CN108230926A - Virtual LED display module and 4 times of frequency displaying methods based on four color LED chips - Google Patents
Virtual LED display module and 4 times of frequency displaying methods based on four color LED chips Download PDFInfo
- Publication number
- CN108230926A CN108230926A CN201711484172.0A CN201711484172A CN108230926A CN 108230926 A CN108230926 A CN 108230926A CN 201711484172 A CN201711484172 A CN 201711484172A CN 108230926 A CN108230926 A CN 108230926A
- Authority
- CN
- China
- Prior art keywords
- led
- virtual
- pixel
- sub
- display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000004020 luminiscence type Methods 0.000 claims abstract description 92
- 239000003086 colorant Substances 0.000 claims abstract description 78
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000011159 matrix material Substances 0.000 claims abstract description 13
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 241001025261 Neoraja caerulea Species 0.000 claims description 13
- 238000002360 preparation method Methods 0.000 claims description 7
- 241001463139 Vitta Species 0.000 claims description 3
- 230000000007 visual effect Effects 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 description 15
- 230000004888 barrier function Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- 229910052681 coesite Inorganic materials 0.000 description 6
- 229910052906 cristobalite Inorganic materials 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910052682 stishovite Inorganic materials 0.000 description 6
- 229910052905 tridymite Inorganic materials 0.000 description 6
- 238000001039 wet etching Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000002955 isolation Methods 0.000 description 5
- 229910002704 AlGaN Inorganic materials 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 102100027730 Endogenous retrovirus group K member 19 Rec protein Human genes 0.000 description 1
- 101001064123 Homo sapiens Endogenous retrovirus group K member 19 Env polyprotein Proteins 0.000 description 1
- 101000893974 Homo sapiens Endogenous retrovirus group K member 19 Gag polyprotein Proteins 0.000 description 1
- 101000956190 Homo sapiens Endogenous retrovirus group K member 19 Pro protein Proteins 0.000 description 1
- 101000580915 Homo sapiens Endogenous retrovirus group K member 19 Rec protein Proteins 0.000 description 1
- 101001066689 Homo sapiens Integrase Proteins 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Abstract
The present invention relates to a kind of virtual LED display module based on four color LED chips and 4 times of frequency displaying methods.The virtual LED display module includes:Four color LED chip groups being made of four color LED chips;Each four colors LED chip includes at least four LED luminescence units;The four colors LED chip is regularly arranged, makes multiple LED luminescence units composition M × N matrixes;Spacing between two LED luminescence units of arbitrary neighborhood is equal.The LED chip of RGBY tetra- colors one that the present invention is prepared totally using the luminescent material based on GaN material four kinds of colors, regularly arranged splicing is assembled into four color LED chip groups, the equidistant evenly distributed four color luminescence unit matrix array of small spacing of all primary colours luminescence units is formed, improves physical resolution.Meanwhile 4 times of scannings are carried out by sub-pixel sharing method, realize that virtual pixel shows that visual density increases to 4 times, and the clarity that image is shown further is made to be improved.
Description
Technical field
The present invention relates to LED display display field, more particularly to a kind of virtual LED based on four color LED chips is shown
Module and 4 times of frequency displaying methods.
Background technology
LED display is capable of the image information of real-time display source video image as Digital Image Display media.It influences
The key factor of LED display display effect has at 2 points:First, the resolution ratio of LED display;Second is that the display color of display screen
And tonal gradation.Generally using the high small space distance LED display screen of physical resolution, LED point spacing exists indoor LED display
P2.5 is hereinafter, mainly include P2.5, P2.0, P1.8, P1.5 equal-specification.The display color and tonal gradation of LED display at present
Standard have been able to meet the requirements, and indoor LED display has resolution ratio higher requirement always, it would be desirable to realize more
High display resolution.
Two kinds of approach can be used in the raising of display resolution:First, physical resolution is improved, second is that being shared by sub-pix
Virtual display is carried out to realize a high virtual resolution.At present country's LED pipe high density electronics assembly technology it is immature,
The limitation of LED pipe and electronic component encapsulation physical size and circuit complexity, of high cost etc. hinders display screen physical point
The raising of resolution.And virtually shown about sub-pix, show to increase pixel by virtually showing though having correlative study
Add 4 times, even higher times yupin effect, but increasing with frequency multiplication number, and display image can be brought to obscure or trail
Phenomenon.Therefore it is simple to realize reason by virtual display to further improve the resolution ratio of indoor small clearance display screen
The effect thought.
Therefore a kind of display unit simple in structure, at low cost is found, and can more effectively improves display and differentiate
The technology of rate is always research hotspot at present in the industry.
Invention content
Therefore, to solve technological deficiency and deficiency of the existing technology, the present invention proposes a kind of based on four color LED chips
Virtual LED display module and 4 times of frequency displaying methods.
Specifically, a kind of virtual LED display module based on four color LED chips that one embodiment of the invention proposes, packet
It includes:Four color LED chip groups being made of four color LED chips;Each four colors LED chip includes at least four LED luminescence units;Four
Color LED chip is regularly arranged, makes multiple LED luminescence units composition M × N matrixes;Between two LED luminescence units of arbitrary neighborhood
Spacing is equal.
In one embodiment of the invention, virtual LED display module further includes virtual display control circuit, for controlling
Virtual LED display module is virtually shown.
In one embodiment of the invention, virtual display control circuit is 4 frequency multiplication scanning circuits.
In one embodiment of the invention, four color LED chips are tetra- colors of the RGBY one prepared based on GaN material
LED chip.
In one embodiment of the invention, four color LED chip groups include the one or four color LED chip, the one or four color LED core
Piece by 4 LED luminescence units with 2 × 2 matrix arrangements, and including 1 red-light LED unit, 1 green light LED unit, 1 blue light
LED unit and 1 yellow light LED unit.
