CN108226955B - Infrared array proximity sensor - Google Patents
Infrared array proximity sensor Download PDFInfo
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- CN108226955B CN108226955B CN201711432539.4A CN201711432539A CN108226955B CN 108226955 B CN108226955 B CN 108226955B CN 201711432539 A CN201711432539 A CN 201711432539A CN 108226955 B CN108226955 B CN 108226955B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/93—Lidar systems specially adapted for specific applications for anti-collision purposes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
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Abstract
The invention discloses an infrared array proximity sensor, which comprises a top array circuit, an infrared generation layer and a bottom array circuit, wherein the top array circuit is connected with the infrared generation layer; the top array circuit and the bottom array circuit are oppositely arranged, and the top array circuit is connected with the bottom array circuit through the infrared generation layer; the output end of the first resistance network of the top array circuit, the infrared generation layer and the input end of the second resistance network of the bottom array circuit are connected in series, and when the infrared generation layer receives feedback information, the first input end and the second input end of the first resistance network and the first output end and the second output end of the second resistance network simultaneously output the position information of the object to be detected relative to the top array circuit. The invention has simple structure, directly outputs the position information of the object to be detected relative to the top array circuit, which is an analog quantity signal, and simplifies the complex operation of a subsequent processor; but also can be directly arranged on the surface of the robot to reduce a large number of blind areas and avoid collision.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to an infrared array proximity sensor.
Background
The proximity sensor is a generic term for a sensor that aims to detect without touching a detection target, instead of a contact detection method such as a limit switch. The movement information and the presence information of the detection object can be converted into an electric signal. In the process of realizing production automation, it is very important to adopt proper sensors.
In recent years, in the field of robots, in order to avoid collision when the robot is operated at a high speed, a plurality of proximity sensors, such as ultrasonic waves, infrared distance measuring sensors, etc., are generally mounted on the robot; the problem with this solution is that each individual sensor needs to be connected to the processor, which occupies a large amount of processor resources; after the number of the sensors is increased, the bandwidth of a complex detection system is inevitably caught, and a detection blind area is brought to a complex curved surface, so that the reliability and the safety of the system are influenced.
Disclosure of Invention
The invention aims to provide an infrared array proximity sensor, which mainly adopts a top array circuit, an infrared generation layer and a bottom array circuit to complete the whole sensor, has simple structure, directly outputs the position information of an object to be detected relative to the top array circuit, is an analog quantity signal, and simplifies the complex operation of a subsequent processor; but also can be directly arranged on the surface of the robot to reduce a large number of blind areas and avoid collision.
The invention provides an infrared array proximity sensor, which comprises a top array circuit, an infrared generation layer and a bottom array circuit, wherein the top array circuit is connected with the infrared generation layer;
the top array circuit and the bottom array circuit are oppositely arranged, and the top array circuit is connected with the bottom array circuit through the infrared generation layer;
the top array circuit comprises an external resistor R1, an external resistor R2, and a first resistor network;
the first input end of the first resistor network is connected with the output end of an external power supply through an external resistor R1, and the second input end of the first resistor network is connected with the output end of the external power supply through an external resistor R1;
the bottom array circuit comprises an external resistor R3, an external resistor R4, and a second resistor network;
the first output end of the second resistor network is connected with the output end of an external power supply through an external resistor R3, and the second output end of the first resistor network is connected with the output end of the external power supply through an external resistor R4;
the output end of the first resistance network, the infrared generation layer and the input end of the second resistance network are connected in series, and when the infrared generation layer receives feedback information, the first input end and the second input end of the first resistance network and the first output end and the second output end of the second resistance network simultaneously output the position information of the object to be detected relative to the top array circuit.
As an implementation manner, the first resistance network includes a plurality of first transverse branches and a plurality of first longitudinal branches intersecting with the first transverse branches in a preset interval arrangement; each first node where each first transverse branch and each first longitudinal branch are intersected is divided into a plurality of first sub-branches, and each first sub-branch is only provided with an internal resistor r.
As an embodiment, the number of the first transverse branches and the first longitudinal branches is 5.
