CN108325864B

CN108325864B - Pressure device for test sorting machine

Info

Publication number: CN108325864B
Application number: CN201711373476.XA
Authority: CN
Inventors: 羅闰成; 李相沅
Original assignee: Techwing Co Ltd
Current assignee: Techwing Co Ltd
Priority date: 2017-01-11
Filing date: 2017-12-19
Publication date: 2020-06-26
Anticipated expiration: 2037-12-19
Also published as: CN111659627B; TWI667482B; CN108325864A; TW201830040A; CN111659627A; KR20180082754A

Abstract

The present invention relates to a pressurizing device for a test handler that supports a test of a semiconductor device. In the pressing device for a test handler of the present invention, the pressing plate fixes the matching plate such that one side end of the matching plate has a first distance from the corresponding opposing surface of the first guide rail and the other side end of the matching plate has a second distance from the corresponding opposing surface of the second guide rail, or fixes the matching plate such that a virtual reference line parallel to the attaching/detaching direction of the matching plate and passing through the matching plate becomes a reference for thermal expansion or thermal contraction of the matching plate, and the shortest distance between the virtual reference line and the center point of the matching plate is smaller than the shortest distance between the virtual reference line and each of the both side ends of the matching plate, or the virtual reference line passes through the center point. According to the present invention, accurate electrical connection between the semiconductor device and the tester can be ensured, and damage to the test socket, the interposer, the semiconductor device, and the like can be prevented.

Description

Pressure device for test sorting machine

Technical Field

The present invention relates to a pressurizing device for a test handler, and more particularly, to a pressurizing device for a test handler capable of coping with thermal expansion or contraction.

Background

After being tested by the tester, a plurality of produced semiconductor devices are divided into good products and defective products, and only the good products are delivered.

The present invention relates to a technique for coping with thermal expansion or thermal contraction in high-temperature testing or low-temperature testing. The techniques for testing the sorting machine related to this invention are disclosed in korean laid-open patent nos. 10-2013-0079701, 10-2014-0147902, and korean granted patent No. 10-0709114, etc.

The test handler includes a loading device, a soak chamber (soak chamber), a test chamber, a pressurizing device, a desoak chamber (desoak chamber), and an unloading device.

The loading device moves a plurality of semiconductor devices to be tested, which are loaded on the customer tray, to the test tray located at the loading position.

The soak chamber is used to apply a thermal stimulus to a plurality of semiconductor devices loaded on the test tray from the loading position. The produced semiconductor device can be tested at normal temperature, but a thermally severe use environment needs to be considered, and therefore, testing is performed in a high-temperature or low-temperature state in most cases. A soaking chamber is provided for applying such thermal stimuli.

The test chamber provides a space capable of testing a plurality of semiconductor devices loaded on the test tray passing through the soaking chamber. To this end, the tester is coupled to the test chamber side.

The pressurizing device pressurizes the plurality of semiconductor devices of the test tray located at the test position in the test chamber to the test socket side of the tester so that the semiconductor devices can be electrically connected to the test socket. The present invention is germane to such a pressurizing device and will therefore be described in more detail with reference to fig. 1.

The heat removal chamber is used to remove thermal stimuli to the semiconductor devices loaded on the test tray from the test chamber. Therefore, the semiconductor device from which the thermal stimulus is removed in the heat removal chamber can be appropriately unloaded by the unloading device.

The unloading device unloads the plurality of semiconductor devices from the test tray entered into the unloading position and moves toward an empty customer tray.

For reference, the test tray has a plurality of inserts for placing the semiconductor devices thereon, and is moved along a closed circulation path passing through the loading position, the testing position, and the unloading position and connected to the loading position by a plurality of transfer devices. Wherein the insert is provided in a slightly movable manner, and accurate position setting is achieved between the semiconductor device and the test socket regardless of tolerance, thermal deformation, or the like.

On the other hand, the schematic side view of fig. 1 shows the operation in which the semiconductor device D is electrically connected to the test socket TS by the pressurizing device 100.

Fig. 1 (a) shows a state in which the semiconductor device D is released from the pressing, and fig. 1 (b) shows a state in which the semiconductor device D is pressed toward the TESTER (TESTER) by the pressing device 100 and the semiconductor device D is electrically connected to the test socket TS.

The pressing device 100 basically includes a matching plate 110, a pressing plate 120, a driving source 130, a first holding rail 141, and a second holding rail 142.

The matching board 110 presses the semiconductor device D loaded on the test tray TT toward the test socket TS of the TESTER (TESTER). For this purpose, the matching board 110 has a plurality of pushing portions 111 and a setting board 112.