In one embodiment of the invention, four color LED chips further include:1 the first public electrode, is set to described three
The first end of vitta shape LED chip;3 second electrodes are respectively arranged at the second end of three LED luminescence units.
In one embodiment of the invention, four color LED chip groups include the two or four color LED chip, the two or four color LED core
For piece by 2a × 2b LED luminescence unit with 2a × 2b matrix arrangements, 2a × 2b LED luminescence unit includes a × b red-light LED
Unit, a × b green light LED unit, a × b blue-ray LED unit and a × b yellow light LED unit.
A kind of 4 times of frequency displaying methods of virtual LED based on four color LED chips that an alternative embodiment of the invention provides,
For virtual LED display module to be driven virtually to be shown.4 times of frequency displaying methods of the virtual LED include:
4 kinds of scanning coordinates are defined, including the first coordinate, the second coordinate, third coordinate and 4-coordinate;
Is divided to each frame image of input, including the first scan period, the second scanning week the scan period of 4 sequential
Phase, third scan period and the 4th scan period;
The display data of each corresponding scan period is generated according to the image pixel data of each frame image;
Display data is received, according to 4 kinds of scanning coordinates, scan periods, virtual LED display module is driven.
In one embodiment of the invention, 4 kinds of scanning coordinates include:
First coordinate, since the virtual LED display module upper left corner, every 2 × 2 sub-pixels form a virtual display picture
Element, each sub-pixel only use once;
Second coordinate, since the virtual LED display module upper left corner, every 2 × 1 sub-pixels of first row form half virtually
Display pixel, last arranges every 2 × 1 sub-pixels and forms half of virtual display pixel;Every 2 × 2 sub-pixels of remaining sub-pixel
Form a virtual display pixel;Each sub-pixel only uses once;
Third coordinate, since the virtual LED display module upper left corner, every 1 × 2 sub-pixel of the first row forms half virtually
Display pixel, every 1 × 2 sub-pixel of last column form half of virtual display pixel;Every 2 × 2 sub-pixels of remaining sub-pixel
Form a virtual display pixel;Each sub-pixel only uses once;
4-coordinate, since the virtual LED display module upper left corner, the first row first row, the first row last row, first
4 sub-pixels of last row of row last column and last column are respectively separately formed the virtual display pixel of a quarter;The
One remaining sub-pixel of row arranges every 2 × 1 sub-pixels of remaining sub-pixel with last and forms half of virtual display pixel;The first row its
Minor pixel and every 1 × 2 sub-pixel of remaining sub-pixel of last column form half of virtual display pixel;Remaining sub-pixel every 2
× 2 sub-pixels form a virtual display pixel;Each sub-pixel only uses once.
In one embodiment of the invention, according to each corresponding scanning of the image pixel data of each frame image generation
The step of display data in period, includes:
According to the image pixel data of the first coordinate and each frame image, the first display of corresponding first scan period is generated
Data;
According to the image pixel data of the second coordinate and each frame image, the second display of corresponding second scan period is generated
Data;
According to the image pixel data of third coordinate and each frame image, the third for generating the corresponding third scan period is shown
Data
According to the image pixel data of 4-coordinate and each frame image, the 4th display of corresponding 4th scan period is generated
Data.
Virtual LED display module provided in an embodiment of the present invention based on four color LED chips, employs based on GaN material
The LED chip of RGBY tetra- colors one prepared by the luminescent material of totally four kinds of colors, by the thickness for rationally setting each zone isolation layer
Degree, make multiple four colors LED chips it is regularly arranged, splicing be assembled into four color LED chip groups, form all primary colours luminescence units etc.
The evenly distributed four color luminescence unit matrix array of small spacing of spacing, improves physical resolution.Meanwhile the virtual LED is shown
The method that module is shared by sub-pixel carries out it using virtual display control circuit 4 times of scannings, realizes that virtual pixel is shown
Show, visual density increases to 4 times, further significantly improves display resolution, is shown the clarity that image is shown
It writes and improves, effectively improve display effect.
Through the following detailed description with reference to the accompanying drawings, other aspects of the invention and feature become apparent.But it should know
Road, which is only the purpose design explained, not as the restriction of the scope of the present invention, this is because it should refer to
Appended claims.It should also be noted that unless otherwise noted, it is not necessary to which scale attached drawing, they only try hard to concept
Ground illustrates structure and flow described herein.
Description of the drawings
Below in conjunction with attached drawing, the specific embodiment of the present invention is described in detail.
Fig. 1 is the structure diagram of the virtual LED display module provided in an embodiment of the present invention based on four color LED chips;
Fig. 2 is the structure diagram of four colors LED chip provided in an embodiment of the present invention;
Fig. 3 is the structure diagram of four color LED chips that another embodiment of the present invention provides;
Fig. 4 is the structural representation of the virtual LED display module based on four color LED chips that further embodiment of this invention provides
Figure;
Fig. 5 is the flow chart of the preparation method of four colors LED chip provided in an embodiment of the present invention;
Fig. 6 is the flow of virtual LED 4 times of frequency displaying methods provided in an embodiment of the present invention based on four color LED chips
Figure;
Fig. 7 is that the first coordinate that the virtual display pixel of virtual LED display module provided in an embodiment of the present invention is distributed shows
It is intended to;
Fig. 8 is that the second coordinate that the virtual display pixel of virtual LED display module provided in an embodiment of the present invention is distributed shows
It is intended to;
Fig. 9 is that the third coordinate that the virtual display pixel of virtual LED display module provided in an embodiment of the present invention is distributed shows
It is intended to;
Figure 10 is that the 4-coordinate that the virtual display pixel of virtual LED display module provided in an embodiment of the present invention is distributed shows
It is intended to.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.
