CN108289346A - 一种发热片、发热地板及发热片的制备方法 - Google Patents
一种发热片、发热地板及发热片的制备方法 Download PDFInfo
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Abstract
本发明提供了一种发热片、发热地板及发热片的制备方法,涉及发热体技术领域,解决了现有技术中存在的发热体热效率低的技术问题。发热片包括发热本体,发热本体包括两个氧化铝陶瓷基片以及位于两层氧化铝陶瓷基片之间的电阻浆料层,且每个氧化铝陶瓷基片的外侧均设置有静电屏蔽层。采用氧化铝陶瓷基片制成电暖片的发热体,与传统的电暖片的发热体相比热效率高,单位产能的耗电量降低,节能降耗。
Description
技术领域
本发明涉及发热体技术领域,尤其是涉及一种发热片、发热地板及发热片的制备方法。
背景技术
目前市场上出现的电地暖的发热体一般为发热膜、碳纤维发热线、碳晶、合金发热丝等。
本申请人发现现有技术至少存在以下技术问题:
发热膜升温速度慢,热效率低,而且断电后热量消散速度快;
碳纤维发热线容易氧化,有电磁辐射;
碳晶地暖是一块儿一块儿拼接成的,接头较多。电源线无套管保护,存在电极铜条氧化不阻燃。碳晶采用的短纤碳纤维均匀、单丝或多丝碳纤维自由搭接导电的形式,就难免出现局部电压不均匀的情况,时间长了以后,局部单丝连接的地方会被局部击穿,这种局部击穿不会造成整个碳晶板的漏电,但击穿的局部点会越来越多,就会造成电阻变大,电阻变大的后果就是发热温度变高和更加费电,从而造成碳晶板绝缘层的加速老化,老化后的碳晶板绝缘效果变差后如果再出现局部击穿的现象,就会导致出现泄露电流,由于碳晶板的设计是低电流,倒也不会对人有所伤害,可是漏电保护开关却会因此做出给房间断电。
合金发热丝高温环境下的强度较低,铁铬铝合金电热丝在高温中容易发生变形,且变形后不易修复。
发明内容
本发明的目的在于提供一种用于电地暖的发热片、发热地板及发热片的制备方法,以解决现有技术中存在的发热体热效率低的技术问题。本发明提供的诸多技术方案中的优选技术方案所能产生的诸多技术效果详见下文阐述。
为实现上述目的,本发明提供了以下技术方案:
本发明提供的一种发热片,包括发热本体,所述发热本体包括电阻浆料层和两个氧化铝陶瓷基片,所述电阻浆料层位于两层所述氧化铝陶瓷基片之间,每个所述氧化铝陶瓷基片的外侧均设置有静电屏蔽层。
可选地,发热片还包括保温底座,其上开设有嵌入槽,所述发热本体嵌于所述嵌入槽内。
可选地,所述保温底座的所述嵌入槽内向上凸起有定位块,所述发热本体上对应地开设有定位槽,所述发热本体嵌入所述嵌入槽时所述定位块与所述定位槽配合连接。
可选地,所述定位块的高度与所述保温底座的外沿的高度相等。
本发明提供的一种发热地板,包括上述的发热片,所述发热片的上表面固定有饰面层。
可选地,所述饰面层为瓷砖、木地板或大理石。
可选地,所述饰面层粘接于所述发热片上。
本发明提供的一种发热片的制备方法,包括以下步骤:
S1:氧化铝原料经过流延机流延成0.6mm厚度的氧化铝陶瓷基片;
S2:氧化铝陶瓷基片被分切成型;
S3:在氧化铝陶瓷基片的一侧印刷钨或钼锰电子浆料;
S4:在印刷好的氧化铝陶瓷基片上再复合一层氧化铝陶瓷基片,留出电极再进行等温静压成型;
S5:用高温烧结炉分段式烧结,烧结后的发热片为白色的陶瓷薄片;
S6:电极接线采用镍丝,用超声波冷焊或银铜焊接,焊接处用灌封胶密封;
S7:发热片接零线和火线两根线,地线接在静电屏蔽层上。
可选地,S5中,烧结过程中炉内设置抚平器。
可选地,S1中,氧化铝陶瓷基片采用水基流延法制成。
水基流延法中:
可选地,S1中,氧化铝原料包括以下百分比的材料:分散剂2.5%和粘结剂27%~28%。
可选地,分散剂为聚丙烯酸铵,粘结剂为纯丙乳液。
可选地,pH为9.5~10。
可选地,排胶温度为500℃。
可选地,S5中,制备的α-Al2O3流延素片在1650℃烧结温度下保温2h。
可选地,S1中,氧化铝陶瓷基片采用非水基流延法制成。
非水基流延法中:
可选地,溶剂为甲苯和正丁醇混合液,粘结剂为PVB,增塑剂为PEG-400,分散剂为鱼油。
