CN108270698A - Switch backplane interconnect device and method based on the nonopiate frameworks of crossbar - Google Patents
Switch backplane interconnect device and method based on the nonopiate frameworks of crossbar Download PDFInfo
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- CN108270698A CN108270698A CN201611259393.3A CN201611259393A CN108270698A CN 108270698 A CN108270698 A CN 108270698A CN 201611259393 A CN201611259393 A CN 201611259393A CN 108270698 A CN108270698 A CN 108270698A
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- substrate
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- serdes
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L49/00—Packet switching elements
- H04L49/10—Packet switching elements characterised by the switching fabric construction
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L49/00—Packet switching elements
- H04L49/40—Constructional details, e.g. power supply, mechanical construction or backplane
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Use Of Switch Circuits For Exchanges And Methods Of Control Of Multiplex Exchanges (AREA)
- Structure Of Telephone Exchanges (AREA)
Abstract
The present invention proposes a kind of switch backplane interconnect device and method based on the nonopiate frameworks of crossbar.The switch backplane interconnect device, business board and power board are arranged at intervals at the same side of backboard, it is characterized in that, described device, including business connector for substrate and exchange connector for substrate, the high speed serdes of the business connector for substrate, which divides equally, is connected to the exchange connector for substrate, and the high speed serdes is mutually parallel, and optimizes backboard Networking Design scheme.
Description
Technical field
The present invention relates to switch technical field more particularly to a kind of friendships based on the nonopiate frameworks of crossbar
It changes planes backboard interconnect device and method.
Background technology
Corsspoint switch matrix crossbar switching networks are the preferred switching networks for being used to build hicap that industry is generally acknowledged
Network structure, the extended capability of the switching network is very strong, and exchange capacity is very big.At present, most data switching exchane is used and is based on
Crossbar architecture for exchanging, wherein the switch system based on nonopiate framework, can realize in machine system for greater flexibility
High speed serdes is interconnected, and is realized the significantly diminution of device height and depth, is met in the limited computer room in space.
But in nonopiate framework, the high speed serdes interactions between power board and business board pass through the height on backboard
Fast Serdes interconnection is realized, increases the difficulty of backboard Networking Design.Therefore, it is necessary to one kind to be based on the nonopiate framves of crossbar
The switch backplane interconnect device and method of structure, to solve the above-mentioned technical problems in the prior art.
Invention content
The present invention provides a kind of switch backplane interconnect device and method based on the nonopiate frameworks of crossbar, optimizes
Backboard interconnection scheme.
The technical solution adopted by the present invention is：A kind of mutual multi pack of switch backplane based on the nonopiate frameworks of crossbar
It puts, under the nonopiate frameworks of crossbar, business board and power board are arranged at intervals at the same side of backboard, wherein, described device,
Including business connector for substrate and connector for substrate is exchanged, the high speed serdes of the business connector for substrate, which divides equally, is connected to the exchange
Connector for substrate, and the high speed serdes is mutually parallel.
Preferably, the quantity for exchanging connector for substrate is equal to the quantity of the business board, if the number of the business board
It is w to measure, each described business board has x exchange chip, and the serdes pin assignments of each exchange chip are described in y
Business connector for substrate, then the quantity of each business connector for substrate be connected to each institute for the high speed serdes of x*y/w
Exchange connector for substrate is stated, x, y and w are positive integer.
Preferably, the high speed serdes of the business connector for substrate is from the phase of the serdes pins of the business connector for substrate
Gap between the reference GND holes of adjacent column is pierced by.
Preferably, if the quantity of the serdes pins of the business connector for substrate is z, each described business board connects
The quantity of routing layer of the device on the backboard is connect no more than z/6, z is positive integer.
The present invention also provides a kind of switch backplane interconnected method based on the nonopiate frameworks of crossbar,
Under the nonopiate frameworks of crossbar, business board and power board are arranged at intervals to the same side of backboard, including：By the business board
The high speed serdes of connector, which divides equally, is connected to the exchange connector for substrate, and the high speed serdes is mutually parallel.
