CN108276815A - A kind of circuit board coating composition and preparation method thereof - Google Patents
A kind of circuit board coating composition and preparation method thereof Download PDFInfo
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- CN108276815A CN108276815A CN201711388594.8A CN201711388594A CN108276815A CN 108276815 A CN108276815 A CN 108276815A CN 201711388594 A CN201711388594 A CN 201711388594A CN 108276815 A CN108276815 A CN 108276815A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
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Abstract
The present invention provides a kind of circuit board coating compositions, including following components：15 parts by weight of vinyl chloride vinyl laurate methacrylate copolymer rubber powder, 0.2 0.8 amount part of Diacetone Acrylamide, 26 parts by weight of sodium peroxydisulfate, 5 10 parts by weight of magnesium silicate, 12 16 parts by weight of pentaerythrite, 37 parts by weight of ureidopropyltriethoxysilane, 50 100 parts by weight of aqueous acrylic emulsion, 15 parts by weight of sorbierite, 0.5 1 parts by weight of cadmium stearate, 28 parts by weight of polyoxylethylene abietate, 15 parts by weight of cyclohexanone, 0.2 0.9 parts by weight amino-polyether siloxanes.Each ingredient interaction influences each other, and improves the waterproof effect of the coating composition of preparation, is suitable for the protection of circuit board.
Description
Technical field
The present invention relates to technical field of coatings more particularly to a kind of circuit board coating composition and preparation method thereof.
Background technology
Currently, circuit board is widely used in electronic product.Electronic product equipment in wet environment in use, its most
Main problem is exactly its internal component moisture damage, the especially circuit board of precise structure, to the resistance capabilities of steam
It is poor, once electronic equipment intakes or by humidity, then the loss that can not be retrieved is caused, is not whole equipment scrapping, is exactly
Repair is removed, causes economic loss, equipment can not normal use.Therefore, it is necessary to coat water-repellent paint to circuit board surface.
In the prior art, coating and preparation method thereof has been obtained for widely reporting, for example, application No. is
200810185131.6 Chinese patent literature reports a kind of starch coating composition and covers with paint, lacquer, colour wash, etc. the coating composition
Coated article, which utilizes the starch with biological degradability from natural products, as one-pack-type coating
Fine properties and drying property, ornamenting, pencil hardness, wear resistance, adhesion, alkali resistance, resistance to molten can be formed
Agent and the excellent film of weatherability.The coating composition is characterized in that including to make starch and/or modified starch (a), contain
The hydroxyl value of the polymerizable monomer mixture copolymerization gained of 40-95 mass % aromatic series polymerizable monomers is 10-170mgKOH/g's
Resin combination (A) obtained by hydroxy acryl acid resin (b) and polyisocyanate compound (c) reaction.Application No. is
201510689227.6 Chinese patent literature reports a kind of coating composition comprising PVDF resins, acrylic resin and
The solvent for including isophorone, further relates to the coating system for including the coating composition, and the coating system further includes priming paint group
Object, background colour finish compositions and clear coat composition are closed, and the method for preparing the coating system.Application No. is
201510970688.0 Chinese patent literature reports a kind of coating, and each component material quality ratio is aqueous solution 40-50
Part, 1-2 parts of thickener, 30-40 parts of silica flour, 1-2 parts of adhesive, 20-30 parts of titanium dioxide, 10-20 parts of industrial naptha, filler 3-
5 parts.
But the waterproof effect of the coating of above-mentioned report is poor, is not suitable for the surfacecti proteon of circuit board.
Invention content
Present invention solves the technical problem that being to provide a kind of circuit board coating composition and preparation method thereof, have good
Good waterproof effect.
In view of this, the present invention provides a kind of circuit board coating composition, including following components：Vinyl chloride-bay
Sour ethylene-methyl acrylate copolymer rubber powder 1-5 parts by weight, Diacetone Acrylamide 0.2-0.8 amounts part, sodium peroxydisulfate 2-6
Parts by weight, magnesium silicate 5-10 parts by weight, pentaerythrite 12-16 parts by weight, ureidopropyltriethoxysilane 3-7 parts by weight, water
Property acrylic emulsion 50-100 parts by weight, sorbierite 1-5 parts by weight, cadmium stearate 0.5-1 parts by weight, polyoxylethylene abietate
2-8 parts by weight, cyclohexanone 1-5 parts by weight, 0.2-0.9 parts by weight amino-polyether siloxanes.
Preferably, vinyl chloride-vinyl laurate-methacrylate copolymer rubber powder 1-3 parts by weight.
Preferably, Diacetone Acrylamide 0.4-0.8 amounts part.
Preferably, sodium peroxydisulfate 2-5 parts by weight.
Preferably, magnesium silicate 7-10 parts by weight.