Embodiment one
Referring to Fig. 1, Fig. 1 is a kind of virtual LED display module based on four color LED chips provided in an embodiment of the present invention
Structure diagram.
The virtual LED display module 10 includes:Four color LED chip groups 11 being made of several four colors LED chips 12;Often
A four colors LED chip 12 includes at least four LED luminescence units;Several four colors LED chips 12 are regularly arranged, horizontal spacing
For D2, longitudinal pitch D1.Multiple LED luminescence units form M × N matrixes, between two LED luminescence units of arbitrary neighborhood between
Away from equal.
The virtual LED display module 10 further includes virtual display control circuit 13, for control the LED display modules into
The virtual display of row.The virtual display control circuit 13 has storage chip and driving chip, and storage chip receives for storing
Display data, driving chip, which receives, generates corresponding driving current after display data, and driving virtual LED display module carries out
The display of image or video data.In one embodiment of the present of invention, all LED of the virtual LED display module 10 shine list
Member composition M × N matrix minimum display unit P include 4 primary colours luminescence units R, G, B, Y, coordinate be (R, G, B, Y)=
(11,12,21,22), a sub-pixel of each primary colours luminescence unit as the virtual LED display module 10.Virtual display
Control circuit 13 uses 4 frequency multiplication scanning circuits, carries out 4 frequency multiplication scannings to LED display modules, each LED sub-pixel is made to carry out 4
It is secondary shared, it is produced around the practical sub-pixel of virtual LED display module with the void of 4 times of regularly arranged quantity of array way
Intend pixel so that display resolution significantly improves, and image, which is shown, to be more clear.
Referring to Fig. 2, Fig. 2 is the structure diagram of four colors LED chip provided in an embodiment of the present invention.The four colors LED chip
12 be the LED chip of RGBY tetra- colors one prepared altogether using the luminescent material of four kinds of colors based on GaN material.Such as institute in Fig. 2
Show, which includes the luminescence unit of 4 kinds of different base colors, and each four colors LED chip 12 includes LED luminescence units
Quantity be at least 4, the LED luminescence unit quantity of each primary colours is at least 1, these LED luminescence units be arranged in m ×
The two-dimensional matrix array of n, is suitable for carrying out 4 frequencys multiplication by the way of the embodiment of the present invention virtually showing.
In one embodiment of the invention, each four colors LED chip 12 includes the LED luminescence units of 4 different base colors:
Red-light LED luminescence unit 21, green LED unit 22, blue-ray LED luminescence unit 23 and yellow light LED luminescence unit 24.
In each LED luminescence units surrounding filled with isolated substance, isolation is formed between two adjacent LEDs luminescence unit
Layer, including red-light LED separation layer 25, green light LED separation layer 26, blue-ray LED separation layer 27 and yellow light LED separation layer 28.With reference to
Fig. 1 and Fig. 2 are illustrated, and four color LED chips 12 of the embodiment of the present invention are in the preparation, it is contemplated that and the thickness of separation layer is thick
Degree needs to meet when four color LED chip groups 11 of the regularly arranged composition virtual LED display module 10 of multiple four colors LED chips 12
When, it is ensured that in M × N matrix of four color LED chip groups 11, the spacing between two LED luminescence units of arbitrary neighborhood is equal.Cause
This, in the thickness for determining separation layer, to compensate multiple four colors LED chips 12 when splicing assembling in two neighboring four colors LED
Existing clearance D between chip 121And D2, which cannot be too small.Specifically such as, each four colors LED chip 12 it is upper and lower,
The thickness of the separation layer at left and right four edges is respectively d1、d2、d3、d4, inside same four colors LED chip 12, it is neighbouring
Two LED luminescence units between separation layer thickness be d5, the separation layer between two adjacent LED luminescence units of left and right
Thickness be d6.Usually, (D should be met1+d1+d2)=d5, (D2+d3+d4)=d6, meanwhile, meeting chipset packaging technology
Under conditions of level allows, make the space D between adjacent chips as possible1And D2Value accomplish minimum, also, d1、d2、d3、d4、d5
And d6Value also take a smaller value as possible so that the spacing between two adjacent LEDs luminescence unit reaches minimum, and then make
The physical resolution of virtual LED display module reaches maximum.
In another embodiment of the present invention, the isolation at four edges in upper and lower, left and right of each four colors LED chip 12
The thickness of layer is equal, i.e. d1=d2=d3=d4, inside same four colors LED chip 12, neighbouring adjacent with left and right two
The thickness of separation layer between LED luminescence units is also equal, i.e. d5=d6, also, d5=d6=3d1=3d2=3d3=3d4.It is more
When a four colors LED chip 12 is assembled into four color LED chip groups 11, the spacing between two neighboring four colors LED chip 12 is D1=
D2。
The four colors LED chip 12 further includes N-type electrode and P-type electrode.In one embodiment of the invention, each LED
A pair of of N-type electrode and P-type electrode are each provided on luminescence unit, N-type electrode is set to the N-type end of each LED luminescence units,
P-type electrode is set to the p-type end of each LED luminescence units.Specifically such as, red-light LED luminescence unit 21 is provided with N-type electrode
211 and P-type electrode 212, green LED unit 22 be provided with N-type electrode 221 and P-type electrode 222, blue-ray LED luminescence unit
23 are provided with N-type electrode 231 and P-type electrode 232, and yellow light LED luminescence unit 24 is provided with N-type electrode 241 and P-type electrode 242.