Preferably, the high speed serdes by the business connector for substrate, which divides equally, is connected to the exchange connector for substrate,
It specifically includes：If the quantity of the business board is w, each described business board has x exchange chip, by each exchange core
The quantity of each business connector for substrate is then x* in the y business connector for substrate by the serdes pin assignments of piece
The high speed serdes of y/w is connected to each described exchange connector for substrate, and x, y and w are positive integer.
Preferably, the high speed serdes by the business connector for substrate, which divides equally, is connected to the exchange connector for substrate,
And before so that the high speed serdes is mutually parallel, the method further includes：By the high speed of the business connector for substrate
Serdes is pierced by from the gap between the reference GND holes of the adjacent column of the serdes pins of the business connector for substrate.
In addition, the present invention also provides a kind of switch backplane, including according to the mutual multi pack of switch backplane described above
It puts.
Using above-mentioned technical proposal, the present invention at least has following effect：
The switch backplane interconnect device based on the nonopiate frameworks of crossbar proposed using this patent, by by business
The high speed serdes of connector for substrate respectively is connected to exchange connector for substrate, and optimal change machine backboard reduces switch backplane life
Produce cost.
Description of the drawings
Fig. 1 is the schematic diagram of first embodiment of the invention switch backplane interconnect device；
Fig. 2 is the schematic diagram of second embodiment of the invention switch backplane interconnect device；
Fig. 3 is that the high speed serdes of business connector for substrate in third embodiment of the invention switch backplane interconnect device shows
It is intended to；
Fig. 4 is the flow chart of fourth embodiment of the invention switch backplane interconnected method；
Fig. 5 is business connector for substrate high speed serdes connections in fifth embodiment of the invention switch backplane interconnected method
First schematic diagram；
Fig. 6 is business connector for substrate high speed serdes connections in fifth embodiment of the invention switch backplane interconnected method
Second schematic diagram；
Fig. 7 is the flow chart of sixth embodiment of the invention switch backplane interconnected method.
Specific embodiment
The technological means and effect taken further to illustrate the present invention to reach predetermined purpose, below in conjunction with attached drawing
And preferred embodiment, the present invention is described in detail as after.
Switch backplane interconnect device provided by the invention based on the nonopiate frameworks of crossbar optimizes the interchanger back of the body
Plate interconnection scheme reduces switch backplane production cost.The mutual multi pack of switch backplane of the present invention will be described in detail belows
It puts and its various pieces.
First embodiment
The switch backplane interconnect device based on the nonopiate frameworks of crossbar of the present embodiment, between business board and power board
Every the same side for being set to backboard, wherein, which connects including business connector for substrate with power board
Device, the high speed serdes of business connector for substrate, which divides equally, is connected to exchange connector for substrate, and the high speed serdes is mutually parallel.
As shown in Figure 1, the exchange chip of business board is allocated in the exchange chip of power board, the exchange chip of business board, which is divided equally, to be distributed
The serdes pins of business connector for substrate, the exchange chip of power board divide equally the serdes pins for distributing and exchanging connector for substrate, so
The height of the serdes pins interconnection realization business connector for substrate of the serdes pins of business connector for substrate and exchange connector for substrate afterwards
Fast serdes, which divides equally, is connected to exchange connector for substrate.Draw in addition, high speed serdes is mutually parallel including a business connector for substrate
All high speed serdes gone out are mutually parallel, and the high speed serdes that business connector for substrate is drawn respectively two-by-two is mutually parallel,
It prevents high speed serdes from intersecting, reduces the quantity of routing layer.
According to the principle of the nonopiate framework frameworks of crossbar, the high speed serdes between business board and power board passes through industry
Business connector for substrate and exchange connector for substrate are realized, and follow two big principles in the cabling of backboard：Principle 1, the friendship of business board
The high speed serdes for changing chip wants mean allocation in all power boards；Principle 2, the pin assignments of power board support the friendship of business board
The serdes pins of chip are changed, and the pin assignments of power board support the compatibility of power board, that is, exchange the pipe of connector for substrate
Foot distributes, and ensures that the transmitting-receiving of serdes (transmission link TX, receives link RX) pin of the exchange chip of power board, polarity are opposite
It should.Preferably, the pin number for exchanging connector for substrate supports the high speed serdes of business connector for substrate.
