CN108247233A - Preparation method of the alkali cleaning without brazing flux or vacuum brazing plate - Google Patents
Preparation method of the alkali cleaning without brazing flux or vacuum brazing plate Download PDFInfo
- Publication number
- CN108247233A CN108247233A CN201711327691.6A CN201711327691A CN108247233A CN 108247233 A CN108247233 A CN 108247233A CN 201711327691 A CN201711327691 A CN 201711327691A CN 108247233 A CN108247233 A CN 108247233A
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- CN
- China
- Prior art keywords
- brazing
- layer
- alloy
- aluminium
- sodium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 84
- 238000004140 cleaning Methods 0.000 title claims abstract description 47
- 230000004907 flux Effects 0.000 title claims abstract description 34
- 239000003513 alkali Substances 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 238000005476 soldering Methods 0.000 claims abstract description 26
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 25
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 23
- 239000000956 alloy Substances 0.000 claims abstract description 23
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000005554 pickling Methods 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 8
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims abstract description 6
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims abstract description 6
- 238000005266 casting Methods 0.000 claims abstract description 6
- 239000004115 Sodium Silicate Substances 0.000 claims abstract description 5
- 238000005098 hot rolling Methods 0.000 claims abstract description 5
- 235000019795 sodium metasilicate Nutrition 0.000 claims abstract description 5
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052911 sodium silicate Inorganic materials 0.000 claims abstract description 5
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000000137 annealing Methods 0.000 claims abstract description 4
- 239000003960 organic solvent Substances 0.000 claims abstract description 4
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 claims abstract description 3
- 238000005097 cold rolling Methods 0.000 claims abstract description 3
- 235000017557 sodium bicarbonate Nutrition 0.000 claims abstract description 3
- 229910000030 sodium bicarbonate Inorganic materials 0.000 claims abstract description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 claims abstract description 3
- 239000000176 sodium gluconate Substances 0.000 claims abstract description 3
- 235000012207 sodium gluconate Nutrition 0.000 claims abstract description 3
- 229940005574 sodium gluconate Drugs 0.000 claims abstract description 3
- 239000001488 sodium phosphate Substances 0.000 claims abstract description 3
- 229910000162 sodium phosphate Inorganic materials 0.000 claims abstract description 3
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims abstract description 3
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 claims abstract 2
- 229940048086 sodium pyrophosphate Drugs 0.000 claims abstract 2
- 235000019818 tetrasodium diphosphate Nutrition 0.000 claims abstract 2
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 claims abstract 2
- 229910000838 Al alloy Inorganic materials 0.000 claims description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 239000004411 aluminium Substances 0.000 claims description 11
- 239000011777 magnesium Substances 0.000 claims description 9
- 229910052749 magnesium Inorganic materials 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 8
- 239000004615 ingredient Substances 0.000 claims description 8
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 238000005406 washing Methods 0.000 claims description 7
- -1 aluminium manganese Chemical compound 0.000 claims description 6
- 239000008139 complexing agent Substances 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 230000006798 recombination Effects 0.000 claims description 3
- 238000005215 recombination Methods 0.000 claims description 3
- 229910001051 Magnalium Inorganic materials 0.000 claims description 2
- 239000000356 contaminant Substances 0.000 claims description 2
- 238000011010 flushing procedure Methods 0.000 claims description 2
- 239000003921 oil Substances 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 125000003158 alcohol group Chemical group 0.000 claims 1
- 150000002576 ketones Chemical class 0.000 claims 1
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims 1
- 230000007797 corrosion Effects 0.000 abstract description 9
- 238000005260 corrosion Methods 0.000 abstract description 9
- 239000011856 silicon-based particle Substances 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 2
- 239000003518 caustics Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 48
- 230000003647 oxidation Effects 0.000 description 12
- 238000007254 oxidation reaction Methods 0.000 description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 101100373011 Drosophila melanogaster wapl gene Proteins 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 210000004483 pasc Anatomy 0.000 description 4
