CN108288668A - A kind of five foot Full-color LED encapsulation structures - Google Patents
A kind of five foot Full-color LED encapsulation structures Download PDFInfo
- Publication number
- CN108288668A CN108288668A CN201810025040.XA CN201810025040A CN108288668A CN 108288668 A CN108288668 A CN 108288668A CN 201810025040 A CN201810025040 A CN 201810025040A CN 108288668 A CN108288668 A CN 108288668A
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- Prior art keywords
- chip
- led chip
- led
- dao
- light
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 16
- 239000004568 cement Substances 0.000 claims abstract description 4
- 239000011324 bead Substances 0.000 claims description 13
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000005611 electricity Effects 0.000 description 4
- 239000003086 colorant Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 208000010086 Hypertelorism Diseases 0.000 description 1
- 206010020771 Hypertelorism of orbit Diseases 0.000 description 1
- 241001025261 Neoraja caerulea Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of five foot Full-color LED encapsulation structures, including Ji Dao, the peripheries Ji Dao are equipped with 5 pins being connected therewith by holder, are respectively power cord, red light power cord, Data In-Line, DOL Data Output Line and ground wire in pin；Red LED chip, green LED chip, blue-light LED chip and driving chip are respectively equipped with inside base island, each chip is fixed on by conducting resinl or insulating cement on Ji Dao, and red LED chip, green LED chip, blue-light LED chip are electrically connected by conducting wire and driving chip again；The driving chip is connect by conducting wire with Ji Dao.Red LED chip, green LED chip, blue-light LED chip, four chips of driving chip can be integrated compared with traditional technology, to allow the smaller space of full-color LED lamp, reach more rich color by the present invention simultaneously.
Description
Technical field
The invention belongs to field of semiconductor materials, and in particular to a kind of five foot Full-color LED encapsulation structures.
Background technology
LED（Light emitting diode）Encapsulation refers to the encapsulation of luminescence chip, and existing all-colour LED is by red light chips, green light core
Piece, blue chip are encapsulated in a lamp bead, and showing a variety of colors by the different hybrid modes of three primary colours comes out.Due to three
Primary colours light mixng proportions is different, so if all-colour LED lamp bead will realize color change at present, need by be operated alone chip come
Control RGB light mixng proportions.
Current existing mode is to be equipped with all-colour LED, driving chip, current resistor etc. respectively on a printed circuit.
During use, all-colour LED is driven according to pre-set programs by driving chip, is then become by the light of multiple all-colour LEDs
Change and forms a complete LED display.But need to be mounted so that driving chip, current-limiting resistance lamp components, are caused full-color
Hypertelorism between LED lamp bead, LED display pixel is not high, can not well show careful image.Soft pcb board simultaneously
It is easy distortion, bending, device solder joint poor contact is be easy to cause, causes circuit maloperation.Meanwhile driving chip is exposed, easily by
To electromagnetic interference（EMI）.So how driving chip, LED lamp bead, current-limiting resistance to be placed in same lamp bead, lamp bead is reduced
Use space is a very significant project.
LED light will produce power consumption during powering on use, and a part of power consumption is discharged in the form of optical signal, another portion
Sub-signal is discharged outward in the form of thermal energy.This partial heat energy can be such that LED light temperature increases.LED temperature is excessively high, LED can be made to send out
Light efficiency reduces, and generates apparent light decay, or even damage.Meanwhile LED light is mostly with epoxy encapsulation, if temperature is more than
Solid phase transition temperature（Tg）, encapsulating material can to rubber-like change and coefficient of thermal expansion rise sharply, so as to cause LED open circuit or
Failure.Since all-colour LED internal illumination chip has 3, also a driving chip, so this problem can be protruded more.Institute
How to reduce LED power consumptions, reduces operating temperature and be also an important issue project.
There are red light chip, green light chip and blue lamp chip in full-color LED lamp, what all-colour LED on the market used at present does
Method is the anode by three chips as above while being connected on the same power supply, in order to look after the big VF voltages of blue lamp, green light, institute
It necessarily is greater than 3.3V with supply voltage, can cause to waste a large amount of energy on red light in this way, LED is caused to overheat, reduces reliability,
Shorten the service life, also not energy-efficient environmental protection.So the voltage for how balancing three chips is also a very valuable project.
