting
It connects so that the position between cold plate 13 and refrigeration section 16 is fixed.
A cold plate 13 is only arranged in multiple heat sources in embodiment 2, and using rigid between cold plate 13 and refrigeration section 16
Property connection, both make not generating relative displacement, simplify the connection type of water-cooling system, and connected between lift line reliable
Property, reduce risk of leakage.
[embodiment 3]
Fig. 3 illustrates the structure of the chip liquid cooling heat radiation system of embodiment 3, which includes：Base
Plate 11, multiple heat sources 12, cold plate 13, water pump 14, refrigerator pipes 15 and refrigeration section 16.Here multiple heat sources 12 can be chip, system
Cold pipe 15 can be runner, and refrigeration section 16 can be heat exchanger or radiator.Cold plate 13 can be aluminium sheet, and refrigerator pipes 15 can be with
It is runner made of copper pipe.Multiple heat sources 12 are installed on the substrate 11；Cold plate 13 is arranged on the installation of the substrate
There is the side of the heat source；Water pump 14 is embedded in refrigerator pipes 15 inside cold plate 13 together；It is adopted between cold plate 13 and refrigeration section 16
It is rigidly connected with welding manner, since cold plate 13 and refrigeration section 16 belong to metallic plate, will not be produced after the two welding
Raw relative displacement.When being rigidly connected using welding manner between cold plate 13 and refrigeration section 16, refrigerator pipes 171 can be by cold
The mode that 13 inside of plate is carved is realized.In order to enable the refrigerator pipes 171 in cold plate 13 and the refrigeration piping 172 in refrigeration section 16
Connection forms closed loop water route, needs in 13 side of cold plate to be that metal pipe joint is arranged for connecting refrigeration section 16 in refrigerator pipes 171
In refrigeration piping 172.Certainly, refrigerator pipes 171 can also be arranged in by the embedding pipe mode of cold plate inside cold plate 13, then by setting
It sets the connection of the refrigeration piping 172 in joint style and refrigeration section 16 and forms closed loop water route.
A cold plate 13 is only arranged in multiple heat sources in embodiment 3, and using rigid between cold plate 13 and refrigeration section 16
Property connection, both make not generating relative displacement, simplify the connection type of water-cooling system, and connected between lift line reliable
Property, reduce risk of leakage.
[embodiment 4]
Fig. 4 illustrates the structure of the cold plate cooling system of embodiment 4, is the side of being further improved of embodiment 1-3
Case includes mainly：Substrate 11, multiple heat sources 12, cold plate 13, water pump 14, refrigerator pipes 15 and refrigeration section 16.Here multiple heat sources 12
Can be chip, refrigerator pipes 15 can be runner, and refrigeration section 16 can be heat exchanger or radiator.Cold plate 13 can be aluminium
Plate, refrigerator pipes 15 can be runners made of copper pipe.Multiple heat sources 12 are installed on the substrate 11；Cold plate 13 is arranged on
The side for being equipped with the heat source of the substrate；Using rigid connection between cold plate 13 and refrigeration section 16, the two is made not generate
Relative displacement.As shown in figure 4, when 12 power consumption of heat source is higher, a large amount of heat is generated, common water cooling assisting natural heat dissipation technology is
Through being unable to reach the requirement of heat dissipation, and in the case of the permission of 17 bulk of heat exchanger, need by fan forced air cooling
Mode is realized and air heat-exchange.In such a case, it is possible to arrange one or more fans 17 on radiator 16, pass through water cooling
In addition forced air cooling heat dissipation technology reaches heat dissipation effect.
[embodiment 5]
Fig. 5 illustrates a kind of Curve guide impeller of the cold plate cooling system of embodiment 1-4.As shown in figure 5, in embodiment
Water pump 14 is rigidly fixed by way of hard tube welding with cold plate in 5, can be fixed between cold plate 13 and heat exchanger 16
Hard tube at, the upper or lower surface of cold plate can also be fixed on.
It is that heat dissipation object is illustrated with chip in above-mentioned embodiment 1 to embodiment 5, still, this hair
Bright cold plate cooling system, liquid-cooling circulating system can not only be applied to chip cooling, for example, it is also possible to which various need to radiate
Electronic component radiate, for it is all have the arrangement architecture similar with said chip and need the fever object to radiate
It can be applicable in.
Above with reference to attached drawing, the present invention is illustrated based on embodiment, but the present invention is not limited to above-mentioned embodiment party
The part of each embodiment and each variation is constituted the scheme after appropriately combined or displacement according to layout needs etc., also wrapped by formula
Containing within the scope of the invention.Furthermore it is also possible to which the knowledge based on those skilled in the art suitably recombinates the group of each embodiment
Conjunction and processing sequence, or the deformations such as various design alterations are applied to each embodiment, it has been applied in the implementation of such deformation
Mode may also be within the scope of the present invention.
Although each conception of species has already been described in detail in the present invention, it will be appreciated by a person skilled in the art that for those concepts
Various modifications and substituting can be achieved under the spirit disclosed by the invention integrally instructed.Those skilled in the art use
Ordinary skill can realize the present invention illustrated in detail in the claims without undue experimentation.It is appreciated that
, disclosed specific concept is merely illustrative, is not intended to limit the scope of the present invention, the scope of the present invention is by institute
The full scope of attached claims and its equivalent program determines.
