CN108337858B - Server and server group - Google Patents

Server and server group Download PDF

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Publication number
CN108337858B
CN108337858B CN201810118024.5A CN201810118024A CN108337858B CN 108337858 B CN108337858 B CN 108337858B CN 201810118024 A CN201810118024 A CN 201810118024A CN 108337858 B CN108337858 B CN 108337858B
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server
air
fan
air inlet
air outlet
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CN108337858A (en
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岳宣云
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Lenovo Beijing Ltd
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Lenovo Beijing Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • H05K7/20727Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1485Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1487Blade assemblies, e.g. blade cases or inner arrangements within a blade
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • H05K7/20736Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

The application discloses server and server group, wherein the server includes: casing and setting are in fan and server subassembly in the casing, the fan is in be close to in the casing the first terminal surface of casing, be provided with first air intake on the first terminal surface, on the casing with the second terminal surface that first terminal surface is relative is provided with the air outlet, wherein: the first side face of the shell is provided with a second air inlet close to one end of the fan, and the first side face is connected with the first end face, so that the fan can simultaneously suck air from the first air inlet and the second air inlet, and the air outlet can discharge air to dissipate heat of the server assembly.

Description

Server and server group
Technical Field
The application relates to the technical field of heat dissipation control, in particular to a server and a server group.
Background
With the development of technologies, the demand for storage services is increasing, and more storage servers are arranged in cabinets. When the front hard disk of the storage server in the cabinet is full, not only can the power consumption be increased to cause the heat to rise rapidly, but also the air inlet at the front side of the cabinet can be shielded by the hard disk to cause the air inlet area of the fan to be reduced, and the heat dissipation is more difficult.
Disclosure of Invention
In view of this, the present application provides a server and a server group, which are used to solve the technical problem that in the prior art, due to the fact that the front hard disk of the storage server is fully configured, the air inlet is blocked, the air inlet area of the fan is reduced, and the heat dissipation is difficult.
The application provides a server, including:
casing and setting are in fan and server subassembly in the casing, the fan is in be close to in the casing the first terminal surface of casing, be provided with first air intake on the first terminal surface, on the casing with the second terminal surface that first terminal surface is relative is provided with the air outlet, wherein:
the first side face of the shell is provided with a second air inlet close to one end of the fan, and the first side face is connected with the first end face, so that the fan can simultaneously suck air from the first air inlet and the second air inlet, and the air outlet can discharge air to dissipate heat of the server assembly.
The server described above, preferably:
the second air inlets are multiple, and the maximum diameter of each second air inlet is smaller than a preset threshold value.
Preferably, the second air inlet is of a honeycomb structure.
The present application also provides another server, comprising:
casing and setting are in fan in the casing, the fan is in be close to in the casing the first terminal surface of casing, be provided with the air intake on the first terminal surface, wherein:
an air outlet is formed in one end, close to the fan, of the first side face of the shell, the first side face is connected with the first end face, so that the fan can suck air from the air inlet and output air from the air outlet, and air is supplied to other servers close to the first side face.
The server described above, preferably:
the air outlet has a plurality ofly, just the maximum diameter of air outlet is less than the threshold value of predetermineeing.
Preferably, in the server, the air outlet is of a honeycomb structure.
The present application further provides a server group, including:
at least one first server and at least one second server, each of said first servers being disposed adjacent to one of said second servers;
the first server includes: the first fan is arranged in the first shell and is close to a first end face of the first shell, a first air inlet is formed in the first end face of the first shell, and a first air outlet is formed in a second end face, opposite to the first end face, of the first shell;
the second server includes: the second fan is arranged in the second shell and is close to the first end face of the second shell, and a second air inlet is formed in the first end face of the second shell;
the first side surface of the second shell, which is close to the second fan and the first server, is provided with a second air outlet, the first side surface of the first shell, which is close to the first fan and the second server, is provided with a third air inlet, and the second air outlet and the third air inlet are arranged oppositely, so that after the second fan sucks air from the second air inlet and blows out air to the second air outlet, the first fan sucks air from the first air inlet and the third air inlet and blows out air to the first air outlet at the same time, and heat dissipation is performed on the first server assembly.
In the server group, preferably, the second air outlet and the third air inlet are respectively multiple, and the maximum diameter of the second air outlet and the third air inlet is smaller than a preset threshold value.
In the server group, preferably, the second air outlet and the third air inlet are respectively of a honeycomb structure.
According to the technical scheme, the server and the server group are different from the second air inlet of the original first air inlet in one end, close to the fan, of the shell of the server, so that the air inlet area of the fan is increased to reduce the heat dissipation difficulty, and the purpose of the application is achieved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a server according to an embodiment of the present application;