Invention content
Goal of the invention：In view of the above-mentioned deficiencies in the prior art, it is an object of the present invention to provide a kind of five foot all-colour LEDs encapsulation knot
Structure.
Technical solution：In order to reach foregoing invention purpose, what the present invention was specifically performed by：A kind of five feet are full-color
LED encapsulation structure, including Ji Dao, the peripheries Ji Dao are equipped with 5 pins being connected therewith by holder, are respectively electricity in pin
Source line, red light power cord, Data In-Line, DOL Data Output Line and ground wire；Red LED chip, green light are respectively equipped with inside base island
LED chip, blue-light LED chip and driving chip, each chip are fixed on by conducting resinl or insulating cement on Ji Dao, red-light LED core
Piece, green LED chip, blue-light LED chip are electrically connected by conducting wire and driving chip again；The driving chip by conducting wire with
Ji Dao connections.
Wherein, the driving chip die bond is on Ji Dao.
Wherein, the red LED chip, green LED chip, blue-light LED chip die bond are on Ji Dao.
Wherein, the driving chip controls three LED chips to control the brightness of lamp bead by conducting wire.
Wherein, the red LED chip individually enters voltage control, and blue-light LED chip and green LED chip individually enter
Voltage.
Wherein, the driving chip determines the brightness of LED lamp bead by the pulsewidth width of input data.
Red LED chip positive pole individually connects electricity, blue-light LED chip and green LED chip positive pole in the present invention
Electricity individually is connect, while the three chips other ends are connect by conducting wire with driving chip.Driving chip is again by conducting wire respectively at electricity
Source capsule foot, data in pin, data out pin are connected；After power input foot powers on, data input pin inputs again
The control signal of distinct pulse widths, driving chip receive the signal and then control LED chip are sent out different light, to
Achieve the purpose that control lamp color, while driving chip is transmitted to down again by data-signal by data output pin output signal
One lamp bead.
Advantageous effect：The present invention, can be simultaneously by red LED chip, green LED chip, blue light compared with traditional technology
LED chip, four chips of driving chip integrate, and to allow the smaller space of full-color LED lamp, reach more rich
Color.
Description of the drawings
Fig. 1 is schematic structural view of the invention.
Specific implementation mode
Embodiment 1：
Five foot Full-color LED encapsulation structure of one kind as shown in Figure 1, including base island 1,1 periphery of base island pass through therewith equipped with 5
The connected pin 2 of holder, interior pin 2 is respectively power cord, red light power cord, Data In-Line, DOL Data Output Line and ground wire；Base
Red LED chip 3, green LED chip 4, blue-light LED chip 5 and driving chip 6 are respectively equipped with inside island 1, each chip is by leading
Electric glue or insulating cement are fixed on base island 1, red LED chip 3, green LED chip 4, blue-light LED chip 5 again by conducting wire with
Driving chip 6 is electrically connected；The driving chip 6 is connect by conducting wire with base island 1.
Embodiment 2：
Reference implementation example 1, the driving chip die bond is on Ji Dao, the red LED chip, green LED chip, blue-ray LED
For chip die bond on Ji Dao, the driving chip controls three LED chips to control the brightness of lamp bead, institute by conducting wire
State driving chip and determined by the pulsewidth width of input data the brightness of LED lamp bead.
Embodiment 3：
Reference implementation example 1, the red LED chip individually enter voltage control, and blue-light LED chip and green LED chip are independent
Input voltage.
Claims (6)
1. a kind of five foot Full-color LED encapsulation structures, including Ji Dao（1）, which is characterized in that the Ji Dao（1）Periphery be equipped with 5 with
By holder be connected pin（2）, pin（2）Interior is respectively power cord, red light power cord, Data In-Line, data output
Line and ground wire；Ji Dao（1）Inside is respectively equipped with red LED chip（3）, green LED chip（4）, blue-light LED chip（5）And drive
Dynamic chip（6）, each chip is fixed on Ji Dao by conducting resinl or insulating cement（1）On, red LED chip（3）, green LED chip
（4）, blue-light LED chip（5）Pass through conducting wire and driving chip again（6）Electrical connection；The driving chip（6）Pass through conducting wire and base
Island（1）Connection.
2. five feet Full-color LED encapsulation structure according to claim 1, which is characterized in that the driving chip die bond is in base
On island.
3. five feet Full-color LED encapsulation structure according to claim 1, which is characterized in that the red LED chip, green light
LED chip, blue-light LED chip die bond are on Ji Dao.