The pressing portion 111 contacts the semiconductor device D during the pressing operation to press the semiconductor device D toward the test socket TS. Therefore, the number of the pressing portions 111 positioned on the matching plate 110 IS the same as the number of the plurality of interposers IS provided on the test tray TT and the number of the plurality of semiconductor devices D mounted on the plurality of interposers IS.

The installation plate 112 is provided with a plurality of pressing portions 111, an upper end TE portion as one side end portion of the installation plate 112 is gripped by the first gripping rail 141, and a lower end BE portion as the other side end portion thereof is gripped by the second gripping rail 142.

The pressing plate 120 is used to fixedly set the matching plate 110 and transmit the pressing power generated at the driving source 130 to the matching plate 120.

The driving source 130 moves the pressing plate 120 forward or backward, and finally moves the matching plate 110 fixed to the pressing plate 120 forward or backward in the direction opposite to the TESTER (TESTER) side. At this time, when the drive source 130 advances the matching plate 110, the semiconductor device D presses the semiconductor device D toward the test socket TS via the pressing portion 111 as shown in part (b) of fig. 1, and when the matching plate 110 is retreated, the pressure applied to the semiconductor device D via the pressing portion 111 is removed as shown in part (a) of fig. 1.

The first grip rail 141 grips the upper end TE portion of the matching plate 110, and the second grip rail 142 grips the lower end BE portion of the matching plate 110. The first holding rail 141 and the second holding rail 142 may also be named as guide rails to guide the movement of the matching plate 110 when the matching plate 110 is attached to and detached from the pressing plate 120.

On the other hand, since the semiconductor device D is required to be tested in a high-temperature or low-temperature environment, the metal matching plate 110 is thermally expanded or thermally contracted according to the test temperature environment. Therefore, the plurality of pressing portions 111 also move by a distance of thermal expansion or thermal contraction at each position. In this case, the pushing portion 111 moves to a position beyond the movement range amount of the interposer IS due to the difference in thermal deformation between the test tray TT and the matching plate 110, so that the pushing portion 111 may not accurately press the semiconductor device D. Also, the electrical connection between the semiconductor device D and the TESTER (TESTER) may be poor, and the test socket TS or the interposer IS or the semiconductor device D may be damaged. In particular, as the size of the semiconductor device D becomes small and the pitch between a plurality of terminals provided to the semiconductor device D also becomes small, such a problem becomes larger and more frequent. Therefore, it is necessary to reduce the rate of change in the position of the pressing portion 111 due to thermal deformation of the matching plate 110 as much as possible.

In general, since the position of the matching plate 110 needs to be accurately set, the alignment is performed with reference to either one of the two

gripping rails

141, 142. For example, as shown in fig. 1, in a vertical handler in which the semiconductor device D is electrically connected to a TESTER (TESTER) while the test tray TT stands vertically, the matching plate is aligned with reference to a second holding rail 142 that holds the lower end portion of the matching plate 110 by gravity. Therefore, as seen from enlarged parts a and B of fig. 1, the lower end (BE, the same as the lower end of the setting plate) of the matching plate 110 is in contact with the upper face (TF), which is the corresponding facing face of the second holding rail 142, and the upper end (TE, the same as the upper end of the setting plate) of the matching plate 110 is disposed in such a manner as to have several pitches G from the bottom face BF, which is the corresponding facing face of the first holding rail 141. Wherein the distance G between the upper end TE of the matching plate 110 and the bottom face BF of the first holding rail 141 is set in consideration of a difference in thermal deformation between the matching plate 110 and the pressing plate 120 at a high temperature.

However, as shown in fig. 1, if the lower end BE of the matching plate 110 is disposed in a state of being supported by the second holding rail 142, the thermal deformation reference line of the matching plate 110 becomes the lower end BE of the matching plate 110. Therefore, the amount of positional displacement of the upper end TE of the matching plate 110 due to thermal deformation is large, and thus, of course, the positional displacement of the pressing portion 111 adjacent to the upper end TE of the matching plate 110 is also large. Therefore, depending on various conditions such as the size of the matching plate 110 or the difference in thermal deformation between the test tray TT and the matching plate 110, the pushing portion 111 adjacent to the upper end TE of the matching plate 110 may exceed the movement allowable range of the insert IS. In this case, the above-mentioned problem based on thermal deformation is greater. Wherein, the thermal deformation reference line means a fixed line whose position is fixed when thermally deformed.