Preferably, pentaerythrite 12-14 parts by weight.
Preferably, ureidopropyltriethoxysilane 5-7 parts by weight.
Preferably, cadmium stearate 0.5-0.8 parts by weight.
Preferably, polyoxylethylene abietate 5-8 parts by weight.
Correspondingly, the present invention also provides a kind of preparation method of circuit board coating composition, include the following steps：By chlorine
Ethylene-vinyl laurate-methacrylate copolymer rubber powder 1-5 parts by weight, Diacetone Acrylamide 0.2-0.8 amounts part, mistake
Sodium sulphate 2-6 parts by weight, magnesium silicate 5-10 parts by weight, pentaerythrite 12-16 parts by weight, ureidopropyltriethoxysilane 3-7
Parts by weight, aqueous acrylic emulsion 50-100 parts by weight, sorbierite 1-5 parts by weight, cadmium stearate 0.5-1 parts by weight, rosin acid
Then 0.2- was added in high-speed stirred in agitator tank 10 minutes in polyoxyethylene ester 2-8 parts by weight, the mixing of cyclohexanone 1-5 parts by weight
0.9 parts by weight amino-polyether siloxanes is further continued for stirring 5 minutes, obtains circuit board coating composition.
The present invention provides a kind of circuit board coating composition, including following components：Vinyl chloride-vinyl laurate-methyl
Acrylate copolymer rubber powder 1-5 parts by weight, Diacetone Acrylamide 0.2-0.8 amounts part, sodium peroxydisulfate 2-6 parts by weight, silicic acid
Magnesium 5-10 parts by weight, pentaerythrite 12-16 parts by weight, ureidopropyltriethoxysilane 3-7 parts by weight, aqueous acrylic emulsion
50-100 parts by weight, sorbierite 1-5 parts by weight, cadmium stearate 0.5-1 parts by weight, polyoxylethylene abietate 2-8 parts by weight, ring
Hexanone 1-5 parts by weight, 0.2-0.9 parts by weight amino-polyether siloxanes.Compared with prior art, the present invention is with vinyl chloride-bay
Sour ethylene-methyl acrylate copolymer rubber powder, Diacetone Acrylamide, sodium peroxydisulfate, magnesium silicate, pentaerythrite, urea groups third
Ethyl triethoxy silicane alkane, aqueous acrylic emulsion, sorbierite, cadmium stearate, polyoxylethylene abietate, cyclohexanone, amino are poly-
Ether siloxanes is raw material, and each ingredient interaction influences each other, and improves the waterproof effect of the coating composition of preparation, fits
Protection for circuit board.
Specific implementation mode
For a further understanding of the present invention, the preferred embodiment of the invention is described with reference to embodiment, still
It should be appreciated that these descriptions are only the feature and advantage further illustrated the present invention, rather than to the claims in the present invention
Limitation.
The embodiment of the invention discloses a kind of circuit board coating compositions, including following components：Vinyl chloride-lauric acid second
Alkene-methacrylate copolymer rubber powder 1-5 parts by weight, Diacetone Acrylamide 0.2-0.8 amounts part, sodium peroxydisulfate 2-6 weight
Part, magnesium silicate 5-10 parts by weight, pentaerythrite 12-16 parts by weight, ureidopropyltriethoxysilane 3-7 parts by weight, aqueous third
Olefin(e) acid lotion 50-100 parts by weight, sorbierite 1-5 parts by weight, cadmium stearate 0.5-1 parts by weight, polyoxylethylene abietate 2-8
Parts by weight, cyclohexanone 1-5 parts by weight, 0.2-0.9 parts by weight amino-polyether siloxanes.
Preferably, vinyl chloride-vinyl laurate-methacrylate copolymer rubber powder 1-3 parts by weight, diacetone
Acrylamide 0.4-0.8 amount parts, sodium peroxydisulfate 2-5 parts by weight, magnesium silicate 7-10 parts by weight, pentaerythrite 12-14 parts by weight, urea
Base propyl-triethoxysilicane 5-7 parts by weight, cadmium stearate 0.5-0.8 parts by weight, polyoxylethylene abietate 5-8 parts by weight.
Correspondingly, the present invention also provides a kind of preparation method of circuit board coating composition, include the following steps：By chlorine
Ethylene-vinyl laurate-methacrylate copolymer rubber powder 1-5 parts by weight, Diacetone Acrylamide 0.2-0.8 amounts part, mistake
Sodium sulphate 2-6 parts by weight, magnesium silicate 5-10 parts by weight, pentaerythrite 12-16 parts by weight, ureidopropyltriethoxysilane 3-7
Parts by weight, aqueous acrylic emulsion 50-100 parts by weight, sorbierite 1-5 parts by weight, cadmium stearate 0.5-1 parts by weight, rosin acid
Then 0.2- was added in high-speed stirred in agitator tank 10 minutes in polyoxyethylene ester 2-8 parts by weight, the mixing of cyclohexanone 1-5 parts by weight
0.9 parts by weight amino-polyether siloxanes is further continued for stirring 5 minutes, obtains circuit board coating composition.