As an implementation manner, the second resistance network includes a plurality of second transverse branches and a plurality of second longitudinal branches intersecting with the second transverse branches in a preset interval arrangement; each first transverse branch and each first longitudinal branch are divided into a plurality of second sub-branches by each second node where the first transverse branch and the first longitudinal branch intersect, and each second sub-branch is only provided with an internal resistor r.
As an embodiment, the number of the first transverse branches and the number of the second longitudinal branches are the same, and the number of the first longitudinal branches and the number of the second transverse branches are the same.
As an implementation mode, the infrared generation layer comprises a plurality of infrared pair tubes which are arranged in parallel;
and each infrared pair of transistors is respectively connected with the corresponding first node, second node and external driving circuit.
As an implementable mode, the infrared pair of tubes comprises a transmitting tube and a receiving tube;
the transmitting tube is connected with an external driving circuit;
and the anode of the receiving tube is connected with the first node, and the cathode of the receiving tube is connected with the second node.
In one embodiment, the external resistors R1, R2, R3 and R4 have the same resistance.
Compared with the prior art, the technical scheme has the following advantages:
the invention provides an infrared array proximity sensor, which comprises a top array circuit, an infrared generation layer and a bottom array circuit, wherein the top array circuit is connected with the infrared generation layer; the top array circuit and the bottom array circuit are oppositely arranged, and the top array circuit is connected with the bottom array circuit through the infrared generation layer; the output end of the first resistance network of the top array circuit, the infrared generation layer and the input end of the second resistance network of the bottom array circuit are connected in series, and when the infrared generation layer receives feedback information, the first input end and the second input end of the first resistance network and the first output end and the second output end of the second resistance network simultaneously output the position information of the object to be detected relative to the top array circuit. The invention mainly adopts the top array circuit, the infrared generation layer and the bottom array circuit to complete the whole sensor, has simple structure, directly outputs the position information of the object to be detected relative to the top array circuit, is an analog quantity signal, and simplifies the complex operation of a subsequent processor; but also can be directly arranged on the surface of the robot to reduce a large number of blind areas and avoid collision.
Drawings
Fig. 1 is a schematic perspective view of an infrared array proximity sensor according to an embodiment of the present invention;
fig. 2 is a schematic plan view of an infrared array proximity sensor according to an embodiment of the present invention;
fig. 3 is a schematic view of a portion of the structure of fig. 1.
In the figure: 1. a top array circuit; 2. an infrared-generating layer; 3. a bottom array circuit.
Detailed Description
The above and further features and advantages of the present invention will be apparent from the following, complete description of the invention, taken in conjunction with the accompanying drawings, wherein the described embodiments are merely some, but not all embodiments of the invention.
Referring to fig. 1, an infrared array proximity sensor according to a first embodiment of the present invention includes a top array circuit 1, an infrared generation layer 2, and a bottom array circuit 3;
the top array circuit 1 and the bottom array circuit 3 are oppositely arranged, and the top array circuit 1 is connected with the bottom array circuit 3 through the infrared generation layer 2;
the top array circuit 1 comprises an external resistor R1, an external resistor R2, and a first resistor network;
the first input end of the first resistor network is connected with the output end of the external power supply through an external resistor R1, and the second input end of the first resistor network is connected with the output end of the external power supply through an external resistor R1;
the bottom array circuit 3 comprises an external resistor R3, an external resistor R4 and a second resistor network;
the first output end of the second resistor network is connected with the output end of an external power supply through an external resistor R3, and the second output end of the first resistor network is connected with the output end of the external power supply through an external resistor R4;
the output end of the first resistance network, the infrared generation layer 2 and the input end of the second resistance network are connected in series, and when the infrared generation layer 2 receives feedback information, the first input end and the second input end of the first resistance network, and the first output end and the second output end of the second resistance network simultaneously output the position information of the object to be detected relative to the top array circuit 1.