Therefore, the applicant of the present application proposed a technique of providing a thermal deformation reference line between two matching plates by korean patent application No. 10-2014-.

However, the conventional technique is designed to have a structure in which two matching plates are provided in correspondence with one test tray, and is suitably applicable when the widths of the two matching plates are adjusted to be small with reference to a reference line, but is difficult to be suitably applied when the widths of the two matching plates are adjusted to be large with reference to a reference line. The reason is that when the widths of the two matching plates are increased with reference to the reference line, the position of the pressing portion having a large distance from the reference line is changed greatly, and thus the above-mentioned problem remains.

Disclosure of Invention

Technical problem to be solved

The purpose of the present invention is to provide a technique for minimizing the change in the position of a pressing portion that moves the maximum position among a plurality of pressing portions of a matching plate during thermal expansion or thermal contraction.

Technical scheme for solving problems

A pressurizing device for a test handler according to a first embodiment of the present invention includes: a matching plate for electrically connecting the semiconductor device and the tester by pressing the semiconductor devices loaded on the test tray toward the test sockets of the tester; a pressurizing plate for fixedly arranging the matching plate and capable of moving forward or backward along the direction of pressurizing the semiconductor device; a driving source for moving the pressurizing plate forward or backward; a first guide rail for guiding one end of the matching plate when the matching plate is moved in an assembling and disassembling manner; and a second guide rail for guiding the other side end portion of the matching plate when the matching plate is moved to be attached and detached, wherein the pressing plate has at least one fixing unit for fixing the matching plate such that a first distance is provided between one side end of the matching plate and a corresponding facing surface of the first guide rail and a second distance is provided between the other side end of the matching plate and a corresponding facing surface of the second guide rail, and the matching plate has at least one corresponding unit corresponding to the at least one fixing unit and is fixedly installed on the pressing plate.

The pressure device for a test handler according to a second embodiment of the present invention includes a matching plate for pressing a plurality of semiconductor devices mounted on a test tray toward a plurality of test sockets of a tester to electrically connect the semiconductor devices and the tester; a pressurizing plate for fixedly arranging the matching plate and capable of moving forward or backward along the direction of pressurizing the semiconductor device; and a driving source for moving the pressing plate forward or backward, wherein the pressing plate includes at least one fixing unit for fixing the matching plate such that a virtual reference line, which is parallel to a mounting/dismounting movement direction of the matching plate and passes through the matching plate, becomes a reference for thermal expansion or thermal contraction of the matching plate, the matching plate includes at least one corresponding unit corresponding to the at least one fixing unit, and is fixedly installed in the pressing plate, and a shortest distance between the virtual reference line and a center point of the matching plate is smaller than a shortest distance between the virtual reference line and each of both side ends of the matching plate, or the virtual reference line passes through the center point.

The fixing means is a protruding pin, the corresponding means is an insertion groove into which the protruding pin is inserted, and the insertion groove is formed on a line through which the virtual reference line passes.

In the pressing device for a test handler according to the first or second embodiment, the fixing means may be a protruding pin, the corresponding means may be an insertion groove into which the protruding pin is inserted, and the protruding pin may protrude in a direction in which the matching plate is removed and moved so that any movement of the matching plate in a direction in which the semiconductor device is pressed is restricted.

In the pressing device for a test handler according to the first or second embodiment, the fixing means may be a first protrusion pin and a second protrusion pin, the corresponding means may be a first insertion groove into which the first protrusion pin is inserted and a second insertion groove into which the second protrusion pin is inserted, the first protrusion pin may protrude in a direction in which the semiconductor device is pressed, and the second protrusion pin may protrude in a direction in which the matching plate is removed and moved.

In the test handler of the first or second embodiment, the plurality of matching plates are provided, and when a pitch between a plurality of ends facing each other in the plurality of matching plates changes due to thermal expansion or thermal contraction, positions of the plurality of ends facing each other change. In this case, the plurality of matching boards correspond to one test tray 1:1, respectively.

Advantageous effects of the invention

According to the present invention, when thermal contraction or thermal expansion occurs, a positional change occurs at both ends of the matching plate, and thus the amount of positional change at both ends is smaller than that which may occur at the other side end when either side section is fixed. Thereby, the positional movement of the pressing portion causing the largest positional change can also occur within the movement range of the insert. Therefore, accurate electrical connection between the semiconductor device and the tester can be ensured, and the test socket, the interposer, the semiconductor device, and the like can be prevented from being damaged.

Drawings

Fig. 1 (a) and (b) are reference views for explaining a conventional test handler pressurizing device.

