CN108336079A - A kind of LED light source - Google Patents
A kind of LED light source Download PDFInfo
- Publication number
- CN108336079A CN108336079A CN201810187554.5A CN201810187554A CN108336079A CN 108336079 A CN108336079 A CN 108336079A CN 201810187554 A CN201810187554 A CN 201810187554A CN 108336079 A CN108336079 A CN 108336079A
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- CN
- China
- Prior art keywords
- led chip
- light source
- led
- mounting surface
- led light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000843 powder Substances 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000009434 installation Methods 0.000 abstract description 5
- 238000000605 extraction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- PLXMOAALOJOTIY-FPTXNFDTSA-N Aesculin Natural products OC[C@@H]1[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)[C@H]1Oc2cc3C=CC(=O)Oc3cc2O PLXMOAALOJOTIY-FPTXNFDTSA-N 0.000 description 1
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of LED light sources, including substrate, the first LED chip and the second LED chip, the top of substrate is equipped with the first mounting surface and the second mounting surface with difference in height, first LED chip is mounted on the first mounting surface, second LED chip is mounted on the second mounting surface, and first LED chip and the installation position of the second LED chip it is not be overlapped, fluorescence rubber powder is covered at the top of substrate, first LED chip and the second LED chip are completely covered fluorescence rubber powder, and the top of fluorescence rubber powder is even curface.A kind of LED light source of the present invention, by the way that two groups of LED chips are respectively arranged on different height position, again fluorescence rubber powder of the same race is covered in two groups of LED chip overlyings, since two groups of LED chips are fixed in Different Plane, the thickness for the fluorescence rubber powder that can be excited in LED chip is different, therefore just forms different colour temperatures, the double color temperature light sources formed in this way, its productivity effect is high, and manufacturing cost is low.
Description
Technical field
The present invention relates to a kind of field of LED illumination more particularly to a kind of LED light sources.
Background technology
LED light source is the light source using LED as illuminator, since it has the characteristics that energy conservation and environmental protection, service life are long,
Through being more and more widely used in lighting area.
Colour temperature is a measurement unit for indicating to include in light color component, and light source color temperature is different, the sense brought to people
Feeling also can be different.
Currently, many LED light sources are all monochromatic temperature displays, both high color temperature or low color temperature, passed through different fluorescent powder types
The ratio of type and configuration fluorescent powder controls the display of high low color temperature, covers a powder is carried out after these fluorescent powders and silica gel spin coating
LED chip realizes the display of high color temperature or low color temperature with this.Since this manufacture craft is only able to display a kind of colour temperature, nothing
Method carries out the conversion of two kinds of colour temperatures inside the same LED light source, and application of function is relatively single, cannot be satisfied certain scenes and answers
Demand, for example, the high low color temperature of photography luminaire shooting demand.Therefore, it when needing the adjusting control of two kinds of colour temperatures, often needs
The LED light source of two different-colours is wanted to realize, the design and production to rear end lamps and lanterns bring inconvenience, and monochromatic temperature
LED light source also brings certain limitation to the application of LED light source.For this purpose, a kind of existing LED light source, by one piece of base
Two groups of LED chips are set on plate, by covering the fluorescence rubber powder of different proportion colour temperature in two groups of LED chips, and then realize LED
The double-colored temp effect of light source.
But existing LED light source, the fluorescence rubber powder of different proportion colour temperature is needed to configure, different LED is respectively overlay in
On chip, the process is more complicated, causes production efficiency relatively low, and cost of manufacture is higher, also, two kinds of colour temperatures of LED light source point
It is not arranged in different zones, the uniformity coefficient for mixing light extraction is relatively low.
Invention content
For overcome the deficiencies in the prior art, the purpose of the present invention is to provide a kind of LED light sources, can relatively easily be formed
The light source of different-colour, productivity effect is high, and manufacturing cost is low, and the uniformity coefficient phase of the light source mixing light extraction of its high low color temperature
To higher.
The purpose of the present invention adopts the following technical scheme that realization：
A kind of LED light source, including substrate, the first LED chip and the second LED chip, the top of the substrate, which is equipped with, to be had
The first mounting surface and the second mounting surface of difference in height, first LED chip are mounted on first mounting surface, and described second
LED chip is mounted on second mounting surface, and the installation position of first LED chip and second LED chip is not
Overlapping, is covered with fluorescence rubber powder at the top of the substrate, and the fluorescence rubber powder is by first LED chip and the 2nd LED
Chip is completely covered, and the top of the fluorescence rubber powder is even curface.