Based on mentioned above principle, the high speed serdes mean allocations of business connector for substrate are in exchanging connector for substrate, and described
High speed serdes is mutually parallel.Assuming that the quantity of power board is 2, the line sequence of the high speed serdes of business connector for substrate is a b
The line sequence a b c d of the high speed serdes of business connector for substrate are connected on two power boards by c d two-by-two respectively, so as to real
The high speed serdes of all exchange chips of an existing business board, which divides equally, is interconnected to power board, and high speed serdes is mutually flat
Row.
Second embodiment
On the basis of first embodiment, the number of the exchange connector for substrate in the switch backplane interconnect device of the present embodiment
Amount is equal to the quantity of business board, if the quantity of business board is w, each business board has x exchange chip, each exchange
The serdes pin assignments of chip are the high speed of x*y/w in y business connector for substrate, the then quantity of each business connector for substrate
Serdes is connected to each and exchanges connector for substrate.Ensure that the high speed serdes of business board divides equally in all power boards, x, y and
W is positive integer.
3rd embodiment
As shown in figure 3, on the basis of first embodiment and second embodiment, the high speed serdes of business connector for substrate
(outlet 1 and 6) is pierced by from the gap between the reference GND holes of the adjacent column of the serdes pins of business connector for substrate.Thus it sees
Go out, in the outlet method of business connector for substrate, on the basis of common outlet method is retained (outlet 2-5), then in serdes
Outlet is done in gap between the GND pins (the solid black color dot in Fig. 3 represents) of pin adjacent column, is interchanger complete machine lamination
Reduce space.
Preferably, if the quantity of the serdes pins of business connector for substrate is z, each business connector for substrate
For the quantity of routing layer on backboard no more than z/6, z is positive integer.
Under conditions of the quantity of the serdes pins of the business connector for substrate of the preferred embodiment is z, outlet is commonly used
Mode is from serdes pins and GND pins (i.e. the reference pin of serdes signals, play the role of protection signal integrality)
Between gap in outlet, each business connector for substrate in this way can only go out 4 high speeds in a routing layer of backboard
(as shown in fig. 6, be only a part for business connector for substrate in figure, solid black color dot represents GND pins, hollow to serdes in figure
Circle represents serdes pins).Therefore, the quantity of each routing layer of the business connector for substrate on backboard is about in the prior art
Z/4.In the case of preferred embodiment using the present embodiment, if between the reference GND holes of the adjacent column of serdes pins
Gap in outlet, then each routing layer have more at least two serdes, therefore, each business connector for substrate is on backboard
Routing layer quantity no more than z/6, relative to the prior art, the quantity of the routing layer of this preferred embodiment reduces 1/3,
Due to the enormous amount of the high speed serdes of business board, the quantity for occupying routing layer is larger, therefore this preferred embodiment is from entirety
The quantity of the upper routing layer for reducing switch backplane, the lamination for having well solved backboard is difficult, greatly reduces adding for backboard
Work cost.
Fourth embodiment
As shown in figure 4, present embodiments provide a kind of switch backplane interconnection side based on the nonopiate frameworks of crossbar
Business board and power board are arranged at intervals at the same side of backboard by method, including：Step S10：By the high speed of business connector for substrate
Serdes, which divides equally, is connected to exchange connector for substrate, and the high speed serdes is mutually parallel.
As shown in Fig. 2, according to aforementioned principle, each exchange chip on business board 1 is allocated in each business board and is connected
It meets 4 on device high speed serdes to be connected to two-by-two on power board 1 and power board 2 respectively so that all exchange cores on business board 1
The high speed serdes mean allocations of piece are on power board 1 and power board 2, and then, business board 2,3,4 also in the same way, is incited somebody to action
The high speed serdes mean allocations of its exchange chip realize the height of 4 business boards of interchanger in power board 1 and power board 2
Fast serdes mean allocations are in all power boards.
