CN108299898A - The cured circuit board electronic Protection glues of UV - Google Patents
The cured circuit board electronic Protection glues of UV Download PDFInfo
- Publication number
- CN108299898A CN108299898A CN201610791424.3A CN201610791424A CN108299898A CN 108299898 A CN108299898 A CN 108299898A CN 201610791424 A CN201610791424 A CN 201610791424A CN 108299898 A CN108299898 A CN 108299898A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electronic protection
- board electronic
- protection glues
- glues
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/20—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
Abstract
The present invention relates to the Protection glues of circuit board more particularly to circuit board.A kind of cured circuit board electronic Protection glues of UV, it include the Y804 6 10% of following weight percents, DY2600 6 10%, PM 24 6%, polyurethane 19 22%, hydroxy-ethyl acrylate 45 50%, 1,173 5 6%, benzophenone 0.6 1.1%, diethylamine be modified that TM 3 4%, BYK358N 0.1 0.3%, moral be modest 2,700 0.1 0.5%, Changxing 4,601 0.1 0.30.Smell of the present invention is small, and curing rate is high, and glossiness is good.
Description
Technical field
The present invention relates to the Protection glues of circuit board more particularly to circuit board.
Background technology
Currently, circuit board is required for coating Electronic protection glue will not be because of small metal for protection circuit boards solder, pin
Part falls and leads to short circuit, and the cured Electronic protection glues of wherein UV are gradually promoted come in recent years.But current UV solidifications
Electronic protection glue smell it is larger, damage and discomfort in smell are brought to user；Also, existing product glossiness is inadequate, apply
Circuit board appearance after covering is bad；In addition, curing rate is also the bottleneck for limiting UV solidification Electronic protection glues and promoting slowly.
Invention content
Present invention seek to address that the drawbacks described above of the prior art, provides a kind of cured circuit board electronic Protection glues of UV.This
Invention smell is small, and curing rate is high, and glossiness is good.
In order to solve the above-mentioned technical problem, the cured circuit board electronic Protection glues of a kind of UV, it includes following weight percent
Ratio：
The cured circuit board electronic Protection glues of the UV, its condition of cure are 500mJ, 3-5s.
The cured circuit board electronic Protection glues of the UV, it is I grades that the cross-hatching after solidification, which measures paint film intensity,.
Raw material smell of the present invention is small, and peculiar smell is substantially not present after solidification, does not interfere with the smell of user.This
Outside, higher solidification hastens that production efficiency can be effectively improved, and glossiness is high after solidification, good visual effect.
Specific implementation mode
A kind of cured circuit board electronic Protection glues of UV, it includes following weight percents
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | |
| Y804 | 9.5 | 7.4 | 9 | 8.6 |
| DY2600 | 9.5 | 7.4 | 9 | 8.6 |
| Acrylated phosphate | 4 | 4.5 | 5.5 | 6 |
| Polyurethane | 22 | 20 | 21 | 19 |
| Hydroxy-ethyl acrylate | 45 | 50 | 45 | 47.1 |
| - 2 methyl-1 phenyl -1- acetone of 2- hydroxyls | 6 | 5.3 | 5.9 | 5 |
| Benzophenone | 0.6 | 0.9 | 0.8 | 1.1 |
| Diethylamine is modified TM | 3.1 | 4 | 3 | 3.5 |
| BYK358N | 0.1 | 0.15 | 0.26 | 0.3 |
| Moral modest 2700 | 0.1 | 0.2 | 0.34 | 0.5 |
| Changxing 4601 | 0.1 | 0.15 | 0.2 | 0.3 |
| It amounts to | 100 | 100 | 100 | 100 |
Solidification, is the ultraviolet light 3-5s of 500mJ with power.
Paint film intensity, it is I grades that each embodiment measures paint film intensity with cross-hatching.
Claims (3)
1. a kind of cured circuit board electronic Protection glues of UV, it includes following weight percents
2. the cured circuit board electronic Protection glues of UV according to claim 1, which is characterized in that its condition of cure is
500mJ ultraviolet lights, 3-5s.
3. the cured circuit board electronic Protection glues of UV according to claim 1, which is characterized in that the cross-hatching after solidification is surveyed
It is I grades to determine paint film intensity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610791424.3A CN108299898A (en) | 2016-08-31 | 2016-08-31 | The cured circuit board electronic Protection glues of UV |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610791424.3A CN108299898A (en) | 2016-08-31 | 2016-08-31 | The cured circuit board electronic Protection glues of UV |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108299898A true CN108299898A (en) | 2018-07-20 |
Family
ID=62871629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610791424.3A Pending CN108299898A (en) | 2016-08-31 | 2016-08-31 | The cured circuit board electronic Protection glues of UV |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108299898A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102643600A (en) * | 2012-04-18 | 2012-08-22 | 上海维凯化学品有限公司 | Ultraviolet light curing coating composition |
| CN102732159A (en) * | 2012-06-25 | 2012-10-17 | 烟台开发区泰盛精化新材料有限公司 | Peelable solder mask UV curing adhesive, and its preparation and application methods |
| CN103555187A (en) * | 2013-09-30 | 2014-02-05 | 上海维凯化学品有限公司 | High impact resistance ultraviolet curing coating combination and use method thereof |
| CN104152032A (en) * | 2014-08-01 | 2014-11-19 | 苏州袭麟光电科技产业有限公司 | Scratch-resistant stiffed film and preparation method thereof |
-
2016
- 2016-08-31 CN CN201610791424.3A patent/CN108299898A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102643600A (en) * | 2012-04-18 | 2012-08-22 | 上海维凯化学品有限公司 | Ultraviolet light curing coating composition |
| CN102732159A (en) * | 2012-06-25 | 2012-10-17 | 烟台开发区泰盛精化新材料有限公司 | Peelable solder mask UV curing adhesive, and its preparation and application methods |
| CN103555187A (en) * | 2013-09-30 | 2014-02-05 | 上海维凯化学品有限公司 | High impact resistance ultraviolet curing coating combination and use method thereof |
| CN104152032A (en) * | 2014-08-01 | 2014-11-19 | 苏州袭麟光电科技产业有限公司 | Scratch-resistant stiffed film and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180720 |
|
| WD01 | Invention patent application deemed withdrawn after publication |