CN108287604A - A kind of mobile supercomputing center - Google Patents
A kind of mobile supercomputing center Download PDFInfo
- Publication number
- CN108287604A CN108287604A CN201810305130.4A CN201810305130A CN108287604A CN 108287604 A CN108287604 A CN 108287604A CN 201810305130 A CN201810305130 A CN 201810305130A CN 108287604 A CN108287604 A CN 108287604A
- Authority
- CN
- China
- Prior art keywords
- chip
- case
- heat conduction
- boiling
- condenser pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009835 boiling Methods 0.000 claims abstract description 45
- 238000001816 cooling Methods 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 26
- 239000000110 cooling liquid Substances 0.000 claims abstract description 25
- 238000009434 installation Methods 0.000 claims abstract description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 11
- 150000008282 halocarbons Chemical class 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 206010037660 Pyrexia Diseases 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001727 in vivo Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
- H01L23/445—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air the fluid being a liquefied gas, e.g. in a cryogenic vessel
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of mobile supercomputing center, belongs to super calculation centre sphere.The boiling heat conduction case of the device is fixedly connected on chip cooling technique case, and the two shares a joint face；The first kind insulating and cooling liquid body of the interior filling half of the heat conduction case that boils, chip cooling technique case fill the second kind insulating and cooling liquid body of half；Chip is fixed on by fast insert-pull pedestal on the bottom plate of chip cooling technique case, and chip is lined up multiple row and is immersed in second kind insulating and cooling liquid body；The top of boiling heat conduction case is fixedly connected with more vertical condenser pipes, and the nest plate of the outer surface installation multilayer of condenser pipe, the inside of condenser pipe is connected to boiling heat conduction case；The lower part of boiling heat conduction case is fixedly connected with more vertical boiling condenser pipes, and the appearance surface pressure for the condenser pipe that boils is wound around piece, and the lower port for the condenser pipe that boils stretches into chip cooling technique case, is connected to chip cooling technique case.The mobile supercomputing center of the present invention is small, can be mounted on automobile；It more safeguards and changes chip conveniently, it is energy saving.
Description
Technical field
Centre sphere is calculated the invention belongs to super, is related to a kind of mobile supercomputing center.
Background technology
Existing super calculation center, required to have huge water cooling system due to chip cooling, this necessarily brings following
Aspect is inconvenient：When it is bulky, water cooling coil pipe heat-conducting block is used between chip, needs water pump, valve, cooling tower, fan etc.
Integration of equipments takes up space big, cannot be mounted on automobile and move at any time；It safeguards that chip bothers second is that replacing, is used between chip
Water cooling coil pipe heat-conducting block is tightly fastened installation, and to change chip and must tear heat-conducting block open can just change chip, third, for heat dissipation
And increase the energy consumption of water pump fan.
Invention content
In order to solve the deficiencies in the prior art, the present invention provides a kind of mobile supercomputing center, is changed using compound boiling
Heat, natural cooling, chips close are immersed in insulating liquid, small, can be mounted on automobile；It more safeguards and changes chip conveniently,
It is energy saving.
Technical scheme of the present invention：
A kind of mobile supercomputing center, including condenser pipe, nest plate, boiling heat conduction case, boiling condenser pipe, around piece, chip
Cooler bin and chip；Boiling heat conduction case is fixedly connected on chip cooling technique case, and the two shares a joint face；It boils in heat conduction case
First kind insulating and cooling liquid body full of half, chip cooling technique case are full of the second kind insulating and cooling liquid body of half；Chip passes through quick
Plug pedestal is fixed on the bottom plate of chip cooling technique case, and chip is lined up multiple row and is immersed in second kind insulating and cooling liquid body；Boiling
The top of heat conduction case is fixedly connected with more vertical condenser pipes, the nest plate of the outer surface installation multilayer of condenser pipe, condenser pipe it is interior
Portion is connected to boiling heat conduction case；The lower part of boiling heat conduction case is fixedly connected with more vertical boiling condenser pipes, and boil condenser pipe
Appearance surface pressure is wound around piece, and the lower port for the condenser pipe that boils stretches into chip cooling technique case, is connected to chip cooling technique case.