可选地,配比为甲苯:正丁醇为5:3,增塑剂与粘结剂的比值为0.4,粘结剂加入量为5wt%,分散剂加入量为0.6wt%。
本发明提供的一种发热片、发热地板及发热片的制备方法,采用氧化铝陶瓷基片制成电暖片的发热体,与传统的电暖片的发热体相比热效率高,单位产能的耗电量降低,节能降耗。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是本发明一种发热片的俯视结构示意图;
图2是本发明一种发热地板的***结构示意图。
图中1、发热本体;11、电阻浆料层;12、氧化铝陶瓷基片;13、静电屏蔽层;2、保温底座;3、电源线;4、饰面层。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚,下面将对本发明的技术方案进行详细的描述。显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动的前提下所得到的所有其它实施方式,都属于本发明所保护的范围。
如图1所示,本发明提供了一种发热片,包括发热本体1,发热本体1包括电阻浆料层11和两个氧化铝陶瓷基片12,电阻浆料层11位于两层氧化铝陶瓷基片12之间,每个氧化铝陶瓷基片12的外侧均设置有静电屏蔽层13。
电阻浆料层11采用稀土制造,静电屏蔽层13为铝泊层。
采用氧化铝陶瓷基片12制成电暖片的发热体,与传统的电暖片的发热体相比热效率高,单位发热量的耗电量降低,节能降耗。
作为可选地实施方式,发热片还包括保温底座2,其上开设有嵌入槽,发热本体1嵌于嵌入槽内。
保温底座2采用聚氨酯材料制造。
设置保温底座2后能够减少热量的散失,达到更好的加热保温效果,从而进一步节能降耗。
作为可选地实施方式,保温底座2的嵌入槽内向上凸起有定位块,发热本体1上对应地开设有定位槽,发热本体1嵌入嵌入槽时定位块与定位槽配合连接。
通过定位块与定位槽的配合连接实现发热本体1与保温底座2的紧密连接,连接可靠性高。
作为可选地实施方式,定位块的高度与保温底座2的外沿的高度相等。
定位块的高度与保温底座2的外沿的高度相等,发热本体1嵌入保温底座2后表面平整,便于安装使用,且美观。
本发明提供的一种发热地板,包括上述的发热片,发热片的上表面固定有饰面层4。发热地板的结构参见图2,图2给出了发热地板的***结构示意。
在发热片的上表面固定饰面层4,家装时能够直接将发热地板铺设于地面,安装方便,美观。
作为可选地实施方式,饰面层4为瓷砖、木地板或大理石。
顾客能够根据需要和自身喜好选择饰面层4的材质,灵活多样,常见的瓷砖、大理石和木地板均可复合到发热片上。
作为可选地实施方式,饰面层4粘接于发热片上。
保温底座2采用高密度聚氨酯发泡成型,将发热本体1镶嵌在保温底座2内,发热本体1与保温底座2的表面处于同一平面,打上不含甲醛等挥发有害气体的单组分胶水,5吨压力冷压复合到瓷砖、大理石或实木地板上,接上防水抗氧化主电源线3,用温控器控制室内温度也可以控制物体表面温度。发热片拼接使用,能够整体控制加热使用面积,也可以分区域控制,灵活性高。电阻-温度变化线性,能够通过控制电阻便捷地控制温度。
本发明提供的一种发热片的制备方法,包括以下步骤:
S1:氧化铝原料经过流延机流延成0.6mm厚度的氧化铝陶瓷基片12;
S2:氧化铝陶瓷基片12被分切成型;
S3:在氧化铝陶瓷基片12的一侧印刷钨或钼锰电子浆料;
S4:在印刷好的氧化铝陶瓷基片12上再复合一层氧化铝陶瓷基片12,留出电极再进行等温静压成型;
S5:用高温烧结炉分段式烧结,烧结后的发热片为白色的陶瓷薄片;
S6:电极接线采用镍丝,用超声波冷焊或银铜焊接,焊接处用灌封胶密封;
S7:发热片接零线和火线两根线,地线接在静电屏蔽层13上。
S5中,氧化铝的分段烧结温度的控制参见下表:
温度/℃ | 180 | 220 | 240 | 300 | 440 | 600 | 950 | 1150 | 1350 | 1500 | 1580 |
时间/min | 60 | 120 | 180 | 120 | 60 | 90 | 90 | 60 | 60 | 60 | 180 |
