CN108221477B - Glue-blocking release paper for flexible circuit board pressing and preparation method thereof - Google Patents
Glue-blocking release paper for flexible circuit board pressing and preparation method thereof Download PDFInfo
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- CN108221477B CN108221477B CN201611130463.5A CN201611130463A CN108221477B CN 108221477 B CN108221477 B CN 108221477B CN 201611130463 A CN201611130463 A CN 201611130463A CN 108221477 B CN108221477 B CN 108221477B
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- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H23/00—Processes or apparatus for adding material to the pulp or to the paper
- D21H23/02—Processes or apparatus for adding material to the pulp or to the paper characterised by the manner in which substances are added
- D21H23/22—Addition to the formed paper
- D21H23/50—Spraying or projecting
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/10—Homopolymers or copolymers of propene
- C09J123/12—Polypropene
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H19/00—Coated paper; Coating material
- D21H19/10—Coatings without pigments
- D21H19/14—Coatings without pigments applied in a form other than the aqueous solution defined in group D21H19/12
- D21H19/20—Coatings without pigments applied in a form other than the aqueous solution defined in group D21H19/12 comprising macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- D21H19/22—Polyalkenes, e.g. polystyrene
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H25/00—After-treatment of paper not provided for in groups D21H17/00 - D21H23/00
- D21H25/04—Physical treatment, e.g. heating, irradiating
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
- D21H27/18—Paper- or board-based structures for surface covering
- D21H27/20—Flexible structures being applied by the user, e.g. wallpaper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Abstract
The invention discloses adhesive-resistant release paper for laminating a flexible circuit board, which comprises a raw paper layer, a mixed adhesive layer and a release layer, wherein the release layer is the release layer containing TPX, the mixed adhesive layer is the adhesive layer containing EMMA, the Vicat softening temperature of a stack structure formed by the mixed adhesive layer and the release layer is 150 plus 170 ℃, the temperature of the existing FPC laminating process is generally 160 plus 180 ℃, in the laminating process, the release paper disclosed by the invention can be fully softened, and collapses and clings along pits and corners on the surface of the circuit board, the filling and laminating effects are good, the excellent adhesive-resistant effect is achieved, the release paper has the advantages of good leveling property and easiness in tearing, silicon, plasticizer and halogen are not contained, the environment is protected, and the problem of secondary pollution cannot exist in the torn flexible circuit board.
Description
Technical Field
The invention relates to release paper and the technical field of preparation thereof, in particular to adhesive-resistant release paper for fast laminating of a Flexible Printed Circuit (FPC).
Background
A Flexible Printed Circuit Board (hereinafter referred to as "Flexible Printed Circuit Board") is called a "Flexible Printed Circuit Board" in short, and is commonly referred to as an FPC in the industry, and has many advantages that a rigid Printed Circuit Board does not have, such as free bending, winding, and folding. The FPC can be used for greatly reducing the volume of electronic products, and is suitable for the development of the electronic products in the directions of high density, miniaturization and high reliability. Therefore, the FPC is widely applied to the fields or products of aerospace, military, mobile communication, portable computers, computer peripherals, palm computers, digital cameras and the like.
The FPC is mainly formed by laminating a flexible copper foil substrate and a protective film at high temperature, wherein the protective film is a heat-resistant resin film coated with an adhesive and used for insulation and circuit protection. In order to avoid the bonding or damage of the pressing plate and the flexible circuit board in the pressing process and ensure that the adhesive melted out at high temperature does not damage the flexible circuit board, a separation layer is required to be arranged between the pressing plate and the flexible circuit board to ensure the quality of a product in hot pressing, wherein the separation layer is release paper (film) for the pressing of the flexible circuit board, and the requirement that the overflowed adhesive is not adhered to the flexible copper foil substrate in the hot pressing process and is well separated from the flexible circuit board after being pressed is required.
