CN108214958A - A kind of coating cutter shaft and its manufacturing method with diamond abrasive layer - Google Patents
A kind of coating cutter shaft and its manufacturing method with diamond abrasive layer Download PDFInfo
- Publication number
- CN108214958A CN108214958A CN201810181796.3A CN201810181796A CN108214958A CN 108214958 A CN108214958 A CN 108214958A CN 201810181796 A CN201810181796 A CN 201810181796A CN 108214958 A CN108214958 A CN 108214958A
- Authority
- CN
- China
- Prior art keywords
- cutter shaft
- diamond abrasive
- sublayer
- abrasive grain
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000010432 diamond Substances 0.000 title claims abstract description 154
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 154
- 238000000576 coating method Methods 0.000 title claims abstract description 72
- 239000011248 coating agent Substances 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000006061 abrasive grain Substances 0.000 claims abstract description 102
- 238000005476 soldering Methods 0.000 claims abstract description 52
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 34
- 229910000679 solder Inorganic materials 0.000 claims description 41
- 229910045601 alloy Inorganic materials 0.000 claims description 13
- 239000000956 alloy Substances 0.000 claims description 13
- 230000008021 deposition Effects 0.000 claims description 10
- 239000010936 titanium Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000011435 rock Substances 0.000 claims description 3
- 238000010792 warming Methods 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 238000005520 cutting process Methods 0.000 abstract description 27
- 229910052751 metal Inorganic materials 0.000 abstract description 10
- 239000002184 metal Substances 0.000 abstract description 10
- 238000005240 physical vapour deposition Methods 0.000 abstract description 5
- 239000002994 raw material Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 61
- 239000011521 glass Substances 0.000 description 23
- 238000000151 deposition Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000004575 stone Substances 0.000 description 6
- 238000005219 brazing Methods 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000001291 vacuum drying Methods 0.000 description 2
- BVPWJMCABCPUQY-UHFFFAOYSA-N 4-amino-5-chloro-2-methoxy-N-[1-(phenylmethyl)-4-piperidinyl]benzamide Chemical compound COC1=CC(N)=C(Cl)C=C1C(=O)NC1CCN(CC=2C=CC=CC=2)CC1 BVPWJMCABCPUQY-UHFFFAOYSA-N 0.000 description 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229960004424 carbon dioxide Drugs 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 238000002224 dissection Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0635—Carbides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The application provides a kind of coating cutter shaft with diamond abrasive layer, including cutter shaft body and it is fixedly arranged on the diamond abrasive layer on cutter shaft body surface, the coating cutter shaft has higher hold to break bar, relative to common metal cutter shaft, coating cutter shaft wear-resisting property with diamond abrasive layer is good, service life is long, and the break bar glass-cutting installed using the coating cutter shaft is more stable.The application also provides a kind of method for manufacturing above-mentioned coating cutter shaft, soldering sublayer is specially brazed on cutter shaft body surface, the physical vapour deposition (PVD) titanium carbide sublayer in soldering sublayer again, raw material sources are extensive used in the method, diamond abrasive grain can be uniformly brazed using the method that the application provides in cutter shaft body, and can titanium carbide sublayer be equably set in soldering sub-layer surface, method is easy, mild condition, diamond abrasive grain firm stable in soldering sublayer and titanium carbide sublayer.
Description
Technical field
The application belongs to diamond abrasive tool field, and in particular to a kind of coating cutter shaft and its system with diamond abrasive layer
Make method.
Background technology
Mainly include break bar, cutter shaft and knife rest for the cutter hub of glass-cutting, wherein, the break bar for playing dissection passes through knife
Axis is installed on knife rest, and cutter shaft is installed on knife rest, and as cutter hub is in the movement of glass surface, break bar is rotated around cutter shaft, from
And cut is formed in glass surface, the cutting of glass is completed using other processing.
