CN108216718B - The method for packing electronic device - Google Patents
The method for packing electronic device Download PDFInfo
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- CN108216718B CN108216718B CN201711444455.2A CN201711444455A CN108216718B CN 108216718 B CN108216718 B CN 108216718B CN 201711444455 A CN201711444455 A CN 201711444455A CN 108216718 B CN108216718 B CN 108216718B
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- plastic foil
- electronic device
- adsorbent
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- packaging
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- 238000012856 packing Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000004033 plastic Substances 0.000 claims abstract description 99
- 229920003023 plastic Polymers 0.000 claims abstract description 99
- 239000011888 foil Substances 0.000 claims abstract description 93
- 239000003463 adsorbent Substances 0.000 claims abstract description 70
- 238000004806 packaging method and process Methods 0.000 claims abstract description 34
- 238000001179 sorption measurement Methods 0.000 claims abstract description 23
- 239000002985 plastic film Substances 0.000 claims abstract description 13
- 229920006255 plastic film Polymers 0.000 claims abstract description 13
- 230000033001 locomotion Effects 0.000 claims description 11
- 238000007731 hot pressing Methods 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 3
- 239000000428 dust Substances 0.000 description 23
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 9
- 230000009471 action Effects 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 206010053615 Thermal burn Diseases 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 210000000867 larynx Anatomy 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B11/00—Wrapping, e.g. partially or wholly enclosing, articles or quantities of material, in strips, sheets or blanks, of flexible material
- B65B11/50—Enclosing articles, or quantities of material, by disposing contents between two sheets, e.g. pocketed sheets, and securing their opposed free margins
- B65B11/52—Enclosing articles, or quantities of material, by disposing contents between two sheets, e.g. pocketed sheets, and securing their opposed free margins one sheet being rendered plastic, e.g. by heating, and forced by fluid pressure, e.g. vacuum, into engagement with the other sheet and contents, e.g. skin-, blister-, or bubble- packaging
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B63/00—Auxiliary devices, not otherwise provided for, for operating on articles or materials to be packaged
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Packaging Frangible Articles (AREA)
Abstract
This application involves packing technique field, the methods for specifically disclosing packaging electronic device comprising the plastic film sleeve of tubular is located on the cylinder above adsorption section by step (1)；(2) start blower, electronic device to be packaged is placed into work stage；(3) plastic foil is pullled downwards until the stomata of adsorbent lower part is covered；(4) adsorbent is pushed down on, plastic foil is pulled in except in dirt barrel；(5) after plastic foil is adsorbed on except on dirt barrel inner wall, adsorbent is retracted, then cut to plastic foil；(6) two hot waferings of mouth-sealed portion are moved toward one another, after hot wafering presses plastic foil, separate hot wafering；(7) electronic device after packaging is taken out., can be to electronic device dedusting when packing electronic device by means of the present invention, and the bag body after packaging is made to be in heave shape.
Description
Technical field
The present invention relates to packing technique fields, and in particular to a method of packaging electronic device.
Background technique
When the adsorption of electronic device has dust, influenced having on the performance of electronic device, and due to electronics device
Part surface itself is easy to produce static electricity, so that electronic device easily adsorbs dust.Therefore when packing to electronic device, it is first right to need
Electronic device is dusted, and in current electronic device packaging process, the dedusting and packaging two processes point of electronic device
It drives row into, therefore also needs setting transmission process between two above process, to will lead to packaging efficiency reduction.In addition, electric
Sub- device is easily damaged when being squeezed, therefore when packing electronic device, usually also needs to be inflated packaging bag, so that packet
Packaging bag after dress electronic device is in shape is heaved, to can avoid electronic device mutual extrusion when electronic device is cased.In
In existing packaging process, after electronic device is packed into packaging bag, also need to need to be inflated packaging bag, then to packaging
Bag is sealed, and just can guarantee packaging bag in heaving shape, but in inflation and sealing, it is easy to packaging bag is shriveled, therefore
When packing electronic device, need operator that there is more rich packaging experience.