The high speed serdes of business board and power board can be well realized in the switch backplane interconnected method of the present embodiment
Interconnection, it is not necessary to consider the number of business connector for substrate, regularity is strong.
5th embodiment
On the basis of fourth embodiment, in switch backplane interconnected method provided in this embodiment, step S10：By industry
The high speed serdes of business connector for substrate, which divides equally, is connected to exchange connector for substrate, specifically includes：If the quantity of business board is w, often
One business board has x exchange chip, by the serdes pin assignments of each exchange chip in y business connector for substrate, then
The high speed serdes that the quantity of each business connector for substrate is x*y/w is connected to each and exchanges connector for substrate, x, y and w
It is positive integer.
As shown in Figure 2, Figure 5 and Figure 6, the quantity of business board is 4, and the quantity of power board is 2, each business board has
6 exchange chips, for the high speed serdes mean allocations of each exchange chip in n business connector for substrate, each exchanges core
The quantity that piece is allocated in the high speed serdes on each business connector for substrate is 4, then is divided on each business connector for substrate
The total quantity of high speed serdes matched is 4*6=24, and the quantity for exchanging connector for substrate is equal to the quantity of business board, and exchange
The pin number of connector for substrate supports all high speed serdes of business board, the height thus distributed on each business connector for substrate
Fast serdes line sequences for a b c d, e f g h, i j k l, m n o p ....In Fig. 6, the of business board 1
The high speed serdes line sequences distributed on one business connector for substrate are a b c d, the high speed distributed on the second business connector for substrate
Serdes line sequences for e f g h, and so on.First business connector for substrate of business board 2 to the n-th business connector for substrate is also this
Sample setting.
Then, 6 on the first layer of backboard routing layer first each business connector for substrate by business board 1, business board 4
The serdes a whole outlets of a exchange chip are connected to power board 1 (first business connector for substrate 1 is shown in the figure),
Can also be the different line sequences of 6 exchange chips high speed serdes combination outlet be distributed on first layer routing layer.Here it is false
If the line sequence a of 6 exchange chips b c d can same layer outlet.
Then, it is in the second layer of backboard routing layer that the serdes b of business board 1,6 exchange chips of business board 4 is whole
Outlet is connected to power board 1 (Fig. 5 and Fig. 6 are not shown).
Furthermore correspondingly by serdes c, the d of 6 exchange chips of business board 1,4 third layer routing layer, the 4th layer
Routing layer is connected respectively to power board 2, and Fig. 6 is illustrated that the serdes c of 6 exchange chips of business board 1 in third layer cabling
Layer is connected respectively to power board 2；
Similar to above-mentioned steps, by the high speed serdes that second business connector for substrate line sequence of business board 1 is e f g h
Mean allocation is in power board 1 and power board 2.
Similar to above-mentioned steps, the high speed serdes line sequences of each business connector for substrate of business board 2,3 and 4 are put down
It is all connected to power board 1 and power board 2.
As can be seen that all high speed serdes of 4 business boards are connected to 2 friendships using 8 High speed rear panel routing layers
Plate is changed, realizes interconnections of the high speed serdes between business board and power board.
Sixth embodiment
As shown in fig. 7, on the basis of fourth embodiment, step S10：The high speed serdes of business connector for substrate is equal
Exchange connector for substrate point is connected to, and before so that the high speed serdes is mutually parallel, the switch backplane of the present embodiment
Interconnected method further includes：Step S20：By the high speed serdes of business connector for substrate from the serdes pins of business connector for substrate
Adjacent column reference GND holes between gap be pierced by.
The high speed serdes of business connector for substrate, from the gap between the reference GND holes of the adjacent column of serdes pins
It draws, each business connector for substrate at least draws 6 high speed serdes, therefore for each business on a routing layer
24 serdes pins of connector for substrate, using not more than 4 routing layers can be by the high speed of a business connector for substrate
Serdes whole outlets.
