CN108326280B - Diamond cutting knife for cutting ultrathin sapphire glass and preparation method thereof - Google Patents
Diamond cutting knife for cutting ultrathin sapphire glass and preparation method thereof Download PDFInfo
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- CN108326280B CN108326280B CN201711492495.4A CN201711492495A CN108326280B CN 108326280 B CN108326280 B CN 108326280B CN 201711492495 A CN201711492495 A CN 201711492495A CN 108326280 B CN108326280 B CN 108326280B
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- 238000005520 cutting process Methods 0.000 title claims abstract description 70
- 239000010432 diamond Substances 0.000 title claims abstract description 39
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 39
- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 28
- 239000010980 sapphire Substances 0.000 title claims abstract description 28
- 239000011521 glass Substances 0.000 title claims abstract description 21
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 44
- 239000002184 metal Substances 0.000 claims abstract description 43
- 239000011159 matrix material Substances 0.000 claims abstract description 25
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000005245 sintering Methods 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract description 15
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000012545 processing Methods 0.000 claims abstract description 15
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 6
- 238000003825 pressing Methods 0.000 claims description 11
- 238000007873 sieving Methods 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 5
- 238000012216 screening Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 11
- 239000000843 powder Substances 0.000 description 10
- 238000005452 bending Methods 0.000 description 9
- 238000000227 grinding Methods 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 238000005204 segregation Methods 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- -1 aluminum and tin Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000006477 desulfuration reaction Methods 0.000 description 1
- 230000023556 desulfurization Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000006213 oxygenation reaction Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
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- B22F1/0003—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F2005/001—Cutting tools, earth boring or grinding tool other than table ware
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
Abstract
The invention discloses a diamond cutting knife for cutting ultrathin sapphire glass and a preparation method thereof, wherein a mixture of a metal matrix, graphite powder and diamond is sieved and then cold-pressed to obtain a cold-pressed blank; the metal matrix comprises copper powder, tin powder, cobalt powder, titanium powder, aluminum powder and metal lanthanum; sintering the cold-pressed green body to obtain a formed body; the sintering treatment temperature is 600-700 ℃, the time is 25-35 minutes, and the heating rate is 25-35 ℃/min; the diamond cutting knife for cutting the ultrathin sapphire glass, which is obtained by processing the forming body, can be used for cutting the sapphire with very high hardness, and particularly for the ultrathin sapphire, can avoid cutting damage and improve the yield.
Description
Technical Field
The invention belongs to the technical field of cutting knives, and particularly relates to a diamond cutting knife for cutting ultrathin sapphire glass and a preparation method thereof.
Background
Sapphire has excellent mechanical and optical properties, and is used in electronic products, such as lens modules as a protective cover or mobile phones as a front cover to protect the lens modules and the mobile phones by using wear-resistant and impact-resistant properties. However, since sapphire has a high hardness (hardness of 9), it is difficult to process, for example, even if cutting is performed using an advanced nano laser, micro cracks are generated on the cut surface due to a thermal fusion problem, and further, sapphire cut by a diamond wire saw having a diameter of 0.25mm is cut into a wafer, but the cut rate is low, and the surface line mark is deep, which affects the wafer yield.
Disclosure of Invention
The invention discloses a diamond cutting knife for cutting ultrathin sapphire glass and a preparation method thereof, which can be used for cutting the sapphire with very high hardness, particularly for the ultrathin sapphire, can avoid cutting damage and improve the yield.
The following technical scheme is adopted:
a preparation method of a diamond cutting knife for cutting ultrathin sapphire glass comprises the following steps:
(1) screening a mixture of the metal matrix, graphite powder and diamond, and cold-pressing to obtain a cold-pressed green body; the metal matrix comprises copper powder, tin powder, cobalt powder, titanium powder, aluminum powder and metal lanthanum;
(2) sintering the cold-pressed green body to obtain a formed body; the sintering treatment temperature is 600-700 ℃, the time is 25-35 minutes, and the heating rate is 25-35 ℃/min;
(3) and processing the formed body to obtain the diamond cutting knife for cutting the ultrathin sapphire glass.