It should be noted that the top array circuit 1, the infrared generation layer 2 and the bottom array circuit 3 are three layers of oppositely arranged structures, wherein each small array of the first resistor network has a corresponding small array in the second resistor network, and the small array refers to a resistor network formed by interleaving one or more resistors. The top array circuit 1 is generally disposed at a position facing the object to be detected, the bottom array circuit 3 is disposed at the innermost, and the infrared generation layer 2 may be disposed between the two array circuits or may be disposed separately, but the positions of the two array circuits are required to correspond to each other. And the top array circuit 1 is arranged at 90 degrees to the bottom array circuit 3. The top array circuit 1 can be used as a standard X-axis, and the bottom array circuit 3 can be used as a standard Y-axis. In other embodiments, the top array circuit 1 may be used as the standard Y-axis, and the bottom array circuit 3 may be used as the standard X-axis, which is not limited herein.
When the top array circuit 1 is used as a standard X axis and the bottom array circuit 3 is used as a standard Y axis, in the top array circuit 1, an external power supply is connected with a first resistance network through an external resistor R1 and an external resistor R2, and the first resistance network is used for feeding back the position information of the X axis of the detected object; in the low array circuit, an external power supply is connected with a second resistor network through an external resistor R3 and an external resistor R4, and the second resistor network is used for feeding back Y-axis position information of a detected object; that is, no matter how large the first resistance network and the second resistance network are, only the input end and the output end of the external power supply, the first input end and the second input end of the first resistance network, and the first output end and the second output end of the second resistance network are needed, and the six positions are connected with the external processor. When the infrared sensor is used for the surface of a robot, the sizes of the first resistance network, the infrared generation layer 2 and the second resistance network can be directly set according to requirements, so that the detection blind area is reduced.
The invention provides an infrared array proximity sensor, which comprises a top array circuit 1, an infrared generation layer 2 and a bottom array circuit 3; the top array circuit 1 and the bottom array circuit 3 are oppositely arranged, and the top array circuit 1 is connected with the bottom array circuit 3 through the infrared generation layer 2; through the output end of the first resistance network of the top array circuit 1, the input ends of the infrared generation layer 2 and the second resistance network of the bottom array circuit 3 which are connected in series, when the infrared generation layer 2 receives feedback information, the first input end and the second input end of the first resistance network, and the first output end and the second output end of the second resistance network simultaneously output the position information of the object to be detected relative to the top array circuit 1. The invention mainly adopts the top array circuit 1, the infrared generation layer 2 and the bottom array circuit 3 to complete the whole sensor, has simple structure, directly outputs the position information of the object to be detected relative to the top array circuit 1, is an analog quantity signal, and not only simplifies the complex operation of a subsequent processor; but also can be directly arranged on the surface of the robot to reduce a large number of blind areas and avoid collision.
In order to improve the detection accuracy, the first resistance network comprises a plurality of first transverse branches and a plurality of first longitudinal branches which are arranged and intersected with the first transverse branches at preset intervals; each first node where each first transverse branch and each first longitudinal branch are intersected is divided into a plurality of first sub-branches, and each first sub-branch is only provided with an internal resistor r.
Correspondingly, the second resistance network comprises a plurality of second transverse branches and a plurality of second longitudinal branches which are arranged and intersected with the second transverse branches according to a preset interval; each first transverse branch and each second node where the first longitudinal branches are intersected are divided into a plurality of second sub-branches, and each second sub-branch is only provided with an internal resistor r.
The number of the transverse branches and the longitudinal branches can be any number, but it must be an integer, and the number of the two branches added must be greater than or equal to 3, that is, the smallest array of the first circuit network or the second circuit network is 1X 2. Of course, the array of resistor networks may be 3X3, 4X5, 5X5, 2X9, and so on. In this embodiment, the number of the first transverse branches and the number of the first longitudinal branches are 5. The preset distance is a fixed value and can be set arbitrarily. The larger the value of the preset pitch is, the smaller the detected position accuracy is. Therefore, in order to improve the detection accuracy, a small pitch may be preset as much as possible. In other embodiments, the predetermined distance is set to 1 cm. And the resistance value of each internal resistor r is the same. The combination of the first circuit network and the second resistor network is the same, except that the relative angles and positions of the two arrangements are different.
