CN108385070A - Prevent plate and sputter equipment - Google Patents
Prevent plate and sputter equipment Download PDFInfo
- Publication number
- CN108385070A CN108385070A CN201810328992.9A CN201810328992A CN108385070A CN 108385070 A CN108385070 A CN 108385070A CN 201810328992 A CN201810328992 A CN 201810328992A CN 108385070 A CN108385070 A CN 108385070A
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- CN
- China
- Prior art keywords
- motherboard
- temperature
- preventing
- cooling
- prevent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention provides one kind and preventing plate and sputter equipment.This prevents that plate includes preventing motherboard and being arranged in the cooling structure prevented on motherboard；The cooling structure, for when the temperature for preventing motherboard is more than preset temperature, reducing the temperature for preventing motherboard.The program will prevent that the temperature of motherboard controls in certain temperature range, improve sputtering yield by the way that cooling structure is arranged on preventing motherboard.
Description
Technical field
The present invention relates to display technology fields, preventing plate and sputter equipment more particularly to one kind.
Background technology
It is to make the charged particle in high vacuum using driving source under certain high vacuum state to sputter (Sputtering)
It obtains high-energy and bombards target material surface, the component of target material surface is made to obtain sufficiently large energy and sputter to splash to glass
The membrane deposition method of substrate surface generally carries out sputtering operation using special sputter equipment.
In sputtering process, the component of target material surface can also be splashed to glass substrate in addition to being splashed to glass baseplate surface
Surrounding and target peripheral region, pollute.Therefore setting one is needed to prevent that plate blocking is sputtered onto around glass substrate and target
The target component of peripheral region.However, preventing plate after the bombardment by target component, temperature rise causes setting preventing
Film layer crystallite dimension and roughness above plate become larger, and form protrusion.After by plasma bombardment, protrusion is easily formed film layer
Particle, particle influence product quality after peeling off, the sputtering yield of sputter equipment are caused to reduce.
Invention content
The purpose of the present invention is to provide one kind preventing plate and sputter equipment, can improve the sputtering effect of sputter equipment
Rate.
An embodiment of the present invention provides one kind preventing plate, is applied to sputter equipment, including prevents motherboard and be arranged in institute
State the cooling structure prevented on motherboard；
The cooling structure, for when the temperature for preventing motherboard is more than preset temperature, reduction is described to prevent motherboard
Temperature.
In some embodiments, the cooling structure includes cooling line, and the cooling pipe includes at least one set of inputs
Mouth and delivery outlet；
When the temperature for preventing motherboard is more than preset temperature, the input port is described defeated for inputting cooling media
Outlet is for exporting the cooling media.
In some embodiments, the cooling media includes gas cooling medium or liquid cooling media.
In some embodiments, described to prevent that plate further includes flow restriction, the flow restriction is set to the input port；
The flow restriction, for according to the temperature for preventing motherboard, controlling the input port input cooling media
Rate.
In some embodiments, described to prevent that plate further includes temperature inductor, the temperature inductor is prevented with described respectively
Motherboard, the flow restriction is electrically connected；
The temperature inductor, for when sputter equipment is sputtered, detecting the temperature for preventing motherboard；
The flow restriction, the temperature for preventing motherboard for being detected according to the temperature inductor, described in control
Input port inputs the rate of cooling media.
The embodiment of the present invention additionally provides a kind of sputter equipment, including prevents plate, it is described prevent plate include prevent motherboard with
And it is arranged in the cooling structure prevented on motherboard；
The cooling structure, for when the temperature for preventing motherboard is more than preset temperature, reduction is described to prevent motherboard
Temperature.
In some embodiments, the cooling structure includes cooling line, and the cooling pipe includes at least one set of inputs
Mouth and delivery outlet；
When the temperature for preventing motherboard is more than preset temperature, the input port is described defeated for inputting cooling media
Outlet is for exporting the cooling media.
In some embodiments, the cooling media includes gas cooling medium or liquid cooling media.
In some embodiments, described to prevent that plate further includes flow restriction, the flow restriction is set to the input port；
The flow restriction, for according to the temperature for preventing motherboard, controlling the input port input cooling media
Rate.