Fig. 2 is a conceptual plan view of a test handler to which the pressing device for a test handler of the present invention can be applied.

Fig. 3 is a perspective view of the pressurizing device for a test handler to which the apparatus of fig. 2 is applied.

Fig. 4 is a cut-away perspective view of a matching plate suitable for use in the pressurizing device for the test handler of fig. 3.

Fig. 5 is a reference view for explaining a first insertion groove formed at the matching board of fig. 4.

Fig. 6 is a reference view for explaining a second insertion groove formed at the matching board of fig. 4.

Fig. 7 is a front view of the matching sheet of fig. 4.

Fig. 8 is a reference diagram for explaining the present invention in the case where a plurality of matching plates are provided.

Fig. 9 is a cut-away perspective view of a pressing plate applied to the pressing device for the test handler of fig. 3.

Fig. 10 is a cross-sectional view for explaining the operational features of the present invention.

Fig. 11 is a reference diagram for explaining a preferred application example of the present invention.

Description of reference numerals

200: pressure device for test sorting machine

210: matching board

211: push part

212: setting board

212 a: first insertion groove

213: fixing member

213 a: second insertion groove

220: pressurizing plate

221: first protruding pin

222: second projecting pin

230: driving source

241: first guide rail

242: second guide rail

Detailed Description

Preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, and for the sake of simplicity of description, repetitive or substantially identical structural descriptions will be omitted or compressed as much as possible.

Brief description of the test handler

Fig. 2 is a conceptual plan view of a test handler TH to which a pressing device 200 for a test handler (hereinafter, simply referred to as a pressing device) according to the present invention can be applied.

The test handler TH includes a loading device LA, a soaking chamber SC, a test chamber TC, a pressurizing device 200, a heat removing chamber DC, and an unloading device UA.

The loading device LA moves a plurality of semiconductor devices to be tested loaded on the customer tray CT1 to the test tray located at the loading position LP.

The soaking chamber SC is used to apply thermal stimulus to the plurality of semiconductor devices loaded on the test tray TT from the loading position LP.

The test chamber TC provides a space capable of testing a plurality of semiconductor devices loaded on the test tray TT passing through the soaking chamber SC.

The pressurizing apparatus 200 pressurizes the plurality of semiconductor devices of the test tray TT located at the test position TP in the test chamber TC to the test socket side of the TESTER (TESTER) so that the semiconductor devices can be electrically connected to the test sockets. Such a pressurizing device has the features to be described in the present specification, and is therefore described in a catalog.

The heat removing chamber DC is used for removing the thermal stimulus to the semiconductor device loaded on the test tray TT from the test chamber TC

The unloading device UA unloads the plurality of semiconductor devices from the test tray TT which enters the unloading position UP and moves toward the empty customer tray CT 2.

Of course, the test tray TT moves along a closed circulation path passing through the loading position LP, the test position TP, and the unloading position UP and connected to the loading position LP.

For reference, the test handler TH of fig. 2 explained above is a vertical type handler in which the semiconductor device is electrically connected to a TESTER (TESTER) with the test tray standing in a vertical manner.

Description of the pressurizing device

Fig. 3 is a perspective view of a pressing device 200 applied to the test handler TH of fig. 2.

Referring to fig. 3, the pressing device 200 of the present invention includes a matching plate 210, a pressing plate 220, a driving source 230, a first guide rail 241, and a second guide rail 242.

The matching board 210 presses the semiconductor device loaded on the test tray TT toward the test socket side. For this purpose, the matching plate 210 has a plurality of pressing portions 211, an installation plate 212, and a fixing member 213 arranged in a matrix as shown in the sectional view of fig. 4.

The pressing portion 211 is in contact with the semiconductor device during the pressing operation to press the semiconductor device toward the test socket.

The installation plate 212 is provided with a plurality of pressing portions 211 in a matrix. The installation plate 212 is provided with a first insertion groove 212a, a handle hole 212b, a movement restriction hole 212c, and a movement restriction groove 212 d.

The first insertion groove 212a is located at a right side portion of the installation plate 212 and is formed to be open in the front-rear direction and the right-side direction as shown in fig. 5. Such a first insertion groove 212a may be divided into a guide portion GP, a set portion SP, and an excess portion RP, into which a first protrusion pin 221 positioned at a pressing plate 220 described later is inserted.

When the matching sheet 210 is disposed, the guide portion GP guides the movement of the horizontally moving matching sheet 210 in the vertical direction so that the matching sheet 210 is disposed at a set height. For this reason, the guide portion GP has a slope whose width is expanded as it goes to the right side direction, which is the direction in which the matching plate 210 device moves.