Cutter shaft is manufactured usually using hard metal, alloy or PCD material, the glass generated during glass-cutting
Bits can enter in the gap of cutter shaft and break bar, and with the rotation of break bar, chips of glass of the clip between cutter shaft and break bar can be worn
Metal cutter shaft or PCD cutter shafts cause the running orbit of break bar to deviate straight line, and then lead to cutting accuracy and cut the drop of quality
It is low.
It would therefore be highly desirable to develop the cutter shaft that a kind of wearability is strong and price is relatively low.
Invention content
To solve the problems, such as that cutter shaft wears no resistance, the application provides a kind of coating cutter shaft with diamond abrasive layer, institute
It states coating cutter shaft and includes cutter shaft body and the diamond abrasive layer for being fixedly installed on cutter shaft body surface, the diamond abrasive grain
Layer in each diamond abrasive grain exposed height it is close, can also be set between the diamond abrasive layer and cutter shaft body to
Few one layer of diamond abrasive layer.The application also provides a kind of method for preparing above-mentioned coating cutter shaft, and the method is in cutter shaft body
Upper one layer of soldering sublayer of soldering, then on the brazing layer titanium carbide layer, the method behaviour are prepared using physical vaporous deposition
Make simple and easy to do, production cost is low.
The application's is designed to provide a kind of coating cutter shaft with diamond abrasive layer, and the coating cutter shaft includes:
Cutter shaft body 1 and the diamond abrasive layer 2 for being set to 1 surface of cutter shaft body, the diamond abrasive layer 2 include being brazed in
Soldering sublayer 21 in cutter shaft body 1 is set to the titanium carbide sublayer in the soldering sublayer 21 by physical vaporous deposition
22 and be embedded in it is described soldering sublayer 21 and the titanium carbide sublayer 22 in diamond abrasive grain 23, the diamond abrasive grain 23
Outer end stretch out the titanium carbide sublayer 22.
In a kind of achievable mode, the grain size of the diamond abrasive grain 23 is 5~50 μm, the grain size margin of tolerance for ±
2 μm, the diamond abrasive grain 23 stretch out it is described soldering sublayer 21 length L1 be 2 thickness D of diamond abrasive layer 40%~
60%, the thickness D of the diamond abrasive layer 2 is extremely brazed sublayer 21 for 23 outer end of diamond abrasive grain close to 1 side of cutter shaft body
Between distance.
In a kind of achievable mode, the outer diameter of coating cutter shaft is 0.77~0.79mm, wherein, the coating cutter shaft
Outer diameter is in terms of the maximum external diameter of a circle where diamond abrasive grain outer end.
It is described to contain active element for manufacturing the cored solder of soldering sublayer 21 and being selected from a kind of achievable mode
Copper-base alloy tin solder, the silver-base alloy solder containing active element, one kind in the nickel-base alloy solder containing active element, institute
It states active element and includes titanium elements, chromium.
Since the hardness of diamond abrasive grain is larger, after break bar is installed on the coating cutter shaft, produced during glass-cutting
Raw chips of glass can enter in the gap between diamond abrasive grain, and with the continuous rotation of break bar, chips of glass is by Buddha's warrior attendant stone mill
Grain is crushed as the smaller chips of glass of grain size, compared to simple metal cutter shaft, alloy cutter shaft or PCD cutter shafts, after being crushed
Chips of glass causes diamond abrasive grain abrasion very little, in addition, most chips of glass can be discharged break bar hole, so as to cut glass
The chips of glass that glass generates will not cause to hinder to the rotation of break bar.Therefore, the coating cutter shaft provided using the application can cut
Lasting high cutting accuracy and excellent cutting quality are provided during cutting glass.
Due to there is the diamond abrasive grain in partial denudation state in diamond brazing layer, and diamond abrasive grain and break bar it
Between friction coefficient be more than friction coefficient between common metal cutter shaft and break bar, therefore, coating provided by the embodiments of the present application
Cutter shaft has break bar higher hold, and.Titanium carbide sublayer is further strengthened between cored solder and diamond abrasive grain
Bond strength, enhancing cored solder make diamond abrasive grain be inlayed in sublayer is brazed more firm the hold of diamond abrasive grain
It is Gu and not easily to fall off.Meanwhile relative to common metal cutter shaft, alloy cutter shaft or PCD cutter shafts, there is the painting of diamond abrasive layer
Layer cutter shaft wear-resisting property is good, and service life is long, and the break bar glass-cutting installed using the coating cutter shaft is more stable;Relative to PCD
(polycrystalline diamond) cutter shaft, coating cutter shaft provided by the embodiments of the present application is cheap and anticracking cutting capacity is high.
