CN108275330A - A kind of method of ceramic package component rapid open - Google Patents
A kind of method of ceramic package component rapid open Download PDFInfo
- Publication number
- CN108275330A CN108275330A CN201710005897.0A CN201710005897A CN108275330A CN 108275330 A CN108275330 A CN 108275330A CN 201710005897 A CN201710005897 A CN 201710005897A CN 108275330 A CN108275330 A CN 108275330A
- Authority
- CN
- China
- Prior art keywords
- component
- chip
- envelope body
- ceramics
- kaifeng
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B69/00—Unpacking of articles or materials, not otherwise provided for
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
Present invention is disclosed a kind of methods of ceramic package component rapid open, and this approach includes the following steps：A, the component sample to break a seal is needed with x-ray fluoroscopy instrument shooting, to determine the corresponding position of chip；B, plain grinding is carried out until stopping plain grinding when away from chip surface 0.5mm~1mm to the ceramics envelope body above chip position with file；C, component sample is wrapped to using copper foil and is removed the copper foil for the position that needs to break a seal；D, it prepares corrosive liquid and is heated to boiling；E, the component sample wrapped is immersed in the corrosive liquid of boiling, it is rapid after 5 seconds and be put into acetone soln and cleaned；F, Kaifeng situation is observed, if ceramics envelope body removal is incomplete, repeats step E until ceramics envelope body removal is clean；G, ceramics envelope body is removed complete component to be put into the beaker for filling acetone soln, then beaker is put into supersonic wave cleaning machine and carries out oscillation cleaning, be dried after residue is cleaned up, complete the Kaifeng of component.
Description
【Technical field】
The present invention relates to a kind of methods of ceramic package component rapid open.
【Background technology】
Commonly a kind of destructive testing when component Kaifeng is failure analysis, mainly for encapsulation component.For pottery
Porcelain encapsulation component generally erodes the packaging body outside component using nitration mixture, it is made to expose inside chip or lead,
To carry out subsequent analysis.Automatic Kaifeng machine is generally used to break a seal in the industry, the advantages of Kaifeng machine Kaifeng is to compare peace automatically
Entirely, but automatic mail opener have the shortcomings that it is following：One, automatic mail opener cost is higher, and instrument price is generally in 200,000 people
Coin or so, and subsequently need constantly to buy some patent acid solutions and instrument maintenance maintenance to instrument supplier, for medium-sized and small enterprises
It is a white elephant；Two, cannot control corrosion rate time well, can only according to personal experience come setting time, if when
Between it is too short, cannot chip surface ceramics seal body it is cleared, if the time is too long, the copper wire on chip is possible to be corroded, and
And the size of component surface Kaifeng window depends entirely on the jig of coordinative composition of equipments in testing, and cannot arbitrarily set as needed
The position in Kaifeng.
In conjunction with the above analysis, how efficient, high-precision Kaifeng to be carried out to component and realizes that fast and low-cost breaks a seal
The problem of, become failure analysis field urgent problem to be solved.
【Invention content】
The purpose of the present invention is to provide a kind of ceramic package component opening method, step is simple, it is easy to operate, open
It is short, of low cost to seal the time.
To achieve the above object, the present invention takes following technical scheme：A kind of side of ceramic package component rapid open
Method includes the following steps：
A, the component sample to break a seal is needed with x-ray fluoroscopy instrument shooting, shooting X-ray photos are to determine that chip is corresponding
Position；
B, plain grinding, the ceramics envelope of gradual plain grinding removal chip surface are carried out to the ceramics envelope body above chip position with file
Body stops plain grinding when until plain grinding is away from chip surface 0.5mm~1mm；
C, component sample is wrapped using copper foil, removes the copper foil for the position that needs to break a seal on component sample；
D, Kaifeng corrosive liquid is prepared, and corrosive liquid is heated to boiling；
E, the component sample wrapped is immersed in the corrosive liquid of boiling, takes out component sample after 5 seconds rapidly, puts
Enter and cleaned into acetone soln, removes the ceramics envelope body on component chip；
F, Kaifeng situation is observed, if ceramics envelope body removal is incomplete, repeats step E, until ceramics envelope body removal is clean；
G, ceramics envelope body is removed complete component to be put into the beaker for filling acetone soln, then beaker is put into ultrasound
Oscillation cleaning is carried out in wave cleaning machine, is dried after the residue of chip surface is cleaned up, and the Kaifeng of component is completed.