Referring to Fig. 3, Fig. 3 is the structure diagram of four color LED chips that another embodiment of the present invention provides.To make four color
The structure of LED chip 30 is simpler, and multiple N-type electrodes of all LED luminescence units are set as a common n-type electrode,
The N-type end of the four colors LED chip 30 is arranged on, multiple P-type electrodes are independently set to the p-type end of each LED luminescence units,
Or multiple P-type electrodes of all LED luminescence units are set as a public P-type electrode, it is arranged on the four colors LED chip 30
P-type end, multiple N-type electrodes are independently set to the N-type end of each LED luminescence units.
Specifically in yet another embodiment of the present invention, which includes 4 LED luminescence units:Feux rouges
LED luminescence units 31, green LED unit 32, blue-ray LED luminescence unit 33 and yellow light LED luminescence unit 34.Red-light LED
Luminescence unit 31 is provided with N-type electrode 311, and green LED unit 32 is provided with N-type electrode 321, blue-ray LED luminescence unit
33 are provided with N-type electrode 331, and yellow light LED luminescence unit 34 is provided with N-type electrode 341, at the p-type end of the four colors LED chip 30
It is provided with public P-type electrode 35.
Embodiment two
Referring to Fig. 4, Fig. 4 is the virtual LED display module based on four color LED chips that further embodiment of this invention provides
Structure diagram.
The virtual LED display module 40 includes:It virtual display control circuit 41 and is made of several four colors LED chips
Four color LED chip groups 42.
The four colors LED chip group 42 is made of four color LED chips of a variety of different sizes, and each four colors LED chip includes
At least four LED luminescence units, and contain the LED luminescence units of four kinds of primary colours, respectively red-light LED luminescence unit, green light
LED luminescence units, blue-ray LED luminescence unit and yellow light LED luminescence unit.Four color LED chips of the plurality of specifications are by 2a × 2b
A LED luminescence units are a including a × b red-light LED unit, a × b green light LED unit, a × b with 2a × 2b matrix arrangements
Blue-ray LED unit and a × b yellow light LED unit.
Four color LED chip groups 42 of the embodiment of the present invention employ multiple four colors LED chips 43, and it includes 4 LED to shine
Unit (R, G, B, Y);Multiple four colors LED chips 44 are employed, it includes 8 LED luminescence units (2R, 2G, 2B, 2Y);Using
Multiple four colors LED chips 45, it includes 6 LED luminescence units (2R, G, 2B, Y);Multiple four colors LED chips 46 are employed,
It includes 16 LED luminescence units (4R, 4G, 4B, 4Y);Multiple four colors LED chips 47 are employed, it includes 20 LED to shine
Unit (5R, 5G, 5B, 5Y);Multiple four colors LED chips 48 are employed, it includes 6 LED luminescence units (R, 2G, B, 2Y);It adopts
With multiple four colors LED chips 49, it includes 12 LED luminescence units (3R, 3G, 3B, 3Y).The four of several different sizes
Color LED chip is regularly arranged, makes all LED luminescence units composition M × N matrixes;Between two LED luminescence units of arbitrary neighborhood
Spacing is equal.In the four color LED chip for preparing the plurality of specifications, size specification is according to preparing the specification of material therefor simultaneously
It is determined with reference to the specification of LED display modules, in the splicing assembling for carrying out LED display modules, can flexibly select as needed
The four color LED chips for selecting appropriate size are assembled, and four color LED chips of big specification further simplify LED display modules
Structure, four color LED chips of small dimension are used to fill up fringe region.
Four color LED chips of a variety of different sizes of the embodiment of the present invention with above-described embodiment one, are total to based on GaN material
The LED chip of RGBY tetra- colors one prepared using the luminescent material of four kinds of colors.
Four color LED chips of a variety of different sizes of the embodiment of the present invention are shone list in each LED with above-described embodiment one
First surrounding is filled with isolated substance, and separation layer is formed between two adjacent LEDs luminescence unit, and the thickness of separation layer meets (D1+
d1+d2)=d5, (D2+d3+d4)=d6, it is preferable that selection d1=d2=d3=d4, d5=d6=3d1=3d2=3d3=3d4, D1=
D2。
To sum up described in two embodiments, the virtual LED based on four color LED chips that the above embodiment of the present invention provides is shown
Module employs the LED chip of RGBY tetra- colors one prepared by the luminescent material based on GaN material totally four kinds of colors, passes through conjunction
Reason sets the thickness of each zone isolation layer, makes that multiple four colors LED chips are regularly arranged, splicing is assembled into four color LED chip groups
Afterwards, the equidistant evenly distributed four color luminescence unit matrix array of small spacing of all primary colours luminescence units is formed, improves physics
Resolution ratio.Meanwhile the virtual LED display module carries out it 4 times of scannings using virtual display control circuit, realizes virtual pixel
It has been shown that, further significantly improves display resolution.
Embodiment three
Four color LED chips of the embodiment of the present invention are prepared altogether using the luminescent material of four kinds of colors based on GaN material
The LED chip of RGBY tetra- colors one.The four colors LED chip includes the luminescence unit of four kinds of primary colours from structure, is sent out for red-light LED
Light unit, green LED unit, blue-ray LED luminescence unit, yellow light LED luminescence unit further include N-type electrode and p-type electricity
Pole.Isolation is formed between two adjacent LEDs luminescence unit filled with isolated substance around four kinds of primary colours luminescence units
Layer.
Referring to Fig. 5, Fig. 5 is the flow chart of the preparation method of three vittas shape LED chip provided in an embodiment of the present invention.Specifically
Ground, the preparation method following steps of the four colors LED chip:
501, select substrate.
In an embodiment of the invention, sapphire material or SiC material are selected as substrate.
502, BLUE LED emissions structure is prepared on substrate, obtains monochromatic light emitting structure.