In a kind of achievable mode, can 1 surface of cutter shaft body be provided with diamond abrasive layer 2 described in multilayer.
The application also provides a kind of method for manufacturing above-mentioned coating cutter shaft, the method includes:
Step 1, cutter shaft body 1 is pre-processed, removes surface grease and other dirts, by diamond abrasive grain and soldering
Material is uniformly mixed, and mixture is made;
Step 2, by step 1 treated cutter shaft body 1 is installed on soldering mold, cutter shaft body 1 and soldering mold it
Between there are gap, mixture made from step 1 is added in into the gap;
Step 3, in aerobic environment, make the mold heating for being equipped with cutter shaft body 1 and cored solder of step 2 acquisition;
Step 4, in oxygen-free environment, such as in a vacuum furnace, the workpiece that step 3 obtains is made to continue to heat up;
Step 5, using physical vaporous deposition titanium carbide sublayer is manufactured in the workpiece surface that step 4 obtains;
Step 6, the titanium carbide that diamond abrasive grain surface deposits in the workpiece that step 5 obtains is removed, stretches diamond abrasive grain
Go out the partial denudation of titanium carbide sublayer, also, make coating cutter shaft uniform external diameter obtained.
In a kind of achievable mode, the weight ratio of diamond abrasive grain and cored solder is 1:(3~30).
In a kind of achievable mode, in step 3, make step 2 acquisition is equipped with cutter shaft body (1) and cored solder
Mold be warming up to 50 DEG C~150 DEG C, and keep the temperature 5~10min at this temperature.
In a kind of achievable mode, in step 4, the workpiece that step 3 obtains is made to be continuously heating to 800 DEG C~1100
DEG C, and 10s~60s is kept the temperature at this temperature.
In a kind of achievable mode, after step 1~step 6 is completed, continue in diamond abrasive grain layer surface
Step 1~6 can obtain the coating cutter shaft with multi-layer diamond abrasive grain layer.
Since diamond has larger hardness, the coating cutter shaft wearability that the application provides is obviously improved, and
Can chips of glass of the clip between coating cutter shaft and break bar be ground by the smaller clast of grain size by diamond abrasive grain, so as to
It so that cutting is more smoothly, and can further reduce abrasion of the chips of glass to coating cutter shaft, and then improve the precision of cutting
With cutting quality.
The method of manufacture aforementioned coatings cutter shaft that the application provides, used raw material sources are extensive, carried using the application
The method of confession can uniformly be brazed diamond abrasive grain, and can be in soldering sub-layer surface equably in cutter shaft body
Titanium carbide sublayer is set, and method is easy, mild condition, and diamond abrasive grain is securely steady in soldering sublayer and titanium carbide sublayer
It is fixed.
The embodiment of the present application realizes soldering, while be brazed sublayer by being chemically reacted between diamond abrasive grain and cored solder
It further improves diamond abrasive grain and is brazed the bond strength of sublayer, the risk that diamond abrasive grain comes off during reduction use,
So as to fulfill the high-accuracy production requirement of coating cutter shaft technique, and reduce the production cost of coating cutter shaft.
Description of the drawings
Fig. 1 is a kind of sectional view of the coating cutter shaft with diamond abrasive layer provided by the embodiments of the present application;
Fig. 2 is the sectional view of another coating cutter shaft with diamond abrasive layer provided by the embodiments of the present application.
Reference sign
1- cutter shaft bodies, 2- diamond abrasive layers, 21- soldering sublayers, 22- titanium carbide sublayers, 23- diamond abrasive grains.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Whole description, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts
Embodiment shall fall within the protection scope of the present invention.
