CN108231639A - Semiconductor manufacturing apparatus and its SMIF casees, the cleaning method of wafer carrying case - Google Patents
Semiconductor manufacturing apparatus and its SMIF casees, the cleaning method of wafer carrying case Download PDFInfo
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- CN108231639A CN108231639A CN201611192640.2A CN201611192640A CN108231639A CN 108231639 A CN108231639 A CN 108231639A CN 201611192640 A CN201611192640 A CN 201611192640A CN 108231639 A CN108231639 A CN 108231639A
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- wafer
- carrying case
- smif
- casees
- air inlet
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A kind of semiconductor manufacturing apparatus and its SMIF casees, the cleaning method of wafer carrying case, the SMIF casees include：Babinet；The air intake duct and exhaust duct being arranged on the babinet, the air intake duct, exhaust duct both ends communicated with air.By being filled with pure gas to the air intake duct of SMIF casees, gas can be from intracavitary in the inflow of the air inlet of wafer carrying case, to drive the impurity in wafer carrying case away, then the exhaust duct discharge of the exhaust outlet from wafer carrying case, SMIF casees successively, the inner cavity that ensure that wafer carrying case is always pure wafer storage environment, when avoiding the transmission wafer between wafer carrying case and wafer processing, the problem of wafer is contaminated and contaminated wafer brings pollutant in wafer processing or wafer carrying case into occurs.
Description
Technical field
The present invention relates to technical field of semiconductors, more particularly to a kind of semiconductor manufacturing apparatus and its SMIF casees, wafer
The cleaning method of carrying case.
Background technology
With reference to shown in Fig. 1 to Fig. 2, a kind of existing semiconductor manufacturing apparatus includes wafer processing 1, SMIF
(Standard Mechanical Interface) case 2 and wafer carrying case 3.Wherein：
Wafer processing 1 is equipped with the window 10 for wafer disengaging, and the wafer transport mechanism in wafer processing 1 is (such as
It is manipulator, not shown) external wafer is transported from window 10 to being processed in wafer processing 1 and add wafer
The wafer of completion of processing is moved out from window 10 in construction equipment 1.
SMIF casees 2, which have, movably solves locking closure 20, and window 10 is sealed or opened wide by solution locking closure 20.When window 10 seals
When, wafer processing 1 is interior to form a closed space with atmospheric isolation.
Wafer carrying case 3 between each wafer processing for transmitting wafer, with storage case and openable and closable
Door.The inner cavity for holding wafer is surrounded with the storage case when the door lock is lived.Wafer carrying case 3 is placed on the top of SMIF casees 2
Portion, and the shop front to solution locking closure 20.Solution locking closure 20, which can unlock this, makes its opening so that window 10 and wafer carrying case 3
Inner cavity communicate, and then wafer can be transported between wafer carrying case 3 and wafer processing 1, that is, by wafer carrying case 3
Interior wafer transports to processing in wafer processing 1 or transports the wafer of completion of processing in wafer processing 1 to crystalline substance
In circle carrying case 3.
However, after wafer carrying case 3 is placed on the top of SMIF casees 2, in wafer carrying case 3 and wafer processing 1
Between when transmitting wafer, can there are following problems：The attachment of particle that wafer is suspended in the air in wafer carrying case 3 or
Unwanted substance is generated with the steam reaction in air, wafer is caused to be contaminated, and yield declines.Contaminated wafer can incite somebody to action
Pollutant is brought into wafer processing 1 or wafer carrying case 3.
Invention content
The problem to be solved in the present invention is：After existing wafer carrying case is placed on the top of SMIF casees, in wafer carrying case
When wafer is transmitted between wafer processing, wafer is easily contaminated, and pollutant can be brought into wafer processing by contaminated wafer
In equipment or wafer carrying case.
To solve the above problems, the present invention provides a kind of SMIF casees, including：Babinet；It is arranged on the babinet
Air intake duct and exhaust duct, the air intake duct, exhaust duct both ends communicated with air.
Optionally, it further includes：Positioned at the top of the box in bit detector, it is described in bit detector for detecting wafer
Whether carrying case is placed on the top of the babinet.