The invention also discloses a preparation method of the forming body for the diamond cutting knife, which comprises the following steps:
(1) screening a mixture of the metal matrix, graphite powder and diamond, and cold-pressing to obtain a cold-pressed green body; the metal matrix comprises copper powder, tin powder, cobalt powder, titanium powder, aluminum powder and metal lanthanum;
(2) sintering the cold-pressed blank to obtain a forming body for the diamond cutting knife; the sintering treatment temperature is 600-700 ℃, the time is 25-35 minutes, and the heating rate is 25-35 ℃/min.
The invention also discloses a preparation method of the cold-pressed blank for the diamond cutting knife, which comprises the following steps:
(1) screening a mixture of the metal matrix, graphite powder and diamond, and cold-pressing to obtain a cold-pressed green body; the metal matrix comprises copper powder, tin powder, cobalt powder, titanium powder, aluminum powder and metal lanthanum.
In the technical scheme, the metal matrix comprises the following components in percentage by mass:
40-50% of copper (Cu) powder
25-45% of tin (Sn) powder
5-15% of cobalt (Co) powder
2-6% of titanium (Ti) powder
4-8% of aluminum (Al) powder
1 to 3 percent of metal lanthanum
The combined addition of titanium and aluminum provides enough energy for the interface reaction of titanium and diamond, can strengthen the tire body, and can improve the wetting and bonding of the tire body to the diamond; particularly, the addition of the rare earth elements can effectively reduce the melting point of the alloy, and meanwhile, the rare earth elements also have strong deoxidation, desulfurization and denitrification effects and have the effects of inhibiting oxygen, sulfur and segregation; compared with the existing cutting knife, the bending strength of the prepared product is increased by 20%, the hardness is increased by 15%, the bending strength and the hardness are increased, deflection can be reduced, the knife mark is narrower, and the thickness of the conventional cutting knife which is 1.15 times can be reduced to 1.0-1.03 times.
In the technical scheme, the technical conditions of the copper powder are as follows:
the technical conditions of the tin powder are as follows:
| Sn(≮) | colour(s) | Specific surface area (m)2/g） | Particle size of mum | Bulk density g/cm3 | Crystal form |
| 99.9% | Black color | 45. 3 | 10-15 | 0.42 | Spherical shape |
According to the technical scheme, the mass ratio of the metal matrix, the graphite powder and the diamond is (78-83): (2-4): (15-25), the preferred particle size of the diamond is 5-20 microns, the cutting force of a cutting knife is insufficient due to too low concentration, the cutting back collapse is too large due to too high concentration, and the concentration range ensures that the blade has good self-sharpening performance and long service life.
In the technical scheme, the sieving is performed by sequentially sieving with a 80-mesh sieve and a 200-mesh sieve, preferably, the sieving is performed for 4 times with the 200-mesh sieve, and the multiple sieving not only can play a role in improving the uniformity of the mixed materials, but also can play a good role in granulating.
In the technical scheme, the cold pressing temperature is room temperature, the time is 25-35 seconds, and the pressure is 3.5 tons/cm2Can ensure the compact, uniform and gapless cold-pressed blank.
In the technical scheme, the sintering treatment temperature is 650 ℃, the time is 30 minutes, and the heating rate is 30 ℃/min; too high a sintering temperature causes segregation and overflow of tin, while maintaining a relatively low temperature rise rate also to prevent segregation and overflow of low melting point metals such as aluminum and tin, while ensuring uniformity of composition.
In the technical scheme, the machining comprises deburring, inner hole excircle machining and end face thinning machining, the machining is carried out until the dimensional accuracy required by a drawing is achieved, and the qualified cutting knife is obtained after the inspection is in accordance with the drawing requirements.
The invention also discloses a diamond cutting knife for cutting ultrathin sapphire glass, which is prepared by the preparation method, can meet the cutting requirement of the ultrathin sapphire glass with 175 microns, has the characteristics of strong holding force, high cutting degree, long service life and the like on the premise of meeting the processing quality, and has the advantages of speed reaching 5mm/s during test and use, rotating speed of a main shaft of a cutting machine being 20K RPM, stable quality in batch use, and no phenomena of knife breakage and sparking.