Furthermore, the number of the first transverse branches is the same as that of the second transverse branches, and the number of the first longitudinal branches is the same as that of the second transverse branches. For example, when the number of the first transverse branches is 3, the number of the second longitudinal branches is also 3; when the number of the first longitudinal branches is 4, the number of the second transverse branches is also 4. The main function is to reduce the amount of calculation. For example, if the number of the first transverse branches is not the same as that of the second longitudinal branches, extra calculation is required for the extra parts, which results in resource waste.
The infrared generation layer 2 comprises a plurality of infrared geminate transistors which are arranged in parallel; each infrared pair of transistors is respectively connected with the corresponding first node, the second node and the external driving circuit. That is, each node of the first circuit network is connected to a node of the second resistive network through a corresponding pair of ir-pairs of ir-generating layers 2.
The infrared pair tube comprises a transmitting tube and a receiving tube; the transmitting tube is connected with an external driving circuit; and the anode of the receiving tube is connected with the first node, and the cathode of the receiving tube is connected with the second node. The transmitting tube transmits signals through an external driving circuit, and the receiving tube generates feedback signals when an object to be detected enters.
In order to simplify the operation process, the external resistors R1, R2, R3 and R4 have the same resistance.
Referring to fig. 1, 2 and 3, the following examples illustrate the position information fed back by the present invention:
for example, the array circuit of the present invention has an mXn structure, and the external resistor R1, the external resistor R2, the external resistor R3, and the external resistor R4 are all external resistors R0. Wherein Va (i, j) is the voltage of the first node (i, j) of the first resistive network; va (i, j-1) is the voltage of the first node (i, j-1), which is located to the left of the first node (i, j); va (i, j +1) is the voltage of the first node (i, j +1), which is located to the right of the first node (i, j); and I (I, j) is the current flowing to the infrared pair tube receiving tube from the first node (I, j).
First, the current I (i.j) at the first node (i.j) is calculated by kirchhoff's current law to be equal to the total of the entire branch currents. Then the current I (i.j) at the first node (i.j) is:
the left side of the equation of equation (1) is used with discrete LaplaceProcessing is performed, then equation (1) is:
similarly, for the second node (i.j) of the second resistor network:
the infrared pair tubes of the infrared generation layer 2 are equally distributed between coordinates (-1, -1) to (1, 1), and the coordinates (x, y) of a single emission tube in fig. 2 can be expressed as:
due to the equidistant distribution of the emitter tubes, a coordinate sum of 0 is obtained.
secondly, due to the edge distribution of the infrared pair transistors of the infrared generation layer 2, in the top array circuit 1, the input terminals S2 and S4 of the first resistor network are not led out by resistors, so that the potential of the 0 th row is consistent with that of the first row, and the potential of the m th row is equal to that of the m +1 th row, that is to say:
Va(0,j)=Va(1,j),Va(m+1,j)=Va(m,j) (7)。
in addition, in the top array circuit 1, the first input terminal E1 of the first resistor network is connected to the external power supply through the external resistor R1, and the second input terminal E3 of the first resistor network is connected to the external power supply through the external resistor R2; then the formula can also be obtained according to kirchhoff current laws S1, S3:
Va(i,0)=VE1,Va(i,n+1)=VE3(10)。
finally, in the mXn array, when the detected object is detected, the current at the center point of the corresponding transmitting tube located at the detected object is:
substituting equation (1) into equation (12) yields:
after organization, the following results were obtained:
from equation (6), equation (7), and equation (14):
substituting equation (8) and equation (9) into equation (15) yields:
the total current from the top array circuit 1 to the bottom array circuit 3 is equal to the total current flowing through the external resistor R0, i.e.:
therefore, the coordinates of the center of the relative transmitting tube at which the detected object is detected can be expressed as:
Substituting the formula (16), the formula (17) and the formula (18) into the formula (19), the position information of the object to be detected relative to the top array circuit 1 can be obtained:
the invention mainly adopts the top array circuit 1, the infrared generation layer 2 and the bottom array circuit 3 to complete the whole sensor, has simple structure, directly outputs the position information of the object to be detected relative to the top array circuit 1, is an analog quantity signal, and not only simplifies the complex operation of a subsequent processor; but also can be directly arranged on the surface of the robot to reduce a large number of blind areas and avoid collision.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make variations and modifications of the present invention without departing from the spirit and scope of the present invention by using the methods and technical contents disclosed above.