The material of blue-ray LED light emitting structure includes GaN material.Specifically, it is sequentially prepared the first GaN bufferings on substrate
Layer, the first GaN stabilized zones, the first n-type GaN layer, the first InGaN/GaN multiple quantum well active layers, the first p-type AlGaN barrier layers,
First p-type GaN layer.Wherein, the first InGaN/GaN multiple quantum well active layers include multiple GaN barrier layers and multiple InGaN quantum
Well layer, GaN barrier layers and InGaN quantum well layers are arranged alternately.
503, etching forms feux rouges wick slot on monochromatic light emitting structure, and preparing red-light LED in feux rouges wick slot shines
Structure obtains dual color light emitting structure.
In an embodiment of the invention, the first SiO is deposited in the first p-type GaN layer using pecvd process2Layer uses
Wet-etching technology is in the first SiO2Specific location etches the first rectangular window on layer, then using dry etch process in window
Range, which persistently etches to be formed, removes the first SiO after the first groove2Layer, the first p-type GaN layer upper surface, substrate upper surface and
The side wall of first groove precipitates the 2nd SiO2Layer etches the upper of the first p-type GaN layer upper surface and substrate using dry etch process
2nd SiO on surface2Layer is in the first SiO of the side wall of the first groove formation2Separation layer, for be isolated blue light emitting structure with it is red
Light light emitting structure so far forms feux rouges wick slot.
The 2nd GaN buffer layers, the second N-shaped GaAs buffer layers, the second N-shaped GaAs is sequentially prepared in feux rouges wick slot to stablize
Layer, the 2nd GalnP/A1GaInP multiple quantum well active layers, the second p-type A1GaInP barrier layers, the second p-type GaAs contact layers.Its
In, the 2nd GalnP/A1GaInP multiple quantum well active layers include multiple GalnP barrier layers and multiple A1GaInP barrier layers,
GalnP barrier layers and A1GaInP barrier layers are arranged alternately.
In an embodiment of the invention, 1 the first rectangular window is etched using wet-etching technology, forms 1 first
Groove forms 1 feux rouges wick slot, finally prepares 1 red-light LED light emitting structure.
504, etching forms green light wick slot in dual color light emitting structure, and green LED is prepared in green light wick slot
Structure obtains three-colour light-emitting structure.
In an embodiment of the invention, the 3rd SiO is deposited in the first p-type GaN layer using pecvd process2Layer;Using
Wet-etching technology is in the 3rd SiO2Specific location etches the second rectangular window on layer;Again using dry etch process in window
Range, which persistently etches to be formed, removes the 3rd SiO after the second groove2Layer;The first p-type GaN layer upper surface, substrate upper surface and
The side wall of second groove precipitates the 4th SiO2Layer;The upper of first p-type GaN layer upper surface and substrate is etched using dry etch process
4th SiO on surface2Layer is in the 2nd SiO of the side wall of the second groove formation2Separation layer, for red light-emitting structure, blue light to be isolated
Light emitting structure and green luminescence structure so far form green light wick slot.
The 3rd GaN buffer layers, the 3rd GaN stabilized zones, third n-type GaN layer, third are sequentially prepared in green light wick slot
InGaN/GaN multiple quantum well active layers, third p-type AlGaN barrier layers, third p-type GaN layer.Wherein, third p-type AlGaN stops
Layer includes multiple GaN barrier layers and multiple InGaN quantum well layers, and GaN barrier layers and InGaN quantum well layers are arranged alternately.
In an embodiment of the invention, 1 the second rectangular window is etched using wet-etching technology, forms 1 second
Groove forms 1 green light wick slot, finally prepares 1 green LED structure.
505, etching forms yellow light wick slot in three-colour light-emitting structure, and preparing yellow light LED in yellow light wick slot shines
Structure obtains the one or four color light emitting structure.
In an embodiment of the invention, the 5th SiO is deposited in the first p-type GaN layer using pecvd process2Layer;Using
Wet-etching technology is in the 5th SiO2Specific location etches third rectangular window on layer;Again using dry etch process in window
Range, which persistently etches to be formed, removes the 5th SiO after third groove2Layer;The first p-type GaN layer upper surface, substrate upper surface and
The side wall of third groove precipitates the 6th SiO2Layer;The upper of first p-type GaN layer upper surface and substrate is etched using dry etch process
6th SiO on surface2Layer is in the 3rd SiO of the side wall of third groove formation2Separation layer, for Yellow light emitting structure, feux rouges to be isolated
Light emitting structure, blue light emitting structure and green luminescence structure so far form yellow light wick slot.
The 4th GaN buffer layers, the 4th GaN stabilized zones, the 4th n-type GaN layer, the 4th are sequentially prepared in yellow light wick slot
InGaN/GaN multiple quantum well active layers, the 4th p-type AlGaN barrier layers, the 4th p-type GaN layer.Wherein, the 4th InGaN/GaN is more
Mqw active layer includes multiple GaN barrier layers and multiple InGaN quantum well layers, GaN barrier layers and InGaN quantum well layers alternating
Arrangement.
In an embodiment of the invention, 1 third rectangular window is etched using wet-etching technology, forms 1 third
Groove forms 1 yellow light wick slot, finally prepares 1 yellow light LED light emitting structure.
In an embodiment of the invention, by step 501~505, the one or four color light emitting structure being prepared, comprising
1 red light-emitting structure, 1 green luminescence structure, 1 blue light emitting structure and 1 Yellow light emitting structure, 4 light emitting structures
It is arranged with 2 × 2 matrix forms.Step 503, step 504, the sequence of step 505 can be exchanged arbitrarily.
506, light screening material is prepared in the one or four color light emitting structure upper surface, forms the light-emission window of specified layout and size
Mouthful, obtain the two or four color light emitting structure;
In an embodiment of the invention, the two or four color light emitting structure being prepared, 4 red light-emitting structures shine
Window size is equal, between the upper and lower away from between left and right away from equal.
