CN108326927A - The ultrasonic wave sliver apparatus and its method of screen cutting comprehensively - Google Patents
The ultrasonic wave sliver apparatus and its method of screen cutting comprehensively Download PDFInfo
- Publication number
- CN108326927A CN108326927A CN201810157123.4A CN201810157123A CN108326927A CN 108326927 A CN108326927 A CN 108326927A CN 201810157123 A CN201810157123 A CN 201810157123A CN 108326927 A CN108326927 A CN 108326927A
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- Prior art keywords
- ultrasonic wave
- ultrasonic
- sliver
- transducer
- screen cutting
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- 238000005520 cutting process Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 230000003321 amplification Effects 0.000 claims abstract description 7
- 238000003199 nucleic acid amplification method Methods 0.000 claims abstract description 7
- 230000010358 mechanical oscillation Effects 0.000 claims abstract description 6
- 206010041662 Splinter Diseases 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000003698 laser cutting Methods 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 4
- 238000002604 ultrasonography Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000013467 fragmentation Methods 0.000 description 2
- 238000006062 fragmentation reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/56—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which travels with the work otherwise than in the direction of the cut, i.e. flying cutter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/08—Means for actuating the cutting member to effect the cut
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Treatment Of Fiber Materials (AREA)
Abstract
The invention discloses the ultrasonic wave sliver apparatus and method of comprehensive screen cutting, including being connected the supersonic generator of arrangement, ultrasonic transducer, ultrasonic variable amplitude device and ultrasonic wave sliver cutter head successively, the supersonic generator generates ultrasonic wave；The ultrasonic wave that supersonic generator generates is converted to mechanical oscillation by the ultrasonic transducer；The ultrasonic variable amplitude device, by the output Amplitude amplification of ultrasonic transducer；The output amplitude of ultrasonic variable amplitude device is further amplified in the ultrasonic wave sliver cutter head, focuses ultrasonic wave, and the vibration of high frequency band dynamic cutter head acts on object to be processed and generates resonance, realizes mechanical sliver, makes the stress release after cutting.The sliver residual of laser cutting can effectively be controlled and collapse scarce problem, residual collapses scarce stability contorting within 30um after sliver, solves the problems, such as to shield the sliver in U groove processings comprehensively, compared to artificial and mechanical paddle mode, it is more easy to be integrated into automatic production line, significantly improves production efficiency.
Description
Technical field
The present invention relates to a kind of the ultrasonic wave sliver apparatus and its method of comprehensive screen cutting.
Background technology
Currently, burning hot and laser cutting special-shaped product project the increase of screen technology comprehensively, is badly in need of reply abnormity cutting and splits
The problem of piece predominantly shields the sliver problem of big U slots comprehensively.
Existing sliver scheme is broadly divided at 2 points, 1) manually sliver, there are many uncertain factors, artificially cause to shield
Body fragmentation and larger remaining risk, and can not be integrated into automation equipment；2) mechanical paddle, it is outside using fixture clamping type
Stretch the manual imitation sliver mode that carries out, stability is relatively artificial relatively high, but the material selection difficulty of touch screen body is big, cross as hard as
The soft sliver that can all generate is bad, and residual is larger, can not pull out even fragmentation, and serious wear, replaces frequent.
A kind of more stable sliver technology that is quick easy to maintain and being readily integrated into automatic production line is studied, becomes comprehensive
Shield the task of top priority of project-driven.
Invention content
The purpose of the present invention is overcoming the shortcomings of the prior art, a kind of ultrasonic wave sliver dress of comprehensive screen cutting is provided
It sets and its method.
The purpose of the present invention is achieved through the following technical solutions：
The ultrasonic wave sliver apparatus of screen cutting, feature are comprehensively：Including being connected the supersonic generator of arrangement, ultrasound successively
Wave transducer, ultrasonic variable amplitude device and ultrasonic wave sliver cutter head,
The supersonic generator generates ultrasonic wave；
The ultrasonic wave that supersonic generator generates is converted to mechanical oscillation by the ultrasonic transducer；
The ultrasonic variable amplitude device, by the output Amplitude amplification of ultrasonic transducer；
The output amplitude of ultrasonic variable amplitude device is further amplified in the ultrasonic wave sliver cutter head, focuses ultrasonic wave, high frequency band
Dynamic cutter head vibrates, and acts on object to be processed and generates resonance, realizes mechanical sliver, makes the stress release after cutting.