The present invention described below.
Fig. 1 is a kind of sectional view of the coating cutter shaft with diamond abrasive layer provided by the embodiments of the present application, incorporated by reference to
Fig. 1, the coating cutter shaft include:Cutter shaft body 1 and the diamond abrasive layer 2 for being set to 1 surface of cutter shaft body.
The cutter shaft body 1 can be that any one is used for the cutter shaft being installed on break bar on knife rest, example in the prior art
Such as, cutter shaft body 1 can be the as shown in Figure 1 cutter shaft for including coaxial and integrally formed cone and cylinder, knife
The outer diameter of shaft body 1 is slightly less than the outer diameter of common cutter shaft, so that after on cutter shaft body surface, diamond abrasive layer is set, coating
The outer diameter of cutter shaft is suitable with the outer diameter of common cutter shaft.In this application, the outer diameter of coating cutter shaft refers to that break bar surrounds that of rotation
Partial outer diameter, for example, coating cutter shaft as shown in Figure 1, the outer diameter of coating cutter shaft refers to the outer of coating cutter shaft cylindrical portion
Diameter.
In a kind of achievable mode, the cutter shaft body 1 can use the material manufactures such as steel, iron or alloy.
The diamond abrasive layer 2 includes the soldering sublayer 21 being brazed in cutter shaft body 1, passes through physical vaporous deposition
It is set to the titanium carbide sublayer 22 being brazed in sublayer 21 and is embedded in the soldering sublayer 21 and the titanium carbide sublayer
The titanium carbide sublayer 22 is stretched out in diamond abrasive grain 23 in 22, the outer end of the diamond abrasive grain 23.
In a kind of achievable mode, the grain size of the diamond abrasive grain 23 is 5 μm~50 μm, and the grain size margin of tolerance is
±2μm.Under different cutting demands, the quantity and grain size for the chips of glass that glass-cutting generates are different, therefore, for difference
Cutting demand filler of the diamond abrasive grain as diamond abrasive layer that grain size can be used different.But for same painting
For layer cutter shaft, the grain size of the diamond abrasive grain of selection is more uniform, if for example, selecting grain size as 5 μm of diamond
Abrasive grain can then select particle size range as 5 ± 2 μm of diamond abrasive grain, so as to ensure the Buddha's warrior attendant set on cutter shaft body surface
The height of stone mill grain is uniform, and distribution of the diamond abrasive grain in cutter shaft body is also more uniform.
In a kind of achievable mode, the length L1 that the diamond abrasive grain 23 stretches out the soldering sublayer 21 is Buddha's warrior attendant
The 40%~60% of 2 thickness D of stone mill granulosa, the thickness D of the diamond abrasive layer 2 are 23 outer end of diamond abrasive grain to being brazed son
The distance between 1 side of cutter shaft body of layer 21.If the length L1 that diamond abrasive grain 23 stretches out the soldering sublayer 21 is less than
The 40% of 2 thickness D of diamond abrasive layer, then diamond abrasive grain be exposed to titanium carbide sublayer part it is too small, it is impossible to significantly body
The effect of existing diamond abrasive grain;If the length L1 that diamond abrasive grain 23 stretches out the soldering sublayer 21 is more than diamond abrasive layer
The 60% of 2 thickness D, then diamond abrasive grain 23 it is described soldering sublayer 21 in built on the sand, may during glass-cutting
Diamond abrasive grain is caused to come off, the outer diameter so as to cause coating cutter shaft is uneven, and then reduces cutting accuracy and cutting quality.
In a kind of achievable mode, the outer diameter of coating cutter shaft is 0.77~0.79mm, wherein, the coating cutter shaft
Outer diameter is in terms of the maximum external diameter of a circle where diamond abrasive grain outer end.For different break bars, can use has outside different
The coating cutter shaft of diameter, the outer diameter for the coating cutter shaft that the application provides can either ensure that break bar normally makes in 0.77mm~0.79mm
With can also fully demonstrate the effect of diamond abrasive grain in use.