Optionally, it further includes：
Air inlet switch in air inlet pipe, the air inlet pipe are connected with the air intake duct；
Air discharge cook on exhaust pipe, the exhaust pipe are connected with the exhaust duct；
The air inlet switch, air discharge cook are used to described that in bit detector to detect that wafer carrying case is placed on described
It is opened during the top of babinet.
Optionally, it further includes：Flowmeter in the air inlet pipe, the air inlet switch are used in the flowmeter
Measurement result is closed when being more than given threshold.
Optionally, it further includes：Pressure at expulsion meter on the exhaust pipe or exhaust duct, the air discharge cook are used for
The measurement result of the pressure at expulsion meter is closed when being less than the pressure of air.
Optionally, it further includes：Admission pressure meter in the air inlet pipe or air intake duct.
Optionally, it further includes：Humidity controller, temperature controller in the air inlet pipe at least one.
Optionally, it further includes：Filter in the air inlet pipe.
Optionally, it further includes：Pressure regulator valve in the air inlet pipe.
The present invention also provides a kind of semiconductor manufacturing apparatus, including：Wafer processing has for wafer disengaging
Window；Any of the above-described SMIF casees, further include the solution locking closure being movably installed on the babinet, and the solution locking closure is used
In sealing or open wide the window；Wafer carrying case has the inner cavity for accommodating wafer, air inlet in communication with the inner cavity
And exhaust outlet and openable and closable door；The wafer carrying case is placed on the top of the SMIF casees, the air inlet with it is described
Air intake duct communicates, and the exhaust outlet is communicated with the exhaust duct, and the door, and can be in the solution locking closure towards the solution locking closure
The lower unlock of effect is opened, so that the window is connected with the inner cavity.
Furthermore the present invention also provides a kind of cleaning method of wafer carrying case, the wafer carrying case has to hold
The inner cavity of nano-crystal circle, air inlet and exhaust outlet in communication with the inner cavity, the method includes：The wafer carrying case is placed
At the top of any of the above-described SMIF casees, and the air inlet is communicated with the air intake duct, the exhaust outlet and the row
Air flue communicates；Be filled with pure gas to the air intake duct of the SMIF casees so that the gas from the wafer carrying case into
Gas port flow into intracavitary, to drive the impurity in wafer carrying case away, the then exhaust outlet from wafer carrying case, SMIF casees successively
Exhaust duct is discharged.
Optionally, the gas is inert gas or the air of drying.
Compared with prior art, technical scheme of the present invention has the following advantages：
By being filled with pure gas to the air intake duct of SMIF casees, gas can flow into inner cavity from the air inlet of wafer carrying case
It is interior, to drive the impurity in wafer carrying case (such as air, steam or suspended particulate) away, then successively from the exhaust of wafer carrying case
The exhaust duct discharge of mouth, SMIF casees, the inner cavity that ensure that wafer carrying case is always pure wafer storage environment, is avoided
When wafer is transmitted between wafer carrying case and wafer processing, wafer is contaminated and contaminated wafer is by pollutant band
The problem of entering in wafer processing or wafer carrying case occurs.
Description of the drawings
Fig. 1 is a kind of three-dimensional exploded view of existing semiconductor manufacturing apparatus；
Fig. 2 is the installation diagram of semiconductor manufacturing apparatus shown in Fig. 1；
Fig. 3 is the three-dimensional exploded view of semiconductor manufacturing apparatus in one embodiment of the present of invention；
Fig. 4 is the installation diagram of semiconductor manufacturing apparatus shown in Fig. 3；
Fig. 5 is the operation principle schematic diagram of semiconductor manufacturing apparatus in one embodiment of the present of invention.
Specific embodiment
It is understandable for the above objects, features and advantages of the present invention is enable to become apparent, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.