507, N-type electrode is prepared at the N-type end of the two or four color light emitting structure, P-type electrode is prepared at p-type end, obtains four colors
LED chip.
In an embodiment of the invention, a N-type electricity is prepared respectively at the N-type end of each luminescence unit and p-type end
Pole and P-type electrode.
In another embodiment, a common n-type electrode is prepared at the N-type end of the two or four color light emitting structure,
A P-type electrode is respectively prepared at the p-type end of each luminescence unit.
In another embodiment of the invention, a public P-type electrode is prepared at the p-type end of the two or four color light emitting structure,
A N-type electrode is respectively prepared at the N-type end of each luminescence unit.
The preparation method of the embodiment of the present invention, when etching wick slot on each light emitting structure, the position of fluting and quantity
Determine the distribution mode of each primary colours luminescence unit in finally prepd four colors LED chip, the size of fluting determines each primary colours
The size of luminescence unit, the spacing between adjacent slot determine the point spacing of each primary colours luminescence unit.Therefore, it is different by setting
Parameter values, four color LED chips of various different sizes can be prepared, such as include 2a × 2b LED luminescence unit with 2a
× 2b matrix arrangements, including a × b red-light LED unit, a × b green light LED unit, a × b blue-ray LED unit and a × b
A yellow light LED unit.
In conclusion according to the preparation method of the embodiment of the present invention, the LED chip of four colors one can be prepared, the chip
The light of multiple color can be generated in the form of single-chip, greatly reduces the dosage of fluorescent powder;In addition, the chip is integrated,
Integrated level is high, greatly reduces cost of manufacture;And the chip also has the advantages that flexible modulation colour temperature.
Example IV
Referring to Fig. 6, Fig. 6 is virtual LED 4 times of frequency displaying methods provided in an embodiment of the present invention based on four color LED chips
Flow chart.The virtual LED display methods includes the following steps:
601, define 4 kinds of scanning coordinates.
The virtual LED display module of the embodiment of the present invention as shown in fig. 1, altogether comprising 8 × 12 primary colours luminescence units, i.e.,
8 × 12 sub-pixels, every 2 × 2 sub-pixels form a display pixel, form 24 display pixels altogether.
Referring to Fig. 7, Fig. 7 is that the virtual display pixel of virtual LED display module provided in an embodiment of the present invention is distributed
One coordinate schematic diagram.Since the virtual LED display module upper left corner, every 2 × 2 sub-pixels form a virtual display pixel,
Each sub-pixel only uses once.
Referring to Fig. 8, Fig. 8 is that the virtual display pixel of virtual LED display module provided in an embodiment of the present invention is distributed
Two coordinate schematic diagrames.Since the virtual LED display module upper left corner, every 2 × 1 sub-pixels of first row form half of virtual display
Pixel, last arranges every 2 × 1 sub-pixels and forms half of virtual display pixel;Every 2 × 2 sub-pixels of remaining sub-pixel are formed
One virtual display pixel.Each sub-pixel only uses once.
Referring to Fig. 9, Fig. 9 is that the virtual display pixel of virtual LED display module provided in an embodiment of the present invention is distributed
Three coordinate schematic diagrames.Since the virtual LED display module upper left corner, every 1 × 2 sub-pixel of the first row forms half of virtual display
Pixel, every 1 × 2 sub-pixel of last column form half of virtual display pixel;Every 2 × 2 sub-pixels of remaining sub-pixel are formed
One virtual display pixel.Each sub-pixel only uses once.
Referring to Figure 10, Figure 10 is that the virtual display pixel of virtual LED display module provided in an embodiment of the present invention is distributed
4-coordinate schematic diagram.Since the virtual LED display module upper left corner, the first row first row, the first row last row, first row
4 sub-pixels of last row of last column and last column are respectively separately formed the virtual display pixel of a quarter;First
It arranges remaining sub-pixel and last arranges every 2 × 1 sub-pixels of remaining sub-pixel and forms half of virtual display pixel;The first row remaining
Sub-pixel and every 1 × 2 sub-pixel of remaining sub-pixel of last column form half of virtual display pixel;Remaining sub-pixel every 2 × 2
A sub-pixel forms a virtual display pixel.Each sub-pixel only uses once.
602, the scan period of 4 sequential is divided to each frame image of input, 4 scan periods include the equal time
Section.
603, the display of each corresponding scan period is generated according to the image pixel data of each frame image
Data.
According to the image pixel data of the first coordinate and each frame image, the first display of corresponding first scan period is generated
Data;
According to the image pixel data of the second coordinate and each frame image, the second display of corresponding second scan period is generated
Data;
According to the image pixel data of third coordinate and each frame image, the third for generating the corresponding third scan period is shown
Data
According to the image pixel data of 4-coordinate and each frame image, the 4th display of corresponding 4th scan period is generated
Data.
604, display data is received, according to the scanning coordinate, scanning sequence and period of definition, to virtual LED display module
It is driven.
In the embodiment of the present invention, virtual display control circuit has storage chip and driving chip, and storage chip is used to deposit
The display data received is stored up, driving chip generates corresponding driving current after receiving display data, and driving virtual LED is shown
Module carries out the display of image or video data.When the data source of input is image, after carrying out 4 scanning, image is completed empty
Intend display;It is right again successively after 4 virtual displays of scanning completion are carried out to a frame image if the data source of input is video
Next frame image carries out 4 scanning, is finally completed and the high-resolution of video data is virtually shown.
4 times of frequency displaying methods of virtual LED based on four color LED chips through the embodiment of the present invention, using four colors one
LED chip, realize smaller spacing, then the method shared by sub-pixel, 24 display pixels, can form originally
77 virtual display pixels.Sub-pixel positioned at virtual LED display module edge position generally can not achieve 4 times and share,
When virtual LED display module is larger, and the luminescence unit quantity of composition virtual LED display module is more, visual density increases to
About 34 times.Therefore, the method for the embodiment of the present invention makes the clarity that image is shown be significantly improved, and effectively improves aobvious
Show effect, display area has good application value indoors.