其中,0-150度抽真空,150-220度充氢气,220-750度是排胶过程,750-1580度是烧结过程。1400-750是冷却过程,冷却过程的温度控制参见下表:
温度/℃ | 1400 | 1300 | 1200 | 1100 | 1000 | 900 | 750 |
时间/min | 60 | 90 | 90 | 90 | 90 | 90 | 90 |
作为可选地实施方式,步骤S5中,烧结过程中炉内设置有抚平器。
利用抚平器,通过夹持的方式,防止了氧化铝陶瓷基片12在受热后的弯曲变形。
作为可选地实施方式,氧化铝陶瓷基片12采用水基流延法制成:
分散剂选用聚丙烯酸铵(PAA-NH4),且聚丙烯酸铵含量为2.5%,粘结剂采用纯丙乳液,纯丙乳液用量为27%~28%,在pH为9.5~10时制备出稳定性良好、流动性适宜的α-Al2O3的水基流延浆料。对纯丙乳液进行了DTA和TGA热分析,在此基础上确定流延素片的排胶温度在500℃。将该工艺制备的α-Al2O3流延素片在1650℃并保温2h的烧结条件下,能够获得强度和致密度都较高的烧结体,其中烧结较好的流延片的相对密度达到0.945,制备出的Al2O3生坯材料表面光滑、结构均匀、柔韧性良好且强度较高。
作为可选地实施方式,氧化铝陶瓷基片12采用非水基流延法制成:
以甲苯和正丁醇混合液为溶剂,PVB为粘结剂,PEG-400为增塑剂,鱼油为分散剂,当混合溶剂的最佳配比为甲苯:正丁醇为5:3,增塑剂与粘结剂的比值为0.4,粘结剂加入量为5wt%、分散剂加入量为0.6wt%时可获得粘度为2100~3500mPa·s的适合流延的浆料,将流延制得的氧化铝基片生坯在1575℃烧成,密度为3.78g/cm3。
本发明的发热片具有结构简单、升温迅速、温度补偿快、加热均匀、加热温度能够自由调节、无明火、使用安全等特点,而且寿命长、功率衰减少,发热体与空气绝缘,元件耐酸碱及其他腐蚀性物质,不含铅、镉、汞、六价铬、多溴联苯、多溴二苯醚等有害物质,环保安全。
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以权利要求的保护范围为准。
Claims (10)
1.一种发热片,其特征在于,包括发热本体,所述发热本体包括电阻浆料层和两个氧化铝陶瓷基片,所述电阻浆料层位于两层所述氧化铝陶瓷基片之间,每个所述氧化铝陶瓷基片的外侧均设置有静电屏蔽层。
2.根据权利要求1所述的一种发热片,其特征在于,还包括保温底座,其上开设有嵌入槽,所述发热本体嵌于所述嵌入槽内。
3.根据权利要求2所述的一种发热片,其特征在于,所述保温底座的所述嵌入槽内向上凸起有定位块,所述发热本体上对应地开设有定位槽,所述发热本体嵌入所述嵌入槽时所述定位块与所述定位槽配合连接。
4.根据权利要求3所述的一种发热片,其特征在于,所述定位块的高度与所述保温底座的外沿的高度相等。
5.一种发热地板,其特征在于,包括权利要求1-4任一项所述的发热片,所述发热片的上表面固定有饰面层。
6.根据权利要求5所述的一种发热地板,其特征在于,所述饰面层为瓷砖、木地板或大理石。
7.根据权利要求5所述的一种发热地板,其特征在于,所述饰面层粘接于所述发热片上。
8.一种发热片的制备方法,其特征在于,包括以下步骤:
S1:氧化铝原料经过流延机流延成0.6mm厚度的氧化铝陶瓷基片;
S2:氧化铝陶瓷基片被分切成型;
S3:在氧化铝陶瓷基片的一侧印刷钨或钼锰电子浆料;
S4:在印刷好的氧化铝陶瓷基片上再复合一层氧化铝陶瓷基片,留出电极再进行等温静压成型;
S5:用高温烧结炉分段式烧结,烧结后的发热片为白色的陶瓷薄片;
S6:电极接线采用镍丝,用超声波冷焊或银铜焊接,焊接处用灌封胶密封;
S7:发热片接零线和火线两根线,地线接在静电屏蔽层上。
9.根据权利要求8所述的发热片的制备方法,其特征在于,S1中,氧化铝陶瓷基片采用水基流延法制成。
10.根据权利要求8所述的发热片的制备方法,其特征在于,S1中,氧化铝陶瓷基片采用非水基流延法制成。
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