As a preferred embodiment of the present invention, with file, by ceramics envelope body on chip, to carry out plain grinding straight in the step B
To the position away from chip surface about 0.5mm.
As a preferred embodiment of the present invention, the corrosive liquid in the step D is the mixed acid solution of boiling.
As a preferred embodiment of the present invention, the corrosive liquid in the step D is concentrated nitric acid, the concentrated sulfuric acid and hydrofluoric acid group
At mixed acid, volume ratio 10：5：2.
Compared with prior art, the present invention has the advantages that：
1, the method for the present invention step be simple and convenient to operate, the time of breaking a seal it is short, can be with fast accurate really to the member of ceramic package
The chip of device is broken a seal and is broken a seal completely；
2, the method for the present invention can observe the extent of corrosion of component sample at any time, can avoid during Kaifeng to chip and
The damage of lead；
3, auxiliary implement, material and the corrosion reagent that the method for the present invention uses are easy to acquirement and of low cost, a large amount of saving
The cost in Kaifeng, can bring certain economic benefit to enterprise.
【Specific implementation mode】
In order to make those skilled in the art more fully understand the present invention, with reference to specific embodiment to the skill of the present invention
Art scheme is described in detail.
A kind of method of ceramic package component rapid open, this approach includes the following steps：
1, chip position is determined：Need the component sample that breaks a seal with x-ray fluoroscopy instrument shooting, shooting X-ray photos with
Determine the corresponding position of chip.
2, sample preparation：Plain grinding is carried out to the ceramics envelope body above chip position with file, gradual plain grinding removes chip list
The ceramics envelope body in face then uses copper foil by component sample until stopping plain grinding when away from the chip surface positions about 0.5mm~1mm
Product wrap, and then remove the copper foil for the position that needs to break a seal on component sample.
3, raw material prepare：The raw material prepared are needed to have：Analyze the pure concentrated sulfuric acid, the pure concentrated nitric acid of analysis, the pure fluorination of analysis
If hydrogen, acetone, dropper only, beaker it is several.
4, corrosion acid solution is prepared：The pure concentrated sulfuric acid, the pure concentrated nitric acid of analysis will be analyzed and analyze pure hydrogen fluoride according to 10:5:2
Volume ratio is prepared.
5, heating corrosion acid solution：Prepared corrosion acid solution is heated to boiling.
6, sample etches：The component sample prepared is immersed in the corrosion acid solution of boiling, takes out member after 5 seconds rapidly
Device example is put into acetone soln and is cleaned, and the ceramics envelope body on component chip is removed；Kaifeng situation is observed, such as
Fruit ceramics seal body removal not exclusively, constantly repeat above operation, until the removal of ceramics envelope body is totally, i.e. the chip of component is whole
It exposes.
7, sample clean：Ceramics envelope body is removed complete component to be put into the beaker for filling acetone soln, then will be burnt
Cup, which is put into supersonic wave cleaning machine, carries out oscillation cleaning, is dried after the residue of chip surface is cleaned up, and completes member
The Kaifeng of device.
The method of the present invention step is simple and convenient to operate, the time of breaking a seal is short, can be with fast accurate really to first device of ceramic package
The chip of part breaks a seal, and it is complete to break a seal；This method can observe the extent of corrosion of component sample at any time, can avoid Kaifeng
In the process to the damage of chip and lead；And auxiliary implement, material and the corrosion reagent that this method uses are easy to acquirement and cost
It is cheap, the cost in Kaifeng is substantial saved, certain economic benefit can be brought to enterprise.
The above is only the specific implementation mode of the present invention, is not intended to limit the present invention in any form.It is any
Those skilled in the art, without departing from the scope of the technical proposal of the invention, all using above-mentioned method to this
The changes and modifications that inventive technique scheme is made, or it is revised as the equivalent embodiment of equivalent variations.Therefore, protection model of the invention
Enclosing be determined by the scope of protection defined in the claims.
