CN108231460A - Electronic product casing is molded the contact manufacturing method that electrically conducts - Google Patents
Electronic product casing is molded the contact manufacturing method that electrically conducts Download PDFInfo
- Publication number
- CN108231460A CN108231460A CN201711221863.1A CN201711221863A CN108231460A CN 108231460 A CN108231460 A CN 108231460A CN 201711221863 A CN201711221863 A CN 201711221863A CN 108231460 A CN108231460 A CN 108231460A
- Authority
- CN
- China
- Prior art keywords
- contact
- electronic product
- electrically conducts
- housing
- product casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
- H01H11/06—Fixing of contacts to carrier ; Fixing of contacts to insulating carrier
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Coating By Spraying Or Casting (AREA)
- Laser Beam Processing (AREA)
Abstract
A kind of electronic product casing is molded the contact manufacturing method that electrically conducts, and the case inside face local location of electronic product is planned to contact shaping area；In being integrally coated with water-soluble hardening at subcritical temerature or the peelable glued membrane of heat setting type, then implement drying and shaping on medial surface and the contact shaping area of housing；With the peelable glued membrane on the contact shaping area surface of laser beam removal housing；Continue that contact shaping area surface is processed into rough surface with laser beam；Using room temperature air pressure plasma spraying with gas-pressurized blow molten metal formed metallic, metallic is sprayed be bonded on rough surface formed metal meltallizing spray layer, and metal meltallizing sprays layer instantaneous temperature reduction into the contact that electrically conducts；Finally the peelable glued membrane in case inside face is removed and is removed；So as to the manufacturing method of the invention that the contact that electrically conducts is molded in electronic product casing, contact bonding force and fineness can be promoted, save human and material resources and working hour, and more reduce cost.
Description
Technical field
The present invention is molded the contact manufacturing method that electrically conducts about a kind of electronic product casing, espespecially a kind of to be used for wisdom
The housings such as type mobile device, personal digital assistant, mobile phone are molded the manufacturing method for the contact that electrically conducts.
Background technology
Intelligent moving device, personal digital assistant, mobile phone ... in current electronic product etc., mostly using modeling
Material or magnesium-aluminium alloy material are expected as shell, and the surfaces externally and internally of plastic material shell can be more coated equipped with anodization,
To improve aesthetics.
And current electronic product casing is equipped with multiple copper foil gold clad contacts mostly in inner surface, in conduct electrons product
The associated electronics and electronic component in portion.But this multiple copper foil gold clad contact is adhered to respectively one by one using laser mode
On the rough surface of shell, it is slow to be not only process velocity, and waste of manpower, material resources and working hour.
Metal is sprayed with the inner surface meltallizing in electronic product casing using room temperature air pressure plasma spraying before the present inventor
The contact that electrically conducts is made.When implementation air pressure meltallizing sprays metallic, it is necessary to first add in the non-of electronic product casing surface
Masking jig is installed on work area, is sprayed to avoid metallic and is bonded to non-processing area surface.But this masking jig
Relative production, assembling, dismounting are inconvenient, waste of manpower, material resources and working hour.Therefore how to solve the above problems, as the industry
Related dealer is desired most ardently where the subject of research.
Invention content
It is a primary object of the present invention to using hardening at subcritical temerature or the peelable glued membrane spraying shielding of heat setting type in electronics
In non-processing area on the inside of product shell, then laser is coordinated to carry out contact shaping area roughening, then implement meltallizing and spray metal
Consolidation forms the contact that electrically conducts, and can promote contact bonding force and fineness, improves manufacture efficiency, meets environmentally friendly specification, and
And the correlative charges of the masking jig needed for existing housing can be omitted, human and material resources and working hour are saved, and more reduce cost.