The invention also discloses a metal matrix for the diamond cutter; the metal-based matrix comprises the following components in percentage by mass:
40-50% of copper (Cu) powder
25-45% of tin (Sn) powder
5-15% of cobalt (Co) powder
2-6% of titanium (Ti) powder
4-8% of aluminum (Al) powder
1-3% of metal lanthanum.
The invention designs a new metal composite formula, can improve the strength and the hardness of a cutting knife by utilizing the combined action of metal and metal, avoids the precipitation of metal elements by combining the addition of rare earth elements, particularly improves the self-lubricating property of a final product by adding graphite powder during the preparation of a blank, mainly inhibits the oxidation of metal lanthanum, prevents the excessive oxidation of the metal lanthanum by matching with sintering parameters, and simultaneously can provide high strength by the small amount of lanthanum oxide.
Detailed Description
In the invention, the technical conditions of the copper powder are as follows:
the technical conditions of the tin powder are as follows:
| Sn(≮) | colour(s) | Proportion tableArea (m)2/g） | Particle size of mum | Bulk density g/cm3 | Crystal form |
| 99.9% | Black color | 45. 3 | 10-15 | 0.42 | Spherical shape |
The particle size of the diamond is 5-20 mu m; the remaining raw materials are not limited.
Example one
A metal matrix for a diamond cutting knife comprises the following components in percentage by mass:
50 percent of copper powder
27 percent of tin powder
Cobalt powder 6%
6 percent of titanium powder
Aluminum powder 8%
3 percent of metal lanthanum
The preparation method of the diamond cutting knife for cutting the ultrathin sapphire glass comprises the following steps:
(1) mixing materials: according to the proportion, placing accurately weighed copper powder, tin powder, cobalt powder, titanium powder, aluminum powder and metal lanthanum into a three-dimensional mixer, and premixing for 2 hours to obtain a metal matrix; then adding graphite powder and diamond, mixing for 10 hours, sieving by a 80-mesh sieve, and placing into a drying vessel for later use; the mass ratio of the metal matrix body, the graphite powder and the diamond is 80: 3: 17;
(2) and (3) pressing and forming: sieving the prepared material with 200 mesh screen for 4 times to ensure that the material is not agglomerated, slowly putting the material into a mold, rotating the mold and scraping the material with a scraper, putting an upper compression ring, and putting the mold and the upper compression ring on a pressing platform of a grinding wheel hydraulic pressAt room temperature, a pressure of 3.5 tons/cm was applied2Maintaining the pressure for 30 seconds to prepare a cold-pressed green body;
(3) sintering and forming: placing the cold-pressed blank together with the die into a sintering furnace, heating to the final sintering temperature of 650 ℃ at the heating rate of 30 ℃/min, keeping the temperature for 0.5 hour, cooling to room temperature along with the furnace, taking out, and deburring for later use;
(4) processing an inner hole and an outer circle: placing the sintered green body in a special fixture, clamping the fixture and an inner and outer circle grinding machine, adjusting the precision by using a dial indicator, selecting a grinding wheel, a feed speed and a rotating speed, and processing the inner and outer circles of a scribing cutter to the dimensional precision required by a drawing;
(5) and (3) thinning and processing of double end faces: and (3) placing the blank after the inner and outer circles are processed into a double-end-face thinning machine, fixing a tool clamp, selecting a pressure, a rotating speed and a grinding wheel disc for thinning, processing to the dimensional precision required by the drawing, and checking that the requirement of the drawing is met to obtain the qualified diamond cutting knife for cutting the ultrathin sapphire glass.
The cutting knife of preparation is extremely strong from the sharpness, the cutting blade is fragile and sharp, can satisfy ultra-thin 175 mu m sapphire glass's cutting demand, under the prerequisite that satisfies processingquality, the life-span can reach 300 meters, 2 times of prior art, speed can reach 5mm/s when the test is used, cutting machine main shaft rotational speed 20K RPM, use the stable quality in batches, the defective rate is less than or equal to 0.2%, there is not disconnected sword, the phenomenon of striking sparks appears, simultaneously compare with current cutting knife (this company's last generation product), the product bending strength of preparation increases 20%, the hardness increases 15%, because stronger bending strength and brittle rigidity, effectively reduce the beat under the high-speed operation, the tool mark control is narrower, 1.01 times sword is thick.