As shown in Figure 5 and Figure 6, the quantity of business board has 4, and the outlet simultaneously of business board 1 and 4, business board 2 and 3 goes out simultaneously
Line, thus the high speed serdes of interchanger complete machine using 8 routing layers can whole outlets, utilize the interchanger of the present embodiment
Backboard interconnected method can save 8 routing layers in switch backplane Networking Design.
Using the switch backplane interconnected method of the present embodiment, the high speed between the power board and business board of interchanger
Serdes is more, and the number of plies that can save routing layer is more, more apparent in the effect of back veneer stack-design saliency, very great Cheng
Degree ground reduces the processing cost of backboard.
7th embodiment
In addition, the present invention also provides a kind of switch backplane, including according to the mutual multi pack of switch backplane described above
It puts.
By the explanation of specific embodiment, should can to the present invention for reach technological means that predetermined purpose is taken and
Effect is able to more go deep into and specific understanding, however appended diagram is only to provide reference and description and is used, and is not used for originally
Invention limits.
Claims (8)
1. a kind of switch backplane interconnect device based on the nonopiate frameworks of crossbar, business board and power board are arranged at intervals at
The same side of backboard, which is characterized in that described device including business connector for substrate and exchanges connector for substrate, and the business board connects
The high speed serdes for connecing device is respectively connected to the exchange connector for substrate, and the high speed serdes is mutually parallel.
2. switch backplane interconnect device according to claim 1, which is characterized in that the quantity for exchanging connector for substrate
It is equal to the quantity of the business board, if the quantity of the business board is w, each described business board has x exchange chip,
The serdes pin assignments of each exchange chip are in y business connector for substrate, then each described business connector for substrate
Quantity be x*y/w high speed serdes be connected to each described exchange connector for substrate, x, y and w are positive integer.
3. switch backplane interconnect device according to claim 1 or 2, which is characterized in that the business connector for substrate
High speed serdes is pierced by from the gap between the reference GND holes of the adjacent column of the serdes pins of the business connector for substrate.
4. switch backplane interconnect device according to claim 3, which is characterized in that if the business connector for substrate
The quantity of serdes pins is z, then the quantity of each routing layer of the business connector for substrate on the backboard is little
In z/6, z is positive integer.
5. business board and power board are arranged at intervals by a kind of switch backplane interconnected method based on the nonopiate frameworks of crossbar
In the same side of backboard, which is characterized in that including：
The high speed serdes of the business connector for substrate is divided equally and is connected to the exchange connector for substrate, and causes the high speed
Serdes is mutually parallel.
6. switch backplane interconnected method according to claim 5, which is characterized in that described by the business connector for substrate
High speed serdes divide equally be connected to the exchange connector for substrate, specifically include：
If the quantity of the business board is w, each described business board has x exchange chip, by each exchange chip
The quantity of each business connector for substrate is then x*y/w's in the y business connector for substrate by serdes pin assignments
High speed serdes is connected to each described exchange connector for substrate, and x, y and w are positive integer.
7. switch backplane interconnected method according to claim 6, which is characterized in that described by the business connector for substrate
High speed serdes divide equally and be connected to the exchange connector for substrate, and before so that the high speed serdes is mutually parallel, institute
Method is stated, is further included：
By the high speed serdes of the business connector for substrate from the ginseng of the adjacent column of the serdes pins of the business connector for substrate
The gap examined between GND holes is pierced by.
8. a kind of switch backplane, which is characterized in that including switch backplane according to any one of claim 1 to 4
Interconnect device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611259393.3A CN108270698B (en) | 2016-12-30 | 2016-12-30 | Switchboard backboard interconnection device and method based on crossbar non-orthogonal architecture |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611259393.3A CN108270698B (en) | 2016-12-30 | 2016-12-30 | Switchboard backboard interconnection device and method based on crossbar non-orthogonal architecture |
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| CN108270698A true CN108270698A (en) | 2018-07-10 |
| CN108270698B CN108270698B (en) | 2021-12-14 |
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|---|---|
| CN108270698B (en) | 2021-12-14 |
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