In order to achieve the above object, the electronic product casing molding of the present invention electrically conducts, contact manufacturing method includes following step
Suddenly：(a) the case inside face local location of electronic product is planned to contact shaping area；(b) in the medial surface of housing and contact
Hardening at subcritical temerature or the peelable glued membrane of heat setting type are integrally coated on shaping area, then implements drying and shaping；(c) with laser beam
Remove the peelable glued membrane on the contact shaping area surface of housing；(d) continue to be processed into contact shaping area surface with laser beam
Rough surface；(e) molten metal is blowed with gas-pressurized using room temperature air pressure plasma spraying and forms metallic, metallic is sprayed
It is bonded on the rough surface of contact shaping area and forms metal meltallizing and spray layer, and metal meltallizing sprays layer instantaneous temperature reduction into electrically leading
It connects a little；(f) the peelable glued membrane in case inside face is removed and removed.
Aforementioned electronic product casing is molded the contact manufacturing method that electrically conducts, and the housing being wherein somebody's turn to do in (a) step is gold
Belong to body, using carbon dioxide laser in (c) step, and red laser is used in (d) step.
Aforementioned electronic product casing is molded the contact manufacturing method that electrically conducts, and the housing being wherein somebody's turn to do in (a) step is modeling
Expect body, using carbon dioxide laser in (c) step, and red laser is used in (d) step.
Aforementioned electronic product casing is molded the contact manufacturing method that electrically conducts, and the housing being wherein somebody's turn to do in (a) step is glass
Glass body using carbon dioxide laser in (c) step, and uses purple light laser in (d) step.
Aforementioned electronic product casing is molded the contact manufacturing method that electrically conducts, and the housing being wherein somebody's turn to do in (a) step is pottery
Porcelain body, using carbon dioxide laser in (c) step, and sequentially using red laser, green laser in (d) step.
Aforementioned electronic product casing is molded the contact manufacturing method that electrically conducts, and the housing being wherein somebody's turn to do in (a) step is modeling
Expect body, vitreum or ceramic body, and the medial surface of housing is anodization.
Aforementioned electronic product casing is molded the contact manufacturing method that electrically conducts, the adhesive being wherein somebody's turn to do in (b) step
Film component includes three acrylic acid propane front three alcohol ester of ethyoxyl, polyacrylic acid, polypropylene glycol monobutyl ether, water, and its drying is fixed
Type required temperature is 45~65 degrees Celsius.
Aforementioned electronic product casing is molded the contact manufacturing method that electrically conducts, the adhesive being wherein somebody's turn to do in (b) step
Film is water solubility, and water-soluble solution temperature is 50~60 degrees Celsius.
Aforementioned electronic product casing is molded the contact manufacturing method that electrically conducts, the laser beam being wherein somebody's turn to do in (c) step
It is 70~73 degree to carry out laser engraving angle for peelable glued membrane.
Aforementioned electronic product casing is molded the contact manufacturing method that electrically conducts, the metal meltallizing being wherein somebody's turn to do in (e) step
Spray one of group that layer is formed selected from zinc, copper, nickel, cadmium, pltine and corronil.
Description of the drawings
Fig. 1 is that the electronic product casing of the embodiment of the present invention is molded the front view for the contact that electrically conducts；
Fig. 2 is the profile along A~A hatching lines of Fig. 1；
Fig. 3 is the front view of the case inside face of the embodiment of the present invention before processing；
Fig. 4 is that the embodiment of the present invention is coated with the front view of peelable glued membrane in case inside face；
Fig. 5 is the embodiment of the present invention with the front view of the peelable glued membrane on laser ablation contact shaping area surface；
Fig. 6 is the profile along B~B hatching lines of Fig. 5；
Fig. 7 is the front view that rough surface is processed on contact shaping area surface by the embodiment of the present invention；
Fig. 8 is that the embodiment of the present invention sprays the front view to form the contact that electrically conducts in contact shaping area meltallizing；
Fig. 9 is the profile along C~C hatching lines of Fig. 8.
Reference sign：
1st, housing
11st, shell side
12nd, medial surface
13rd, lateral surface
14th, contact shaping area
15th, rough surface
2nd, peelable glued membrane
3rd, electrically conduct contact
31st, metal meltallizing sprays layer.