Summary of the invention
The purpose of the present invention is to provide a kind of methods for packing electronic device, can remove to electronic device in packaging
Dirt, and the bag body after packaging is made to be in heave shape.
In order to achieve the above objectives, base case of the invention is as follows:
The method of packaging electronic device includes the following steps:
(1) plastic film sleeve of tubular is located on the cylinder above adsorption section, and plastic foil is bonded with damaged surface；
(2) start blower, electronic device to be packaged is placed into work stage；
(3) plastic foil is pullled downwards by operator, the lower end of plastic foil is made to be pulled to cylinder bottom and will be under adsorbent
The stomata in portion covers；
(4) it opens the first cylinder and pushes down on adsorbent, pulled plastic foil except working as plastic foil in dirt barrel by adsorbent
After electronic device is completed covering, stopping pushes down on adsorbent；
(5) after plastic foil is adsorbed on except on dirt barrel inner wall, adsorbent is pulled up back by the first cylinder, then to plastic foil
It is cut, is used in packaging except the plastic foil of the electronic device in dirt barrel and the plastics UF membrane being adsorbed on cylinder；
(6) the second cylinder of starting pushes two hot waferings of mouth-sealed portion to move toward one another, and after hot wafering presses plastic foil, makes
Hot wafering separation；
(7) electronic device after packaging is taken out.
Electronic device is packed using electronic device packing device when executing above step.Electronic device packaging dress
Set electronic device packing device successively includes feeding portion, adsorption section and placement section from top to bottom.Feeder includes cylinder, the first gas
Cylinder and adsorbent, the lower end of cylinder are equipped with the air cavity of bottom opening, in the top insertion air cavity of adsorbent and can be in air cavity on
Lower slider, the first cylinder are mounted in cylinder, and the first cylinder can drive adsorbent to stretch out or retract air cavity, the lower part week of adsorbent
To side wall be equipped with the stomata that is connected to air cavity.Adsorption section includes dust removing tube, blower and the air hose for being set in dust removing tube periphery,
Air duct is formed between dust removing tube and air hose, being recessed inwardly in the middle part of air hose makes the middle part in air duct form throat, and the top of throat is
The lower section of entrance, throat is diffuser, and entrance is connected to blower, and the side wall of dust removing tube is equipped with multiple be located at throat
Bar shaped slit, bar shaped slit are vertically arranged, and bar shaped slit is uniformly distributed along the circumferential direction of dust removing tube.Above and below adsorption section
It is equipped with mouth-sealed portion, mouth-sealed portion includes two the second cylinders being oppositely arranged and two hot waferings being oppositely arranged, the hot pressing
Block is separately fixed on two the second cylinder piston rods；Placement section includes pedestal and work stage, and work stage is slidably connected at pedestal
On, and work stage can only be slided along the vertical direction, the lower section of work stage is equipped with the pressure spring to offset with work stage, and work stage is equipped with
First wedge surface, the hot wafering of the mouth-sealed portion below adsorption section, which is equipped with, cooperates with the first wedge surface and can push the of work stage
Two wedge surfaces.
When packaging, the plastic film of tubular is set on cylinder, since plastic foil and damaged surface have centainly
Adhesion strength, therefore plastic foil will be adsorbed on cylinder, so that plastic foil be avoided to slide from cylinder.Starting blower make blower to
Air blast in air duct, then form the air-flow to flow downward in air duct, air-flow successively passes through entrance, throat and diffusion in air duct
Section, flow velocity is accelerated when air-flow passes through throat, thus the pressure reduction at throat.Since bar shaped slit is connected to throat, item
The air-flow that throat is flowed to from dust removing tube will be formed in shape slit.Electronic device is placed in work stage, then electronic device is by position
In in dust removing tube, and bar shaped slit is then respectively around electronic device, therefore bar shaped slit has dust suction effect to electronic device,
It i.e. will be in the dust sucking air duct on electronic device surface.