In this application, soldering sublayer 21 and the thickness ratio of titanium carbide sublayer 22 are not limited, can is the prior art
A kind of thickness ratio that can be realized.For example, the thickness of soldering sublayer is 0.01mm~0.1mm, and the thickness of titanium carbide sublayer is
0.5μm-5μm。
In a kind of achievable mode, the soldering sublayer 21 is set to cutter shaft body surface by the method for soldering,
Specifically, the method includes:
Step 1, cutter shaft body 1 is pre-processed, removes surface grease and other dirts, by diamond abrasive grain and soldering
Material is uniformly mixed, and mixture is made.
It is described to contain active element for manufacturing the cored solder of soldering sublayer 21 and being selected from a kind of achievable mode
Copper-base alloy tin solder, the silver-base alloy solder containing active element, one kind in the nickel-base alloy solder containing active element, institute
It states active element and includes titanium elements, chromium, the active element of other chemical property can also be included, such as manganese element, tin element
Deng.The application utilizes the titanium elements in above-mentioned cored solder that chemical reaction occurs in brazing process so that in pricker with diamond abrasive grain
Titanium carbide is generated in weldering sublayer 21, it, can due to having strong effect power between the titanium carbide and diamond abrasive grain of generation
Make diamond abrasive grain securely in soldering sublayer 21 is embedded in.
In a kind of achievable mode, cored solder used in this application is bulk goods, to be mixed with diamond abrasive grain,
And convenient for being used in mold is brazed.
In a kind of achievable mode, the weight ratio of diamond abrasive grain and cored solder is 1:(3~30).Due in this Shen
Please in for soldering mold internal diameter it is unadjustable, therefore, after the grain size of diamond abrasive grain is selected, can pass through adjust gold
The mode of the weight ratio of hard rock abrasive grain and cored solder adjusts the density for the diamond abrasive grain inlayed in coating cutter shaft.Specifically,
Increase the weight ratio of cored solder to reduce the distribution density of diamond abrasive grain, reduce the weight ratio of cored solder to improve Buddha's warrior attendant stone mill
The distribution density of grain.
Step 2, by step 1 treated cutter shaft body 1 is installed on soldering mold, cutter shaft body 1 and soldering mold it
Between there are gap, mixture made from step 1 is added in into the gap.
In a kind of achievable mode, the application selection and cored solder similar in the grain size of selected diamond abrasive grain,
Enable cored solder mixed with diamond abrasive grain more abundant and uniformly.
In a kind of achievable mode, the internal via shape of the mold is similar to the shape of cutter shaft body, and difference only exists
In, the size of mold endoporus is slightly larger than the size of the cutter shaft body, so that after cutter shaft body is installed in mold, cutter shaft sheet
Gap can be formed between body and mould inner wall.
Further, after the cutter shaft body is installed in mold, cutter shaft main body and mold are coaxial so that cutter shaft main body with
The distance between mould inner wall is equal, so as to which the thickness of the brazing layer formed in cutter shaft body surfaces is uniform.Optionally, cutter shaft master
The distance between body and mould inner wall are slightly larger than the grain size of diamond abrasive grain, so that diamond abrasive grain can be distributed evenly in
Between cutter shaft body and mould inner wall, without since the excessive and most of clip of grain size is at the top of gap.
Step 3, in aerobic environment, make the mold heating for being equipped with cutter shaft body 1 and cored solder of step 2 acquisition.
In a kind of achievable mode, make the mold heating for being equipped with cutter shaft body 1 and cored solder of step 2 acquisition
To 50 DEG C~150 DEG C, and 5~10min is kept the temperature at this temperature.
This step operates in aerobic environment, and the material of low melting point in cored solder is made to melt, and and oxygen at the temperature disclosed above
Reaction generation oxide, so as to which diamond abrasive grain to be sintered in the surface of cutter shaft body 1.
Step 4, in oxygen-free environment, the workpiece that step 3 obtains is made to continue to heat up.