When the setting of the matching sheet 210 is finished, the setting part SP accurately sets the matching sheet 210 at the set height. Accordingly, the setting portion SP is formed in a horizontal form to prevent the matching plate 210 from vertically moving due to gravity. Such a set portion SP is required to have a length in which the first protrusion pin 221 can be located regardless of thermal expansion or thermal contraction at normal or low temperatures.

The excess portion RP is formed to be more extended in the left direction from the set portion SP in consideration of the length of the matching plate 210 that is thermally expanded due to high temperature after the setting.

In fig. 5, O1 is the center point of the first protrusion pin 221 at normal temperature, O2 is the center point of the first protrusion pin 221 at low temperature, and O3 is the center point of the first protrusion pin 221 at high temperature. For convenience of explanation and understanding in this example, the references for the partition guide portion GP, the set portion SP, and the excess portion RP are taken as the positions of the center points O1, O2, and O3.

For reference, the positions of the center points O1, O2, and O3 in fig. 5 and the description thereof are merely for describing the positional relationship between the first protrusion pin 221 and the first insertion groove 212a in the relative relationship between the first protrusion pin 221 and the first insertion groove 212 a. That is, as shown in fig. 5, the position of the insertion groove 212a is stopped and the first protrusion pin 221 is moved in a manner shown merely for clarity of description and understanding, and both the first insertion groove 212a and the first protrusion pin 221 are actually moved due to thermal deformation. At this time, the position of the first insertion groove 212a of the matching plate 210 made of a metal is moved more than the position of the first protrusion pin 221. Therefore, the amount of movement of the first protrusion pin 221 is small compared to the first insertion groove 212a, and if the thermal deformation coefficient of the pressing plate is theoretically 0, the position of the first protrusion pin can be fixed, in which case O1 ═ O2 ═ O3. Therefore, it is preferable to represent that the first protrusion pin 221 is fixed and the first insertion groove 212a is moved, but in order to clearly explain the guide portion GP, the set portion SP, and the surplus portion RP by fig. 5, it is represented that the first protrusion pin 221 is moved in fig. 5.

A handle hole 212b is formed in a left side portion of the installation plate 212 for an operator to hold the matching plate 210 with a hand.

The movement limiting hole 212c is located on the left side of the installation plate 212 and on the right side of the handle hole 212b, has a long length in the vertical direction and a narrow width in the horizontal direction, and is formed to penetrate in the front-rear direction. Such movement limiting holes 212c are used to eliminate the possibility that the matching plate 210 loaded on the pressing plate 220 is removed in the left direction due to an operational impact or an unexpected external force. Of course, a plurality of movement limiting holes 212c may be provided according to an embodiment.

The movement limiting groove 212d is formed at a lower portion of the set plate 212, and serves to prevent the matching plate 210 from being arbitrarily removed when an operation impact or an unexpected external force is applied thereto, like the movement limiting hole 212 c. Of course, the movement limiting groove 212d is used as a position setting means for setting the position of the matching plate 210 when the matching plate 210 is attached and detached, and a plurality of grooves may be provided according to the embodiment.

The fixing member 213 is positioned at the left center portion of the installation plate 212, is positioned slightly to the right of the handle hole 212b, protrudes toward the pressing plate 220 positioned at the rear, and has a second insertion groove 213a formed at a portion protruding rearward.

As shown in the cross-sectional view of fig. 6, second insertion groove 213a is formed by fixing member 213 penetrating in the direction (the left-right direction in the drawing) in which matching plate 210 is attached and detached. The second insertion groove 213a may be divided into a guide portion GP1 and a set portion SP1 into which the second protrusion pin 222 positioned at the pressing plate 220 described later is inserted. The guide portion GP1 of the second insertion groove 213a also has a slope whose width is expanded toward the right. Among them, the roles of the guide portion GP1 and the set portion SP1 of the second insertion groove 213a are the same as those of the guide portion GP and the set portion SP in the first insertion groove 212a, and thus, the description is omitted.

Fig. 7 is a front view of the matching plate 210, and is a reference view for explaining formation positions of the first insertion groove 212a and the second insertion groove 213 a.