After the dust on electronic device surface is sucked away, plastic film is pulled downward on, and makes plastic film by adsorbent lower part
Stomata covering, then start the first cylinder, make the first cylinder push adsorbent slide downward.The process of adsorbent slide downward
In, the space of air cavity increases, therefore air cavity will suck air by the stomata on adsorbent, thus opposite with adsorbent lower part
Plastic foil will be adsorbed on the surface of adsorbent by stomata.Adsorbent is greater than damaged surface to plastic foil to the adsorption capacity of plastic foil
Adsorption capacity, then during the first cylinder pushes adsorbent slide downward, adsorbent will pull down plastic foil simultaneously, thus adsorbent
Plastic foil can be pulled in except in dirt barrel.Plastic foil is adsorbed body and pulls in except after in dirt barrel, adsorbent moves down stopping；Pass through
Coarse shape is set by the outer peripheral surface of adsorbent lower part, or several grooves are set on the outer peripheral surface of adsorbent lower part, then plastics
After film is adhered to adsorbent surface, air still can enter in stomata from the groove on adsorbent, and enter air cavity；When in air cavity
Pressure recovery be normal pressure after, adsorbent will not have suction-operated to plastic foil, and bar shaped slit is then by plastic foil at this time
It is adsorbed on the inner wall except dirt barrel, at this time cuts off plastic foil, and move up adsorbent by the first cylinder, then for packing electricity
The plastic foil of sub- device will be attracted to except on dirt barrel inner wall and positioned at electronic device periphery.
Start the second cylinder, then the second cylinder moves toward one another the hot wafering that driving two is oppositely arranged, so that hot wafering can
The upper and lower ends of the plastic foil of tubular are pressed together respectively.And plastic foil can be melted and be pressed by hot wafering, so as to incite somebody to action
The sealing two ends of plastic foil.The hot wafering of mouth-sealed portion below adsorption section is equipped with the second wedge surface, when hot wafering is towards work
When making platform movement, the second wedge surface will cooperate with the first wedge surface on workbench, so that hot wafering will push work stage, make work stage to
Lower movement.In addition, the movement velocity due to hot wafering is fast, workbench will be moved down rapidly, and be placed in electronics on workbench
Device will remain in plastic foil under the action of inertia force, to can make electronics when the both ends to plastic foil are sealed
Device rests in plastic foil, completes the packaging to electronic device.
The beneficial effect that this programme generates is:
(1) when being packed to electronic device, electronic device can be first dusted by adsorption section, to avoid
After packaging, electronic device remained on surface has dust.
(2) adsorption section also has suction-operated to plastic foil, in the present solution, due to the modeling for packing electronic device
Expect film both ends open, when plastic film sleeve is located at electronic device periphery, workbench does not have supporting role to plastic foil, therefore logical
It crosses adsorption section to adsorb plastic foil from the circumferential of plastic foil, is conducive to carry out hot pressing to the both ends of plastic foil.And due to plastics
The circumferential direction of film is adsorbed, therefore by after the both ends hot pressing of plastic foil, after the gas in the middle part of plastic foil can stay in both ends hot pressing
In plastic foil, so that the plastic foil after hot pressing in shape is heaved, then in vanning, can avoid mutual extrusion between electronic device.
(3) during adsorbent moves down, adsorbent can generate adsorption capacity to plastic foil, to pull plastics
Film moves down；When adsorbent does not move down, do not have adsorption capacity then to plastic foil, plastic foil can be made to be attracted to dedusting
On cylinder inner wall, consequently facilitating being sent into plastic foil to removing in dirt barrel.
Preferred embodiment one: advanced optimizing as to base case, adsorbent to except dirt barrel movement speed be 15-
20cm/s can pull plastic foil slide downward, while again to guarantee that adsorbent keeps certain adsorption capacity to plastic foil
Plastic foil is avoided to fall off from adsorbent.
It,, can by the blade being arranged in ring body in the step of being packed to electronic component (5) in preferred embodiment one
Plastic foil is cut automatically while the first cylinder retracts adsorbent.Concrete principle are as follows: when adsorbent moves up,
The space of air cavity becomes smaller, therefore the air in air cavity will be escaped and enter in first passage by the first check valve, and due to
One channel is connected to the airflow channel in ring body, and when air-flow is discharged by circular passage, air-flow will be on spiral stator blade
Wind pressure is generated, which will drive ring body rotation；Its principle is similar to the operation logic of turbine in turbocharger.When ring body turns
When dynamic, blade will will be acted on by centrifugal force, so that blade will be skidded off out of ring body, and the outer peripheral surface for protruding ring body penetrates modeling
Expect in film, while ring body rotation can form notch on the plastic film, and plastic foil is cut off.
