CN108321310A - The manufacturing system of organic light emitting diode device - Google Patents
The manufacturing system of organic light emitting diode device Download PDFInfo
- Publication number
- CN108321310A CN108321310A CN201810090616.0A CN201810090616A CN108321310A CN 108321310 A CN108321310 A CN 108321310A CN 201810090616 A CN201810090616 A CN 201810090616A CN 108321310 A CN108321310 A CN 108321310A
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- China
- Prior art keywords
- substrate
- transmission chamber
- manufacturing system
- light emitting
- emitting diode
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The present invention provides a kind of manufacturing systems of organic light emitting diode device comprising transmission chamber and the processing chamber being connected with the transmission chamber and intermediate cavity, the intermediate cavity are operable to carry out the transmission of substrate.The manufacturing system further includes in the transmission chamber and rotatable manipulator, the indoor substrate of intermediate cavity described in the manipulator Electrostatic Absorption simultaneously rotates 180 ° after being returned to the transmission chamber, to drive the substrate to overturn 180 ° in the transmission chamber, the effect of to reach upset substrate.
Description
Technical field
The present invention relates to a kind of manufacturing systems of organic light emitting diode device.
Background technology
Organic Light Emitting Diode (OLED) device in the production process, can be related to being deposited and encapsulating Liang Ge workshop sections, but this
Liang Ge workshop sections require difference, vapor deposition workshop section requirement substrate to require substrate direction upwards towards workshop section downwards, is encapsulated orientation substrate,
This requires from vapor deposition section enter encapsulation section have to there are one substrate overturn link.
As shown in Figure 1, being by the processing method that substrate 100 is overturn at present：It is arranged one in vapor deposition section or encapsulation section
Chamber 200 is overturn, with the rotary movement of the completing substrate 100 in overturning chamber 200.But using overturning chamber 200 by substrate
100 modes overturn can be such that productive temp extends, and overturn chamber 200 and can occupy the position of a processing chamber 300,
Improve production equipment cost.
In view of this, being improved it is necessory to the manufacturing system to existing OLED device, to solve the above problems.
Invention content
The purpose of the present invention is to provide a kind of manufacturing system of organic light emitting diode device, which can pass
Upset substrate while sending substrate, to which the link into overturning chamber be omitted.
To achieve the above object, the present invention provides a kind of manufacturing systems of organic light emitting diode device comprising passes
Defeated chamber and the processing chamber being connected with the transmission chamber and intermediate cavity, the intermediate cavity are operable to carry out substrate
Transmission, the manufacturing system further includes being located in the transmission chamber and rotatable manipulator, the manipulator electrostatic are inhaled
The indoor substrate of the attached intermediate cavity simultaneously rotates 180 ° after being returned to the transmission chamber, to drive the substrate in the biography
180 ° of overturning in defeated chamber.
As a further improvement on the present invention, the transmission chamber includes the roof being oppositely arranged and bottom wall and sets relatively
The left and right sides wall set, the distance between the roof and bottom wall and the distance between left and right sides wall are all higher than the substrate
Length, to facilitate the substrate to overturn 180 ° in the transmission chamber.
As a further improvement on the present invention, the hexagonal setting of the transmission chamber, the opposite of the transmission chamber set
The both sides set are separately connected an intermediate cavity, other four side of the transmission chamber respectively with four processing chamber phases
Even.
As a further improvement on the present invention, the manipulator is operable in the intermediate cavity and the transmission chamber
Between and the processing chamber and the transmission chamber between transmit the substrate, the manipulator includes lever arm and fixation
Arm, the substrate Electrostatic Absorption is on the fixed arm.
As a further improvement on the present invention, the end of the fixed arm is equipped with Electrostatic Absorption disk, described in Electrostatic Absorption
Substrate.
As a further improvement on the present invention, the center position in the transmission chamber is arranged in the manipulator, described
Lever arm includes the first lever arm and the second lever arm of movable connection, the end of the fixed arm and second lever arm
It is connected, to drive the fixed arm to enter or exit the intermediate cavity and the processing chamber when stretching the lever arm.