Example two
A metal matrix for a diamond cutting knife comprises the following components in percentage by mass:
copper powder 42%
34 percent of tin powder
11 percent of cobalt powder
5 percent of titanium powder
6 percent of aluminum powder
2 percent of metal lanthanum
The preparation method of the diamond cutting knife for cutting the ultrathin sapphire glass comprises the following steps:
(2) mixing materials: according to the proportion, placing accurately weighed copper powder, tin powder, cobalt powder, titanium powder, aluminum powder and metal lanthanum into a three-dimensional mixer, and premixing for 2 hours to obtain a metal matrix; then adding graphite powder and diamond, mixing for 10 hours, sieving by a 80-mesh sieve, and placing into a drying vessel for later use; the mass ratio of the metal matrix body, the graphite powder and the diamond is 82: 2: 16;
(2) and (3) pressing and forming: sieving the prepared material with 200 mesh screen for 4 times to ensure that the material is not agglomerated, slowly putting the material into a mold, rotating the mold and scraping the material with a scraper, putting an upper pressure ring, putting the mold and the upper pressure ring on a pressing platform of a grinding wheel hydraulic press, and applying pressure of 3.5 tons/cm at room temperature2Maintaining the pressure for 30 seconds to prepare a cold-pressed green body;
(3) sintering and forming: placing the cold-pressed blank together with the die into a sintering furnace, heating to the final sintering temperature of 650 ℃ at the heating rate of 30 ℃/min, keeping the temperature for 0.5 hour, cooling to room temperature along with the furnace, taking out, and deburring for later use;
(4) processing an inner hole and an outer circle: placing the sintered green body in a special fixture, clamping the fixture and an inner and outer circle grinding machine, adjusting the precision by using a dial indicator, selecting a grinding wheel, a feed speed and a rotating speed, and processing the inner and outer circles of a scribing cutter to the dimensional precision required by a drawing;
(5) and (3) thinning and processing of double end faces: and (3) placing the blank after the inner and outer circles are processed into a double-end-face thinning machine, fixing a tool clamp, selecting a pressure, a rotating speed and a grinding wheel disc for thinning, processing to the dimensional precision required by the drawing, and checking that the requirement of the drawing is met to obtain the qualified diamond cutting knife for cutting the ultrathin sapphire glass.
The cutting knife of preparation is extremely strong from the sharp nature, the cutting blade is fragile and sharp, can satisfy ultra-thin 175 mu m sapphire glass's cutting demand, under the prerequisite that satisfies processingquality, the life-span can reach 300 meters, 2 times of prior art, speed can reach 5mm/s when the test is used, cutting machine main shaft rotational speed 20K RPM, use the stable quality in batches, the defective rate is less than or equal to 0.2%, there is not disconnected sword, the phenomenon of striking sparks appears, simultaneously compare with current cutting knife, the product bending strength of preparation increases 18%, the hardness increases 15%, because stronger bending strength and brittle, effectively reduce the beat under the high-speed operation, the tool mark control is narrower, 1.03 times sword is thick.
Comparative example 1
The metal matrix comprises the following components in percentage by mass:
50 percent of copper powder
29 percent of tin powder
Cobalt powder 6%
Titanium powder 7%
Aluminum powder 8%
The rest is consistent with the embodiment, the ultra-thin 175-micron sapphire glass is cut, the service life reaches 200 meters on the premise of meeting the processing quality, the speed can reach 5mm/s when in test use, the rotating speed of a main shaft of a cutting machine is 20K RPM, the quality in batch use is stable, the reject ratio is 0.6 percent, and simultaneously compared with the existing cutting knife, the bending strength of the prepared product is increased by 3 percent, the hardness is increased by 1 percent, and the thickness of the cutting knife is 1.09 times.