Specific embodiment
To reach above-mentioned purpose, used technological means and its effect hereby enumerate possible embodiments to the related present invention, and
And cooperation description of the drawings is as follows：
First, it please refers to Fig.1 to shown in Fig. 9, it can be clearly seen from the figure that, the present invention is mainly in the housing of electronic product 1
Inside is molded the contact 3 that electrically conducts, and electronic product includes having intelligent moving device, personal digital assistant, mobile phone ... etc.,
And the housing 1 of electronic product can be set as plastic body, vitreum, ceramic body or magnesium-aluminium alloy material metallic object, housing 1 has surrounding
Edge shell side 11, medial surface 12 and opposite lateral surface 13.
Housing 1 the present invention relates to electronic product is molded the manufacturing method for the contact 3 that electrically conducts, and it includes have following step
Suddenly：
(a) more than 12 a local location of the medial surface of the housing of electronic product 1 is respectively planned to contact shaping area 14 (refering to figure
3)；
(b) in the medial surface 12 of housing 1 hardening at subcritical temerature or heat setting is coated with integrally being sprayed on contact shaping area 14
The peelable glued membrane 2 of type (refers to Fig. 4), then implements drying and shaping and stood with follow-up；Peelable glued membrane 2 meets environmentally friendly specification, into
Subpackage contains three acrylic acid propane front three alcohol ester of ethyoxyl, polyacrylic acid, polypropylene glycol monobutyl ether, water, and its drying and shaping institute
It is 45~65 degrees Celsius to need temperature, and environment temperature is 20 degrees Celsius ± 5 degrees Celsius, and ambient humidity is 40%RH ± 5%RH；It is peelable
It is water solubility from glued membrane 2, and water-soluble solution temperature is 50~60 degrees Celsius；
(c) peelable glued membrane 2 of the housing 1 in 14 upper surface of contact shaping area, and laser beam are removed using laser beam
It is 70~73 degree to carry out laser engraving best angle for peelable glued membrane 2, is molded with showing exposing inside thereof face 12 in each contact
Surface and its periphery (referring to Fig. 5 and Fig. 6) in the range of area 14；
(d) continue that surface of the medial surface 12 in the range of each contact shaping area 14 is processed into rough surface 15 with laser beam
(referring to Fig. 7)；
(e) molten metal is blowed with gas-pressurized using room temperature air pressure plasma spraying and forms metallic, metallic is sprayed
It covers and is bonded on the rough surface 15 of each contact shaping area 14, layer 31 (refering to Fig. 8 and Fig. 9) is sprayed, and each to form metal meltallizing
Metal meltallizing sprays 31 instantaneous temperature reduction of layer into the contact 3 that electrically conducts.And metal meltallizing spray layer 31 can be selected from zinc, copper, nickel,
One of group that cadmium, pltine and corronil are formed, the contact 3 that makes to electrically conduct is available for conduct electrons product
Internal associated electronics and electronic component；
(f) finally by the peelable glued membrane 2 of 1 medial surface 12 of housing, stripping removes rapidly, to show completely in housing 1
Side 12 and the contact 3 that respectively electrically conducts (refering to Fig. 1 and Fig. 2).
By upper, the present invention is mainly using hardening at subcritical temerature or peelable 2 spraying shielding of glued membrane of heat setting type in electronic product
The non-processing area of 1 inside of housing, then laser is coordinated to carry out contact shaping area 14 and is roughened, then implement meltallizing and spray metal consolidation
Formation electrically conducts contact 3, can promote contact bonding force and fineness, improves manufacture efficiency, meets environmentally friendly specification, and can
The correlative charges of the masking jig needed for housing 1 is omitted, saves human and material resources and working hour, and more reduces cost.