Further, first mounting surface is recess, and relatively described first mounting surface of second mounting surface forms convex
The portion of rising.
Further, the periphery of first LED chip and the second LED chip is equipped with a corral dam, and the box dam is formed
The inside of box dam circle, the box dam circle is covered with the fluorescence rubber powder.
Further, the recess is bar shaped recess, and the both ends of the recess are connect with the box dam circle respectively, correspondingly
The both ends of the lug boss are also connect with the box dam circle respectively.
Further, the recess is round recess, and the size of the recess is adapted with first LED chip.
Further, the box dam is silica gel box dam.
Further, positive terminal pad and negative terminal pad, one end of first LED chip are additionally provided at the top of the substrate
And one end of second LED chip is electrically connected with the positive terminal pad, the other end of first LED chip and described second
The other end of LED chip is electrically connected with the negative terminal pad.
Further, the negative terminal pad include the first negative terminal pad and the second negative terminal pad, first LED chip with
The first negative terminal pad electrical connection, second LED chip are electrically connected with second negative terminal pad.
Further, the substrate is the mirror metal substrate of high reflecting rate.
Further, the substrate is made of a kind of material in aluminium, copper.
Compared with prior art, the beneficial effects of the present invention are：
A kind of LED light source of the present invention, by the way that two groups of LED chips are respectively arranged on different height position, then two
Group LED chip overlying covers fluorescence rubber powder of the same race, can be by since two groups of LED chips are fixed in Different Plane, in LED chip
The thickness of the fluorescence rubber powder of excitation is different, therefore just forms different colour temperatures, the double color temperature light sources formed in this way, production effect
Beneficial high, manufacturing cost is low.
Description of the drawings
Fig. 1 is a kind of sectional view of LED light source of the present invention；
Fig. 2 is the vertical view that a kind of LED light source of the present invention is equipped with bar shaped recess；
Fig. 3 is the vertical view that a kind of LED light source of the present invention is equipped with round recess；
In figure：1, substrate；2, the first LED chip；3, the second LED chip；4, box dam circle；5, fluorescence rubber powder；6, anode weldering
Disk；7, the first negative terminal pad；8, the second negative terminal pad；9, recess.
Specific implementation mode
In the following, in conjunction with attached drawing and specific implementation mode, the present invention is described further, it should be noted that not
Under the premise of conflicting, new implementation can be formed between various embodiments described below or between each technical characteristic in any combination
Example.
Embodiment one：
A kind of LED light source as shown in Figs. 1-2, including substrate 1, the first LED chip 2 and the second LED chip 3, the substrate 1
Top be equipped with difference in height the first mounting surface and the second mounting surface, first LED chip 2 be mounted on first mounting surface
On, which is mounted on second mounting surface, and first LED chip 2 and second LED chip 3 are set to difference
Height and position, and first LED chip 2 and the installation position of second LED chip 3 be not be overlapped, the setting of two groups of LED chips
Position is not overlapped, and is to ensure that two groups of light sources are not blocked；The top of the substrate 1 is covered with fluorescence rubber powder 5, the fluorescent glue
First LED chip 2 and second LED chip 3 are completely covered powder 5, and the top of the fluorescence rubber powder 5 is even curface.It is glimmering
Optical cement powder 5 can form colour temperature under the excitation of LED chip, since the height and position of two groups of LED chip settings is different, and be covered in
The top of fluorescence rubber powder 5 thereon is even curface, therefore first LED chip 2 and second LED chip 3 are excited
The thickness of fluorescence rubber powder 5 is different, just forms different colour temperatures, wherein the thicker local of fluorescence rubber powder 5 can form relatively low color
Temperature, the relatively thin region of fluorescence rubber powder 5 can form higher color temperature, and the LED light source formed with this is simple in structure, is conducive to improve
Productivity effect, manufacturing cost are relatively low.It should be noted that two groups of LED chips are LED chip of the same race, by setting
The difference of seated position realizes the effect of its double-colored temperature.It should be noted that a kind of LED light source of the present invention, mainly profit
The 5 thickness difference of fluorescence rubber powder that is excited with LED chip realizes the effect of double-colored temperature, on this basis, more by being arranged
The mounting surface of a different height position, can be achieved on polychrome temp effect.In addition, the first LED chip 2 and the second LED chip 3
It can be LED chip of the same race, be realized by the thickness difference of the fluorescence rubber powder 5 of the difference and LED chip of installation position double
The effect of colour temperature；First LED chip 2 and the second LED chip 3 are set as LED chip of the same race, and process structure can be made more simple
Single, manufacturing process is also more simple.First LED chip 2 and the second LED chip 3 may be arranged as LED chip not of the same race, together
When by adjusting the thickness of LED chip and fluorescence rubber powder 5 preferably realize the effect of double-colored temperature.