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical compound [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 159000000011 group IA salts Chemical class 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000006557 surface reaction Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000004320 controlled atmosphere Methods 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 210000003027 ear inner Anatomy 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 235000003642 hunger Nutrition 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000010731 rolling oil Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 230000001256 tonic effect Effects 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/286—Al as the principal constituent
- B23K35/288—Al as the principal constituent with Sn or Zn
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention discloses a kind of preparation method of alkali cleaning without brazing flux or vacuum brazing plate, include the following steps：Using alloy casting apparatus, ingot casting is cast, annealing is distinguished to sandwich layer, brazing layer, then hot rolling becomes thin plate, then welds together each layer, hot rolling, then carries out cold rolling again, finally anneal, the method being surface-treated before welding includes the following steps：(1) surface of the alkali cleaning without brazing flux or vacuum brazing plate is cleaned with organic solvent；(2) with the product of caustic dip step (1)：One or more of 0 5wt% of sodium gluconate, 0 5wt% of sodium pyrophosphate, 0 10wt% of sodium carbonate, sodium phosphate 0 3%, 0 10wt% of sodium bicarbonate and 0 5wt% of 0 1wt% of NaOH and sodium metasilicate；(3) product of step (2) is cleaned with saturation EDTA solution or saturation aqueous isopropanol；(4) using product pickling of the salpeter solution to step (3)；(5) it washes.The present invention is smaller to silicon particle corrosion, and pollution is small to ensure that good soldering gap, achieves good effect.
Description
Technical field
The present invention relates to a kind of preparation method of alkali cleaning without brazing flux or vacuum brazing plate.
Background technology
The requirement of brazing flux Heat transmission industry development manufactures high-quality material and component with alap ultimate cost, and heat is handed over
The most commonly used is produced in the atmosphere in nitrogen and containing oxygen impurities as a small amount of as possible for parallel operation soldering.This process is referred to as
Controlled atmosphere is brazed (" CAB "), also includes the Nocolok solder flux of Al-K-F base solder flux, such as application, by adding in soldering flux point
Solution, dissolving go oxide film dissolving formation wetting, melting to achieve the purpose that soldering.
But the film of flux residue after soldering, it is typically considered what heat exchanger was harmful to, because they may divide
The aluminium surface of soldering or the inner passage of blocking are dispersed in, is effectively exchanged with heat exchanger heat so as to hinder.Fluoride flux
Residue tightly depends on the surface of aluminium parts after soldering, not readily dissolves, for some labyrinths, such as honeycomb, heat
Complexity or slype in exchanger, and be only capable of mechanically wiping, easily it is detained a large amount of residues, it is difficult to clear up completely.
And in having soldering flux brazing process, a large amount of toxic gases are generated, it is serious to damage operator's health and safety.In addition,
In brazing process, the brazing flux of tube interior is remained in, the corrosion rate of material is accelerated, heat exchanger is caused to be perforated, reduce
Heat exchanger service life.
In the 1970s, occurring as soon as vacuum or inert gas shielding soldering processes.The expansion of magnesium of this kind of technology utilization
It dissipates phenomenon and is easy to volatilize and pierce through from almag the oxidation film on its surface, make the characteristic of solder metal flow.This kind
Technique eliminates the necessity that residue after chloride, fluoride soldering is removed, reduce soldering and to corrosion of aluminium alloy and
Hinder the influence of radiator heat conduction.But it is stringent due to requiring brazing process vacuum degree and oxygen content, once sent out for some time
It postpones slow.In recent years, Bi, Mg element are added in due to adding in middle layer or coating and brazing layer, to vacuum degree and oxygen content
It is required that decreasing, solder without soldering acid technology grows up again, and depth is expected by client.But these solder without soldering acid technologies respectively have
Shortcoming still needs to constantly improve raising,
103347643 A of WO 2010052231 A1 and CN each provides a kind of no brazing flux material structure, both nothings
Brazing flux material patent is all brazing layer in outermost, when be brazed atmosphere oxygen content it is higher when, brazing layer is higher containing magnesium and for a long time
Diffusion, forms a large amount of magnesia, also hinders soldered fitting fusion.In addition, though it is very high to vacuum degree and oxygen content requirement, it
Ask outside several ppm, brazing member river that namely several ppm, but since inside is confined space, outside is equivalent to out oxygen content
Between emptying, brazing member exterior space relative interior space is infinitely great, causes interior welds intact, external since oxygen content is opposite
Higher reason, oxidation is severe, forms thicker oxidation film, and welding quality is bad, this is that bottleneck at present without brazing flux industry is asked
Topic.