Preferred embodiment two: as advanced optimizing to preferred embodiment one, when hot wafering offsets, the temperature of hot wafering is controlled
At 170-180 DEG C, it is ensured that while plastic foil blends, plastic foil deflection is small, and can avoid plastic foil fusion part and become
Firmly.
Preferred embodiment three: as advanced optimizing to preferred embodiment two, the movement speed that hot wafering is run in opposite directions is 1-
1.5m/s, hot wafering offset after 3s, and hot wafering is separated.Hot wafering is controlled as 1-1.5m/s, so that hot wafering can quickly make
Work stage moves down, so that electronic device will not drop out under the action of inertia force out of plastic foil；The time that hot wafering offsets is
3s can be worn guaranteeing to scald plastic foil while pressing plastic foil.
Preferred embodiment four: as advanced optimizing to preferred embodiment three, the speed control for pullling plastic foil downwards exists
20cm/s hereinafter, can be subject to avoid plastic foil to pull power excessive, cause plastic foil to deform or be torn.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of electronic device packing device；
Fig. 2 is part A enlarged drawing in Fig. 1；
Fig. 3 is part B enlarged drawing in Fig. 1.
Specific embodiment
Below by specific embodiment, the present invention is described in further detail:
Appended drawing reference in Figure of description includes: cylinder 10, the first cylinder 11, adsorbent 12, first passage 13, first
Check valve 14, second one-way valve 15, ring body 16, blade 17, stator blade 18, stomata 19, top mouth-sealed portion 20a, lower section mouth-sealed portion
20b, hot wafering 21, the second wedge surface 23, the first wedge surface 24, adsorption section 30, air duct 31, dust removing tube 32, bar shaped slit 33, blower
34, pedestal 40, work stage 41, pressure spring 42, plastic film 50, electronic device 60
The method of the packaging electronic device 60 of the present embodiment has used 60 packing device of electronic device.As shown in Figure 1, Figure 2 and Fig. 3
Shown, applied 60 packing device of electronic device successively includes feeding portion, adsorption section 30 and placement section from top to bottom.Feeding portion
Including cylinder 10, the first cylinder 11 and adsorbent 12, the lower end of cylinder 10 is equipped with the air cavity of bottom opening, the top of adsorbent 12
Insertion air cavity simultaneously closes air cavity, and the top of cylinder 10 is equipped with cavity, and the cylinder body of the first cylinder 11 is mounted in cavity, and first
The piston rod of cylinder 11 is protruded into air cavity and is fixed with adsorbent 12, can be driven by the flexible of piston rod of the first cylinder 11
Adsorbent 12 slides up and down in air cavity.It is equipped with second channel in adsorbent 12, is set on the side wall of the lower part circumferential direction of adsorbent 12
There are several stomatas 19, stomata 19 is connected to by second channel with air cavity, and second one-way valve 15 is equipped in second channel, and second is single
It is connected to the outlet end of valve 15 with air cavity.The lower end of cylinder 10 is equipped with cutting part, and cutting part includes being rotatablely connected with cylinder 10
Ring body 16, the interior airflow channel for being equipped with annular along the vertical direction of ring body 16, airflow channel is interior circumferentially uniformly to be set equipped with several
The spiral stator blade 18 set, when there is air-flow by airflow channel, air-flow will generate wind pressure on stator blade 18, and due to
The setting of 18 spiral of stator blade, therefore stator blade 18 is by by the component along 16 tangential direction of ring body, so as to keep ring body 16 opposite
It is rotated in cylinder 10.The circumferential direction of ring body 16 is equipped with multiple mounting holes radially, is equipped with slidable blade 17 in mounting hole,
And be equipped in mounting hole and press against spring on blade 17, when ring body 16 rotates, blade 17 will under the influence of centrifugal force from
It is skidded off in mounting hole, and when ring body 16 stops operating, spring then pushes back blade 17 in mounting hole.The is equipped on cylinder 10
Airflow channel is connected to by one channel 13, first passage 13 with air cavity, and the first check valve 14 is equipped in first passage 13, and first
The arrival end of check valve 14 is connected to air cavity.The outer peripheral surface of 12 lower part of adsorbent is set as coarse shape, or in 12 lower part of adsorbent
Outer peripheral surface on several grooves are set so that after plastic foil is adhered to 12 surface of adsorbent, groove on adsorbent 12 is into can
It is connected to air cavity with outside.