The existing release paper is mostly PET release paper, namely a thin film layer (CPP or PET) is compounded on base paper or a middle layer, and then a silicone oil release agent is coated on the base paper or the middle layer to form the release paper, as shown in figures 1 and 2, after the release paper is pressed with FPC, the release and glue resistance performances are poor and difficult to control, glue is easy to overflow and remains outside a circuit to be exposed, and short circuit or poor welding is caused; for the above-mentioned glue overflow situation, most of the prior methods use chemical agents, plasma for removing the residue or grinding for removing part of the glue on the surface of the circuit, which not only wastes labor and time and increases the cost, but also has low yield; in addition, the silicone oil release agent layer of the PET release paper A100 has overlarge adhesiveness, residual glue is left when the release paper is torn off, secondary pollution is caused to a circuit board, manual clearing is needed, the cost is increased, and the surface of the release paper contains silicon and pollutes the environment.
In order to overcome the defects, the designer actively researches and innovates to create the adhesive-resistant release paper for quickly laminating the Flexible Printed Circuit (FPC).
Disclosure of Invention
The invention mainly solves the technical problem of providing the adhesive-resistant release paper for laminating the flexible circuit board, which has the advantages of good adhesive-resistant performance, good flowing uniformity of an adhesive layer and easy tearing, does not contain silicon, is environment-friendly, and does not have the problem of secondary pollution of the flexible circuit board.
In order to solve the technical problems, the invention adopts a technical scheme that: the adhesive comprises a raw paper layer, a mixed adhesive layer and a release layer, wherein the mixed adhesive layer is formed on the surface of the raw paper layer, the release layer is formed on the upper surface of the mixed adhesive layer, and the raw paper layer and the release layer are adhered by the mixed adhesive layer;
the release layer is prepared from the following raw materials (in percentage by weight):
TPX：70％-100％；
PP：0％-30％；
the mixed adhesive layer is prepared from the following raw materials in percentage by weight:
TPX：10％-30％；
PP：40％-70％；
EMMA：5％-15％；
PE：5％-15％。
in order to solve the technical problems, the invention adopts the further technical scheme that:
the Vicat softening temperature of the stack formed by the mixed adhesive layer and the release layer is 150-170 ℃.
Further, the thickness of the mixed adhesive layer is 15-70 μm.
Further, the thickness of the raw paper layer is 60-180 μm.
Further, the thickness of the release layer is 10-30 μm.
Further, the release paper is used for fast laminating of the flexible circuit board.
Furthermore, the glue overflowing amount of the release paper to the glue layer after pressing is controlled within 2 mil.
Further, the base paper layer is highlight color-jet base paper or art paper.
The method for preparing the adhesive-resistant release paper for laminating the flexible circuit board comprises the steps of laminating a film on one side surface of the raw paper layer by adopting a double-layer co-extrusion mode, and simultaneously forming a mixed adhesive layer and a release layer on one side surface of the raw paper layer.