With reference to shown in Fig. 3 to Fig. 4, the semiconductor manufacturing apparatus of the present embodiment includes wafer processing 10, SMIF
(Standard Mechanical Interface) case 20 and wafer carrying case 30.Wherein：
Wafer processing 10 for can to wafer carry out semiconductor machining equipment, for example, its can be deposition apparatus,
Oxidation furnaces, plasma etch apparatus, lithographic equipment etc..Wafer processing 10 is equipped with the window 100 for wafer disengaging, brilliant
Wafer transport mechanism (such as manipulator, not shown) in circle process equipment 10 transports external wafer to wafer from window 100
It is processed in process equipment 10 and moves out the wafer of completion of processing in wafer processing 10 from window 100.
SMIF casees 20 include babinet 210 and movably solve locking closure 220, and solution locking closure 220 is in driving mechanism (not shown)
Under driving, can opposite case 210 move, to seal or open wide the window 100 of wafer processing 10.In the present embodiment,
Solution locking closure 220 can move on the short transverse Z of wafer processing 10.
Wafer carrying case 30 provides one for transmitting wafer between each wafer processing 10, for internal wafer
A pure wafer storage environment prevents wafer to be contaminated in transmit process.Wafer carrying case 30 has storage case 310 and can
The door 320 of folding, door 320, which has, locks and unlocks two states.When door 320 locks, storage case 310 is fixed on door 320
Together, and inner cavity 330 is surrounded, inner cavity 330 is in air-tight state.When door 320 unlocks, storage case 310 is separable with door 320, with
Inner cavity 330 is made to be communicated with air.
Storage case 310 is equipped with air inlet 340 and exhaust outlet 350, and air inlet 340, exhaust outlet 350 are connected with inner cavity 330.
By being filled with pure gas to air inlet 340, the impurity (such as air, steam or suspended particulate) in inner cavity 330 can be driven away
Afterwards, it is discharged from exhaust outlet 350, so as to ensure that inner cavity 330 is pure microenvironment.
The babinet 210 of SMIF casees 20 is equipped with air intake duct 230 and exhaust duct 240, and air intake duct 230, the both ends of exhaust duct 240 are equal
It is communicated with air.Wafer carrying case 30 is placed on after the top of SMIF casees 20, and air intake duct 230 is communicated with air inlet 340, exhaust
Road 240 is communicated with exhaust outlet 350, and door 320 towards solution locking closure 220.
Solution locking closure 220 can unlock the door 320 of wafer carrying case 30, and door 320 is driven to move to setting position together,
So that window 100 is opened wide and communicated with the inner cavity 330 of wafer carrying case 30, and then can be processed in wafer carrying case 30 and wafer
Transport wafer, that is, the wafer in wafer carrying case 30 is transported to processing in wafer processing 10 or incited somebody to action between equipment 10
The wafer of completion of processing is transported to wafer carrying case 30 in wafer processing 10, and wafer is sent to other wafers processes
Equipment.
By being filled with pure gas to air intake duct 230, gas can be flowed into from air inlet 340 in inner cavity 330, to drive crystalline substance away
Impurity (such as air, steam or suspended particulate) in circle carrying case 30, is then discharged from exhaust outlet 350, exhaust duct 240 successively,
Ensure that inner cavity 330 is always pure wafer storage environment, avoid wafer carrying case 30 and wafer processing 10 it
Between when transmitting wafer wafer be contaminated and contaminated wafer brings pollutant into wafer processing 10 or wafer carrying case
The problem of in 30, occurs.
The clean gas being filled with can be with inert gas, such as nitrogen, argon gas.Inert gas can prevent wafer from being aoxidized.
Certainly, the clean gas being filled with can also be dry pure air, relatively cheap.It can be according to wafer for oxidation resistant
It is required that select inert gas or pure dry air.
Air intake duct 230, exhaust duct 240, air inlet 340, exhaust outlet 350 quantity can arbitrarily set, in the present embodiment
In, air intake duct 230, exhaust duct 240, air inlet 340, exhaust outlet 350 quantity be one.