When housing 1 of the present invention in (a) step is metallic object or plastic body, i.e., titanium dioxide is used in (c) step
Carbon laser, and red laser is used in (d) step.And when working as the housing 1 in (a) step for vitreum, then in (c) step
Using carbon dioxide laser, and purple light laser is used in (d) step.Furthermore when the housing 1 in (a) step is ceramic body,
Using carbon dioxide laser i.e. in (c) step, and sequentially using red laser, green laser in (d) step.Except this it
Outside, the medial surface 12 of plastics, glass or ceramic material housing 1 can be set as anodization, then sequentially carry out (a) step, (b) step
Surface of the medial surface 12 in the range of each contact shaping area 14 is processed into slightly by suddenly, (c) step and (d) step with laser beam
Matte 15 (refers to Fig. 7), then implements (e) step and (f) step, metallic is sprayed and is bonded to each contact shaping area 14
On rough surface 15, layer 31 (refering to Fig. 8 and Fig. 9) is sprayed, and each metal meltallizing sprays 31 instantaneous temperature reduction of layer to form metal meltallizing
Into the contact 3 that electrically conducts, the peelable glued membrane 2 of 1 medial surface 12 of housing is directly finally removed into removal.
The present invention is using room temperature air pressure plasma spraying in (e) step, and metallic is sprayed and is bonded to each contact shaping area
On 14 rough surface 15, layer 31 (refering to Fig. 8 and Fig. 9) is sprayed, and each metal meltallizing sprays 31 moment of layer to form metal meltallizing
Cool down into the contact 3 that electrically conducts.And air pressure is sprayed used in room temperature air pressure plasma spraying as 3~12Bars, the meltallizing machine used
Device can adjust melting temperature according to different conductive materials, the voltage that meltallizing machine uses be 20~50V, the electric current used
It is 185~295 amperes, to utilize arc method molten metal, gas-pressurized is recycled to blow to form metallic, makes clipped wire
Son spray be bonded to rough surface 15 formed metal meltallizing spray layer 31, and metallic temperature moment is reduced to room temperature, also
It is about 24~40 degrees Celsius, and forms the contact 3 that electrically conducts.Furthermore metal meltallizing sprays layer 31 and is attached on rough surface 15
Adhesive force is 99.8kgf/cm2~150kgf/cm2, and it is 1~5% that metal meltallizing, which sprays the porosity of layer 31, to improve key
Resultant force and fineness.
Embodiment provided above only uses the present invention for convenience of description, and is not in a limitative way, not from spiritual model of the invention
Farmland, the various simple variations and modification that those skilled in the art can make, should include the range in claims
In.
Claims (10)
- The contact manufacturing method 1. a kind of electronic product casing molding electrically conducts, which is characterized in that include following steps：A) the case inside face local location of electronic product is planned to contact shaping area；B) in being integrally coated with hardening at subcritical temerature or the peelable glued membrane of heat setting type on the medial surface of housing and contact shaping area, then Implement drying and shaping；C) with the peelable glued membrane on the contact shaping area surface of laser beam removal housing；D) continue that contact shaping area surface is processed into rough surface with laser beam；E) molten metal is blowed with gas-pressurized using room temperature air pressure plasma spraying and forms metallic, metallic is sprayed into fixation Layer is sprayed, and metal meltallizing sprays layer instantaneous temperature reduction and connect into electrically conducting in forming metal meltallizing on the rough surface of contact shaping area Point；F) the peelable glued membrane in case inside face is removed and removed.
- The contact manufacturing method 2. electronic product casing molding according to claim 1 electrically conducts, which is characterized in that this is a) Housing in step is metallic object, using carbon dioxide laser in c) step, and red laser is used in d) step.
- The contact manufacturing method 3. electronic product casing molding according to claim 1 electrically conducts, which is characterized in that this is a) Housing in step is plastic body, using carbon dioxide laser in c) step, and red laser is used in d) step.
- The contact manufacturing method 4. electronic product casing molding according to claim 1 electrically conducts, which is characterized in that this is a) Housing in step is vitreum, using carbon dioxide laser in c) step, and purple light laser is used in d) step.
- The contact manufacturing method 5. electronic product casing molding according to claim 1 electrically conducts, which is characterized in that this is a) Housing in step is ceramic body, using carbon dioxide laser in c) step, and in d) step sequentially using red laser, Green laser.