As preferred embodiment, which is recess 9, and second mounting surface is with respect to the first mounting surface shape
At lug boss.By the way that the recess 9 is arranged so that the installation position of two groups of chip generates difference in height, to realize that two groups of chip excites
The effect of the fluorescence rubber powder 5 of different-thickness.Specifically, the periphery of first LED chip 2 and the second LED chip 3 is equipped with a corral
Dam, the box dam form box dam circle 4, and the inside of the box dam circle 4 is covered with the fluorescence rubber powder 5.By the way that a corral dam circle 4, side is arranged
Just for coating fluorescence rubber powder 5 on first LED chip 2 and the second LED chip 3, the top of fluorescence rubber powder 5 can be with box dam circle 4
Top maintain an equal level, to keep the top of fluorescence rubber powder 5 as even curface.More specifically, as shown in Fig. 2, the recess 9 is bar shaped
The both ends of recess, the recess 9 are connect with the box dam circle 4 respectively, and correspondingly the both ends of the lug boss also connect with the box dam circle 4 respectively
It connects.First LED chip 2 is set to bar shaped recess bottom, which is set to the top of the lug boss, is come with this
The double color temperature light sources of spaced bar shaped are formed, since two kinds of colour temperatures are alternatively arranged, the uniformity coefficient for mixing light extraction is also opposite
It is higher.The box dam is silica gel box dam, and the box dam circle 4 that silica gel box dam is formed makes surfacing thereon for fixing fluorescence rubber powder 5.
In addition, the top of the substrate 1 is additionally provided with positive terminal pad 6 and negative terminal pad, one end of first LED chip 2 and should
One end of second LED chip 3 is electrically connected with the positive terminal pad 6, the other end of first LED chip 2 and second LED chip 3
The other end be electrically connected with the negative terminal pad.After being connected by simple circuit, positive terminal pad 6 and negative terminal pad need to only be connect
Electricity, you can generate double color temperature light sources.Specifically, which includes the first negative terminal pad 7 and the second negative terminal pad 8, this
One LED chip 2 is electrically connected with first negative terminal pad 7, which is electrically connected with second negative terminal pad 8, passes through
Setting；Two negative terminal pads so that a kind of LED light source in the present embodiment is relatively easy on the structure line of circuit, connects in circuit
Connect also relative ease.More specifically, first LED chip 2 is in parallel with second LED chip 3.Two groups of LED chips are with parallel connection
Mode access in circuit so that two groups of circuits are independent of each other, convenient to be replaced to the LED chip of damage.
The substrate 1 is the mirror metal substrate of high reflecting rate can effectively be carried using the mirror metal substrate of high reflecting rate
The radiation response of high light source.Specifically, which is made of a kind of material in aluminium, copper.Usual substrate 1 is using conductive
Material is made, and since aluminium, copper are that more typical conduction tears material open, aluminium, copper is selected to tear material open as the original for making substrate 1.
Embodiment two：
A kind of LED light source that embodiment two provides, as shown in figure 3, unlike the LED light source of embodiment one, this reality
The LED light source of example, the use of recess 9 and the matched round recess of LED chip are applied, the first LED is set in round recess bottom
Chip 2, correspondingly the second LED chip 3, the fluorescent glue excited by two groups of LED chips is arranged in raised region around it
The thickness of powder 5 is different, therefore, low color temperature can be formed in the region where round recess, the region other than round recess, can shape
At higher color temperature.