For this problem, the influence that a kind of new method reduces or eliminates oxidation film is developed, is the industry task of top priority.
US2015053751A1 discloses a kind of method of alkali cleaning, but the material alloys, not containing magnesium, the volatilization of no magnesium is gone out and is brazed
The several ppm oxygen of exterior space or steam reaction are very difficult to, except influence of the exterior space oxygen to oxidation film, soldering be caused still to have insatiable hunger
It is full.
Invention content
The object of the present invention is to provide a kind of preparation method of alkali cleaning without brazing flux or vacuum brazing plate, to overcome the prior art
Existing drawbacks described above.
The alkali cleaning is without brazing flux or vacuum brazing material, including brazing layer and sandwich layer；
The sandwich layer one or both sides are brazing layers；
Preferably, soldering internal layer is further included, the soldering internal layer is arranged between brazing layer and sandwich layer；
The sandwich layer is：1xxx or 3xxx or 5xxx or 6xxx or 7xxx；
It is alloy that term 1xxx, which represents aluminium alloy 1, i.e. commercial-purity aluminium；
It is alloy that term 3xxx, which represents aluminium alloy 3, i.e., using aluminium manganese as a series of alloys of essential element；
It is alloy that term 5xxx, which represents aluminium alloy 5, i.e., using magnalium as a series of alloys of essential element；
It is alloy that term 6xxx, which represents aluminium alloy 6, i.e., using aluminium silicon magnesium as a series of alloys of essential element；
It is alloy that term 7xxx, which represents aluminium alloy 7, i.e., using aluminium zinc-magnesium copper as a series of alloys of essential element.
The brazing layer contains the ingredient of following mass percent：
Si 5-15%, Fe<0.3%, Mg 0-2%, Zn 0-5%, Bi0-0.3%, remaining is aluminium；
When equipped with soldering internal layer, the soldering internal layer contains the ingredient of following mass percent：
Si 5-15%, Fe<0.3%, Mg 0-2%, Zn 0-5%, Bi0-0.3%, remaining is aluminium；
Brazing layer contains the ingredient of following mass percent：
Si3-11%, Fe≤0.3%, Bi0-0.3%, Zn 0-1%, remaining is aluminium；
Preferably, the brazing layer contains the ingredient of following mass percent：
Si3-10%, Fe≤0.3%, Bi0-0.2%, Zn 0-1%, remaining is aluminium；
It is furthermore preferred that the brazing layer contains the ingredient of following mass percent：
Si 4.5-10%, Fe≤0.26%, Bi0-0.15%, Zn 0-1%, remaining is aluminium；
For the multilayer aluminium alloy without brazing flux material, recombination rate is as follows：
It is compound than being 0.1-10% to be brazed outer layer, it is preferably compound than being 0.2-5%；
Brazing layer is compound than being 5-20%, preferably compound than being 6-12%；
Remaining is sandwich layer recombination rate.
The compound percentage than referring to total material shared by layers of material in Al alloy composite, this specific hair
Bright namely each layer thickness accounts for overall thickness percentage.