Comparative example No. two
Graphite powder is not added, and the mass ratio of the metal matrix body to the diamond is 85: 15; the rest is consistent with the embodiment, the ultra-thin 175-micron sapphire glass is cut, the service life reaches 190 meters on the premise of meeting the processing quality, the speed can reach 5mm/s when in test use, the rotating speed of a main shaft of a cutting machine is 20K RPM, the quality in batch use is stable, the reject ratio is 0.7 percent, and simultaneously compared with the existing cutting knife, the bending strength of the prepared product is increased by 5 percent, the hardness is increased by 3 percent, and the thickness of the cutting knife is 1.11 times.
Comparative example No. three
The metal matrix comprises the following components in percentage by mass:
45 percent of copper powder
36 percent of tin powder
11 percent of cobalt powder
6 percent of aluminum powder
2 percent of metal lanthanum
The rest is consistent with the embodiment, the ultra-thin 175-micron sapphire glass is cut, the service life reaches 220 meters on the premise of meeting the processing quality, the speed can reach 5mm/s when in test use, the rotating speed of a main shaft of a cutting machine is 20K RPM, the quality in batch use is stable, the reject ratio is 0.4 percent, and simultaneously compared with the existing cutting knife, the bending strength of the prepared product is increased by 5 percent, the hardness is increased by 2 percent, and the thickness of the cutting knife is 1.08 times.
Claims (3)
1. A preparation method of a diamond cutting knife for cutting ultrathin sapphire glass comprises the following steps:
(1) screening a mixture of the metal matrix, graphite powder and diamond, and cold-pressing to obtain a cold-pressed green body; the metal matrix comprises copper powder, tin powder, cobalt powder, titanium powder, aluminum powder and metal lanthanum;
(2) sintering the cold-pressed green body to obtain a formed body; the sintering treatment temperature is 600-700 ℃, the time is 25-35 minutes, and the heating rate is 25-35 ℃/min;
(3) processing the formed body to obtain a diamond cutting knife for cutting the ultrathin sapphire glass; the metal matrix comprises the following components in percentage by mass:
40-50% of copper powder
25 to 45 percent of tin powder
5 to 15 percent of cobalt powder
2 to 6 percent of titanium powder
4 to 8 percent of aluminum powder
1-3% of metal lanthanum;
the mass ratio of the metal matrix to the graphite powder to the diamond is (78-83) to (2-4) to (15-25); the particle size of the diamond is 5-20 mu m.
2. The preparation method according to claim 1, wherein the sieving is sequentially sieving with 80 mesh sieve and 200 mesh sieve; the cold pressing temperature is room temperature, the time is 25-35 seconds, and the pressure is 3.5 tons/cm2。
3. The method according to claim 1, wherein the sintering treatment is carried out at 650 ℃ for 30 minutes at a heating rate of 30 ℃/min.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711492495.4A CN108326280B (en) | 2017-12-30 | 2017-12-30 | Diamond cutting knife for cutting ultrathin sapphire glass and preparation method thereof |
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| CN201711492495.4A CN108326280B (en) | 2017-12-30 | 2017-12-30 | Diamond cutting knife for cutting ultrathin sapphire glass and preparation method thereof |
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| CN114472889B (en) * | 2021-12-28 | 2024-02-20 | 苏州赛尔科技有限公司 | Ultra-thin superfinishing cutter with metal binding agent and preparation method |
| CN114472894A (en) * | 2021-12-31 | 2022-05-13 | 苏州赛尔科技有限公司 | Metal sintering ultrathin cutting knife for silicon wafer cutting and preparation method |
| CN114472895A (en) * | 2021-12-31 | 2022-05-13 | 苏州赛尔科技有限公司 | Metal sintered diamond ultrathin cutting blade for QFN and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS5655536A (en) * | 1979-10-09 | 1981-05-16 | Mitsui Mining & Smelting Co Ltd | Metal bond-diamond sintered body |
| CN103821456A (en) * | 2014-02-28 | 2014-05-28 | 郑州神利达钻采设备有限公司 | Filling-type sintered diamond drill bit and manufacturing method thereof |
| CN105821279A (en) * | 2016-05-18 | 2016-08-03 | 江苏超峰工具有限公司 | High-strength diamond saw blade |
| CN106566968B (en) * | 2016-10-14 | 2018-08-07 | 苏州赛尔科技有限公司 | A kind of glass of color filter cutting diamond scribing knife and preparation method thereof |
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