The above embodiment is only the preferred embodiment of the present invention, and the scope of protection of the present invention is not limited thereto,
The variation and replacement for any unsubstantiality that those skilled in the art is done on the basis of the present invention belong to institute of the present invention
Claimed range.
Claims (10)
1. a kind of LED light source, it is characterised in that：Including substrate, the first LED chip and the second LED chip, the top of the substrate
Equipped with the first mounting surface and the second mounting surface with difference in height, first LED chip is mounted on first mounting surface,
Second LED chip is mounted on second mounting surface, and first LED chip and second LED chip are set
Seated position is not overlapped, and is covered with fluorescence rubber powder at the top of the substrate, and the fluorescence rubber powder is by first LED chip and described
Second LED chip is completely covered, and the top of the fluorescence rubber powder is even curface.
2. a kind of LED light source as described in claim 1, it is characterised in that：First mounting surface is recess, second peace
Relatively described first mounting surface in dress face forms lug boss.
3. a kind of LED light source as claimed in claim 2, it is characterised in that：First LED chip and the second LED chip
Periphery is equipped with a corral dam, and the box dam forms box dam circle, and the inside of the box dam circle is covered with the fluorescence rubber powder.
4. a kind of LED light source as claimed in claim 3, it is characterised in that：The recess be bar shaped recess, the two of the recess
End is connect with the box dam circle respectively, and correspondingly the both ends of the lug boss are also connect with the box dam circle respectively.
5. a kind of LED light source as claimed in claim 3, it is characterised in that：The recess is round recess, the recess it is big
It is small to be adapted with first LED chip.
6. a kind of LED light source as claimed in claim 3, it is characterised in that：The box dam is silica gel box dam.
7. a kind of LED light source as described in claim 1, it is characterised in that：Be additionally provided at the top of the substrate positive terminal pad and
One end of negative terminal pad, one end of first LED chip and second LED chip is electrically connected with the positive terminal pad, institute
The other end of the other end and second LED chip of stating the first LED chip is electrically connected with the negative terminal pad.
8. a kind of LED light source as claimed in claim 7, it is characterised in that：The negative terminal pad include the first negative terminal pad and
Second negative terminal pad, first LED chip are electrically connected with first negative terminal pad, second LED chip and described the
Two negative terminal pads are electrically connected.
9. a kind of LED light source as described in claim 1, it is characterised in that：The substrate is the mirror metal base of high reflecting rate
Plate.
10. a kind of LED light source as claimed in claim 9, it is characterised in that：The substrate is using a kind of material in aluminium, copper
Material is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810187554.5A CN108336079A (en) | 2018-03-07 | 2018-03-07 | A kind of LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810187554.5A CN108336079A (en) | 2018-03-07 | 2018-03-07 | A kind of LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108336079A true CN108336079A (en) | 2018-07-27 |
Family
ID=62930626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810187554.5A Pending CN108336079A (en) | 2018-03-07 | 2018-03-07 | A kind of LED light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108336079A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102543980A (en) * | 2010-12-31 | 2012-07-04 | 矽品精密工业股份有限公司 | Light emitting diode packaging structure and manufacturing method thereof |
| CN107507903A (en) * | 2017-09-08 | 2017-12-22 | 广东晶科电子股份有限公司 | A kind of COB modules of adjustable color temperature |
| CN206921818U (en) * | 2017-04-24 | 2018-01-23 | 深圳市源磊科技有限公司 | A kind of dual-colored LED light source |
| CN208077972U (en) * | 2018-03-07 | 2018-11-09 | 广州硅能照明有限公司 | A kind of LED light source |
-
2018
- 2018-03-07 CN CN201810187554.5A patent/CN108336079A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102543980A (en) * | 2010-12-31 | 2012-07-04 | 矽品精密工业股份有限公司 | Light emitting diode packaging structure and manufacturing method thereof |
| CN206921818U (en) * | 2017-04-24 | 2018-01-23 | 深圳市源磊科技有限公司 | A kind of dual-colored LED light source |
| CN107507903A (en) * | 2017-09-08 | 2017-12-22 | 广东晶科电子股份有限公司 | A kind of COB modules of adjustable color temperature |
| CN208077972U (en) * | 2018-03-07 | 2018-11-09 | 广州硅能照明有限公司 | A kind of LED light source |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180727 |