The boiling point of the first kind insulating and cooling liquid body is 35~45 DEG C, and the boiling point of second kind insulating and cooling liquid body is 50~65
℃。
The first kind insulating and cooling liquid body is dichloromethane, and the second kind insulating and cooling liquid body is the mixing of halogenated hydrocarbons
Object.
The chip cooling technique case of the present invention is full of the second kind insulating and cooling liquid body of half, and chip lines up multiple row and is immersed in second kind
In insulating and cooling liquid body；Second kind insulating and cooling liquid body ebuillition of heated is become steam by chip fever, and heat is taken away by steam, chip
It is cooled down；Steam is condensed into liquid in the outer surface of boiling condenser pipe, and liquid instills chip cooling technique lower box part and continues evaporation suction
Receive heat.
The interior first kind insulating and cooling liquid body for being full of half of the heat conduction case that boils, after boiling condenser pipe is heated, the insulation of first kind
Cooling liquid is boiled into as steam, and steam is condensed into liquid in the inner surface of condenser pipe, liquid instill boiling heat conduction lower box part after
Continuous evaporation absorbs heat, and condenser pipe is passed to heat in air by nest plate.
Beneficial effects of the present invention：Mobile supercomputing center uses compound boiling heat transfer, natural cooling, chips close leaching
Bubble is small in insulating liquid, can be mounted on automobile；It more safeguards and changes chip conveniently, it is energy saving.In mobile supercomputing
The heart is highly suitable for using under the emergency cases such as disaster relief and rescue commander.
Description of the drawings
Fig. 1 is the sectional view of mobile supercomputing center.
Fig. 2 is the left sectional view of mobile supercomputing center.
Fig. 3 is the vertical view of mobile supercomputing center.
In figure：1 condenser pipe；2 nest plates；3 boiling heat conduction casees；4 boiling condenser pipes；5 around piece；6 chip cooling technique casees；7 chips.
Specific implementation mode
Below in conjunction with attached drawing and technical solution, the specific implementation mode that further illustrates the present invention.
A kind of mobile supercomputing center, including condenser pipe 1, nest plate 2, boiling heat conduction case 3, boiling condenser pipe 4, around piece 5,
Chip cooling technique case 6 and chip 7；Boiling heat conduction case 3 is fixedly connected on chip cooling technique case 6, and the two shares a joint face；Boiling
The dichloromethane of filling half, chip cooling technique case 6 fill the mixture of the halogenated hydrocarbons of half in heat conduction case 3；Chip 7 is by quick
Plug pedestal is fixed on the bottom plate in chip cooling technique case 6, and chip 7 is lined up multiple row and is immersed in second kind insulating and cooling liquid body；
The top of boiling heat conduction case 3 is fixedly connected with more vertical condenser pipes 1, and the nest plate 2 of the outer surface installation multilayer of condenser pipe 1 is cold
The inside of solidifying pipe 1 is connected to boiling heat conduction case 3；The lower part of boiling heat conduction case 3 is fixedly connected with more vertical boiling condenser pipes 4,
The appearance surface pressure winding of boiling condenser pipe 4 is stretched into chip cooling technique case 6, is connected with chip cooling technique case 6 around piece 5, boiling condenser pipe 4
It is logical.
The mixture of halogenated hydrocarbons of the chip cooling technique case full of half, chip line up multiple row and are immersed in second kind insulating and cooling liquid
In vivo；Second kind insulating and cooling liquid body ebuillition of heated is become steam by chip fever, and heat is taken away by steam, and chip is cooled down；
Steam is condensed into liquid in the outer surface of boiling condenser pipe, and liquid instills chip cooling technique lower box part and continues evaporation absorption heat.