In a kind of achievable mode, in step 4, the workpiece that step 3 obtains is made to be continuously heating to 800 DEG C~1100
DEG C, and 10s~60s is kept the temperature at this temperature.Under above-mentioned temperature condition, the high-melting-point substances fusing in cored solder, and uniformly
Ground is coated on 1 surface of cutter shaft body.After heat preservation, workpiece is made to cool down, so as to complete the soldering to diamond abrasive grain.
Step 4 is operated in oxygen-free environment, cored solder and diamond is avoided to be contacted with oxygen, oxidation reaction occurs, from
And keep the state of cored solder simple substance, it is even more important that diamond is avoided to be contacted with oxygen and generate two under the high temperature conditions
Carbonoxide, so as to keep the complete of diamond abrasive grain shape.
In this step, the oxygen-free environment for example can be in vacuum drying oven.
In a kind of achievable mode, the titanium carbide sublayer 22 passes through physical vaporous deposition (Physical
Vapor Deposition, PVD) it is set in the soldering sublayer 21.
Physical vaporous deposition is that under vacuum, using the physical forms such as evaporation or sputtering, the material of solid is turned
Then turning to the gaseous substance of atom, molecule or ionic state makes these evaporation particles for carrying energy deposit to matrix or part
Surface, to form the film manufacturing method of film layer.
The embodiment of the present application using PVD method manufacture TiC sublayers method be specially:Electric arc is put on Ti targets in vacuum drying oven
Electricity, metal Ti ionization generation Ti ions;Meanwhile methane or C are passed through inside furnace chamber2H2Gas, under the action of tungsten filament electric discharge,
Diamond abrasive grain ionizes out C ions.The place that Ti ions and C ions are stored in bias (is specially knife in the embodiment of the present application
The placement location of shaft body is brazed the surface of sublayer) attract, and generate movement.TiC is generated in soldering sub-layer surface, with electricity
It constantly discharges to arc, the quantity of the TiC of generation gradually increases, so as to form TiC with preset thickness in soldering layer surface
Layer.
In the embodiment of the present application, one layer of TiC sublayer is set again in soldering sublayer, sub-layer surface TiC is brazed by increase
The quantity of molecule further improves the binding force between cored solder and diamond abrasive grain, moreover, make soldering sublayer and titanium carbide
The uniformity higher of the overall thickness of sublayer.
Fig. 2 is another coating cutter shaft provided by the embodiments of the present application, incorporated by reference to Fig. 2, is provided on 1 surface of cutter shaft body
Diamond abrasive layer 2 described in multilayer.For example, coating cutter shaft as shown in Figure 2 includes two layers of diamond abrasive layer, wherein, it is close
The diamond abrasive layer of cutter shaft body is the first diamond abrasive layer, and the diamond abrasive layer far from cutter shaft body is the second Buddha's warrior attendant
Stone mill granulosa.
The thickness of first diamond abrasive layer and the thickness of the second diamond abrasive layer can be the same or different, and inlay
Diamond abrasive grain in the first diamond abrasive layer and the grain size of diamond abrasive grain being embedded in the second diamond abrasive layer
It can be the same or different.
As coating cutter shaft is constantly used, second diamond abrasive layer on coating cutter shaft surface may come off and exposed
Go out the first diamond abrasive layer, so as to increase the service life of coating cutter shaft.It is preset moreover, if the outer diameter of cutter shaft body is less than
The outer diameter of cutter shaft body can also increase the outer diameter of default cutter shaft body, so as to make system by increasing by the first diamond abrasive layer
The outer diameter of the coating cutter shaft obtained can reach target outer diameter.
Since the hardness of diamond abrasive grain is larger, after break bar is installed on the coating cutter shaft, produced during glass-cutting
Raw chips of glass can enter in the gap between diamond abrasive grain, and with the continuous rotation of break bar, chips of glass is by Buddha's warrior attendant stone mill
It is the smaller chips of glass of grain size that grain, which crushes, and compared to simple metal cutter shaft, the chips of glass after being crushed makes diamond abrasive grain
Into abrasion very little, in addition, most chips of glass can be discharged break bar hole, so as to which the chips of glass that glass-cutting generates will not be right
The rotation of break bar causes to hinder.Therefore, the coating cutter shaft provided using the application can be provided during glass-cutting to be held
Long high cutting accuracy and excellent cutting quality.