As a further improvement on the present invention, the center for defining the transmission chamber is the origin of the manipulator
Position, when the substrate is located at the intermediate cavity, the tie point present position for defining the fixed arm and the second lever arm is
Work point, and the tie point of the fixed arm and the second lever arm is dynamic from work point towards origin displacement, and reaches origin
Behind position, substrate rotates 180 ° described in the machinery hand-motion.
As a further improvement on the present invention, the tie point of the fixed arm and the second lever arm is former from work point direction
When point moves, the fixed arm and substrate in only the horizontal direction on be subjected to displacement.
As a further improvement on the present invention, when the tie point of the fixed arm and the second lever arm is located at work point
When, the lever arm is in integrally V-shape, when the tie point of the fixed arm and the second lever arm is located at origin position, the work
Swing arm is in integrally "-" type and vertical with the fixed arm.
As a further improvement on the present invention, the manipulator can 360 ° of rotations.
The beneficial effects of the invention are as follows：The manufacturing system of the organic light emitting diode device of the present invention, by the biography
The rotatable manipulator of setting in defeated chamber, so as to using substrate described in the manipulator Electrostatic Absorption and described in being returned to
180 ° are rotated after transmission chamber, to drive the substrate to overturn 180 °, and then the effect of reach upset substrate.
Description of the drawings
Fig. 1 is that current substrate overturns mode structure chart.
Fig. 2 is the structural schematic diagram when substrate is located at intermediate cavity in the present invention.
Absolute construction schematic diagram when Fig. 3 is manipulator Electrostatic Absorption substrate in Fig. 2.
Fig. 4 is the structural schematic diagram when substrate is located at transmission chamber in the present invention.
Fig. 5 is the structural schematic diagram before substrate overturning in the present invention.
Fig. 6 is the structural schematic diagram after substrate overturning in the present invention.
Specific implementation mode
To make the objectives, technical solutions, and advantages of the present invention clearer, right in the following with reference to the drawings and specific embodiments
The present invention is described in detail.
It please refers to shown in Fig. 2, present invention is disclosed a kind of manufacturing system of Organic Light Emitting Diode (OLED) device, packets
Include transmission chamber 10 and the processing chamber being connected with the transmission chamber 10 11 and intermediate cavity 12.Because of the making of OLED device
Workshop section include it is very much (such as：Vapor deposition and encapsulation), therefore corresponding manufacturing system is also more complex, including multiple transmission chambers 10 and company
The intermediate cavity 12 of two neighboring transmission chamber 10 is connect, each transmission chamber 10 is also respectively connected with multiple processing chambers 11, with right
Substrate 13 carries out many more manipulations (including vapor deposition, encapsulation, coating etc.).
The manufacturing system of the present invention can be used for encapsulating workshop section, it can also be used to workshop section or other workshop sections be deposited, not limited in this
System.Following description part will be described in detail the manufacturing system of the present invention for encapsulating workshop section.
It is provided with manipulator 14 in the transmission chamber 10, the substrate 13 being located in the intermediate cavity 12 (is steamed
Substrate 13 after the completion of plating) it is sent to corresponding processing chamber 11, then it is packaged.It should be noted that：Substrate 13 is complete
It after vapor deposition, can first be transferred into intermediate cavity 12, phase is then sent to by the manipulator 14 in another transmission chamber 10 again
The processing chamber 11 answered, to complete corresponding operation, thus the intermediate cavity 12 is operable to carry out the transmission of substrate 13.
The manipulator 14 be designed as be located at the transmission chamber 10 in and it is rotatable, to complete be deposited after, can profit
Substrate 13 in the intermediate cavity 12 described in 14 Electrostatic Absorption of the manipulator simultaneously rotates after being returned to the transmission chamber 10
180 °, and then drive the substrate 13 180 ° of overturning in the transmission chamber 10.After the completion of the substrate 13 is overturn, the machine
The substrate 13 is sent in other processing chambers 11 by tool hand 14 again, to carry out subsequent encapsulation operation.It is described in the present invention
Manipulator 14 can 360 ° of rotations.The manufacturing system further includes the control system for controlling the rotation of the manipulator 14, described
Control system is combined with computer, to realize automatically controlling to the manipulator 14.