A virtual reference line SL is drawn horizontally in the left-right direction, which is a direction in which matching plate 210 is attached and detached, through center point CP of matching plate 210, and first insertion groove 212a and second insertion groove 213a are located on a line through which virtual reference line SL passes when viewed from the front. Since the matching plate 210 is fixed to the pressing plate 220 by the first insertion groove 212a and the second insertion groove 213a, when thermal expansion or thermal contraction occurs, the position where the virtual reference line SL passes is fixed without moving in the vertical direction, and the upper portion and the lower portion move in the vertical direction according to the degree of thermal expansion or thermal contraction, respectively, with the virtual reference line SL as a reference. That is, since the thermal expansion or contraction in the vertical direction of the matching plate 210 is formed using the virtual reference line SL passing through the center point CP as a fixed line, the shortest distances S01 and S02 from the center point CP to the both ends TE and BE are the same, and thus the amount of positional change between the upper end TE and the lower end BE of the matching plate 210 is only 1/2 (half) of the amount of change in the entire vertical length of the matching plate 210.

On the other hand, when it is necessary to consider another case where a plurality of matching plates 210 are provided, as shown in fig. 8, the virtual reference lines SL1 and SL2 may pass through positions inclined upward or downward from the center points CP1 and CP2, respectively. In this case, it is also necessary to reduce the amount of positional change of the upper end TE1 and the lower end BE1 of the upper matching plate 210T and the upper end TE2 and the lower end BE2 of the lower matching plate 210B as much as possible. Therefore, it is necessary to change the positions of all the upper ends TE1, TE2 and lower ends BE1, BE2 of the upper and

lower matching plates

210T, 210B. At this time, it is preferable that the shortest distance S10 between the center point CP1 of the upper matching plate 210T and the virtual reference line SL1 inclined to the upper side is smaller than the shortest distance S11 between the virtual reference line SL1 and the upper end TE1 of the upper matching plate 210T, so that the amount of positional change of the lower end BE1 of the upper matching plate 210T can BE minimized. Also, it is preferable that the shortest distance S20 between the center point CP2 of the lower matching plate 210B and the virtual reference line SL2 is smaller than the shortest distance S21 between the virtual reference line SL2 and the lower end BE2 of the lower matching plate 210B, so that the amount of positional change of the upper end TE2 of the lower matching plate 210B can BE minimized. Of course, the shortest distance S10 between the center point CP1 of the upper matching plate 210T and the virtual reference line SL1 is smaller than the shortest distance S12 between the virtual reference line SL1 and the lower end BE1 of the upper matching plate 210T, and the shortest distance S20 between the center point CP2 of the lower matching plate 210B and the virtual reference line SL2 is smaller than the shortest distance S22 between the virtual reference line SL2 and the upper end TE2 of the lower matching plate 210B. Of course, as shown in fig. 8, when a plurality of matching

plates

210T and 210B are provided, it is preferable that the maximum variation value is minimized by making the position variation amounts of the upper ends TE1 and TE2 and the lower ends BE1 and BE2 of the

matching plates

210T and 210B the same by making the plurality of virtual reference lines SL1 and SL2 pass through the center points CP1 and CP2 of the

matching plates

210T and 210B, respectively.

The pressing plate 220 is used to fixedly set the matching plate 210 and transmit power generated at the driving source 230 to the matching plate 210. To this end, as shown in the partially exploded view of fig. 9, the pressurizing plate 220 includes a first protrusion pin 221, a second protrusion pin 222, a movement limiter 223, and a positioning bead 224(ball plunger).

The first protrusion pin 221 is located at a right side portion of the pressing plate 220 and protrudes forward in a direction in which the pressing plate 220 moves during pressing operation. As described above, such a first protrusion pin 221 is inserted into the first insertion groove 212 a.

The second protrusion pin 222 is located at a left side portion of the pressurizing plate 220. Such a second protrusion pin 222 is formed to protrude in the left direction of the direction in which the matching plate 210 is removed and moved during the replacement work of the matching plate 210, corresponding to the forming direction of the second insertion groove 213 a. Therefore, when the second protrusion pin 222 is inserted into the second insertion groove 213a, the second protrusion pin 222 prevents the matching plate 210 from being arbitrarily moved or removed forward in a direction in which the pressing plate 220 can be moved forward or backward in the front-rear direction.

In the case where the matching plate 210 receives an external force such as an operation impact, the movement limiter 223 limits the movement of the matching plate 210 in the left direction. For this, the movement limiter 223 has a limiting plate 223a that moves in the front-rear direction.

The restriction plate 223a is a unit for restricting the removal of the matching plate 210 in the left direction. When the restricting plate 223a moves forward, it is inserted into the movement restricting hole 212c to restrict the movement of the matching plate 210 in the left-right direction, and when the restricting plate 223a moves backward, it comes out of the movement restricting hole 212c to release the restriction, so that the matching plate 210 can be removed in the left-right direction.