The invention has the beneficial effects that: the invention comprises three layers of the raw paper layer, the mixed adhesive layer and the release layer, has reasonable structure, and has reasonable formula of the release layer and the mixed adhesive layer, so the invention at least has the following advantages:
the Vicat softening temperature of the stacked structure formed by the mixed adhesive layer and the release layer is 170 ℃ at 150-; moreover, due to certain leveling property during pressing, the problems of unrealized pressing and air bubbles of the high-precision FPC can be prevented;
the invention has excellent glue resistance, controls the glue overflow amount within 2mil, can completely be used for pressing the high-precision circuit board, and does not need the procedures of chemical agent, plasma deslagging or frosting removal on the glue overflow like the traditional release paper, thereby reducing the procedures, saving the working time and the cost, and improving the production efficiency and the yield;
the release layer is mainly poly-4-methylpentene, after hot-pressing softening, the adhesiveness is small, the release paper is easy to tear, and no residual glue is contained after tearing, so that secondary pollution to a circuit board can be avoided, manual removal is not needed, operation procedures are reduced, the production efficiency is improved, and the low adhesiveness can be suitable for simultaneously laminating multiple layers of FPCs, so that the production efficiency is further improved;
the preparation method adopts a film spraying mode of simultaneously double-layer co-extrusion of the mixed adhesive layer and the release layer, only one time of film spraying is needed to be carried out on one side surface of the raw paper layer, and then the raw paper layer is rolled to obtain a finished product, compared with a single-layer extrusion production process, the production process is simpler, the process is easy to control, and the cost is lower;
the release paper does not contain silicone oil and plasticizer, does not cause secondary pollution to the circuit board after being torn off, and is environment-friendly;
sixth, because the release layer at the outermost layer of the release paper mainly adopts poly 4-methylpentene, the release paper has leveling property, low water absorption and antistatic performance, so that the release paper has the advantages of preventing mutual transfer printing between FPC products, preventing static electricity, strong chemical resistance, low water absorption and the like;
and seventhly, halogen-free meets the environmental protection requirement.
The foregoing description of the present invention is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clear and clear, and to implement the technical solutions according to the content of the description, the following detailed description of the preferred embodiments of the present invention is provided with the accompanying drawings.
Drawings
FIG. 1 is a schematic structural diagram of a prior art PET release paper after the PET release paper is completely laminated without being removed;
FIG. 2 is a schematic structural view of a PET release paper after lamination and peeling of the PET release paper in the prior art;
FIG. 3 is a schematic structural view of the present invention;
FIG. 4 is a schematic view of the stack of the present invention as it is being pressed;
FIG. 5 is a schematic structural view of the present invention after pressing without removing the release paper;
FIG. 6 is a schematic structural view of the present invention after pressing and removing the release paper;
FIG. 7 is a process flow diagram of the present invention;
the parts in the drawings are marked as follows:
A100-PET release paper;
100-release paper, 101-raw paper layer, 102-mixed adhesive layer and 103-release layer;
200-an upper platen; 300-protective film, 301-adhesive layer; 400-copper foil substrate, 401-copper foil circuit; 500-lower press plate.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and the present invention will be described in detail with reference to the accompanying drawings. The invention may be embodied in other different forms, i.e. it is capable of various modifications and changes without departing from the scope of the invention as disclosed.
Example 1: an adhesive-resistant release paper for laminating a flexible circuit board comprises a raw paper layer 101, a mixed adhesive layer 102 and a release layer 103, wherein the mixed adhesive layer 102 is formed on the surface of the raw paper layer 101, the release layer 103 is formed on the upper surface of the mixed adhesive layer 102, and the mixed adhesive layer 102 bonds the raw paper layer 101 and the release layer 103;
the release layer is prepared from the following raw materials (in percentage by weight):
TPX (poly 4-methylpentene): 70 percent;
PP (polypropylene): 30 percent;
the mixed adhesive layer is prepared from the following raw materials in percentage by weight:
TPX (poly 4-methylpentene): 10 percent;
PP (polypropylene): 60 percent;
EMMA (ethylene-methyl methacrylate copolymer): 15 percent of
PE (polyethylene): 15 percent.
The vicat softening temperature of the stack of the mixed adhesive layer 102 and the release layer 103 is 150-170 ℃.
The thickness of the release layer 103 is 10 μm.
The thickness of the mixed adhesive layer 102 was 70 μm.
The thickness of the raw paper layer 101 is 90 μm.
The release paper 100 is used for fast laminating of the flexible circuit board.
The glue overflowing amount of the laminated glue layer of the release paper 100 is controlled within 2mil, namely, the glue overflowing amount is controlled within 2 mil.
The base paper layer 101 is highlight color-jet base paper or art paper.