Equipped in bit detector 270, bit detector 270 is used to detect crystalline substance at the top (top is shown as in figure) of SMIF casees 20
Whether circle carrying case 30 is placed on the top of babinet 210.When bit detector 270 detects that wafer carrying case 30 is placed on babinet
During 210 top, it can control and pure gas is filled with into air intake duct 230 to purify wafer carrying case 30.Bit detector 270
After detecting that wafer carrying case 30 is placed on the top of SMIF casees 20, wafer carrying case 30 is opened after can first inflating a period of time
Door, as soon as alternatively, bit detector 270 detects that wafer carrying case 30 is placed on the top of SMIF casees 20, filled in synchronization
Gas and the door for opening wafer carrying case 30.
Further, in the present embodiment, include location aware device and identity recognizer in bit detector 270.Institute's rheme
Perceptron is put for detecting whether there is the top that object is placed on SMIF casees 20, the identity recognizer is placed on for identifying
Whether the wafer in the wafer carrying case 30 at 20 top of SMIF casees can produce in the wafer processing 10.
As shown in figure 5, SMIF casees 20 further include air inlet pipe 251 and exhaust pipe 252, air inlet pipe 251 connects with air intake duct 230
Logical, exhaust pipe 252 is connected with exhaust duct 240.When purifying wafer carrying case 30, be contained in clean gas in gas cylinder 280 from into
Tracheae 251 is filled with, and then flows to the air inlet of air intake duct 230, wafer carrying case 30 successively according to arrow direction shown in dotted line in figure
Mouth 340, the exhaust outlet 350 of wafer carrying case 30, exhaust duct 240, are finally discharged from exhaust pipe 252.
Air inlet pipe 251 and exhaust pipe 252 may be mounted on the babinet of SMIF casees 20, and the two can be hose, can also
For hard tube.
Air inlet pipe 251 be equipped with along gas flow direction set gradually air inlet switch 260, pressure regulator valve 261, flowmeter 262,
Humidity controller 263, temperature controller 264, filter 265, air intake duct 230 is interior to be equipped with admission pressure meter 266, exhaust duct 240
Interior to be equipped with pressure at expulsion meter 267, exhaust pipe 252 is equipped with air discharge cook 268.
Air inlet switch 260 is used to control whether to be filled with gas to air inlet pipe 251 to purify wafer carrying case 30.Air inlet switch
260 when bit detector 270 detects that wafer carrying case 30 is placed on the top of SMIF casees 20 for opening, so that gas fills
Enter air inlet pipe 251.
In addition, air inlet switch 260 is additionally operable to close when the measurement result of flowmeter 262 exceeds predetermined threshold value, to stop
It is inflated to air inlet pipe 251, avoids wasting.The predetermined threshold value can transmit wafer according to the gas gross for being filled with air inlet pipe 251
Impurity in case 30 catches up with most requirement to set.
With reference to shown in Fig. 3 and Fig. 5, pressure regulator valve 261 is used to adjust the pressure of gas in air inlet pipe 251, makes wafer carrying case
Air pressure in 30 is consistent with the air pressure in wafer processing 10, will not be connected because of wafer carrying case 30 with wafer processing 10
Lead to and the air pressure in wafer processing 10 is caused to deviate technological requirement.In the present embodiment, pressure regulator valve 261 is manual pressure regulating valve.
Humidity controller 263 is used to adjust the humidity of gas in air inlet pipe 251, makes humidity and crystalline substance in wafer carrying case 30
Humidity in circle process equipment 10 is consistent, wafer will not be caused to process due to wafer carrying case 30 is connected with wafer processing 10
Humidity in equipment 10 deviates technological requirement.Humidity controller 263 includes moisture detector and damping valve, the moisture detector
For detecting the humidity of gas in air inlet pipe 251, the damping valve is used to be adjusted according to the testing result of the moisture detector
Save the humidity of gas in air inlet pipe 251.
Temperature controller 264 is used to adjust the temperature of gas in air inlet pipe 251, makes temperature and crystalline substance in wafer carrying case 30
Temperature in circle process equipment 10 is consistent, wafer will not be caused to process due to wafer carrying case 30 is connected with wafer processing 10
Temperature in equipment 10 deviates technological requirement.Temperature controller 264 includes temperature detector and heat control valve, the temperature detector
For detecting the temperature of gas in air inlet pipe 251, the heat control valve is used to be adjusted according to the testing result of the temperature detector
Save the temperature of gas in air inlet pipe 251.