Due to there is the diamond abrasive grain in partial denudation state in diamond brazing layer, and diamond abrasive grain and break bar it
Between friction coefficient be more than friction coefficient between common metal cutter shaft and break bar, therefore, coating provided by the embodiments of the present application
Cutter shaft has higher hold to break bar, and titanium carbide sublayer further strengthens the knot between cored solder and diamond abrasive grain
Intensity is closed, enhancing cored solder makes diamond abrasive grain be inlayed in sublayer is brazed more secured the hold of diamond abrasive grain
It is and not easily to fall off.Meanwhile relative to common metal cutter shaft, the coating cutter shaft wear-resisting property with diamond abrasive layer is good, uses
Long lifespan, the break bar glass-cutting installed using the coating cutter shaft are more stable;Relative to PCD (polycrystalline diamond) cutter shaft, this Shen
Please embodiment provide coating cutter shaft is cheap and anticracking cutting capacity is high.
The application also provides a kind of method for manufacturing aforementioned coatings cutter shaft, the method includes:
Step 1, cutter shaft body 1 is pre-processed, removes surface grease and other dirts, by diamond abrasive grain and soldering
Material is uniformly mixed, and mixture is made;
Step 2, by step 1 treated cutter shaft body 1 is installed on soldering mold, cutter shaft body 1 and soldering mold it
Between there are gap, mixture made from step 1 is added in into the gap;
Step 3, in aerobic environment, make the mold heating for being equipped with cutter shaft body 1 and cored solder of step 2 acquisition;
Step 4, in oxygen-free environment, the workpiece that step 3 obtains is made to continue to heat up;
Step 5, using physical vaporous deposition titanium carbide sublayer is manufactured in the workpiece surface that step 4 obtains;
Step 6, the titanium carbide that diamond abrasive grain surface deposits in the workpiece that step 5 obtains is removed, stretches diamond abrasive grain
Go out the partial denudation of titanium carbide sublayer, also, make coating cutter shaft uniform external diameter obtained.
The specific implementation of this method step 1~4 may refer to the aforementioned manufacturing process to being brazed sublayer and describe, herein
It repeats no more.
The specific implementation of this method step 5 may refer to the aforementioned manufacturing process to titanium carbide sublayer and describe, herein
It repeats no more.
This method step 6 can be the titanium carbide that diamond abrasive grain surface deposition is abraded using grinding tool, expose gold
Hard rock abrasive grain ontology.
In a kind of achievable mode, continue step 1~6 in diamond abrasive grain layer surface, obtaining has multilayer
The coating cutter shaft of diamond abrasive layer.
The method of manufacture aforementioned coatings cutter shaft that the application provides, used raw material sources are extensive, carried using the application
The method of confession can uniformly be brazed diamond abrasive grain, and can be in soldering sub-layer surface equably in cutter shaft body
Titanium carbide sublayer is set, and method is easy, mild condition, and diamond abrasive grain is securely steady in soldering sublayer and titanium carbide sublayer
It is fixed.
The embodiment of the present application realizes soldering, while be brazed sublayer by being chemically reacted between diamond abrasive grain and cored solder
It further improves diamond abrasive grain and is brazed the bond strength of sublayer, the risk that diamond abrasive grain comes off during reduction use,
So as to fulfill the high-accuracy production requirement of coating cutter shaft technique, and reduce the production cost of coating cutter shaft.
The application is described in detail above in association with specific embodiment and exemplary example, but these explanations are simultaneously
It is not intended that the limitation to the application.It will be appreciated by those skilled in the art that in the case of without departing from the application spirit and scope,
A variety of equivalencings, modification or improvement can be carried out to technical scheme and embodiments thereof, these each fall within the application
In the range of.The protection domain of the application is determined by the appended claims.