The alkali cleaning is without brazing flux or vacuum brazing plate, and overall thickness is in 0.1mm to 3mm；
Preparation method of the alkali cleaning without brazing flux or vacuum brazing plate, includes the following steps：
Using alloy casting apparatus, cast ingot casting, to sandwich layer, brazing layer respectively 480~500 DEG C of homogenizing annealings 1~
2h, then hot rolling become thin plate, then weld together each layer, carry out hot rolling at 480-500 DEG C, then carry out cold rolling again,
It finally anneals, annealing temperature is 350 DEG C, and the time is 1~2h, you can obtains product.
The alkali cleaning is suitable for preparing heat exchanger without brazing flux or vacuum brazing plate.
It can ensure the mechanical performance of the alkali cleaning without brazing flux or vacuum brazing plate, be capable of the big production alkali cleaning of scale can
Can, alkali cleaning aluminium alloy needs economic scale, meets production of large quantities, removes oxide film dissolving, guarantees pouring inert gas
Under the conditions of atmosphere or vacuum brazing, no brazing flux can realize good welds.
Aluminium alloy for producing greatly will pass through multiple step process, in the operation of rolling, more or less without brazing flux material
There will be ROLLING OIL remaining, be surface-treated before welding, processing method includes the following steps：
(1) surface and oil contaminant is cleared up：Using the organic solvent such as cleaning such as alcohol, the acetone alkali cleaning without brazing flux or vacuum pricker
The surface of welding plate；
(2) alkali cleaning, using the product of lye component cleaning step (1) matched as follows：Sodium gluconate 0-5wt%, burnt phosphorus
One or more of sour sodium 0-5wt%, sodium carbonate 0-10wt%, sodium phosphate 0-3%, sodium bicarbonate 0-10wt%；
Then NaOH 0-1wt% and sodium metasilicate 0-5wt% are added in, the preferably weight content of NaOH is less than 0.5%, adds in
Sodium metasilicate can play corrosion inhibition, control reaction rate, hinder alkaline excessively high and pasc reaction.
Cleaning temperature is 30~90 DEG C, and the time is 20~90 seconds；
(3) complexing agent cleans, and the product of step (2) is complexed using saturation EDTA solution or saturation aqueous isopropanol
Cleaning；
(4) pickling uses weight concentration to carry out pickling, cleaning to the product of step (3) for the salpeter solution of 0.05-1%
Remained on surface oxide and impurity neutralize alkali；
(5) acid is removed in washing, is precipitated as surface also has, and to pass through the further surface of spray gun flushing method when washing
Cleaning removes surface deposits, then alcohol washes surface.
The present invention is smaller to silicon particle corrosion, does not generate nigrescence phenomenon, and oxidation film can remove, and surface reaction is more equal
It is even, therefore part gap is also than more uniform after punching press, after ensure that good weldability, the present invention add in complexing agent, aluminium ion
It is deposited in solution rapidly.There is no foreign ion to adhere on surface.Highly basic cleaning corrosion silicon particle, highly basic close pasc reaction and significantly produce
The black phenomenon of hair tonic, and the obvious deposition aluminum alloy surface of a large amount of corrosion products.
The present invention is using moderate strength alkaline salt, and instead of highly basic, it is undesirable thoroughly to overcome highly basic cleaning performance, pollution
Seriously, the defects of dangerous big.Because highly basic not only with oxidation reactive aluminum, is also easy to and pasc reaction, highly basic makes piece surface rotten
The very uneven Uniform of erosion, it is difficult to ensure good joint clearance of brazing, by using moderate strength alkaline salt, substantially reduce alkalinity, first
Not with pasc reaction, and the naked leakage of silicon particle is realized, secondary response is uniform, and reaction rate is again less big, can control, and ensures
Good soldering gap.