Filter 265 is used to filter the impurity of gas in air inlet pipe 251, makes the gas being filled in wafer carrying case 30 more
It is pure.
In the alternative of the present embodiment, filter 265 is arranged in air intake duct 230.In another transformation of the present embodiment
In example, filter 265 is arranged in the air inlet 340 of wafer carrying case 30.
Air inlet side pressure gauge 266 is used to measure the air pressure in air inlet pipe 251, and whether the gas being filled with judgement is with enough
Speed drives the impurity in wafer carrying case 30 away.
Further, in the present embodiment, when the measurement result of air inlet side pressure gauge 266 is undesirable, Ke Yifa
Go out alarm, to remind manual adjustment or repair SMIF casees 20.
Air discharge cook 268 is used to detect wafer in bit detector 270 for controlling whether exhaust pipe 252 is vented
Carrying case 30 is opened when being placed on the top of SMIF casees 20, so that gas is discharged from exhaust pipe 252.
Pressure at expulsion meter 267 is used to measure the air pressure in exhaust pipe 252.Air discharge cook 268 is 267 based in pressure at expulsion
Measurement result close when being less than the pressure of air, poured in down a chimney with preventing gas, that is, prevent air from entering from exhaust pipe 252 brilliant
In circle carrying case 30, wafer processing 10.
In the alternative of the present embodiment, pressure at expulsion meter 267 is arranged on exhaust pipe 252.
It should be noted that in the inventive solutions, pressure regulator valve 261, flowmeter 262, humidity controller 263, temperature
Priority relative position between degree controller 264, filter 265 should not be limited to given embodiment.It can be with for example, being filled with gas
It first flows to temperature controller 264 and flows to humidity controller 263 again, filter 265 can be arranged on the arbitrary position of air inlet pipe 251
It puts, such as between air inlet switch 260 and pressure regulator valve 261 or between flowmeter 262 and humidity controller 263.
In addition, the present invention also provides a kind of cleaning method of wafer carrying case, with reference to shown in Fig. 3 to Fig. 4, wafer transmission
Case 30 has the inner cavity 330 for accommodating wafer, the air inlet 340 and exhaust outlet 350 connected with inner cavity 330.
The method includes：Wafer carrying case 30 is placed on to the top of SMIF casees 20, and air inlet 340 and air intake duct
230 communicate, and exhaust outlet 350 is communicated with exhaust duct 240；Pure gas is filled with to the air intake duct 230 of SMIF casees 20, so that described
Gas is flowed into from the air inlet 340 of wafer carrying case 30 in inner cavity 330, to drive the impurity in wafer carrying case 30, Ran Houyi away
Secondary exhaust outlet 350 from wafer carrying case 30, SMIF casees 20 exhaust duct 240 discharge.
Although present disclosure is as above, present invention is not limited to this.Any those skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (12)
1. a kind of SMIF casees, which is characterized in that including：
Babinet；
The air intake duct and exhaust duct being arranged on the babinet, the air intake duct, exhaust duct both ends communicated with air.
2. SMIF casees as described in claim 1, which is characterized in that further include：Positioned at the top of the box in bit detector,
It is described at the top that bit detector is used to detect whether wafer carrying case be placed on the babinet.
3. SMIF casees as claimed in claim 2, which is characterized in that further include：
Air inlet switch in air inlet pipe, the air inlet pipe are connected with the air intake duct；
Air discharge cook on exhaust pipe, the exhaust pipe are connected with the exhaust duct；
The air inlet switch, air discharge cook are used to detect that wafer carrying case is placed on the babinet in bit detector described
Top when open.
4. SMIF casees as claimed in claim 3, which is characterized in that further include：Flowmeter in the air inlet pipe, it is described
Air inlet switch is used to close when the measurement result of the flowmeter is more than given threshold.