Claims (4)
1. a kind of method of ceramic package component rapid open, it is characterised in that：This approach includes the following steps：
A, the component sample to break a seal is needed with x-ray fluoroscopy instrument shooting, shooting X-ray photos are to determine the corresponding position of chip
It sets；
B, plain grinding being carried out to the ceramics envelope body above chip position with file, the ceramics of gradual plain grinding removal chip surface seal body,
Stop plain grinding when until plain grinding is away from chip surface 0.5mm~1mm；
C, component sample is wrapped using copper foil, removes the copper foil for the position that needs to break a seal on component sample；
D, Kaifeng corrosive liquid is prepared, and corrosive liquid is heated to boiling；
E, the component sample wrapped is immersed in the corrosive liquid of boiling, takes out component sample after 5 seconds rapidly, is put into
It is cleaned in acetone soln, removes the ceramics envelope body on component chip；
F, Kaifeng situation is observed, if ceramics envelope body removal is incomplete, repeats step E, until ceramics envelope body removal is clean；
G, ceramics envelope body is removed complete component and is put into the beaker for filling acetone soln, then that beaker is put into ultrasonic wave is clear
Oscillation cleaning is carried out in washing machine, is dried after the residue of chip surface is cleaned up, and the Kaifeng of component is completed.
2. a kind of method of ceramic package component rapid open described in claim 1, it is characterised in that：In the step B
Ceramics envelope body on chip is subjected to plain grinding until the position away from chip surface about 0.5mm with file.
3. a kind of method of ceramic package component rapid open described in claim 1, it is characterised in that：In the step D
Corrosive liquid be boiling mixed acid solution.
4. a kind of method of ceramic package component rapid open described in claim 1, it is characterised in that：In the step D
Corrosive liquid be concentrated nitric acid, the concentrated sulfuric acid and hydrofluoric acid composition mixed acid, volume ratio 10：5：2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710005897.0A CN108275330A (en) | 2017-01-05 | 2017-01-05 | A kind of method of ceramic package component rapid open |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710005897.0A CN108275330A (en) | 2017-01-05 | 2017-01-05 | A kind of method of ceramic package component rapid open |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108275330A true CN108275330A (en) | 2018-07-13 |
Family
ID=62800358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710005897.0A Pending CN108275330A (en) | 2017-01-05 | 2017-01-05 | A kind of method of ceramic package component rapid open |
Country Status (1)
| Country | Link |
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| CN (1) | CN108275330A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110328211A (en) * | 2019-06-19 | 2019-10-15 | 东莞高伟光学电子有限公司 | It is a kind of for separating the separation method and chemical reagent of nonmetallic sensor |
| CN111180361A (en) * | 2019-12-13 | 2020-05-19 | 贵州航天计量测试技术研究所 | Wet unsealing method for plastic package device |
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| CN102339732A (en) * | 2011-08-11 | 2012-02-01 | 上海华碧检测技术有限公司 | Method for quickly unsealing small component |
| CN102419336A (en) * | 2011-08-16 | 2012-04-18 | 上海华碧检测技术有限公司 | Unpackaging method for tiny components |
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| CN102509693A (en) * | 2011-10-19 | 2012-06-20 | 广东步步高电子工业有限公司 | Chemical unsealing method of plastic package electronic component using aluminum wire as connecting wire and preparation method of etching solution used in chemical unsealing method |
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| CN104008956A (en) * | 2014-06-06 | 2014-08-27 | 航天科工防御技术研究试验中心 | Unsealing method for flip chip device |
| US9275864B2 (en) * | 2013-08-22 | 2016-03-01 | Freescale Semiconductor,Inc. | Method to form a polysilicon nanocrystal thin film storage bitcell within a high k metal gate platform technology using a gate last process to form transistor gates |
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| JP2734839B2 (en) * | 1991-10-09 | 1998-04-02 | シャープ株式会社 | Etching solution for aluminum, etching method and aluminum etching product |
| CN102339732A (en) * | 2011-08-11 | 2012-02-01 | 上海华碧检测技术有限公司 | Method for quickly unsealing small component |
| CN102419336A (en) * | 2011-08-16 | 2012-04-18 | 上海华碧检测技术有限公司 | Unpackaging method for tiny components |
| CN102426121A (en) * | 2011-08-30 | 2012-04-25 | 上海华碧检测技术有限公司 | Method for unsealing component at fixed point |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110328211A (en) * | 2019-06-19 | 2019-10-15 | 东莞高伟光学电子有限公司 | It is a kind of for separating the separation method and chemical reagent of nonmetallic sensor |
| CN110328211B (en) * | 2019-06-19 | 2022-02-01 | 东莞高伟光学电子有限公司 | Separation method and chemical reagent for separating nonmetal sensor |
| CN111180361A (en) * | 2019-12-13 | 2020-05-19 | 贵州航天计量测试技术研究所 | Wet unsealing method for plastic package device |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180713 |
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| RJ01 | Rejection of invention patent application after publication |