fig. 2 to 6 are schematic partial structural diagrams of a first embodiment of the present application;
fig. 7 is a schematic structural diagram of a server according to a second embodiment of the present application;
fig. 8 to 11 are schematic partial structural views of a second embodiment of the present application;
fig. 12 is a schematic structural diagram of a server group according to a third embodiment of the present application;
fig. 13 to 15 are schematic partial structural views of a third embodiment of the present application;
fig. 16 to 18 are diagrams illustrating other examples of applications of the embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Fig. 1 is a schematic structural diagram of a server according to an embodiment of the present disclosure, where the server may be a storage server, and data may be stored in the storage server by deploying a storage device such as a hard disk.
In this embodiment, the server may include the following structure:
the fan assembly comprises a shell 1, a fan 2 and a server assembly 3, wherein the fan 2 and the server assembly 3 are arranged in the shell 1, the fan 2 is close to a first end face 4 of the shell 1 in the shell 1, a first air inlet 5 is formed in the first end face 4, and an air outlet 6 is formed in a second end face, opposite to the first end face 4, of the shell 1.
Wherein the housing 1 may be of a metal housing structure. The server component 3 may be a storage device such as a hard disk, and the server component 3 may be disposed in the housing 1 to provide storage services for users.
In this embodiment, the one end that is close to fan 2 on the first side 7 of casing 1 is provided with second air intake 8, and first side 7 links to each other with first terminal surface 4, from this for fan 2 induced drafts from first air intake 5 and second air intake 8 simultaneously, and the wind that flows again is via air-out 6 air-outs, thereby dispels the heat to server component 3.
As shown in fig. 2, a first air inlet 5 is disposed on the first end surface 4 of the housing 1, an air outlet 6 is disposed on the second end surface 5, the fan 2 sucks air from the first air inlet 5, and the air flows out of the housing 1 through the server assembly 3 via the air outlet 6, so as to take away heat generated by the server assembly 3, thereby achieving heat dissipation of the server assembly 3.
And when server subassembly 3 was full in casing 1, not only can produce more heats, and first air intake 5 can be sheltered from by server subassembly 3 part or whole, make the air inlet area of fan 2 reduce, further reduce the radiating effect, at this moment, as shown in fig. 3, set up second air intake 8 on casing 1's first side 7 in this embodiment, thereby increase fan 2's air inlet area, therefore, fan 2 induced drafts from first air intake 5 and second air intake 8 simultaneously, wind flows out casing 1 through air outlet 6 through server subassembly 3, thereby take away the produced heat of server subassembly 3, realize the heat dissipation to server subassembly 3.
According to the technical scheme, the server provided by the first embodiment of the application is different from the second air inlet of the original first air inlet by arranging the end, close to the fan, of the shell of the server, so that the air inlet area of the fan is increased to reduce the heat dissipation difficulty, and the server is effectively cooled.
In one implementation manner, the number of the second air inlets 8 in this embodiment may be multiple, and the maximum diameter of the second air inlets 8 is smaller than a preset threshold. That is, in order to further increase the air inlet area of the fan 2, a plurality of second air inlets 8 may be provided, but in order to ensure the safety of the server and avoid the damage of radiation and the like to the user, the maximum diameter of the second air inlets 8 needs to be limited, for example, the second air inlets 8 are circular structures 9, the diameter of which is less than 3 mm, as shown in fig. 4; or the second air inlet 8 has a square structure 10 with a diagonal length less than 3 mm, as shown in fig. 5, and so on.
Specifically, the second air inlet 8 may be configured to be a honeycomb structure, as shown in fig. 6, so that the air inlet area of the server fan is increased while the safety of the server is ensured, and effective heat dissipation is realized.
Referring to fig. 7, a schematic structural diagram of a server according to a second embodiment of the present disclosure is provided, where the server may be a computing server, and a device such as a processor may be provided in the computing server to provide a data computing service for a user.
In this embodiment, the server may include the following structure:
the fan 12 is arranged in the shell 11 and close to a first end face 13 of the shell 11, and an air inlet 14 is arranged on the first end face 13.
The housing 11 may be a metal housing structure.
An air outlet 16 is arranged at one end, close to the fan 12, of the first side face 15 of the shell 11, the first side face 15 is connected with the first end face 13, therefore, the fan 12 sucks air from the air inlet 14, the air is exhausted from the air outlet 16 through the shell 11, air is supplied to other servers 17 close to the first side face 15, and therefore heat of the other servers 17 is dissipated.
In practical application, a second end face opposite to the first end face 13 may be provided with other air outlets to output hot air, so as to realize heat dissipation of server components in the server.
As shown in fig. 8, an air inlet 14 is disposed on the first end surface 13 of the housing 11, an air outlet 16 is disposed at an end of the first side surface 15 of the housing 11 close to the fan 12, and other servers 17 are disposed outside the first side surface 15 of the housing 11, such as a storage server, etc., so that after the fan 12 sucks air from the air inlet 14, the air is sent to the other servers 17 from the air outlet 16 through the heat generating components in the housing 11, thereby providing more air capable of dissipating heat for the other servers 17, and thus, while heat dissipation of the heat generating components in the current housing 11 of the server is achieved, heat dissipation of the other servers is achieved.
According to the technical scheme, the second server provided by the embodiment of the application has the advantages that the air outlets are formed in the side faces, close to other servers, of the shell of the server, so that air is supplied to other servers, the air inlet area of other servers is increased, and effective heat dissipation of other servers is achieved.