5. SMIF casees as claimed in claim 3, which is characterized in that further include：Row on the exhaust pipe or exhaust duct
Pressure gauge, measurement result of the air discharge cook based in the pressure at expulsion are closed when being less than the pressure of air.
6. SMIF casees as claimed in claim 3, which is characterized in that further include：In the air inlet pipe or air intake duct into
Pressure gauge.
7. SMIF casees as claimed in claim 3, which is characterized in that further include：Humidity controller in the air inlet pipe,
Temperature controller at least one.
8. SMIF casees as claimed in claim 3, which is characterized in that further include：Filter in the air inlet pipe.
9. SMIF casees as claimed in claim 3, which is characterized in that further include：Pressure regulator valve in the air inlet pipe.
10. a kind of semiconductor manufacturing apparatus, which is characterized in that including：
Wafer processing has the window for wafer disengaging；
Claim 1 to 9 any one of them SMIF casees, further include the solution locking closure being movably installed on the babinet, institute
Solution locking closure is stated for sealing or opening wide the window；
Wafer carrying case has for the inner cavity that accommodates wafer, air inlet and exhaust outlet in communication with the inner cavity and can open
The door of conjunction；
The wafer carrying case is placed on the top of the SMIF casees, and the air inlet is communicated with the air intake duct, the exhaust
Mouth is communicated with the exhaust duct, and the door can be unlocked under the action of the solution locking closure and be opened towards the solution locking closure, so that
The window is connected with the inner cavity.
11. a kind of cleaning method of wafer carrying case, which is characterized in that the wafer carrying case has to accommodate the interior of wafer
Chamber, air inlet and exhaust outlet in communication with the inner cavity, the method includes：
The wafer carrying case is placed on to the top of claim 1 to 9 any one of them SMIF casees, and the air inlet with
The air intake duct communicates, and the exhaust outlet is communicated with the exhaust duct；
Pure gas is filled with to the air intake duct of the SMIF casees, so that air inlet stream of the gas from the wafer carrying case
Enter interior intracavitary, to drive the impurity in wafer carrying case away, the then exhaust duct of the exhaust outlet from wafer carrying case, SMIF casees successively
Discharge.
12. cleaning method as claimed in claim 11, which is characterized in that the gas is inert gas or the air of drying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611192640.2A CN108231639A (en) | 2016-12-21 | 2016-12-21 | Semiconductor manufacturing apparatus and its SMIF casees, the cleaning method of wafer carrying case |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611192640.2A CN108231639A (en) | 2016-12-21 | 2016-12-21 | Semiconductor manufacturing apparatus and its SMIF casees, the cleaning method of wafer carrying case |
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|---|---|
| CN108231639A true CN108231639A (en) | 2018-06-29 |
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| CN201611192640.2A Pending CN108231639A (en) | 2016-12-21 | 2016-12-21 | Semiconductor manufacturing apparatus and its SMIF casees, the cleaning method of wafer carrying case |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109637955A (en) * | 2018-12-29 | 2019-04-16 | 长江存储科技有限责任公司 | Object scratch system |
| CN111060154A (en) * | 2019-12-26 | 2020-04-24 | 西安奕斯伟硅片技术有限公司 | Semiconductor device storage box |
| CN111438157A (en) * | 2020-04-08 | 2020-07-24 | 中国科学院上海光学精密机械研究所 | Chip amplifier cleaning control structure and method |
| US20220152658A1 (en) * | 2020-11-16 | 2022-05-19 | Sti Co., Ltd. | Pod cleaning process |
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| CN109637955B (en) * | 2018-12-29 | 2021-03-12 | 长江存储科技有限责任公司 | Temporary storage system for target object |
| CN111060154A (en) * | 2019-12-26 | 2020-04-24 | 西安奕斯伟硅片技术有限公司 | Semiconductor device storage box |
| CN111438157A (en) * | 2020-04-08 | 2020-07-24 | 中国科学院上海光学精密机械研究所 | Chip amplifier cleaning control structure and method |
| US20220152658A1 (en) * | 2020-11-16 | 2022-05-19 | Sti Co., Ltd. | Pod cleaning process |
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