The transmission chamber 10 includes the roof (not shown) being oppositely arranged and bottom wall (not shown) and is oppositely arranged
Left and right sides wall (not shown), the distance between the roof and bottom wall and the distance between left and right sides wall are all higher than described
The length of substrate 13, to facilitate 180 ° of the overturning in the transmission chamber 10 of the substrate 13.In the present invention, the transmission chamber
10 hexagonal settings, and the both sides of the transmission chamber 10 being oppositely arranged are separately connected an intermediate cavity 12, institute
Other four side for stating transmission chamber 10 is connected with four processing chambers 11 respectively, to be packaged operation to the substrate 13.
Certainly, in other embodiments, quadrangularly, octagon or other shapes can be also arranged in the transmission chamber 10 according to actual needs
Shape, as long as disclosure satisfy that the making of OLED device.
Shown in Fig. 3 to Fig. 5, the manipulator 14 is operable in the intermediate cavity 12 and the transmission chamber
The substrate 13 is transmitted between 10 and between the processing chamber 11 and the transmission chamber 10, the manipulator 14 includes activity
Arm 141 and fixed arm 142,13 Electrostatic Absorption of the substrate is on the fixed arm 142, so as to vertically into the intermediate cavity
12 and the processing chamber 11.It should be noted that：" vertically into " herein is relative to the corresponding intermediate cavity 12
Or for the open side of the processing chamber 11, the fixed arm 142 drives the substrate 13 vertically into chamber.
The end of the fixed arm 142 is equipped with Electrostatic Absorption disk 143, with substrate 13 described in Electrostatic Absorption.Specifically, institute
The end for stating fixed arm 142 is equipped with two absorption bars 144 being mutually parallel, so that the fixed arm 142 is substantially set in Y types
It sets, the Electrostatic Absorption disk 143 is arranged in the lower section of two absorption bars 144, to carry out electrostatic suction to the substrate 13
It is attached.
Shown in Fig. 2 to Fig. 4, the center position in the transmission chamber 10 is arranged in the manipulator 14, described
Lever arm 141 includes the first lever arm 145 and the second lever arm 146 of movable connection, the fixed arm 142 and described second
The end of lever arm 146 is connected, to drive the fixed arm 142 and the substrate 13 to enter when stretching the lever arm 141
Or exit the intermediate cavity 12 and the processing chamber 11.
The center for defining the transmission chamber 10 is the origin position (as shown in Figure 4) of the manipulator 14, when described
When substrate 13 is located at the intermediate cavity 12, the present positions tie point a of the fixed arm 142 and the second lever arm 146 are defined
For work point (as shown in Figure 2), because vapor deposition workshop section require substrate 13 direction downwards, encapsulation workshop section requirement 13 direction of substrate to
On, therefore before being packaged to substrate 13, the tie point a can be dynamic from work point towards origin displacement, and reaches
Behind origin position, the manipulator 14 drives the substrate 13 to rotate 180 °, to change the direction of the substrate 13, and then is suitable for
Encapsulate workshop section.
When the tie point a is moved from work point towards origin displacement, the fixed arm 142 and substrate 13 are only in level
It is subjected to displacement on direction；Only after the tie point a returns to origin position, the manipulator 14 can just drive the fixed arm
142 and the substrate 13 overturn.
When the tie point a is located at work point, the whole lever arm 141 is in V-shape, when described tie point a
When origin position, the lever arm 141 is whole in "-" type and vertical with the fixed arm 142.
It please refers to shown in Fig. 2 and fig. 4 to fig. 6, the overturning step of the substrate 13 is：First, the manipulator 14 stretches into
In the intermediate cavity 12 and Electrostatic Absorption described in substrate 13, at this point, the connection of the fixed arm 142 and the second lever arm 146
Point a is located at work point；Then, the manipulator 14 is returned in the transmission chamber 10 with the substrate 13 and makes institute
The tie point a for stating fixed arm 142 and the second lever arm 146 is located at origin position；Finally, the manipulator 14 rotates 180 °, with band
The dynamic substrate 13 overturns 180 °.