In some embodiments, described to prevent that plate further includes temperature inductor, the temperature inductor is prevented with described respectively
Motherboard, the flow restriction is electrically connected；
The temperature inductor, for when sputter equipment is sputtered, detecting the temperature for preventing motherboard；
The flow restriction, the temperature for preventing motherboard for being detected according to the temperature inductor, described in control
Input port inputs the rate of cooling media.
Prevent plate and sputter equipment compared to existing, the embodiment of the present invention prevent plate and sputter equipment by
Prevent that cooling structure is arranged on motherboard, will prevent that the temperature of motherboard controls in certain temperature range, improve sputtering yield.
For the above of the present invention can be clearer and more comprehensible, preferred embodiment cited below particularly, and coordinate institute's accompanying drawings, make
Detailed description are as follows：
Description of the drawings
Fig. 1 is the structural schematic diagram of sputter equipment provided in an embodiment of the present invention.
Fig. 2 is the schematic diagram of a scenario of existing sputter equipment sputtering.
Fig. 3 is the structural schematic diagram provided in an embodiment of the present invention for preventing plate.
Specific implementation mode
The explanation of following embodiment is to refer to additional schema, to illustrate the particular implementation that the present invention can be used to implement
Example.The direction term that the present invention is previously mentioned, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outside", " side "
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be illustrate and understand the present invention, rather than to
The limitation present invention.
The similar unit of structure is to be given the same reference numerals in the figure.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
Containing at least one embodiment of the present invention.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
Fig. 1 is please referred to, Fig. 1 is the structural schematic diagram of sputter equipment provided in an embodiment of the present invention.Sputter equipment 1 includes base
Plate 2 and what is be arranged around the substrate 2 prevent plate 3.
Wherein, this prevents that plate 3 includes preventing motherboard 31 and being arranged preventing the cooling structure 32 in motherboard 31.Wherein,
Prevent motherboard 31 for when sputtering, blocking to be sputtered onto the target component of 2 peripheral region of substrate and target peripheral region.Such as Fig. 2 institutes
Show, after preventing bombardment of the motherboard 31 by target component, temperature can rise, and cause to be arranged and preventing the film above motherboard 31
4 crystallite dimension of layer and roughness become larger, and form protrusion 41.And film layer 4 is after by plasma bombardment, protrusion 41 easily forms grain
Son, particle can influence product quality after peeling off.
31 temperature rise of motherboard is prevented in order to prevent, and in a preferred embodiment, a cooling is set on preventing motherboard 31
Structure 32, specifically, the cooling structure 32 is used to, when preventing that 31 temperature of motherboard is more than preset temperature, reduce this and prevent motherboard 31
Temperature.Can be when preventing above motherboard 31 that film layer 4 initially forms protrusion 41, the temperature of motherboard 31 is prevented in detection, generates the
One temperature value, and by first temperature value, or it is slightly below the temperature value of first temperature value, it is set as the preset temperature.It is excellent
Choosing, which can be set as to 100 degrees Celsius.
The cooling structure 32 includes cooling line 321.As shown in figure 3, the cooling line 321 is covered in and prevents motherboard 31
On.In order to preventing that motherboard 31 is uniformly cooled down, it is preferred that set the cooling line 321 to U-shaped shape.Wherein should
Cooling line 321 includes at least one set of input port 3211 and delivery outlet 3212.When prevent motherboard 31 temperature be more than preset temperature
When, cooling media is inputted from input port 3211, then export through delivery outlet 3212, motherboard 31 is prevented by cooling media absorption
Heat has the function that reduce the temperature for preventing motherboard 31.Wherein, which includes gas cooling medium or liquid cooling
Medium.
As shown in figure 3, this prevents that plate 3 further includes flow restriction 33, which is set to input port 3211, is used for
According to the temperature for preventing motherboard 31, the rate that cooling media is inputted in input port 3211 is controlled.Specifically, preventing 31 temperature of motherboard
When degree is no more than preset temperature, flow restriction 33 stops inputting cooling media to cooling line 32 for closing input port 3211.
When preventing that 31 temperature of motherboard is more than preset temperature, flow restriction 33 is used for according to the height for preventing 31 temperature of motherboard, and control is defeated
Entrance 3211 inputs the rate of cooling media.