LED display modules described in above example can be that LED light bar, LED lamp panel, LED box, LED are shown
Screen etc. is any.
In conclusion specific case used herein is to the present invention is based on the virtual LED display modules of four color LED chips
And 4 times of frequency displaying methods are expounded, the explanation of above example is only intended to help to understand method of the invention and its core
Thought is thought;Meanwhile for those of ordinary skill in the art, thought according to the present invention, in specific embodiment and using model
There will be changes are placed, in conclusion the content of the present specification should not be construed as limiting the invention, protection of the invention
Range should be subject to appended claim.
Claims (10)
1. a kind of virtual LED display module based on four color LED chips, which is characterized in that including:It is made of four color LED chips
Four color LED chip groups;
Each four colors LED chip includes at least four LED luminescence units;
The four colors LED chip is regularly arranged, makes multiple LED luminescence units composition M × N matrixes;
Spacing between the LED luminescence units of arbitrary neighborhood two is equal.
2. virtual LED display module according to claim 1, which is characterized in that the virtual LED display module further includes
Virtual display control circuit, for the virtual LED display module to be controlled virtually to be shown.
3. virtual LED display module according to claim 2, which is characterized in that the virtual display control circuit is 4 times
Frequency scanning circuit.
4. virtual LED display module according to claim 1, which is characterized in that the four colors LED chip is based on GaN
The LED chip of the RGBY tetra- colors one of material preparation.
5. virtual LED display module according to claim 1, which is characterized in that the four colors LED chip group includes first
Four color LED chips, the one or the four color LED chip by 4 LED luminescence units with 2 × 2 matrix arrangements, and including 1 feux rouges
LED unit, 1 green light LED unit, 1 blue-ray LED unit and 1 yellow light LED unit.
6. virtual LED display module according to claim 5, which is characterized in that the four colors LED chip further includes:
1 the first public electrode is set to the first end of the three vittas shape LED chip;
3 second electrodes are respectively arranged at the second end of three LED luminescence units.
7. virtual LED display module according to claim 1, which is characterized in that the four colors LED chip group includes second
Four color LED chips, the two or the four color LED chip by 2a × 2b LED luminescence unit with 2a × 2b matrix arrangements, the 2a ×
2b LED luminescence unit include a × b red-light LED unit, a × b green light LED unit, a × b blue-ray LED unit and a ×
B yellow light LED unit.
8. a kind of 4 times of frequency displaying methods of virtual LED based on four color LED chips, for driving such as any institute of claim 1~7
The virtual LED display module stated virtually is shown, which is characterized in that including:
4 kinds of scanning coordinates are defined, including the first coordinate, the second coordinate, third coordinate and 4-coordinate;
The scan period of 4 sequential is divided to each frame image of input, including the first scan period, the second scan period, the
Three scan periods and the 4th scan period;
The display data of each corresponding scan period is generated according to the image pixel data of each frame image;
The display data is received, according to 4 kinds of scanning coordinates, scan periods, the virtual LED display module is driven
It is dynamic.
9. display methods according to claim 8, which is characterized in that 4 kinds of scanning coordinates include:
First coordinate, since the virtual LED display module upper left corner, every 2 × 2 sub-pixels form a virtual display picture
Element, each sub-pixel only use once;
Second coordinate, since the virtual LED display module upper left corner, every 2 × 1 sub-pixels of first row form half virtually
Display pixel, last arranges every 2 × 1 sub-pixels and forms half of virtual display pixel;Every 2 × 2 sub-pixels of remaining sub-pixel
Form a virtual display pixel;Each sub-pixel only uses once;
Third coordinate, since the virtual LED display module upper left corner, every 1 × 2 sub-pixel of the first row forms half virtually
Display pixel, every 1 × 2 sub-pixel of last column form half of virtual display pixel;Every 2 × 2 sub-pixels of remaining sub-pixel
Form a virtual display pixel;Each sub-pixel only uses once;
4-coordinate, since the virtual LED display module upper left corner, the first row first row, the first row last row, first
4 sub-pixels of last row of row last column and last column are respectively separately formed the virtual display pixel of a quarter;The
One remaining sub-pixel of row arranges every 2 × 1 sub-pixels of remaining sub-pixel with last and forms half of virtual display pixel;The first row its
Minor pixel and every 1 × 2 sub-pixel of remaining sub-pixel of last column form half of virtual display pixel;Remaining sub-pixel every 2
× 2 sub-pixels form a virtual display pixel;Each sub-pixel only uses once.