Claims (10)
1. a kind of coating cutter shaft with diamond abrasive layer, which is characterized in that including:It cutter shaft body (1) and is set to described
The diamond abrasive layer (2) on cutter shaft body (1) surface, the diamond abrasive layer (2) is including being brazed in cutter shaft body (1)
Soldering sublayer (21), the titanium carbide sublayer (22) and edge being set to by physical vaporous deposition on the soldering sublayer (21)
Diamond abrasive grain (23) in the soldering sublayer (21) and the titanium carbide sublayer (22), the diamond abrasive grain (23)
Outer end stretch out the titanium carbide sublayer (22).
2. coating cutter shaft according to claim 1, which is characterized in that the grain size of the diamond abrasive grain (23) is 5~50 μ
M, the grain size margin of tolerance are ± 2 μm, and the length L1 that the diamond abrasive grain (23) stretches out the soldering sublayer (21) is diamond
The 40%~60% of abrasive grain layer (2) thickness D, the thickness D of the diamond abrasive layer (2) is diamond abrasive grain (23) outer end to pricker
Weld sublayer (21) distance between cutter shaft body (1) side.
3. coating cutter shaft according to claim 1 or 2, which is characterized in that the outer diameter of coating cutter shaft is 0.77~0.79mm,
Wherein, in terms of the outer diameter of the coating cutter shaft maximum external diameter of a circle where diamond abrasive grain outer end.
4. coating cutter shaft according to any one of claims 1 to 3, which is characterized in that described to be brazed sublayer for manufacturing
(21) cored solder is selected from the copper-base alloy tin solder containing active element, and the silver-base alloy solder containing active element contains work
Property element nickel-base alloy solder in one kind, the active element include titanium elements, chromium.
5. coating cutter shaft according to any one of claims 1 to 3, which is characterized in that be provided on cutter shaft body (1) surface
Diamond abrasive layer described in multilayer (2).
6. a kind of method of any one of manufacturing claims 1 to 5 coating cutter shaft, which is characterized in that the method includes:
Step 1, cutter shaft body (1) is pre-processed, surface grease and other dirts is removed, by diamond abrasive grain and cored solder
It is uniformly mixed, mixture is made;
Step 2, by step 1 treated cutter shaft body (1) is installed on soldering mold, cutter shaft body (1) and soldering mold it
Between there are gap, mixture made from step 1 is added in into the gap;
Step 3, in aerobic environment, make the mold heating for being equipped with cutter shaft body (1) and cored solder of step 2 acquisition;
Step 4, in oxygen-free environment, the workpiece that step 3 obtains is made to continue to heat up;
Step 5, using physical vaporous deposition titanium carbide sublayer is manufactured in the workpiece surface that step 4 obtains;
Step 6, the titanium carbide that diamond abrasive grain surface deposits in the workpiece that step 5 obtains is removed, diamond abrasive grain is made to stretch out carbon
Change the partial denudation of titanium sublayer, also, make coating cutter shaft uniform external diameter obtained.
7. according to the method described in claim 6, it is characterized in that, the weight ratio of diamond abrasive grain and cored solder is 1:(3~
30)。
8. the method described according to claim 6 or 7, which is characterized in that in step 3, make step 2 acquisition is equipped with cutter shaft sheet
Body (1) and the mold of cored solder are warming up to 50 DEG C~150 DEG C, and keep the temperature 5~10min at this temperature.
9. according to claim 6 to 8 any one of them method, which is characterized in that in step 4, make step 3 obtain workpiece after
It is continuous to be warming up to 800 DEG C~1100 DEG C, and 10s~60s is kept the temperature at this temperature.
10. according to claim 6 to 9 any one of them method, which is characterized in that after step 1~step 6 is completed, in gold
Hard rock abrasive grain layer surface continues step 1~6, obtains the coating cutter shaft with multi-layer diamond abrasive grain layer.
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CN201810181796.3A CN108214958A (en) | 2018-03-06 | 2018-03-06 | A kind of coating cutter shaft and its manufacturing method with diamond abrasive layer |
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