Wherein, which can be valve.Assuming that when valve is opened completely, cooling liquid matchmaker in input port 3211
The flow velocity of Jie is that 0.3 liter/second can open valve completely then when preventing that the temperature of motherboard 31 reaches 120 degree, and work as anti-
The temperature of motherboard 311 at 100 degree, can valve only be opened into half.
In some embodiments, the flow restriction 33 being similar on input port 3211, can also be in the cooling line 321
Flow restriction can also be arranged in delivery outlet 3212, to cooperate with the flow restriction 33 on input port 3211, control cooling tube
The flow velocity of cooling media in road 321.
As shown in Figure 1, this prevents that plate 3 further includes temperature inductor 34, the temperature inductor 34 respectively with prevent motherboard 31,
Flow restriction 33 is electrically connected.The temperature inductor 34 is used for when sputter equipment 1 is sputtered, and the temperature of motherboard 31 is prevented in detection
Degree.Correspondingly, the temperature for preventing motherboard 311 that the flow restriction 33 is used to be detected according to the temperature inductor 31, control input
Mouth 3211 inputs the rate of cooling medias.In some embodiments, prevent the temperature of motherboard 31 when temperature inductor 34 detects
In preset temperature range, such as at 50-100 degrees Celsius, then flow restriction 33 is cold for making cooling line 321 stop input
But medium.
The embodiment of the present invention prevents plate and sputter equipment, by the way that cooling structure is arranged on preventing motherboard, will prevent
The temperature of motherboard controls in certain temperature range, improves sputtering yield.
In conclusion although the present invention is disclosed above with preferred embodiment, above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention is subject to the range that claim defines.
Claims (10)
1. one kind preventing plate, it is applied to sputter equipment, which is characterized in that prevent motherboard described including preventing motherboard and being arranged
On cooling structure；
The cooling structure, for when the temperature for preventing motherboard is more than preset temperature, reducing the temperature for preventing motherboard
Degree.
2. according to claim 1 prevent plate, which is characterized in that the cooling structure includes cooling line, the cooling
Pipeline includes at least one set of input port and delivery outlet；
When the temperature for preventing motherboard is more than preset temperature, the input port is for inputting cooling media, the delivery outlet
For exporting the cooling media.
3. according to claim 2 prevent plate, which is characterized in that the cooling media includes gas cooling medium or liquid
Cooling media.
4. according to claim 2 prevent plate, which is characterized in that described to prevent that plate further includes flow restriction, the current limliting
Structure setting is in the input port；
The flow restriction, for according to the temperature for preventing motherboard, controlling the rate of the input port input cooling media.
5. according to claim 4 prevent plate, which is characterized in that described to prevent that plate further includes temperature inductor, the temperature
Degree inductor prevents that motherboard, the flow restriction are electrically connected with described respectively；
The temperature inductor, for when sputter equipment is sputtered, detecting the temperature for preventing motherboard；
The flow restriction, the temperature for preventing motherboard for being detected according to the temperature inductor, controls the input
The rate of mouth input cooling media.
6. a kind of sputter equipment, which is characterized in that described to prevent that plate includes preventing motherboard and being arranged described including preventing plate
Prevent the cooling structure on motherboard；
The cooling structure, for when the temperature for preventing motherboard is more than preset temperature, reducing the temperature for preventing motherboard
Degree.
7. sputter equipment according to claim 6, which is characterized in that the cooling structure includes cooling line, described cold
But pipeline includes at least one set of input port and delivery outlet；
When the temperature for preventing motherboard is more than preset temperature, the input port is for inputting cooling media, the delivery outlet
For exporting the cooling media.
8. sputter equipment according to claim 7, which is characterized in that the cooling media includes gas cooling medium or liquid
Body cooling media.
9. sputter equipment according to claim 7, which is characterized in that described to prevent that plate further includes flow restriction, the limit
Flow structure is set to the input port；
The flow restriction, for according to the temperature for preventing motherboard, controlling the rate of the input port input cooling media.