Further, the ultrasonic wave sliver apparatus of above-mentioned comprehensive screen cutting, wherein the ultrasonic transducer is piezoelectricity
Ceramic-type energy converter.
Further, the ultrasonic wave sliver apparatus of above-mentioned comprehensive screen cutting, wherein the supersonic generator and ultrasound
It is connected by signal wire between wave transducer.
Further, the ultrasonic wave sliver apparatus of above-mentioned comprehensive screen cutting, wherein the supersonic generator is frequency
More than the supersonic generator that 20KHZ, output power are more than 300W.
Further, the ultrasonic wave sliver apparatus of above-mentioned comprehensive screen cutting, wherein the ultrasonic variable amplitude device is ultrasound
Wave amplitude transformer.
The present invention shields the ultrasonic wave splinter method of cutting comprehensively, and generating frequency by supersonic generator is more than 20KHZ, output
Power is more than the ultrasonic wave of 300W, then ultrasonic wave is converted to mechanical oscillation by ultrasonic transducer, then by ultrasonic variable amplitude
Device is by the output Amplitude amplification of ultrasonic transducer；The defeated of ultrasonic variable amplitude device is finally further amplified by ultrasonic wave sliver cutter head
Going out amplitude, focuses ultrasonic wave, the vibration of high frequency band dynamic cutter head acts on object to be processed and generates resonance, to realize mechanical sliver,
The stress after cutting is set preferably to discharge.
Further, the ultrasonic wave splinter method of above-mentioned comprehensive screen cutting, wherein alternating current is converted into high-frequency high-voltage
Alternating current is defeated by ultrasonic transducer, and the electric energy of input is converted into mechanical energy by ultrasonic transducer.
Further, the ultrasonic wave splinter method of above-mentioned comprehensive screen cutting, wherein the ultrasonic transducer is in vertical
To making stretching motion back and forth.
Further, the ultrasonic wave splinter method of above-mentioned comprehensive screen cutting, wherein the frequency of stretching motion is equal to
The high-frequency ac current frequency that driving power is confessed.
Further, the ultrasonic wave splinter method of above-mentioned comprehensive screen cutting, wherein residual, which collapses to lack, after sliver stablizes control
System is within 30um.
The present invention has significant advantages and beneficial effects compared with prior art, embodies in the following areas：
The present invention designs unique, structure novel, can effectively control the sliver residual of laser cutting and collapse scarce problem, after sliver
Residual collapses scarce stability contorting within 30um, solves the problems, such as to shield the sliver in U groove processings comprehensively, compared to artificial and mechanical pull out
Sheet mode is more easy to be integrated into automatic production line, greatly improves production efficiency, is a practical new design.
Description of the drawings
Fig. 1：The structural schematic diagram of the present invention.
The meaning of each reference numeral see the table below in figure：
Specific implementation mode
For a clearer understanding of the technical characteristics, objects and effects of the present invention, specific implementation is now described in detail
Scheme.
As shown in Figure 1, comprehensively screen cutting ultrasonic wave sliver apparatus, including be connected successively the supersonic generator 1 of arrangement,
Ultrasonic transducer 2, ultrasonic variable amplitude device 3 and ultrasonic wave sliver cutter head 4, supersonic generator 1 generate ultrasonic wave；
The ultrasonic wave that supersonic generator generates is converted to mechanical oscillation by ultrasonic transducer 2；Ultrasonic transducer is adopted
With piezoelectric ceramic type energy converter；
Ultrasonic variable amplitude device 3, by the output Amplitude amplification of ultrasonic transducer；
The output amplitude of ultrasonic variable amplitude device is further amplified in ultrasonic wave sliver cutter head 4, focuses ultrasonic wave, and high frequency drives
Cutter head vibrates, and acts on object to be processed (screen body 5) and generates resonance, realizes mechanical sliver, make the stress release after cutting.
Wherein, it is connected by signal wire between supersonic generator 1 and ultrasonic transducer 2.
Supersonic generator 1 is the supersonic generator that frequency is more than 20KHZ, output power is more than 300W.
Ultrasonic variable amplitude device 3 is ultrasonic variable amplitude bar.