The present invention provides a kind of circuit board coating composition, including following components：Vinyl chloride-vinyl laurate-methyl
Acrylate copolymer rubber powder 1-5 parts by weight, Diacetone Acrylamide 0.2-0.8 amounts part, sodium peroxydisulfate 2-6 parts by weight, silicic acid
Magnesium 5-10 parts by weight, pentaerythrite 12-16 parts by weight, ureidopropyltriethoxysilane 3-7 parts by weight, aqueous acrylic emulsion
50-100 parts by weight, sorbierite 1-5 parts by weight, cadmium stearate 0.5-1 parts by weight, polyoxylethylene abietate 2-8 parts by weight, ring
Hexanone 1-5 parts by weight, 0.2-0.9 parts by weight amino-polyether siloxanes.Compared with prior art, the present invention is with vinyl chloride-bay
Sour ethylene-methyl acrylate copolymer rubber powder, Diacetone Acrylamide, sodium peroxydisulfate, magnesium silicate, pentaerythrite, urea groups third
Ethyl triethoxy silicane alkane, aqueous acrylic emulsion, sorbierite, cadmium stearate, polyoxylethylene abietate, cyclohexanone, amino are poly-
Ether siloxanes is raw material, and each ingredient interaction influences each other, and improves the waterproof effect of the coating composition of preparation, fits
Protection for circuit board.
For a further understanding of the present invention, technical solution provided by the invention is carried out specifically with reference to embodiment
Bright, protection scope of the present invention is not limited by the following examples.
Raw material used in the embodiment of the present invention is purchased in market.
Embodiment 1
Weigh vinyl chloride-vinyl laurate -1 parts by weight of methacrylate copolymer rubber powder, Diacetone Acrylamide 0.8
Measure part, 2 parts by weight of sodium peroxydisulfate, 10 parts by weight of magnesium silicate, 12 parts by weight of pentaerythrite, 7 weight of ureidopropyltriethoxysilane
Measure part, 50 parts by weight of aqueous acrylic emulsion, 5 parts by weight of sorbierite, 0.5 parts by weight of cadmium stearate, polyoxylethylene abietate 8
Then 0.9 parts by weight amino-polyether silicon was added in high-speed stirred in agitator tank 10 minutes in parts by weight, the mixing of 1 parts by weight of cyclohexanone
Oxygen alkane is further continued for stirring 5 minutes, obtains circuit board coating composition.
Embodiment 2
Weigh vinyl chloride-vinyl laurate -5 parts by weight of methacrylate copolymer rubber powder, Diacetone Acrylamide 0.2
Measure part, 6 parts by weight of sodium peroxydisulfate, 5 parts by weight of magnesium silicate, 16 parts by weight of pentaerythrite, 3 weight of ureidopropyltriethoxysilane
Part, 100 parts by weight of aqueous acrylic emulsion, 1 parts by weight of sorbierite, 1 parts by weight of cadmium stearate, 2 weight of polyoxylethylene abietate
Measure part, then 0.2 parts by weight amino-polyether silica was added in high-speed stirred in agitator tank 10 minutes in the mixing of 5 parts by weight of cyclohexanone
Alkane is further continued for stirring 5 minutes, obtains circuit board coating composition.
Embodiment 3
Weigh vinyl chloride-vinyl laurate -3 parts by weight of methacrylate copolymer rubber powder, Diacetone Acrylamide 0.5
Measure part, 4 parts by weight of sodium peroxydisulfate, 8 parts by weight of magnesium silicate, 14 parts by weight of pentaerythrite, 5 weight of ureidopropyltriethoxysilane
Part, 80 parts by weight of aqueous acrylic emulsion, 3 parts by weight of sorbierite, 0.7 parts by weight of cadmium stearate, 5 weight of polyoxylethylene abietate
Measure part, then 0.7 parts by weight amino-polyether silica was added in high-speed stirred in agitator tank 10 minutes in the mixing of 3 parts by weight of cyclohexanone
Alkane is further continued for stirring 5 minutes, obtains circuit board coating composition.
The explanation of above example is only intended to facilitate the understanding of the method and its core concept of the invention.It should be pointed out that pair
For those skilled in the art, without departing from the principle of the present invention, the present invention can also be carried out
Some improvements and modifications, these improvement and modification are also fallen within the protection scope of the claims of the present invention.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest range caused.