The preparation method of the glue-blocking release paper for laminating the flexible circuit board comprises the following steps:
step A: respectively feeding the mixed adhesive layer raw material and the release layer raw material prepared according to the proportion into a multilayer casting film machine (such as a three-layer casting film machine, a five-layer casting film machine and the like), respectively heating the mixed adhesive layer raw material and the release layer raw material through a screw material barrel, wherein the screw material barrel A is the release agent layer raw material, the screw material barrel B is the mixed adhesive layer raw material, the heating temperature of the mixed adhesive layer raw material is 280-plus-material 340 ℃, the heating temperature of the release layer raw material is 260-plus-material 320 ℃, and the like as shown in FIG. 7;
and B: extruding the heated mixed adhesive layer raw material and release layer raw material simultaneously to a distributor, and spraying to one side of the raw paper layer through a die head to obtain a semi-finished product, wherein the extrusion cooling temperature of the mixed adhesive layer raw material is 40-80 ℃, and the extrusion cooling temperature of the release layer raw material is 40-80 ℃, as shown in figure 7;
and C: and (5) rolling the mixture by roller traction to obtain a finished product, as shown in figure 7.
Example 2: this embodiment has the same structure as embodiment 1, and is not repeated, except that: the release layer is prepared from the following raw materials (in percentage by weight): TPX: 80 percent; PP: 20 percent;
the mixed adhesive layer is prepared from the following raw materials in percentage by weight: TPX: 20 percent; PP: 70 percent; EMMA: 5 percent; PE: 5 percent.
The thickness of the release layer 103 is 25 μm, the thickness of the mixed adhesive layer 102 is 60 μm, and the thickness of the raw paper layer 101 is 60 μm.
Example 3: this embodiment has the same structure as embodiment 1, and is not repeated, except that: the release layer is prepared from the following raw materials (in percentage by weight): TPX: 100 percent;
the mixed adhesive layer is prepared from the following raw materials in percentage by weight: TPX: 30 percent; PP: 50 percent; EMMA: 8 percent; PE: 12 percent.
The thickness of the release layer 103 is 30 μm, the thickness of the mixed adhesive layer 102 is 50 μm, and the thickness of the raw paper layer 101 is 120 μm.
Example 4: this embodiment has the same structure as embodiment 1, and is not repeated, except that: the release layer is prepared from the following raw materials (in percentage by weight): TPX: 85 percent; PP: 15 percent;
the mixed adhesive layer is prepared from the following raw materials in percentage by weight: TPX: 40 percent; PP: 45 percent; EMMA: 5 percent; PE: 10 percent.
The thickness of the release layer 103 is 20 μm, the thickness of the mixed adhesive layer 102 is 15 μm, and the thickness of the raw paper layer 101 is 180 μm.
Example 5: the release layer is prepared from the following raw materials (in percentage by weight): TPX: 75 percent; PP: 25 percent;
the mixed adhesive layer is prepared from the following raw materials in percentage by weight: TPX: 30 percent; PP: 40 percent; EMMA: 15 percent; PE: 15 percent.
The thickness of the release layer 103 is 15 μm, the thickness of the mixed adhesive layer 102 is 40 μm, and the thickness of the raw paper layer 101 is 150 μm.
Example 6: the release layer is prepared from the following raw materials (in percentage by weight): TPX: 95 percent; PP: 5 percent;
the mixed adhesive layer is prepared from the following raw materials in percentage by weight: TPX: 20 percent; PP: 65 percent; EMMA: 10 percent; PE: 5 percent.
The thickness of the release layer 103 is 18 μm, the thickness of the mixed adhesive layer 102 is 45m, and the thickness of the raw paper layer 101 is 100 μm.