The positioning beads 224 are supported by springs so that the beads B inserted into the movement limiting grooves 212d move forward or backward, and thus the beads B move backward when an external force of a predetermined degree or more is generated, and the beads B keep moving forward when no external force is applied. Therefore, when the matching plate 210 moves from the left direction to the right direction by an external force applied by an operator or the like during the mounting work, the beads B retreat to allow the matching plate 210 to move to the right direction by being guided by the

guide rails

241 and 242. When the beads B are inserted into the movement restricting grooves 212d, the operator or the like does not apply any external force, and therefore the beads B restrict the matching plate 210 from moving in any of the left and right directions. The positioning beads 224 in this respect contribute to the setting of the mounting end position of the matching plate 210.

As described above, the first protrusion pin 221, the second protrusion pin 222, the movement limiter 223, and the positioning bead 224 of the pressing plate 220 function as fixing units for fixedly disposing the matching plate 210, and the first insertion groove 212a, the second insertion groove 213a, the movement limiting hole 212c, and the movement limiting groove 212d of the matching plate 210 function as corresponding units corresponding to the respective fixing units.

The driving source 230 moves the pressing plate 220 forward or backward in the front-rear direction, and finally moves the matching plate 210 fixedly installed on the pressing plate 220 forward in the TESTER (TESTER) -side direction or backward in the opposite direction. Of course, when the driving source 230 moves the matching plate 210 forward, the semiconductor device is pressed toward the test socket by the pressing portion 211, and when the matching plate 210 moves backward, the pressure applied to the semiconductor device by the pressing portion 211 is removed.

The first rail 241 and the second rail 242 are used to guide the attachment and detachment movement of the matching plate 210.

The first guide rail 241 guides an upper end TE portion as one side end of the matching plate 210, and the second guide rail 242 guides a lower end BE portion as the other side end of the matching plate 210.

As can BE seen from fig. 10, when the fixing and mounting of the matching plate 210 to the pressing plate 220 are completed by the plurality of fixing units and the plurality of corresponding units, the upper end TE of the matching plate 210 maintains a first distance G1 from the bottom face BF, which is the corresponding facing surface of the first guide rail 241, and the lower end BE of the matching plate 210 maintains a second distance G2 from the upper face TF, which is the corresponding facing surface of the second guide rail 242. That is, the upper end TE and the lower end BE of the matching plate 210 are spaced apart from the corresponding facing surfaces of the first guide rail 241 and the second guide rail 242, respectively. Therefore, when thermal deformation occurs, the upper end TE and the lower end BE of the matching plate 210 can BE changed in position by using the virtual reference line SL as a fixed line. In the present embodiment, it is considered that the amount of positional change of the upper end TE and the lower end BE of the matching plate 210 is the same by passing a virtual reference line SL horizontal in the left-right direction through the center point CP of the matching plate 210, and therefore, it is preferable that the first pitch G1 and the second pitch G2 are also the same.

According to the present invention as described above, when the matching plate 210 is mounted, the upper end TE portion and the lower end BE portion of the matching plate 210 are guided by the first guide rail 241 and the second guide rail 242, respectively, to move in the left direction to the right direction. The operator confirms the accurate installation position of the matching plate 210 by the second restriction force due to the insertion of the bead B of the positioning bead 224 into the movement restriction groove 212d after the first restriction force transmitted from the matching plate 210 by the action of the positioning bead 224. Wherein the first limiting force is a force to which the match plate 210 is subjected in a state where one side of the match plate 210 is first contacted with the bead B of the positioning bead 224, and the operator pushes the match plate 210 against the force. The second limiting force is a force applied to the matching plate 210 as the bead B is inserted into the movement limiting groove 212 d. Next, when the operator further pushes the matching plate 210, the lower end BE of the matching plate 210 is spaced apart from the upper surface TF, which is the corresponding facing surface of the second guide rail 242, by the vertical displacement amount of the rising guide portions GP and GP1 of the matching plate 210 due to the first protruding pin 221, the first insertion groove 212a, the second protruding pin 222, and the second insertion groove 213 a. Of course, the upper end TE of the matching plate 210 is spaced apart from the bottom face BF, which is the corresponding opposing face of the first guide rail 241. When the matching plate 210 is mounted in this manner and thereafter thermally expands or contracts due to a high temperature or a low temperature, the upper end TE and the lower end BE of the matching plate 210 are displaced in the vertical direction with respect to the virtual reference line SL. Further, since the positional shift of the upper end TE and the lower end BE does not exceed the shift range of the interposer IS provided on the test tray TT unlike the conventional one, the reliability of the electrical connection between the semiconductor device and the tester can BE ensured, and the damage of various components can BE prevented.