The interior dichloromethane for being full of half of the heat conduction case that boils, after boiling condenser pipe is heated, first kind insulating and cooling liquid body
Boiling becomes steam, and steam is condensed into liquid in the inner surface of condenser pipe, and liquid instillation boiling heat conduction lower box part continues evaporation and inhales
Heat is received, condenser pipe is passed to heat in air by nest plate.
Claims (3)
1. a kind of mobile supercomputing center, which is characterized in that including condenser pipe (1), nest plate (2), boiling heat conduction case (3), boiling
Rise condenser pipe (4), around piece (5), chip cooling technique case (6) and chip (7)；Boiling heat conduction case (3) is fixedly connected on chip cooling technique case
(6) on, the two shares a joint face；The interior first kind insulating and cooling liquid body for being full of half of the heat conduction case (3) that boils, chip cooling technique case
(6) it is full of the other half second kind insulating and cooling liquid body；Chip (7) is fixed on chip cooling technique case (6) by fast insert-pull pedestal
On bottom plate, chip (7) is lined up multiple row and is immersed in second kind insulating and cooling liquid body；The top of boiling heat conduction case (3) is fixedly connected
More vertical condenser pipes (1), the nest plate (2) of the outer surface installation multilayer of condenser pipe (1), the inside of condenser pipe (1) and boiling
Heat conduction case (3) is connected to；The lower part of boiling heat conduction case (3) is fixedly connected with more vertical boiling condenser pipes (4), and boil condenser pipe
(4) around piece (5), the lower port of boiling condenser pipe (4) stretches into chip cooling technique case (6), cold with chip for appearance surface pressure winding
But case (6) is connected to.
2. a kind of mobile supercomputing center according to claim 1, which is characterized in that the first kind insulating and cooling liquid
The boiling point of body is 35~45 DEG C, and the boiling point of second kind insulating and cooling liquid body is 50~65 DEG C.
3. a kind of mobile supercomputing center according to claim 1 or 2, which is characterized in that the first kind insulating cold
But liquid is dichloromethane；Second kind insulating and cooling liquid body is the mixture of halogenated hydrocarbons.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810305130.4A CN108287604A (en) | 2018-04-08 | 2018-04-08 | A kind of mobile supercomputing center |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810305130.4A CN108287604A (en) | 2018-04-08 | 2018-04-08 | A kind of mobile supercomputing center |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108287604A true CN108287604A (en) | 2018-07-17 |
Family
ID=62834278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810305130.4A Pending CN108287604A (en) | 2018-04-08 | 2018-04-08 | A kind of mobile supercomputing center |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108287604A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109186126A (en) * | 2018-11-06 | 2019-01-11 | 江南大学 | A kind of heat pump recycling supercomputing center |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894812A (en) * | 2010-06-13 | 2010-11-24 | 华东理工大学 | Evaporator for cooling chip and manufacture method thereof |
| CN106941100A (en) * | 2016-01-04 | 2017-07-11 | 中兴通讯股份有限公司 | A kind of economic benefits and social benefits cooling system |
| CN208636777U (en) * | 2018-04-08 | 2019-03-22 | 江南大学 | A kind of mobile supercomputing center |
-
2018
- 2018-04-08 CN CN201810305130.4A patent/CN108287604A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894812A (en) * | 2010-06-13 | 2010-11-24 | 华东理工大学 | Evaporator for cooling chip and manufacture method thereof |
| CN106941100A (en) * | 2016-01-04 | 2017-07-11 | 中兴通讯股份有限公司 | A kind of economic benefits and social benefits cooling system |
| CN208636777U (en) * | 2018-04-08 | 2019-03-22 | 江南大学 | A kind of mobile supercomputing center |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109186126A (en) * | 2018-11-06 | 2019-01-11 | 江南大学 | A kind of heat pump recycling supercomputing center |
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