- The contact manufacturing method 6. electronic product casing molding according to claim 1 electrically conducts, which is characterized in that this is a) Housing in step is plastic body, vitreum or ceramic body, and the medial surface of housing is anodization.
- The contact manufacturing method 7. electronic product casing molding according to claim 1 electrically conducts, which is characterized in that this is b) Adhesive film component in step includes three acrylic acid propane front three alcohol ester of ethyoxyl, polyacrylic acid, polypropylene glycol monobutyl Ether, water, and its drying and shaping required temperature is 45~65 degrees Celsius.
- The contact manufacturing method 8. electronic product casing molding according to claim 7 electrically conducts, which is characterized in that this is b) Peelable glued membrane in step is water solubility, and water-soluble solution temperature is 50~60 degrees Celsius.
- The contact manufacturing method 9. electronic product casing molding according to claim 1 electrically conducts, which is characterized in that this is c) It is 70~73 degree that laser beam in step carries out laser engraving angle for peelable glued membrane.
- The contact manufacturing method 10. electronic product casing molding according to claim 1 electrically conducts, which is characterized in that should E) the metal meltallizing in step sprays its for the group that layer is formed selected from zinc, copper, nickel, cadmium, pltine and corronil One of.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2016111928361 | 2016-12-21 | ||
| CN201611192836 | 2016-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108231460A true CN108231460A (en) | 2018-06-29 |
Family
ID=62653640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711221863.1A Pending CN108231460A (en) | 2016-12-21 | 2017-11-29 | Electronic product casing is molded the contact manufacturing method that electrically conducts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108231460A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111031158A (en) * | 2019-12-23 | 2020-04-17 | Oppo广东移动通信有限公司 | Ceramic shell, processing method of surface of ceramic shell and electronic equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201718160U (en) * | 2009-09-29 | 2011-01-19 | 林淑清 | Electromagnetic wave protective structure |
| CN103797149A (en) * | 2011-09-16 | 2014-05-14 | 株式会社V技术 | Vapor-deposition mask, vapor-deposition mask manufacturing method, and thin-film pattern forming method |
| CN104735915A (en) * | 2013-12-20 | 2015-06-24 | 台湾立讯精密有限公司 | Method for forming conductor line on insulating substrate |
| US9147875B1 (en) * | 2014-09-10 | 2015-09-29 | Cellink Corporation | Interconnect for battery packs |
| CN105023848A (en) * | 2014-04-30 | 2015-11-04 | 启碁科技股份有限公司 | Method of fabricating substrate structure and substrate structure fabricated by the same method |
| CN106163163A (en) * | 2015-03-31 | 2016-11-23 | 深圳富泰宏精密工业有限公司 | Housing, the electronic installation applying this housing and preparation method thereof |
-
2017
- 2017-11-29 CN CN201711221863.1A patent/CN108231460A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201718160U (en) * | 2009-09-29 | 2011-01-19 | 林淑清 | Electromagnetic wave protective structure |
| CN103797149A (en) * | 2011-09-16 | 2014-05-14 | 株式会社V技术 | Vapor-deposition mask, vapor-deposition mask manufacturing method, and thin-film pattern forming method |
| CN104735915A (en) * | 2013-12-20 | 2015-06-24 | 台湾立讯精密有限公司 | Method for forming conductor line on insulating substrate |
| CN105023848A (en) * | 2014-04-30 | 2015-11-04 | 启碁科技股份有限公司 | Method of fabricating substrate structure and substrate structure fabricated by the same method |
| US9147875B1 (en) * | 2014-09-10 | 2015-09-29 | Cellink Corporation | Interconnect for battery packs |
| CN106163163A (en) * | 2015-03-31 | 2016-11-23 | 深圳富泰宏精密工业有限公司 | Housing, the electronic installation applying this housing and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111031158A (en) * | 2019-12-23 | 2020-04-17 | Oppo广东移动通信有限公司 | Ceramic shell, processing method of surface of ceramic shell and electronic equipment |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180629 |
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| WD01 | Invention patent application deemed withdrawn after publication |