In one implementation, the air outlet 16 on the first side 15 of the housing 11 may be provided in plurality, and the maximum diameter of the air outlet 16 is smaller than a preset threshold. That is, in order to increase the air outlet area of the fan 12 and thus increase the air inlet area to other servers 17, a plurality of air outlets 16 may be provided, but in order to ensure the safety of the servers and avoid the damage of radiation and the like to users, the maximum diameter of the air outlets 16 needs to be limited, for example, the air outlets 16 are circular structures 17, the diameter of which is less than 3 mm, as shown in fig. 9; or the outlet 16 may be a rectangular structure 18 having a diagonal length of less than 3 mm, as shown in figure 10, etc.
Specifically, the air outlet 16 may be configured as a honeycomb structure, as shown in fig. 11, so as to increase the air inlet area of other servers 17 while ensuring the safety of the server, thereby achieving effective heat dissipation.
Referring to fig. 12, a schematic structural diagram of a server group provided in the third embodiment of the present application is provided, where the server group may include at least one first server 19 and at least one second server 20, where the first server 19 and the second server 20 are different, for example, the first server 19 may be a storage server, and provides a storage service by deploying a storage device such as a hard disk, and the second server 20 may be a computing server, and provides a computing server by deploying a processor or the like.
In the server group of the present embodiment, the first servers 19 and the second servers 20 are arranged at intervals, and each of the first servers 19 is arranged adjacent to one of the second servers. As in fig. 12, one second server 20 is deployed on each first server 19.
The structure of the first server 19 may refer to the server structure in fig. 1, for example, the first server 19 may include:
the air conditioner comprises a first shell 21 (shell 1), a first fan 22 (fan 2) and a first server assembly 23 (server assembly 3), wherein the first fan 22 and the first server assembly 23 are arranged in the first shell 21, the first fan 22 is arranged in the first shell 21 and close to a first end face 24 (end face 4) of the first shell 21, a first air inlet 25 (first air inlet 5) is arranged on the first end face 24 of the first shell 21, and a first air outlet 26 (air outlet 6) is arranged on a second end face 26, opposite to the first end face 24, of the first shell 21.
And the structure of the second server 20 may refer to the server structure in fig. 7, for example, the second server 20 may include:
the fan assembly comprises a second casing 27 (casing 11) and a second fan 28 (fan 12) arranged in the second casing 27, wherein the second fan 28 is close to a first end surface 29 (first end surface 13) of the second casing 27 in the second casing 27, and a second air inlet 30 (air inlet 14) is arranged on the first end surface 29 of the second casing 27.
A second air outlet 32 (air outlet 16) is disposed on a first side surface 31 (first side surface 15) of the second casing 27 close to the second fan 28 and the first server 19, a third air inlet 34 (second air inlet 8) is disposed on a first side surface 33 (first side surface 7) of the first casing 21 close to the first fan 22 and the second server 20, and the second air outlet 32 and the third air inlet 34 are disposed opposite to each other, so that after the second fan 28 sucks air from the second air inlet 30 and blows air out to the second air outlet 32, the first fan 22 sucks air from the first air inlet 25 and the third air inlet 34 and blows air out to the first air outlet 26 at the same time, thereby dissipating heat of the first server assembly 23.
Therefore, in the embodiment, the air inlet and the air outlet are formed in the side surface between the first server 19 and the second server 20, so that the air inlet area of the fan of the first server is increased through the second server, and the first server is effectively cooled.
In one implementation, the second air outlet 32 and the third air inlet 34 may be respectively provided in a plurality of numbers, and are oppositely arranged, and the maximum diameter is smaller than a preset threshold value. That is, in order to further increase the air intake area of the fan 22 in the first server 19, a plurality of second air outlets 32 and a plurality of third air inlets 34 may be provided, but in order to ensure the safety of the server and avoid the damage of radiation and the like to the user, the maximum diameters of the second air outlets 32 and the third air inlets 34 need to be limited, for example, the second air outlets 32 and the third air inlets 34 are both circular structures, and the diameters thereof are less than 3 mm, as shown in fig. 13; or the second outlet 32 and the third inlet 34 are both rectangular structures with diagonal lengths less than 3 mm, as shown in fig. 14, and so on.
Specifically, the second air outlet 32 and the third air inlet 34 are respectively of a honeycomb-hole structure, as shown in fig. 15, so that the air inlet area of the first server 19 is increased while the use safety of the server is ensured, and effective heat dissipation is realized.
The following illustrates the application of this embodiment in a specific implementation:
taking a server group as an example of a cabinet, a computing node for providing computing service and a storage node for providing storage service are arranged in the cabinet at intervals, a honeycomb hole is arranged at the bottom of one end, close to a fan, of the front end of the computing node, and a honeycomb hole is arranged at the top of the front end of the storage node.
As shown in fig. 16 and 17, the compute node bottom front end and the storage node top front end are designed as cell holes, and the areas of the cell holes correspond. When storage node fully joins in marriage the hard disk, storage node front panel air inlet area is mostly occupied, the inside fan of storage node induced drafts and is obstructed, inside negative pressure increases, its upper portion calculation node air inlet area is very big relatively, the inside windage of calculation node is very little, there is some wind current to be impressed the storage node by the negative pressure through the honeycomb holes between calculation node and the storage node this moment, as shown in fig. 18, thereby make storage node be unlikely to the difficult hard gas fan high-power speed of pulling up of heat dissipation, save the electric energy, increase the fan life-span and the production of noise abatement.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in Random Access Memory (RAM), memory, Read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (9)