For reference, fig. 11 shows the correspondence between the matching

boards

210T, 210B and the test tray TT in the case where two matching

boards

210T, 210B are applied. One matching board 210T/210B corresponds to one test tray TT1:1, respectively. As described above, since one

matching plate

210T, 210B corresponds to one test tray TT, the present invention can be suitably applied to a case where the

matching plates

210T, 210B have a wide area and a large positional shift of the edge portion occurs due to thermal deformation. As can BE seen from the enlarged view, the upper and lower ends TE1/TE2, BE1/BE2 of each matching plate 210T/210B are spaced from the corresponding facing surfaces BF1/BF2, TF1/TF2 of the guide rails GR1 to GR 4. Of course, the present invention is arbitrarily extended to a case where a plurality of matching boards 210 correspond to a plurality of test trays TT.

On the other hand, the above embodiment has been described taking the case of the vertical test handler TH as an example, but the pressing device 200 according to the present invention may be applied to a horizontal test handler in which the semiconductor device is electrically connected to the tester in a state where the test tray TT is horizontal.

As described above, the present invention has been specifically described with reference to the embodiments shown in the drawings, however, the above embodiments are merely illustrative of the preferred embodiments of the present invention, and it should not be understood that the present invention is limited to the above embodiments, and the scope of the present invention should be understood from the scope of the claims and the equivalent scope thereof.

Claims

1. A pressurizing device for a test handler, comprising:

a matching plate for electrically connecting the semiconductor device and the tester by pressing the semiconductor devices loaded on the test tray toward the test sockets of the tester;

a pressing plate for fixedly mounting the matching plate and capable of moving forward or backward in a direction of pressing the semiconductor device;

a driving source for moving the pressurizing plate forward or backward;

a first guide rail for guiding one end of the matching plate when the matching plate is moved in an assembling and disassembling manner; and

a second guide rail for guiding the other side end portion of the matching plate when the matching plate is moved to be attached and detached,

the pressing plate has at least one fixing unit that fixes the matching plate such that one side end of the matching plate has a first distance from a corresponding facing surface of the first rail and the other side end of the matching plate has a second distance from a corresponding facing surface of the second rail,

the matching plate has at least one corresponding unit corresponding to the at least one fixing unit and is fixedly arranged on the pressurizing plate,

the fixing unit is a first protrusion pin and a second protrusion pin,

the corresponding unit is a first insertion groove into which the first protruding pin is inserted and a second insertion groove into which the second protruding pin is inserted,

the first projecting pin projects in a direction of pressing the semiconductor device, and the second projecting pin projects in a direction of removing the matching plate, so that arbitrary movement of the matching plate in the direction of pressing the semiconductor device is restricted.

2. A pressurizing device for a test handler, comprising:

a driving source for moving the pressing plate forward or backward,

the pressing plate has at least one fixing unit that fixes the matching plate such that a virtual reference line that is parallel to a direction of attaching and detaching movement of the matching plate and passes through the matching plate becomes a reference of thermal expansion or thermal contraction of the matching plate,

the shortest distance between the virtual reference line and the center point of the matching plate is smaller than the shortest distance between the virtual reference line and each of both side ends of the matching plate, or the virtual reference line passes through the center point,

the fixing unit is a protruding pin,

the corresponding unit is an insertion groove into which the protruding pin is inserted,

the insertion groove is formed on a line through which the virtual reference line passes.

3. The pressing device for a test handler according to claim 2,

the protruding pin protrudes in the direction of removing the matching plate, so that the matching plate is restricted from moving arbitrarily in the direction of pressing the semiconductor device.

4. The pressing device for a test handler according to claim 2,

the protruding pins are a first protruding pin and a second protruding pin,

the insertion groove is a first insertion groove into which the first protrusion pin is inserted and a second insertion groove into which the second protrusion pin is inserted,

the first projecting pin projects in a direction of pressing the semiconductor device, and the second projecting pin projects in a direction of removing the matching plate.

5. The pressurizing apparatus for a test handler according to claim 1 or 2,

the matching plate is provided with a plurality of matching plates,

in the plurality of matching plates, when the distance between the ends facing each other changes due to thermal expansion or thermal contraction, the positions of the ends facing each other change.

6. The pressing device for a test handler of claim 5, wherein a plurality of the matching plates correspond to one test tray 1:1, respectively.