The present invention shields the ultrasonic wave splinter method of cutting comprehensively, and generating frequency by supersonic generator 1 is more than 20KHZ, defeated
Go out power and be more than the ultrasonic wave of 300W, then ultrasonic wave is converted into mechanical oscillation by ultrasonic transducer 2, is then become by ultrasonic wave
Width device 3 is by the output Amplitude amplification of ultrasonic transducer；Ultrasonic variable amplitude device is finally further amplified by ultrasonic wave sliver cutter head 4
Output amplitude, focus ultrasonic wave, high frequency band dynamic cutter head vibration, act on screen body 5 generate resonance, to realize mechanical sliver,
The stress after cutting is set preferably to discharge.Residual collapses scarce stability contorting within 30um after sliver, efficiently solves screen U slots comprehensively
Sliver problem in processing, improves production yield.
Alternating current is converted into high-frequency high-voltage alternating current and is defeated by ultrasonic transducer 2, and ultrasonic transducer 2 is by the electricity of input
It can be converted into mechanical energy, stretching motion, the frequency of stretching motion are equal to driving power to ultrasonic transducer 2 back and forth in longitudinally work
The high-frequency ac current frequency confessed.
When propagating, high directivity, energy is easy to concentrate ultrasonic wave；Ultrasonic wave is a kind of wave, while being also one
Kind form of energy can go to change by medium so that destroying object structures.
Sliver mode is contact vibration, the characteristics of using ultrasonic wave high directivity, it is therefore an objective to reduce the material being removed
Double swerve generates scarce to collapsing for glass body.
The cutting purpose for assisting sliver line is to control the sliver residual of low-angle, increases forced area, prevent external force collection
In cause cutting region to be broken in advance a narrow regions to cause larger residual.
Different size of cutter head is selected for various sizes of U flowing current separation, effect is more.
In conclusion the present invention effectively controls the sliver residual of laser cutting and collapses scarce problem, residual, which collapses, after sliver lacks surely
Fixed control solves the problems, such as to shield the sliver in U groove processings comprehensively, compared to artificial and mechanical paddle mode, more within 30um
It is easy of integration in automatic production line, greatly improve production efficiency.
It should be noted that：The foregoing is merely the preferred embodiment of the present invention, are not limited to the power of the present invention
Sharp range；The description above simultaneously, should can be illustrated and implement for the special personage of correlative technology field, thus it is other without departing from
The equivalent change or modification completed under disclosed spirit, should be included in claim.
Claims (10)
1. the ultrasonic wave sliver apparatus of screen cutting comprehensively, it is characterised in that：Including being connected the supersonic generator of arrangement successively, surpassing
Acoustic wave transducer, ultrasonic variable amplitude device and ultrasonic wave sliver cutter head,
The supersonic generator generates ultrasonic wave；
The ultrasonic wave that supersonic generator generates is converted to mechanical oscillation by the ultrasonic transducer；
The ultrasonic variable amplitude device, by the output Amplitude amplification of ultrasonic transducer；
The output amplitude of ultrasonic variable amplitude device is further amplified in the ultrasonic wave sliver cutter head, focuses ultrasonic wave, high frequency band moving knife
Head vibration acts on object to be processed and generates resonance, realizes mechanical sliver, makes the stress release after cutting.
2. the ultrasonic wave sliver apparatus of comprehensive screen cutting according to claim 1, it is characterised in that：The ultrasonic wave transducer
Device is piezoelectric ceramic type energy converter.
3. the ultrasonic wave sliver apparatus of comprehensive screen cutting according to claim 1, it is characterised in that：The ultrasonic wave occurs
It is connected by signal wire between device and ultrasonic transducer.
4. the ultrasonic wave sliver apparatus of comprehensive screen cutting according to claim 1, it is characterised in that：The ultrasonic wave occurs
Device is the supersonic generator that frequency is more than 20KHZ, output power is more than 300W.
5. the ultrasonic wave sliver apparatus of comprehensive screen cutting according to claim 1, it is characterised in that：The ultrasonic variable amplitude
Device is ultrasonic variable amplitude bar.