1. A first server, comprising:
casing and setting are in fan and server subassembly in the casing, the fan is in be close to in the casing the first terminal surface of casing, be provided with first air intake on the first terminal surface, on the casing with the second terminal surface that first terminal surface is relative is provided with the air outlet, wherein:
a second air inlet is formed in one end, close to the fan, of the first side face of the shell, the second air inlet is arranged opposite to an air outlet in the side face of the second server, and the first side face is connected with the first end face, so that after the fan in the second server sucks air from the air inlet in the side face of the second server and blows air out of the air outlet in the side face of the second server, the fan sucks air from the first air inlet and the second air inlet at the same time, blows air out of the air outlet, and dissipates heat of the server assembly; wherein the first server is different from the second server.
2. The first server of claim 1, wherein:
the second air inlets are multiple, and the maximum diameter of each second air inlet is smaller than a preset threshold value.
3. The first server of claim 1 or 2, wherein the second air inlet is a honeycomb structure.
4. A second server, comprising:
casing and setting are in fan in the casing, the fan is in be close to in the casing the first terminal surface of casing, be provided with the air intake on the first terminal surface, wherein:
the fan is characterized in that an air outlet is formed in one end, close to the fan, of the first side face of the shell, the first side face is connected with the first end face, so that the fan sucks air from the air inlet and blows out air from the air outlet, air is supplied to a first server close to the first side face, the fan in the first server sucks air from a first air inlet and a second air inlet in the first server, the second air inlet of the first server is opposite to the air outlet of the second server, and the first server is different from the second server.
5. The second server according to claim 4, wherein:
the air outlet has a plurality ofly, just the maximum diameter of air outlet is less than the threshold value of predetermineeing.
6. The second server of claim 4 or 5, wherein the air outlet is a honeycomb structure.
7. A server group, comprising:
at least one first server and at least one second server, each of said first servers being disposed adjacent to one of said second servers;
the first server includes: the first fan is arranged in the first shell and is close to a first end face of the first shell, a first air inlet is formed in the first end face of the first shell, and a first air outlet is formed in a second end face, opposite to the first end face, of the first shell;
the second server includes: the second fan is arranged in the second shell and is close to the first end face of the second shell, and a second air inlet is formed in the first end face of the second shell;
a second air outlet is formed in a first side face, close to the second fan and the first server, of the second shell, a third air inlet is formed in a first side face, close to the first fan and the second server, of the first shell, and the second air outlet and the third air inlet are arranged oppositely, so that after the second fan sucks air from the second air inlet and blows out air to the second air outlet, the first fan sucks air from the first air inlet and the third air inlet and blows out air to the first air outlet at the same time, and heat dissipation is conducted on the first server assembly; wherein the first server is different from the second server.
8. The server group according to claim 7, wherein said second air outlet and said third air inlet are respectively plural, and the maximum diameter thereof is smaller than a preset threshold value.
9. The server group according to claim 7 or 8, wherein the second air outlet and the third air inlet are respectively of a honeycomb structure.
CN201810118024.5A 2018-02-06 2018-02-06 Server and server group Active CN108337858B (en)