In conclusion the manufacturing system of Organic Light Emitting Diode (OLED) device of the present invention, by the transmission cavity
The rotatable manipulator 14 of setting in room 10, while the inner space height of the transmission chamber 10 is improved, so as to utilize
Substrate 13 described in 14 Electrostatic Absorption of the manipulator simultaneously rotates 180 ° after being returned to the transmission chamber 10, to drive the base
Plate 13 overturns 180 °, and then the effect of reach upset substrate 13.Compared to the prior art, the present invention is without being separately provided a work
Skill chamber improves the utilization rate of transmission chamber 10, while also saving productive temp time, reducing life as overturning chamber
Produce equipment cost.
The above examples are only used to illustrate the technical scheme of the present invention and are not limiting, although with reference to preferred embodiment to this hair
It is bright to be described in detail, it will be understood by those of ordinary skill in the art that, it can modify to technical scheme of the present invention
Or equivalent replacement, without departing from the spirit of the technical scheme of the invention and range.
Claims (10)
1. a kind of manufacturing system of organic light emitting diode device, including transmission chamber and the work that is connected with the transmission chamber
Skill chamber and intermediate cavity, the intermediate cavity are operable to carry out the transmission of substrate, it is characterised in that：The manufacturing system is also
Including being located in the transmission chamber and rotatable manipulator, the indoor substrate of intermediate cavity described in the manipulator Electrostatic Absorption
And 180 ° are rotated after being returned to the transmission chamber, to drive the substrate to overturn 180 ° in the transmission chamber.
2. the manufacturing system of organic light emitting diode device according to claim 1, it is characterised in that：The transmission chamber
Including the roof being oppositely arranged and bottom wall and the left and right sides wall being oppositely arranged, the distance between the roof and bottom wall and
The distance between left and right sides wall is all higher than the length of the substrate, to facilitate the substrate to be overturn in the transmission chamber
180°。
3. the manufacturing system of organic light emitting diode device according to claim 2, it is characterised in that：The transmission chamber
The both sides of hexagonal setting, the transmission chamber being oppositely arranged are separately connected an intermediate cavity, the transmission cavity
Other four side of room is connected with four processing chambers respectively.
4. the manufacturing system of organic light emitting diode device according to claim 1, it is characterised in that：The manipulator can
Operation between the intermediate cavity and the transmission chamber and between the processing chamber and the transmission chamber to transmit institute
Substrate is stated, the manipulator includes lever arm and fixed arm, and the substrate Electrostatic Absorption is on the fixed arm.
5. the manufacturing system of organic light emitting diode device according to claim 4, it is characterised in that：The fixed arm
End is equipped with Electrostatic Absorption disk, with substrate described in Electrostatic Absorption.
6. the manufacturing system of organic light emitting diode device according to claim 4, it is characterised in that：The manipulator is set
The center position in the transmission chamber is set, the lever arm includes the first lever arm and the second activity of movable connection
Arm, the fixed arm are connected with the end of second lever arm, with stretch the lever arm when drive the fixed arm into
Enter or exit the intermediate cavity and the processing chamber.
7. the manufacturing system of organic light emitting diode device according to claim 6, it is characterised in that：Define the transmission
The center of chamber is that the origin position of the manipulator defines the fixation when the substrate is located at the intermediate cavity
The tie point present position of arm and the second lever arm is work point, the tie point work certainly of the fixed arm and the second lever arm
Point is dynamic towards origin displacement, and after reaching origin position, and substrate rotates 180 ° described in the machinery hand-motion.
8. the manufacturing system of organic light emitting diode device according to claim 7, it is characterised in that：The fixed arm with
When the tie point of second lever arm is moved from work point towards origin displacement, the fixed arm and substrate are above sent out in only the horizontal direction
Raw displacement.