The working principle and the working process of the invention are as follows:
the release paper is used for stacking in the hot pressing process of the flexible circuit board, as shown in fig. 4, an upper press plate 200, a release paper 100, a protective film 300, a copper foil substrate 400 (the upper layer of the copper foil substrate 400 is a copper foil circuit 401) and a lower press plate 500 are arranged in sequence from top to bottom, the raw paper layer 101 of the release paper 100 is bonded to the upper press plate 200, and the stacking is pressed at a temperature of 160-, meanwhile, the adhesive layer 301 of the protective film 300 has poor fluidity and is easy to generate bubbles, so that subsequent processing and product performance are affected, as shown in fig. 1 and 2;
the vicat softening temperature of the stack structure formed by the mixed adhesive layer and the release layer is not higher than the temperature of the laminating process, so that the release paper can be fully softened in the laminating process, and the release paper collapses and clings to the pits and corners on the surface of the circuit board, the filling and laminating effects are good, the excellent glue blocking effect is achieved, the control on the glue overflow amount can reach within 2 mils, the generation of uneven flow and bubbles of the glue layer 301 of the protective film 300 is prevented, the laminating process of the high-precision circuit board can be completely performed, and the miniaturization development of electronic products and fine equipment is further promoted; moreover, due to certain leveling property during pressing, the problems of incomplete pressing and air bubbles of the high-precision FPC can be prevented, as shown in FIGS. 5 and 6.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structures made by using the contents of the specification and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (8)
1. The utility model provides a flexible line board is pressed with hindering gluey from type paper which characterized in that: the paper base comprises a paper base layer, a mixed adhesive layer and a release layer, wherein the mixed adhesive layer is formed on the surface of the paper base layer, the release layer is formed on the upper surface of the mixed adhesive layer, and the mixed adhesive layer is used for bonding the paper base layer and the release layer;
the release layer is prepared from the following raw materials in percentage by weight:
TPX：70％-100％；
PP：0％-30％；
the mixed adhesive layer is prepared from the following raw materials in percentage by weight:
TPX：10％-30％；
PP：40％-70％；
EMMA：5％-15％；
PE：5％-15％；
the Vicat softening temperature of the stack formed by the mixed adhesive layer and the release layer is 150-170 ℃, and the Vicat softening temperature of the stack formed by the mixed adhesive layer and the release layer is not higher than the temperature of the laminating process.
2. The adhesive-resistant release paper for flexible circuit board lamination according to claim 1, characterized in that: the thickness of the mixed adhesive layer is 15-70 μm.
3. The adhesive-resistant release paper for flexible circuit board lamination according to claim 1, characterized in that: the thickness of the raw paper layer is 60-180 mu m.
4. The adhesive-resistant release paper for flexible circuit board lamination according to claim 1, characterized in that: the thickness of the release layer is 10-30 μm.
5. The adhesive-resistant release paper for flexible circuit board lamination according to claim 1, characterized in that: the release paper is used for fast laminating of the flexible circuit board.
6. The adhesive-resistant release paper for flexible circuit board lamination according to claim 1, characterized in that: the glue overflowing amount of the laminated glue layer is controlled within 2mil by the release paper.
7. The adhesive-resistant release paper for flexible circuit board lamination according to claim 1, characterized in that: the base paper layer is highlight color-spraying base paper or art paper.