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109032283A (en) * 2018-10-08 2018-12-18 郑州云海信息技术有限公司 A kind of server optimizing mechanical hard disk performance
CN109445537A (en) * 2018-11-05 2019-03-08 英业达科技有限公司 Server and its shockproof structure
CN112165831B (en) * 2020-09-14 2022-08-09 中国运载火箭技术研究院 Be applied to integrated controller and aircraft of aircraft

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8611087B2 (en) * 2007-03-22 2013-12-17 Fujitsu Limited Cooling system for information device
CN106527606A (en) * 2016-09-08 2017-03-22 华为技术有限公司 Server node and server

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2724081Y (en) * 2004-08-23 2005-09-07 北京华旗资讯数码科技有限公司 Heat radiation machine case
US7495906B2 (en) * 2006-04-21 2009-02-24 International Business Machines Corporation Multiple hard disk drive assembly cooling
US20090279253A1 (en) * 2008-05-09 2009-11-12 Michael Joseph Musciano Cooling configuration for communication boards
US20110266229A1 (en) * 2010-04-30 2011-11-03 M&A Technology, Inc. Stackable modular personal computer array
CN104765432A (en) * 2014-01-02 2015-07-08 鸿富锦精密电子(天津)有限公司 Server combination
CN204065963U (en) * 2014-07-24 2014-12-31 南通霆云网络科技有限公司 Multiple field node server
CN204537038U (en) * 2015-04-29 2015-08-05 杭州昆海信息技术有限公司 Blade server and network equipment cabinet

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8611087B2 (en) * 2007-03-22 2013-12-17 Fujitsu Limited Cooling system for information device
CN106527606A (en) * 2016-09-08 2017-03-22 华为技术有限公司 Server node and server

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