Adsorption section 30 includes dust removing tube 32, blower 34 and the air hose for being set in 32 periphery of dust removing tube, dust removing tube 32 and air hose
Between form air duct 31, being recessed inwardly in the middle part of air hose makes the middle part in air duct 31 form throat, and the top of throat is entrance, larynx
The lower section in portion is diffuser, and entrance, throat and diffuser form air duct 31.Entrance is connected to blower 34, and blower 34 starts
After will be to 31 air blast of air duct, to form the wind flowed from top to bottom in air duct 31.There are six being set on the side wall of dust removing tube 32
Bar shaped slit 33, bar shaped slit 33 are vertically arranged, and bar shaped slit 33 is uniformly distributed along the circumferential direction of dust removing tube 32.When air-flow passes through
When the throat in air duct 31, air-flow velocity will be accelerated, to will make the pressure reduction at throat, therefore the air in dust removing tube 32 will
Enter throat by bar shaped slit 33, so that bar shaped slit 33 generates suction to except the air in dirt barrel.
It is equipped with mouth-sealed portion above and below adsorption section 30, the mouth-sealed portion being located above is top mouth-sealed portion 20a, is located at
The mouth-sealed portion of lower section is lower section mouth-sealed portion 20b.Mouth-sealed portion includes that two the second cylinders being oppositely arranged and two are oppositely arranged
Hot wafering 21, hot wafering 21 is separately fixed on two the second cylinder piston rods；When needing to seal plastic foil, the second gas
Cylinder will quickly push 21 relative motion of hot wafering, and the contact of two hot waferings 21 can then seal plastic foil.Mouth-sealed portion is wherein
One hot wafering 21 is to be made of ceramic the first hot wafering 21, and another hot wafering 21 is by castiron second hot wafering 21 the
Eddy current coil is equipped in one hot wafering 21；Eddy current coil in first hot wafering 21 connects alternating current, when the second hot wafering 21 the
When one hot wafering 21, it will be formed and be vortexed in the second hot wafering 21, so that the second hot wafering 21 be made to generate heat；When 21 He of the first hot wafering
After the separation of second hot wafering 21, then there will not be vortex in the second hot wafering 21；In addition to placing 21 He of the first hot wafering
After the separation of second hot wafering 21, the electric current in eddy current coil increases, and eddy current coil is also connect with air switch, thus to vorticity line
Circle is protected.
Placement section includes pedestal 40, work stage 41 and third cylinder, and the piston rod and pedestal 40 of third cylinder are fixed, thus
Third cylinder can push pedestal 40 to slide up and down.Work stage 41 is slidably connected on pedestal 40, the lower section of work stage 41 be equipped with
Under the action of pressure spring 42 work can stretch out the pressure spring 42 that work stage 41 offsets from the upper surface of pedestal 40, and work as workpiece
After platform 41 is pressurized, then pressure spring 42 can be made to shrink, work stage 41 moves down.The left and right sides of work stage 41 is equipped with the first wedge surface
24, and the first hot wafering 21 of lower section mouth-sealed portion 20b and the second hot wafering 21 are equipped with can cooperate with the first wedge surface 24 second
Wedge surface 23；When the first wedge surface 24 and the second wedge surface 23 offset, work stage 41 is by by downward pressure, so as to make work stage
41 is rapidly moving downward.The upper surface of work stage 41 is equipped with locating slot, and electronic device 60 is placed in locating slot, can avoid electronics
Device 60 is toppled over.