Claims (10)
1. a kind of circuit board coating composition, which is characterized in that including following components：
Vinyl chloride-vinyl laurate-methacrylate copolymer rubber powder 1-5 parts by weight, Diacetone Acrylamide 0.2-0.8 amounts
Part, sodium peroxydisulfate 2-6 parts by weight, magnesium silicate 5-10 parts by weight, pentaerythrite 12-16 parts by weight, ureido-propyl triethoxysilicane
Alkane 3-7 parts by weight, aqueous acrylic emulsion 50-100 parts by weight, sorbierite 1-5 parts by weight, cadmium stearate 0.5-1 parts by weight, pine
Perfume acid polyoxyethylene ester 2-8 parts by weight, cyclohexanone 1-5 parts by weight, 0.2-0.9 parts by weight amino-polyether siloxanes.
2. circuit board coating composition according to claim 1, which is characterized in that vinyl chloride-vinyl laurate-methyl
Acrylate copolymer rubber powder 1-3 parts by weight.
3. circuit board coating composition according to claim 1, which is characterized in that Diacetone Acrylamide 0.4-0.8
Measure part.
4. circuit board coating composition according to claim 1, which is characterized in that sodium peroxydisulfate 2-5 parts by weight.
5. circuit board coating composition according to claim 1, which is characterized in that magnesium silicate 7-10 parts by weight.
6. circuit board coating composition according to claim 1, which is characterized in that pentaerythrite 12-14 parts by weight.
7. circuit board coating composition according to claim 1, which is characterized in that ureidopropyltriethoxysilane 5-
7 parts by weight.
8. circuit board coating composition according to claim 1, which is characterized in that cadmium stearate 0.5-0.8 parts by weight.
9. circuit board coating composition according to claim 1, which is characterized in that polyoxylethylene abietate 5-8 weights
Measure part.
10. a kind of preparation method of circuit board coating composition, which is characterized in that include the following steps：
By vinyl chloride-vinyl laurate-methacrylate copolymer rubber powder 1-5 parts by weight, Diacetone Acrylamide 0.2-0.8
Measure part, sodium peroxydisulfate 2-6 parts by weight, magnesium silicate 5-10 parts by weight, pentaerythrite 12-16 parts by weight, ureido-propyl triethoxy
Silane 3-7 parts by weight, aqueous acrylic emulsion 50-100 parts by weight, sorbierite 1-5 parts by weight, cadmium stearate 0.5-1 parts by weight,
Polyoxylethylene abietate 2-8 parts by weight, the mixing of cyclohexanone 1-5 parts by weight, in high-speed stirred in agitator tank 10 minutes, then plus
Enter 0.2-0.9 parts by weight amino-polyether siloxanes and be further continued for stirring 5 minutes, obtains circuit board coating composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711388594.8A CN108276815A (en) | 2017-12-20 | 2017-12-20 | A kind of circuit board coating composition and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711388594.8A CN108276815A (en) | 2017-12-20 | 2017-12-20 | A kind of circuit board coating composition and preparation method thereof |
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| Publication Number | Publication Date |
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| CN108276815A true CN108276815A (en) | 2018-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711388594.8A Pending CN108276815A (en) | 2017-12-20 | 2017-12-20 | A kind of circuit board coating composition and preparation method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103571291A (en) * | 2012-07-27 | 2014-02-12 | 比亚迪股份有限公司 | Waterproof coating |
| CN103958637A (en) * | 2011-11-29 | 2014-07-30 | 新田明胶株式会社 | Material for photocurable sealing, sealing method, sealing material, and case using same |
| CN104497745A (en) * | 2014-12-15 | 2015-04-08 | 深圳市优宝惠新材料科技有限公司 | Waterproof coating material composition |
| CN107446451A (en) * | 2015-10-16 | 2017-12-08 | 宁波高新区夏远科技有限公司 | A kind of environment-friendly waterproof paint and preparation method thereof |
-
2017
- 2017-12-20 CN CN201711388594.8A patent/CN108276815A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103958637A (en) * | 2011-11-29 | 2014-07-30 | 新田明胶株式会社 | Material for photocurable sealing, sealing method, sealing material, and case using same |
| CN103571291A (en) * | 2012-07-27 | 2014-02-12 | 比亚迪股份有限公司 | Waterproof coating |
| CN103571291B (en) * | 2012-07-27 | 2016-05-04 | 比亚迪股份有限公司 | A kind of water-repellent paint |
| CN104497745A (en) * | 2014-12-15 | 2015-04-08 | 深圳市优宝惠新材料科技有限公司 | Waterproof coating material composition |
| CN107446451A (en) * | 2015-10-16 | 2017-12-08 | 宁波高新区夏远科技有限公司 | A kind of environment-friendly waterproof paint and preparation method thereof |
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Application publication date: 20180713 |