4. five feet Full-color LED encapsulation structure according to claim 1, which is characterized in that the driving chip passes through conducting wire
To control three LED chips to control the brightness of lamp bead.
5. five feet Full-color LED encapsulation structure according to claim 1, which is characterized in that the red LED chip is individually defeated
Enter voltage control, blue-light LED chip and green LED chip individually enter voltage.
6. five foot Full-color LED encapsulation structure according to claim 4, which is characterized in that the driving chip is by inputting number
According to pulsewidth width determine the brightness of LED lamp bead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810025040.XA CN108288668A (en) | 2018-01-11 | 2018-01-11 | A kind of five foot Full-color LED encapsulation structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810025040.XA CN108288668A (en) | 2018-01-11 | 2018-01-11 | A kind of five foot Full-color LED encapsulation structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108288668A true CN108288668A (en) | 2018-07-17 |
Family
ID=62835098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810025040.XA Pending CN108288668A (en) | 2018-01-11 | 2018-01-11 | A kind of five foot Full-color LED encapsulation structures |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108288668A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09167861A (en) * | 1995-12-14 | 1997-06-24 | Nichia Chem Ind Ltd | Multi-color light-emitting device and display device using that |
| JPH11224063A (en) * | 1998-02-06 | 1999-08-17 | Rohm Co Ltd | Resin molding type display device and its manufacture |
| CN201017882Y (en) * | 2007-01-08 | 2008-02-06 | 赖金鸿 | Programming all-colour LED lamp string |
| GB0902639D0 (en) * | 2009-02-17 | 2009-04-01 | Huang Hsien Jung | Single full-colour LED with driving mechanism |
| CN101922624A (en) * | 2010-04-09 | 2010-12-22 | 嘉兴嘉尼光电科技有限公司 | High-power LED surface light source |
| CN202930380U (en) * | 2012-10-22 | 2013-05-08 | 金建电子有限公司 | Full color LED sealing structure of integrating driving mechanism |
| CN103177662A (en) * | 2011-12-21 | 2013-06-26 | 四川柏狮光电技术有限公司 | High-density full color light-emitting diode (LED) display dot matrix module |
| CN204144254U (en) * | 2014-08-07 | 2015-02-04 | 金建电子有限公司 | Full-color LED encapsulation structure |
| CN105913796A (en) * | 2016-06-13 | 2016-08-31 | 深圳君略科技有限公司 | Driving circuit and method of LED display screen, and LED driving chips |
| CN207967044U (en) * | 2018-01-11 | 2018-10-12 | 宜兴市旭航电子有限公司 | A kind of five foot Full-color LED encapsulation structures |
-
2018
- 2018-01-11 CN CN201810025040.XA patent/CN108288668A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09167861A (en) * | 1995-12-14 | 1997-06-24 | Nichia Chem Ind Ltd | Multi-color light-emitting device and display device using that |
| JPH11224063A (en) * | 1998-02-06 | 1999-08-17 | Rohm Co Ltd | Resin molding type display device and its manufacture |
| CN201017882Y (en) * | 2007-01-08 | 2008-02-06 | 赖金鸿 | Programming all-colour LED lamp string |
| GB0902639D0 (en) * | 2009-02-17 | 2009-04-01 | Huang Hsien Jung | Single full-colour LED with driving mechanism |
| CN101922624A (en) * | 2010-04-09 | 2010-12-22 | 嘉兴嘉尼光电科技有限公司 | High-power LED surface light source |
| CN103177662A (en) * | 2011-12-21 | 2013-06-26 | 四川柏狮光电技术有限公司 | High-density full color light-emitting diode (LED) display dot matrix module |
| CN202930380U (en) * | 2012-10-22 | 2013-05-08 | 金建电子有限公司 | Full color LED sealing structure of integrating driving mechanism |
| CN204144254U (en) * | 2014-08-07 | 2015-02-04 | 金建电子有限公司 | Full-color LED encapsulation structure |
| CN105913796A (en) * | 2016-06-13 | 2016-08-31 | 深圳君略科技有限公司 | Driving circuit and method of LED display screen, and LED driving chips |
| CN207967044U (en) * | 2018-01-11 | 2018-10-12 | 宜兴市旭航电子有限公司 | A kind of five foot Full-color LED encapsulation structures |
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