According to the actual fact, using the method for the present invention cleaning aluminum alloy without brazing flux or vacuum brazing part, no brazing flux or
Weldquality qualification rate after vacuum brazing greatly improves, and is increased to more than 98%；Also increase the mobility of cored solder, pass through reality
Comparison is tested, not by alkali cleaning, surface film oxide hinders soldering acid flowing, and T-shaped experiment welding point is shorter；Such as Fig. 3, oxidation film
It is serious to hinder soldering acid flowing, it is impossible to soldering acid be made to be contacted with aluminum substrate.After alkali cleaning of the present invention, oxidation film removal, naked leakage
Silicon and alloy matrix aluminum have lower fusing point, mobility is hindered without oxidation film, along with the volatilization of magnesium also promotes soldering acid
Flowing.Therefore the T-shaped experiment welding point of the present invention lengthens significantly, and such as Fig. 4 achieves good effect.
Description of the drawings
Fig. 1 is the configuration of surface that alkali cleaning of the present invention is not used, and it is smudgy that oxidation film enables aluminum alloy to matrix pattern.
Fig. 2 is using the configuration of surface after alkali cleaning of the present invention, can significantly find that the method for the present invention makes silicon particle exposed
Outside aluminum substrate, and do not corroded by NaOH, aluminum alloy surface matrix pattern is clear.
Fig. 3 is the T-shaped experiment brazing property of no alkali cleaning.
Fig. 4 is using T-shaped experiment brazing property after alkali cleaning of the present invention.
Fig. 5 is schematic diagram when containing only one layer of brazing layer.
Structure diagram when Fig. 6 is containing two layers of brazing layer.
Fig. 7 is structure diagram when soldering internal layer and brazing layer are equipped with containing sandwich layer side.
Fig. 8 is to be equipped with soldering internal layer and brazing layer containing sandwich layer side, and opposite side is equipped with structure diagram during brazing layer.
Fig. 9 is structure diagram when soldering internal layer and brazing layer are designed with containing sandwich layer both sides.
Specific embodiment
Referring to Fig. 5~Fig. 9, the alkali cleaning is without brazing flux or vacuum brazing material, including brazing layer and sandwich layer, the core
Layer one or both sides are brazing layers；
Preferably, soldering internal layer is further included, the soldering internal layer is arranged between brazing layer and sandwich layer；
Examples 1 to 10 and comparative example 1-2
Table 1
Cleaning method：
(1) embodiment 1,3,5,7,9 and comparative example 1 using alcohol, embodiment 2,4,6,8,10 and comparative example 2 use acetone
Clean the surface without brazing flux or vacuum brazing plate；
(2) alkali cleaning, using the product of the component cleaning steps (1) matched of embodiment 1-10 in table 1；Then according to embodiment
Proportioning adds in sodium hydroxide and sodium metasilicate, cleaning temperature and scavenging period are as shown in table 1；
(3) complexing agent cleans, and the product of step (2) is complexed using saturation EDTA solution or saturation aqueous isopropanol
Cleaning；
(4) pickling carries out the product of step (3) pickling, cleaning remained on surface oxidation using the salpeter solution of 0.1wt%
Object and impurity and neutralization alkali；
(5) acid is removed in washing, if flow velocity occur slower for alkaline cleaning procedure, surface precipitation cannot be removed, will also washing when
Hou Jiayi walks removing surface, removes surface deposits, then alcohol washes surface.
As can be seen from the above table, for embodiment 1-10 to silicon particle, corrosion is smaller, does not generate nigrescence phenomenon, oxidation film can
Removal, surface reaction is than more uniform, therefore part gap also than more uniform, ensure that good weldability, the present invention after punching press
After adding in complexing agent, aluminium ion is deposited in solution rapidly, is adhered to without foreign ion on surface.Comparative example 1 is does not add in
Complexing agent comparative example, surface have aluminium ion precipitation to influence follow-up welding, and comparative example 2 is highly basic cleaning corrosion silicon particle comparative example,
Highly basic closes rule significant reaction and generates nigrescence phenomenon, and deposition surface is obvious.