8. The method for preparing the adhesive blocking release paper for flexible circuit board lamination according to claim 1, wherein the method comprises the following steps: and (3) coating a film on the surface of one side of the raw paper layer by adopting a double-layer coextrusion mode, so that a mixed adhesive layer and a release layer are simultaneously formed on the surface of one side of the raw paper layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611130463.5A CN108221477B (en) | 2016-12-09 | 2016-12-09 | Glue-blocking release paper for flexible circuit board pressing and preparation method thereof |
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| CN201611130463.5A CN108221477B (en) | 2016-12-09 | 2016-12-09 | Glue-blocking release paper for flexible circuit board pressing and preparation method thereof |
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| CN108221477B true CN108221477B (en) | 2020-06-19 |
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| CN109714901B (en) * | 2019-01-04 | 2022-03-22 | 珠海杰赛科技有限公司 | Method for processing outer-layer flexible rigid-flex board by wet film pasting and rigid-flex board |
| CN111040649B (en) * | 2019-11-14 | 2021-02-09 | 苏州市新广益电子有限公司 | PTFE composite glue-resistant film for LCP high-temperature lamination and production process thereof |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4959264A (en) * | 1987-01-06 | 1990-09-25 | The Wiggins Teape Group Limited | Release paper for making artificial leather |
| WO2000059720A2 (en) * | 1999-04-07 | 2000-10-12 | Honeywell International Inc. And Mitsui Chemicals, Inc. | High temperature release films |
| CN201015913Y (en) * | 2007-01-15 | 2008-02-06 | 夏超华 | Rubber-resisted film for FPC soft board quick-pressing |
| CN101412894A (en) * | 2007-10-19 | 2009-04-22 | 日昌株式会社 | Adhesive unit for emblem, method of producing the same, jig for adhering emblem and emblem for adhesion |
| CN103834320A (en) * | 2014-02-26 | 2014-06-04 | 新纶科技（常州）有限公司 | Re-peel-off type special double-faced adhesive sheet for fixing flexible printed circuit board |
| CN204020105U (en) * | 2014-07-01 | 2014-12-17 | 苏州斯迪克新材料科技股份有限公司 | Submissive type use for electronic products diaphragm |
| JP5644791B2 (en) * | 2011-10-31 | 2014-12-24 | 住友ベークライト株式会社 | Release film |
| TW201612015A (en) * | 2014-09-30 | 2016-04-01 | Oji Holdings Corp | Biaxial extension polypropylene film |
| CN105658753A (en) * | 2014-09-17 | 2016-06-08 | Dic株式会社 | Laminate adhesive, stack using the same, and secondary battery |
| CN105926362A (en) * | 2016-04-26 | 2016-09-07 | 浙江凯伦特种材料有限公司 | Flexible circuit board gum inhibition release paper release layer hot-melt resin composition, gum inhibition release paper and production method of gum inhibition release paper |
-
2016
- 2016-12-09 CN CN201611130463.5A patent/CN108221477B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4959264A (en) * | 1987-01-06 | 1990-09-25 | The Wiggins Teape Group Limited | Release paper for making artificial leather |
| WO2000059720A2 (en) * | 1999-04-07 | 2000-10-12 | Honeywell International Inc. And Mitsui Chemicals, Inc. | High temperature release films |
| CN201015913Y (en) * | 2007-01-15 | 2008-02-06 | 夏超华 | Rubber-resisted film for FPC soft board quick-pressing |
| CN101412894A (en) * | 2007-10-19 | 2009-04-22 | 日昌株式会社 | Adhesive unit for emblem, method of producing the same, jig for adhering emblem and emblem for adhesion |
| JP5644791B2 (en) * | 2011-10-31 | 2014-12-24 | 住友ベークライト株式会社 | Release film |
| CN103834320A (en) * | 2014-02-26 | 2014-06-04 | 新纶科技（常州）有限公司 | Re-peel-off type special double-faced adhesive sheet for fixing flexible printed circuit board |
| CN204020105U (en) * | 2014-07-01 | 2014-12-17 | 苏州斯迪克新材料科技股份有限公司 | Submissive type use for electronic products diaphragm |
| CN105658753A (en) * | 2014-09-17 | 2016-06-08 | Dic株式会社 | Laminate adhesive, stack using the same, and secondary battery |
| TW201612015A (en) * | 2014-09-30 | 2016-04-01 | Oji Holdings Corp | Biaxial extension polypropylene film |
| CN105926362A (en) * | 2016-04-26 | 2016-09-07 | 浙江凯伦特种材料有限公司 | Flexible circuit board gum inhibition release paper release layer hot-melt resin composition, gum inhibition release paper and production method of gum inhibition release paper |
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| CN108221477A (en) | 2018-06-29 |
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