The packaging of electronic device 60 includes the following steps:
(1) plastic film sleeve of tubular is located on the cylinder 10 of 30 top of adsorption section, and plastic foil is bonded with damaged surface；
(2) start blower 34, electronic device 60 to be packaged is placed into work stage 41；
(3) plastic foil is pullled downwards by operator, the lower end of plastic foil is made to be pulled to 10 bottom of cylinder and by adsorbent
The stomata 19 of 12 lower parts covers；
(4) it opens the first cylinder 11 and pushes down on adsorbent 12, pulled plastic foil except in dirt barrel by adsorbent 12, and
Adsorbent 12 to except dirt barrel movement speed control be 15cm/s, when plastic foil by electronic device 60 complete cover after, stop to
Lower promotion adsorbent 12；
(5) after plastic foil is adsorbed on except on dirt barrel inner wall, adsorbent 12, while knife are pulled up back by the first cylinder 11
Piece 17 will cut plastic foil, be used in packaging except the plastic foil of the electronic device 60 in dirt barrel and be adsorbed on cylinder 10
Plastics UF membrane；
(6) the second cylinder of starting pushes two hot waferings 21 of mouth-sealed portion to move toward one another, the movement that hot wafering 21 is run in opposite directions
Speed is 1m/s, and when hot wafering 21 offsets, the temperature of hot wafering 21 is controlled at 175 DEG C, and hot wafering 21 offsets after 3s, makes hot wafering
21 separation；
(7) it pulls the pedestal 40 of placement section to move down by third cylinder, and is taken out from the opening of the bottom except dirt barrel
Electronic device 60 after packaging.
When packing electronic device 60, the specific work process of 60 packing device of electronic device are as follows:
The plastic film 50 of tubular is set on cylinder 10, then starting blower 34 makes blower 34 into air duct 31
Air blast then forms the air-flow to flow downward in air duct 31, flow velocity is accelerated when air-flow passes through throat, so that the pressure drop at throat
It is low, therefore the air-flow that throat is flowed to from dust removing tube 32 will be formed in bar shaped slit 33.Electronic device 60 is fastened on work stage 41
On locating slot in, then to electronic device 60 have dust suction effect so that the dust on 60 surface of electronic device is inhaled into air duct 31
It is interior.After the placement for completing electronic device 60, plastic film is pulled downward on, covers plastic film by the stomata 19 of 12 lower part of adsorbent
Lid, then starts the first cylinder 11, and the first cylinder 11 is made to push 12 slide downward of adsorbent, then the space of air cavity increases, air cavity
Air will be sucked by stomata 19, then the plastic foil opposite with 12 lower part of adsorbent will be adsorbed on the table of adsorbent 12 by stomata 19
Face；Therefore adsorbent 12 will pull down plastic foil simultaneously, so that adsorbent 12 can pull in plastic foil except in dirt barrel.Plastic foil is inhaled
Attached body 12 is pulled in except after in dirt barrel, adsorbent 12 moves down stopping；Air will enter stomata from the groove on adsorbent 12
In 19, and enter air cavity；After the pressure recovery in air cavity is normal pressure, adsorbent 12 will not have absorption to make plastic foil
With plastic foil is then adsorbed on the inner wall except dirt barrel by bar shaped slit 33 at this time.Starting the first cylinder 11 moves up adsorbent 12,
Air in air cavity will be escaped and enter in the airflow channel in ring body 16 by second one-way valve 15, to drive 16 turns of ring body
Dynamic, blade 17 is also stretched out out of mounting hole in ring body 16, cooperates the rotation of ring body 16, and blade 17 can cut off plastic foil, then
Plastic foil for packing electronic device 60 will be attracted to except on dirt barrel inner wall and positioned at 60 periphery of electronic device.