10. display methods according to claim 8 or claim 9, which is characterized in that according to the image pixel of each frame image
The step of display data of each corresponding scan period of data generation, includes:
According to the image pixel data of first coordinate and each frame image, generation corresponding first scan period
First display data;
According to the image pixel data of second coordinate and each frame image, generation corresponding second scan period
Second display data;
According to the image pixel data of the third coordinate and each frame image, the generation corresponding third scan period
Third display data;
According to the image pixel data of the 4-coordinate and each frame image, generation corresponding 4th scan period
4th display data.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711484172.0A CN108230926A (en) | 2017-12-29 | 2017-12-29 | Virtual LED display module and 4 times of frequency displaying methods based on four color LED chips |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711484172.0A CN108230926A (en) | 2017-12-29 | 2017-12-29 | Virtual LED display module and 4 times of frequency displaying methods based on four color LED chips |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108230926A true CN108230926A (en) | 2018-06-29 |
Family
ID=62647286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711484172.0A Pending CN108230926A (en) | 2017-12-29 | 2017-12-29 | Virtual LED display module and 4 times of frequency displaying methods based on four color LED chips |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108230926A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020051944A1 (en) * | 2018-09-13 | 2020-03-19 | 武汉华星光电半导体显示技术有限公司 | Pixel arrangement structure and display apparatus |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1614658A (en) * | 2003-11-07 | 2005-05-11 | 熊小梅 | Four-light arranging method for four basic color LEDs |
CN101950513A (en) * | 2010-09-14 | 2011-01-19 | 深圳市洲明科技股份有限公司 | Led display screen and control method thereof |
US20110140999A1 (en) * | 2009-12-10 | 2011-06-16 | Young Electric Sign Company | Apparatus and method for mapping virtual pixels to physical light elements of a display |
CN103093722A (en) * | 2013-02-22 | 2013-05-08 | 厦门大学 | Four-color light-emitting diode (LED) display sub-pixel restructuring method |
CN103413499A (en) * | 2013-08-07 | 2013-11-27 | 深圳市大象视界科技有限公司 | LED display screen |
CN104241508A (en) * | 2014-09-22 | 2014-12-24 | 山东浪潮华光光电子股份有限公司 | White LED chip and manufacturing method |
CN204441288U (en) * | 2015-03-04 | 2015-07-01 | 扬州中科半导体照明有限公司 | A kind of light emitting diode matrix with double insulating layer |
CN105336706A (en) * | 2014-08-06 | 2016-02-17 | 晶能光电(江西)有限公司 | Preparation method for high voltage LED chip |
CN105932125A (en) * | 2016-05-17 | 2016-09-07 | 太原理工大学 | GaN-base green light LED epitaxial structure and preparation method therefor |
CN207883228U (en) * | 2017-12-29 | 2018-09-18 | 西安智盛锐芯半导体科技有限公司 | Virtual LED display module based on four color LED chips |
-
2017
- 2017-12-29 CN CN201711484172.0A patent/CN108230926A/en active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1614658A (en) * | 2003-11-07 | 2005-05-11 | 熊小梅 | Four-light arranging method for four basic color LEDs |
US20110140999A1 (en) * | 2009-12-10 | 2011-06-16 | Young Electric Sign Company | Apparatus and method for mapping virtual pixels to physical light elements of a display |
CN101950513A (en) * | 2010-09-14 | 2011-01-19 | 深圳市洲明科技股份有限公司 | Led display screen and control method thereof |
CN103093722A (en) * | 2013-02-22 | 2013-05-08 | 厦门大学 | Four-color light-emitting diode (LED) display sub-pixel restructuring method |
CN103413499A (en) * | 2013-08-07 | 2013-11-27 | 深圳市大象视界科技有限公司 | LED display screen |
CN105336706A (en) * | 2014-08-06 | 2016-02-17 | 晶能光电(江西)有限公司 | Preparation method for high voltage LED chip |
CN104241508A (en) * | 2014-09-22 | 2014-12-24 | 山东浪潮华光光电子股份有限公司 | White LED chip and manufacturing method |
CN204441288U (en) * | 2015-03-04 | 2015-07-01 | 扬州中科半导体照明有限公司 | A kind of light emitting diode matrix with double insulating layer |
CN105932125A (en) * | 2016-05-17 | 2016-09-07 | 太原理工大学 | GaN-base green light LED epitaxial structure and preparation method therefor |
CN207883228U (en) * | 2017-12-29 | 2018-09-18 | 西安智盛锐芯半导体科技有限公司 | Virtual LED display module based on four color LED chips |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020051944A1 (en) * | 2018-09-13 | 2020-03-19 | 武汉华星光电半导体显示技术有限公司 | Pixel arrangement structure and display apparatus |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108564890A (en) | Virtual LED display module based on three vitta shape LED chips and 6 times of frequency displaying methods | |
CN103280162B (en) | Display substrate and driving method thereof and display device | |
TWI613809B (en) | Display device | |
TWI525595B (en) | Pixel array, method for displaying image on a display and display | |
CN103366683B (en) | Pixel array, display and method for displaying image on display | |
CN104166259B (en) | Display substrate, driving method thereof and display device | |
CN105047092B (en) | Display and its pel array | |
CN103903524B (en) | Display packing | |
CN102262854B (en) | Pixel arrangement of organic light emitting display device | |
CN104037201B (en) | Pixel array, display and method for presenting images on display | |
US20160027359A1 (en) | Display method and display device | |
KR100676043B1 (en) | Method and apparatus for displaying bitmap multi-color image data on dot matrix-type display screen on which three primary color lamps are dispersedly arrayed | |
CN106816449A (en) | OLED display screen and its dot structure, the preparation method of OLED display screen | |
KR20060030053A (en) | Stacked oled display having improved efficiency | |
CN106097900A (en) | Micro-LED display panel | |
KR20150007261A (en) | Pixel array and display device having the pixel array | |
CN104659037A (en) | OLED (organic light emitting diode) array substrate, preparation method of OLED array substrate and display device | |
WO2016033803A1 (en) | Display panel, display apparatus and sub-pixel rendering method | |
CN104037203A (en) | Pixel array and displayer | |
KR101533764B1 (en) | Organic electroluminescent display device and methods of driving and manufacturing the same | |
CN108198520A (en) | Virtual LED display module and 2 times of frequency displaying methods based on three vitta shape LED chips | |
CN107909931A (en) | Virtual LED display module and 6 times of frequency displaying methods based on three vitta shape LED chips | |
CN108230927A (en) | Virtual LED display module and 3 times of frequency displaying methods based on three vitta shape LED chips | |
CN207883228U (en) | Virtual LED display module based on four color LED chips | |
CN204270613U (en) | A kind of dot structure, display base plate and display device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180629 |