9. the manufacturing system of organic light emitting diode device according to claim 7, it is characterised in that：When the fixed arm
When being located at work point with the tie point of the second lever arm, the lever arm is in integrally V-shape, when the fixed arm and second are lived
When the tie point of swing arm is located at origin position, the lever arm is in integrally "-" type and vertical with the fixed arm.
10. the manufacturing system of organic light emitting diode device according to claim 1, it is characterised in that：The manipulator
It can 360 ° of rotations.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810090616.0A CN108321310A (en) | 2018-01-30 | 2018-01-30 | The manufacturing system of organic light emitting diode device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810090616.0A CN108321310A (en) | 2018-01-30 | 2018-01-30 | The manufacturing system of organic light emitting diode device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108321310A true CN108321310A (en) | 2018-07-24 |
Family
ID=62888904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810090616.0A Pending CN108321310A (en) | 2018-01-30 | 2018-01-30 | The manufacturing system of organic light emitting diode device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108321310A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1712333A (en) * | 2004-06-22 | 2005-12-28 | 大日本网目版制造株式会社 | Substrate turning over apparatus and method, substrate transporting device and method, substrate processing apparatus and method |
| CN101488469A (en) * | 2009-02-13 | 2009-07-22 | 友达光电股份有限公司 | Turnover device and method for turning substrate over |
| CN202120988U (en) * | 2011-07-14 | 2012-01-18 | 四川虹视显示技术有限公司 | Substrate conveying equipment for forming passivation layer on OLED (Organic Light Emitting Diode) substrate |
| CN104377317A (en) * | 2013-08-16 | 2015-02-25 | 三星显示有限公司 | Thin film encapsulation layer manufacturing apparatus and method of manufacturing display apparatus using the same |
| CN104846330A (en) * | 2015-05-04 | 2015-08-19 | 北京欣奕华科技有限公司 | Evaporation device |
| CN105789090A (en) * | 2015-01-14 | 2016-07-20 | 株式会社Snu精密 | Cluster type evaporation device for manufacturing of OLED |
| CN206742197U (en) * | 2017-03-28 | 2017-12-12 | 雷仲礼 | Substrate turnover device and the base plate processing system comprising the substrate turnover device |
-
2018
- 2018-01-30 CN CN201810090616.0A patent/CN108321310A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1712333A (en) * | 2004-06-22 | 2005-12-28 | 大日本网目版制造株式会社 | Substrate turning over apparatus and method, substrate transporting device and method, substrate processing apparatus and method |
| CN101488469A (en) * | 2009-02-13 | 2009-07-22 | 友达光电股份有限公司 | Turnover device and method for turning substrate over |
| CN202120988U (en) * | 2011-07-14 | 2012-01-18 | 四川虹视显示技术有限公司 | Substrate conveying equipment for forming passivation layer on OLED (Organic Light Emitting Diode) substrate |
| CN104377317A (en) * | 2013-08-16 | 2015-02-25 | 三星显示有限公司 | Thin film encapsulation layer manufacturing apparatus and method of manufacturing display apparatus using the same |
| CN105789090A (en) * | 2015-01-14 | 2016-07-20 | 株式会社Snu精密 | Cluster type evaporation device for manufacturing of OLED |
| CN104846330A (en) * | 2015-05-04 | 2015-08-19 | 北京欣奕华科技有限公司 | Evaporation device |
| CN206742197U (en) * | 2017-03-28 | 2017-12-12 | 雷仲礼 | Substrate turnover device and the base plate processing system comprising the substrate turnover device |
Non-Patent Citations (2)
| Title |
|---|
| 张明文: "《工业机器人技术基础及应用》", 31 August 2017, 哈尔滨工业大学出版社 * |
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| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190529 Address after: 215300 Room No. 188 Chenfeng Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Kunshan Mengxian Electronic Technology Co., Ltd. Address before: Room D1-7179, 58 Fumin Branch, Hengsha Township, Chongming District, Shanghai, 202150 (Shanghai Hengtai Economic Development Zone) Applicant before: Shanghai Han Li Electronic Technology Co. Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180724 |