Start the second cylinder, then the second cylinder will drive hot wafering 21 to move toward one another, so that hot wafering 21 can be respectively by cylinder
The upper and lower ends of the plastic foil of shape press together, and plastic foil is melted and pressed, and realize the sealing two ends to plastic foil.And
The second wedge surface 23 on the hot wafering 21 of lower section adsorption section 30 will cooperate with the first wedge surface 24 on workbench, to make work stage 41
It moves downward；Since the movement velocity of hot wafering 21 is fast, so that workbench will move down rapidly, and it is placed in electronics device on workbench
Part 60 remains in plastic foil under the action of inertia force, completes the packaging to electronic device 60.
What has been described above is only an embodiment of the present invention, and the common sense such as well known specific structure and characteristic are not made herein in scheme
Excessive description.It, without departing from the structure of the invention, can be with it should be pointed out that for those skilled in the art
Several modifications and improvements are made, these also should be considered as protection scope of the present invention, these all will not influence what the present invention was implemented
Effect and patent practicability.The scope of protection required by this application should be based on the content of the claims, in specification
The records such as specific embodiment can be used for explaining the content of claim.
Claims (5)
1. the method for packing electronic device, which comprises the steps of:
(1) plastic film sleeve of tubular is located on the cylinder above adsorption section, and plastic foil is bonded with damaged surface；
(2) start blower, electronic device to be packaged is placed into work stage；
(3) plastic foil is pullled downwards by operator, the lower end of plastic foil is made to be pulled to cylinder bottom and by adsorbent lower part
Stomata covering；
(4) it opens the first cylinder and pushes down on adsorbent, pulled plastic foil except in dirt barrel by adsorbent, when plastic foil will be electric
After sub- device completes covering, stopping pushes down on adsorbent；
(5) after plastic foil is adsorbed on except on dirt barrel inner wall, adsorbent is pulled up back by the first cylinder, then carry out to plastic foil
Cutting is used in packaging except the plastic foil of the electronic device in dirt barrel and the plastics UF membrane being adsorbed on cylinder；
(6) the second cylinder of starting pushes two hot waferings of mouth-sealed portion to move toward one another, and after hot wafering presses plastic foil, makes hot pressing
Block separation；
(7) electronic device after packaging is taken out.
2. it is according to claim 1 packaging electronic device method, it is characterised in that: in the step (4), adsorbent to
Except the movement speed of dirt barrel is 15-20cm/s.
3. the method for packaging electronic device according to claim 2, it is characterised in that: in the step (6), hot wafering phase
To when, the temperature of hot wafering is controlled at 170-180 DEG C.
4. the method for packaging electronic device according to claim 3, it is characterised in that: in the step (6), hot wafering phase
It is 1-1.5m/s to the movement speed of operation, hot wafering offsets after 3s, hot wafering is separated.
5. the method for packaging electronic device according to claim 4, it is characterised in that: in the step (3), pull downwards
The speed control of plastic foil is in 20cm/s or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711444455.2A CN108216718B (en) | 2017-12-27 | 2017-12-27 | The method for packing electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711444455.2A CN108216718B (en) | 2017-12-27 | 2017-12-27 | The method for packing electronic device |
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| Publication Number | Publication Date |
|---|---|
| CN108216718A CN108216718A (en) | 2018-06-29 |
| CN108216718B true CN108216718B (en) | 2019-11-05 |
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| CN201711444455.2A Active CN108216718B (en) | 2017-12-27 | 2017-12-27 | The method for packing electronic device |
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| KR100285037B1 (en) * | 1992-09-02 | 2001-06-01 | 기타지마 요시토시 | Dust-free Container |
| JP5247373B2 (en) * | 2008-11-20 | 2013-07-24 | 株式会社コマック | Packaging method |
| CN101879948B (en) * | 2010-06-18 | 2011-11-30 | 汕头市高雄海包装机械有限公司 | Full-automatic coffee padding and compacting packer |
| US9238537B2 (en) * | 2013-06-10 | 2016-01-19 | Frito-Lay North America, Inc. | Method for producing multi-compartment packages |
| CN205872596U (en) * | 2016-07-22 | 2017-01-11 | 重庆市鸣浩电子科技有限公司 | Take dust collector's cell -phone vacuum applicator |
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