Claims (10)
1. a kind of liquid cooling heat radiation system, including：Substrate (11), multiple heat sources (12), cold plate (13), water pump (14), refrigerator pipes
(15), refrigeration section (16)；Multiple heat sources (12) are mounted on the substrate；Cold plate (13), is arranged on the substrate
The side for being equipped with the heat source；Using rigid connection between cold plate (13) and refrigeration section (16), the two is set not generate opposite
Displacement.
2. liquid cooling heat radiation system according to claim 1, which is characterized in that used between cold plate (13) and refrigeration section (16)
Rigid connection makes the two not generate relative displacement, rigid by the way of hard tube or welding specially between cold plate and heat exchanger plates
Property connection.
3. liquid cooling heat radiation system according to claim 2, which is characterized in that used between cold plate (13) and refrigeration section (16)
Hard tube mode is rigidly connected specifically, refrigerator pipes (15) are metal hard tube comprising the first metal hard tube (151) and the second metal
Hard tube (152), the first metal hard tube (151) are arranged in cold plate (13) inside, the second metal hard tube by the embedding pipe mode of cold plate
(152) it is positioned in refrigeration section (16)；First metal hard tube (151) and the second metal hard tube (152) are passed through by rigid connection
First metal hard tube (151) and the rigid connection of the second metal hard tube (152), so that between cold plate (13) and refrigeration section (16)
Mode is rigidly connected.
4. liquid cooling heat radiation system according to claim 3, which is characterized in that the first metal hard tube (151) and the second metal
Hard tube (152) rigid connection is welding, groove clamping hoop connection, flanged joint, silk connects, bell and spigot connects.
5. liquid cooling heat radiation system according to claim 2, which is characterized in that used between cold plate (13) and refrigeration section (16)
Hard tube mode is rigidly connected specifically, refrigerator pipes (15) be metal hard tube, first part's metal hard tube (161) of refrigerator pipes (15)
It is internal to be arranged in cold plate (13) by the embedding pipe mode of cold plate, second part metal hard tube (162) be inserted into refrigeration section (16) into
Row is fixed, so that mode is rigidly connected between cold plate (13) and refrigeration section (16).
6. liquid cooling heat radiation system according to claim 2, which is characterized in that used between cold plate (13) and refrigeration section (16)
When welding manner is rigidly connected, refrigerator pipes (171) can be realized by way of engraving inside cold plate.
7. liquid cooling heat radiation system according to claim 6, which is characterized in that cold plate (13) side be refrigerator pipes (171)
Metal pipe joint is set, for connecting the refrigeration piping (172) in refrigeration section (16).
8. liquid cooling heat radiation system according to claim 2, which is characterized in that water pump (14) embeds together with refrigerator pipes (15)
It is internal in cold plate (13).
9. liquid cooling heat radiation system according to claim 2, which is characterized in that water pump (14) hard tube welding by way of with
Cold plate rigidly fixes.
10. liquid cooling heat radiation system according to claim 1 or 2, which is characterized in that fan is arranged in refrigeration section (16)
(17)。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810373029.2A CN108389843B (en) | 2018-04-24 | 2018-04-24 | Liquid cooling heat dissipation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810373029.2A CN108389843B (en) | 2018-04-24 | 2018-04-24 | Liquid cooling heat dissipation system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108389843A true CN108389843A (en) | 2018-08-10 |
| CN108389843B CN108389843B (en) | 2021-03-30 |
Family
ID=63064534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810373029.2A Active CN108389843B (en) | 2018-04-24 | 2018-04-24 | Liquid cooling heat dissipation system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108389843B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109637989A (en) * | 2019-01-30 | 2019-04-16 | 大禹电气科技股份有限公司 | A kind of parallel pipeline liquid cooling heat radiator for high-power IGBT heat dissipation |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103907410A (en) * | 2011-10-26 | 2014-07-02 | 国际商业机器公司 | Coolant manifold with separately rotatable manifold section(s) |
| US20180046233A1 (en) * | 2016-08-15 | 2018-02-15 | Fujitsu Limited | Cooling apparatus and information processing apparatus |
| US20180058777A1 (en) * | 2016-08-26 | 2018-03-01 | Intel Corporation | Heat exchanger puck |
-
2018
- 2018-04-24 CN CN201810373029.2A patent/CN108389843B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103907410A (en) * | 2011-10-26 | 2014-07-02 | 国际商业机器公司 | Coolant manifold with separately rotatable manifold section(s) |
| US20180046233A1 (en) * | 2016-08-15 | 2018-02-15 | Fujitsu Limited | Cooling apparatus and information processing apparatus |
| US20180058777A1 (en) * | 2016-08-26 | 2018-03-01 | Intel Corporation | Heat exchanger puck |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109637989A (en) * | 2019-01-30 | 2019-04-16 | 大禹电气科技股份有限公司 | A kind of parallel pipeline liquid cooling heat radiator for high-power IGBT heat dissipation |
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| Publication number | Publication date |
|---|---|
| CN108389843B (en) | 2021-03-30 |
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