6. claim 1 described device realizes the ultrasonic wave splinter method of screen cutting comprehensively, it is characterised in that：Occurred by ultrasonic wave
Device generates frequency and is more than the ultrasonic wave of 20KHZ, output power more than 300W, then ultrasonic wave is converted to machine by ultrasonic transducer
Tool vibrates, then by ultrasonic variable amplitude device by the output Amplitude amplification of ultrasonic transducer；Finally by ultrasonic wave sliver cutter head into
One step amplifies the output amplitude of ultrasonic variable amplitude device, focuses ultrasonic wave, and the vibration of high frequency band dynamic cutter head acts on object to be processed production
Raw resonance, to realize mechanical sliver, makes the stress after cutting preferably discharge.
7. the ultrasonic wave splinter method of comprehensive screen cutting according to claim 6, it is characterised in that：Alternating current is converted into high frequency
High voltage alternating current is defeated by ultrasonic transducer, and the electric energy of input is converted into mechanical energy by ultrasonic transducer.
8. the ultrasonic wave splinter method of comprehensive screen cutting according to claim 7, it is characterised in that：The ultrasonic wave transducer
Device makees stretching motion back and forth in longitudinal direction.
9. the ultrasonic wave splinter method of comprehensive screen cutting according to claim 8, it is characterised in that：The frequency of stretching motion
It is equal to the high-frequency ac current frequency that driving power is confessed.
10. the ultrasonic wave splinter method of comprehensive screen cutting according to claim 6, it is characterised in that：Residual collapses after sliver
Stability contorting is lacked within 30um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810157123.4A CN108326927A (en) | 2018-02-24 | 2018-02-24 | The ultrasonic wave sliver apparatus and its method of screen cutting comprehensively |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810157123.4A CN108326927A (en) | 2018-02-24 | 2018-02-24 | The ultrasonic wave sliver apparatus and its method of screen cutting comprehensively |
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|---|---|
| CN108326927A true CN108326927A (en) | 2018-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810157123.4A Pending CN108326927A (en) | 2018-02-24 | 2018-02-24 | The ultrasonic wave sliver apparatus and its method of screen cutting comprehensively |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113102899A (en) * | 2021-03-12 | 2021-07-13 | 大族激光科技产业集团股份有限公司 | Splitting device, splitting method and cutting system |
| CN113281932A (en) * | 2021-05-28 | 2021-08-20 | 深圳市新世纪拓佳光电技术有限公司 | TFT-LCD (thin film transistor-liquid crystal display) full-screen cutting strength improving method |
| CN114670288A (en) * | 2022-03-08 | 2022-06-28 | 深圳市海目星激光智能装备股份有限公司 | Ultrasonic wave splitting method and splitting device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103144137A (en) * | 2013-03-12 | 2013-06-12 | 杭州辉昂科技有限公司 | Ultrasonic composite processing machine tool and machining method thereof |
| CN103978560A (en) * | 2014-05-27 | 2014-08-13 | 华侨大学 | Quick-change ultrasonic vibration auxiliary sawing device |
| CN205291279U (en) * | 2016-01-17 | 2016-06-08 | 西安帕沃辐电气工程有限公司 | Rotatory ultrasonic knife handle for lathe |
-
2018
- 2018-02-24 CN CN201810157123.4A patent/CN108326927A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103144137A (en) * | 2013-03-12 | 2013-06-12 | 杭州辉昂科技有限公司 | Ultrasonic composite processing machine tool and machining method thereof |
| CN103978560A (en) * | 2014-05-27 | 2014-08-13 | 华侨大学 | Quick-change ultrasonic vibration auxiliary sawing device |
| CN205291279U (en) * | 2016-01-17 | 2016-06-08 | 西安帕沃辐电气工程有限公司 | Rotatory ultrasonic knife handle for lathe |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113102899A (en) * | 2021-03-12 | 2021-07-13 | 大族激光科技产业集团股份有限公司 | Splitting device, splitting method and cutting system |
| CN113281932A (en) * | 2021-05-28 | 2021-08-20 | 深圳市新世纪拓佳光电技术有限公司 | TFT-LCD (thin film transistor-liquid crystal display) full-screen cutting strength improving method |
| CN114670288A (en) * | 2022-03-08 | 2022-06-28 | 深圳市海目星激光智能装备股份有限公司 | Ultrasonic wave splitting method and splitting device |
| CN114670288B (en) * | 2022-03-08 | 2023-08-15 | 海目星激光科技集团股份有限公司 | Ultrasonic splitting method and splitting device |
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Application publication date: 20180727 |