Claims (10)
1. preparation method of the alkali cleaning without brazing flux or vacuum brazing plate, which is characterized in that include the following steps：It is set using alloy casting
It is standby, ingot casting is cast, annealing is distinguished to sandwich layer, brazing layer, then hot rolling becomes thin plate, then welds together each layer, heat
It rolls, then carries out cold rolling again, finally anneal, the method being surface-treated before welding includes the following steps：
(1) surface and oil contaminant is cleared up：Using the organic solvent cleaning surface of the alkali cleaning without brazing flux or vacuum brazing plate；
(2) alkali cleaning, using the product of lye component cleaning step (1) matched as follows：Sodium gluconate 0-5wt%, sodium pyrophosphate
One or more of 0-5wt%, sodium carbonate 0-10wt%, sodium phosphate 0-3%, sodium bicarbonate 0-10wt%；
Then NaOH 0-1wt% and sodium metasilicate 0-5wt% are added in；
(3) complexing agent cleans, and the product of step (2) be complexed using saturation EDTA solution or saturation aqueous isopropanol clear
It washes；
(4) pickling carries out pickling using salpeter solution to the product of step (3)；
(5) acid is removed in washing.
2. according to the method described in claim 1, it is characterized in that, in step (1), the organic solvent is alcohol or third
Ketone.
3. according to the method described in claim 1, it is characterized in that, in step (2), the weight content of NaOH is less than 0.5%.
4. according to the method described in claim 3, it is characterized in that, cleaning temperature is 30~90 DEG C, the time is 20~90 seconds.
5. according to the method described in claim 1, it is characterized in that, in step (4), nitre of the weight concentration for 0.05-1% is used
Acid solution carries out pickling to the product of step (3).
6. according to the method described in claim 1, it is characterized in that, in step (5), acid is removed in washing, is precipitated as surface also has,
When washing, pass through the further removing surface of spray gun flushing method.
7. according to claim 1~6 any one of them method, which is characterized in that the alkali cleaning is without brazing flux or vacuum brazing
Material, including brazing layer and sandwich layer；
The sandwich layer one or both sides are brazing layers；
The sandwich layer is：1xxx or 3xxx or 5xxx or 6xxx or 7xxx；
It is alloy that term 1xxx, which represents aluminium alloy 1, i.e. commercial-purity aluminium；
It is alloy that term 3xxx, which represents aluminium alloy 3, i.e., using aluminium manganese as a series of alloys of essential element；
It is alloy that term 5xxx, which represents aluminium alloy 5, i.e., using magnalium as a series of alloys of essential element；
It is alloy that term 6xxx, which represents aluminium alloy 6, i.e., using aluminium silicon magnesium as a series of alloys of essential element；
It is alloy that term 7xxx, which represents aluminium alloy 7, i.e., using aluminium zinc-magnesium copper as a series of alloys of essential element；
The brazing layer contains the ingredient of following mass percent：
Si 5-15%, Fe<0.3%, Mg 0-2%, Zn 0-5%, Bi0-0.3%, remaining is aluminium.
8. the method according to the description of claim 7 is characterized in that further including soldering internal layer, the soldering internal layer is arranged on
Between brazing layer and sandwich layer.
9. according to the method described in claim 8, it is characterized in that, when equipped with soldering internal layer, the soldering internal layer contains
The ingredient of following mass percent：
Si 5-15%, Fe<0.3%, Mg 0-2%, Zn 0-5%, Bi0-0.3%, remaining is aluminium；
Brazing layer contains the ingredient of following mass percent：
Si3-11%, Fe≤0.3%, Bi0-0.3%, Zn 0-1%, remaining is aluminium.
10. according to the method described in claim 9, it is characterized in that, the multilayer aluminium alloy is without brazing flux material, compound ratio
Rate is as follows：It is compound than being 0.1-10% to be brazed outer layer；Brazing layer is compound than being 5-20%, remaining is sandwich layer recombination rate.
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