Claims (8)
1. An infrared array proximity sensor, comprising a top array circuit, an infrared generating layer and a bottom array circuit;
the top array circuit and the bottom array circuit are oppositely arranged, and the top array circuit is connected with the bottom array circuit through the infrared generation layer;
the top array circuit comprises an external resistor R1, an external resistor R2, and a first resistor network;
a first input end of the first resistor network is connected with an output end of an external power supply through an external resistor R1, and a second output end of the first resistor network is connected with an output end of the external power supply through an external resistor R2;
the bottom array circuit comprises an external resistor R3, an external resistor R4, and a second resistor network;
the first output end of the second resistor network is connected with the output end of an external power supply through an external resistor R3, and the second output end of the first resistor network is connected with the output end of the external power supply through an external resistor R4;
the output end of the first resistance network, the infrared generation layer and the input end of the second resistance network are connected in series, and when the infrared generation layer receives feedback information, the first input end and the second input end of the first resistance network and the first output end and the second output end of the second resistance network simultaneously output the position information of the object to be detected relative to the top array circuit.
2. The infrared array proximity sensor of claim 1, wherein the first resistor network comprises a plurality of first transverse branches and a plurality of first longitudinal branches intersecting the first transverse branches at predetermined intervals; each first node where each first transverse branch and each first longitudinal branch are intersected is divided into a plurality of first sub-branches, and each first sub-branch is only provided with an internal resistor r.
3. The infrared array proximity sensor of claim 2, wherein the number of first transverse branches and first longitudinal branches is 5.
4. The infrared array proximity sensor of claim 2, wherein the second resistor network comprises a plurality of second transverse branches and a plurality of second longitudinal branches intersecting the second transverse branches at predetermined intervals; each first transverse branch and each first longitudinal branch are divided into a plurality of second sub-branches by each second node where the first transverse branch and the first longitudinal branch intersect, and each second sub-branch is only provided with an internal resistor r.
5. The infrared array proximity sensor of claim 4, wherein the first transverse legs and the second longitudinal legs are of a uniform number and the first longitudinal legs and the second transverse legs are of a uniform number.
6. The infrared array proximity sensor of claim 4, wherein the infrared generation layer comprises a plurality of infrared pair tubes juxtaposed to each other;
and each infrared pair of transistors is respectively connected with the corresponding first node, second node and external driving circuit.
7. The infrared array proximity sensor of claim 6, wherein the pair of infrared tubes comprises a transmitting tube and a receiving tube;
the transmitting tube is connected with an external driving circuit;
and the anode of the receiving tube is connected with the first node, and the cathode of the receiving tube is connected with the second node.
8. The infrared array proximity sensor of claim 1, wherein the external resistor R1, the external resistor R2, the external resistor R3, and the external resistor R4 are the same resistance.
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101763199A (en) * | 2008-12-22 | 2010-06-30 | 弗莱克斯电子有限责任公司 | New pattern design for a capacitive touch screen |
CN105793727A (en) * | 2013-12-05 | 2016-07-20 | ams有限公司 | Optical sensor arrangement and method of producing an optical sensor arrangement |
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US6856516B2 (en) * | 2002-08-20 | 2005-02-15 | Cts Corporation | Ball grid array resistor capacitor network |
US8482545B2 (en) * | 2008-10-02 | 2013-07-09 | Wacom Co., Ltd. | Combination touch and transducer input system and method |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101763199A (en) * | 2008-12-22 | 2010-06-30 | 弗莱克斯电子有限责任公司 | New pattern design for a capacitive touch screen |
CN105793727A (en) * | 2013-12-05 | 2016-07-20 | ams有限公司 | Optical sensor arrangement and method of producing an optical sensor arrangement |
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Title |
---|
一款高精度红外接近传感器XDU3093的设计;王玮;《中国优秀硕士学位论文全文数据库信息科技辑》;20141115;全文 * |
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