10. sputter equipment according to claim 9, which is characterized in that it is described to prevent that plate further includes temperature inductor, it is described
Temperature inductor prevents that motherboard, the flow restriction are electrically connected with described respectively；
The temperature inductor, for when sputter equipment is sputtered, detecting the temperature for preventing motherboard；
The flow restriction, the temperature for preventing motherboard for being detected according to the temperature inductor, controls the input
The rate of mouth input cooling media.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810328992.9A CN108385070A (en) | 2018-04-13 | 2018-04-13 | Prevent plate and sputter equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810328992.9A CN108385070A (en) | 2018-04-13 | 2018-04-13 | Prevent plate and sputter equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108385070A true CN108385070A (en) | 2018-08-10 |
Family
ID=63073947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810328992.9A Pending CN108385070A (en) | 2018-04-13 | 2018-04-13 | Prevent plate and sputter equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108385070A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109023267A (en) * | 2018-08-17 | 2018-12-18 | 深圳市华星光电技术有限公司 | One kind preventing plate and preparation method thereof |
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| CN1723530A (en) * | 2003-01-08 | 2006-01-18 | 东京毅力科创株式会社 | Cooled deposition baffle in high density plasma semiconductor processing |
| CN101001975A (en) * | 2004-06-30 | 2007-07-18 | 朗姆研究公司 | Methods and apparatus for optimal temperature control in a plasma processing system |
| CN201031253Y (en) * | 2007-03-26 | 2008-03-05 | 建铯科技股份有限公司 | Refrigerating mechanism of sputter machine |
| CN102985588A (en) * | 2010-05-14 | 2013-03-20 | 应用材料公司 | Process kit shield for improved particle reduction |
| CN204347644U (en) * | 2014-12-16 | 2015-05-20 | 桐昆集团浙江恒通化纤有限公司 | Spinning heating agent lesser circulation |
| CN105714255A (en) * | 2016-04-27 | 2016-06-29 | 芜湖真空科技有限公司 | Glass sputtering mechanism easy to cool |
| CN105887033A (en) * | 2016-06-02 | 2016-08-24 | 京东方科技集团股份有限公司 | Clamping equipment, working method of clamping equipment and magnetron sputtering device |
| CN206263793U (en) * | 2016-12-09 | 2017-06-20 | 重庆平步青云汽车配件有限公司 | Sander cooling device with radiating ribs |
| CN206326510U (en) * | 2016-12-21 | 2017-07-14 | 重庆市永川区泰兴机械厂 | It is easy to the heat abstractor of spray coolant |
| CN206768212U (en) * | 2017-06-08 | 2017-12-19 | 合肥鑫晟光电科技有限公司 | Film-forming apparatus |
-
2018
- 2018-04-13 CN CN201810328992.9A patent/CN108385070A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1723530A (en) * | 2003-01-08 | 2006-01-18 | 东京毅力科创株式会社 | Cooled deposition baffle in high density plasma semiconductor processing |
| CN101001975A (en) * | 2004-06-30 | 2007-07-18 | 朗姆研究公司 | Methods and apparatus for optimal temperature control in a plasma processing system |
| CN201031253Y (en) * | 2007-03-26 | 2008-03-05 | 建铯科技股份有限公司 | Refrigerating mechanism of sputter machine |
| CN102985588A (en) * | 2010-05-14 | 2013-03-20 | 应用材料公司 | Process kit shield for improved particle reduction |
| CN204347644U (en) * | 2014-12-16 | 2015-05-20 | 桐昆集团浙江恒通化纤有限公司 | Spinning heating agent lesser circulation |
| CN105714255A (en) * | 2016-04-27 | 2016-06-29 | 芜湖真空科技有限公司 | Glass sputtering mechanism easy to cool |
| CN105887033A (en) * | 2016-06-02 | 2016-08-24 | 京东方科技集团股份有限公司 | Clamping equipment, working method of clamping equipment and magnetron sputtering device |
| CN206263793U (en) * | 2016-12-09 | 2017-06-20 | 重庆平步青云汽车配件有限公司 | Sander cooling device with radiating ribs |
| CN206326510U (en) * | 2016-12-21 | 2017-07-14 | 重庆市永川区泰兴机械厂 | It is easy to the heat abstractor of spray coolant |
| CN206768212U (en) * | 2017-06-08 | 2017-12-19 | 合肥鑫晟光电科技有限公司 | Film-forming apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109023267A (en) * | 2018-08-17 | 2018-12-18 | 深圳市华星光电技术有限公司 | One kind preventing plate and preparation method thereof |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180810 |
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| WD01 | Invention patent application deemed withdrawn after publication |