CN108214593B - A kind of break bar, cutter device and cutting method - Google Patents
A kind of break bar, cutter device and cutting method Download PDFInfo
- Publication number
- CN108214593B CN108214593B CN201810002689.XA CN201810002689A CN108214593B CN 108214593 B CN108214593 B CN 108214593B CN 201810002689 A CN201810002689 A CN 201810002689A CN 108214593 B CN108214593 B CN 108214593B
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- Prior art keywords
- break bar
- knife
- point
- laser
- laser generator
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
- B26D7/10—Means for treating work or cutting member to facilitate cutting by heating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The present invention provides a kind of break bar, cutter device and cutting methods, comprising: cutter shaft, break bar body, point of a knife and laser generator；The laser generator is used to crack output laser at position in the point of a knife cutting object, melts to the cutting object at the crack position, to fill the crackle, to solve the problems, such as that current substrate cut is bad.
Description
Technical field
The present invention relates to technical field of display panel, more particularly to a kind of break bar, cutter device and cutting method.
Background technique
Currently, whole large-size substrate is usually prepared first, at whole in the display panel of manufacture display equipment
After the completion of large-size substrate preparation, then whole large-size substrate be cut by several small size substrates by break bar.
In the prior art, break bar is as shown in Figure 1, the break bar includes: cutter shaft 2, break bar body 3 and point of a knife 1, when in use, knife
Wheel body 3 obtains the pressure of cutting substrate 4 from point of a knife 1, cuts base by rotation and under the action of the pressure that break bar body 3 provides
Plate can generate longitudinal crack and transversal crack during cutting substrate 4 on substrate, the transversal crack as shown in Fig. 2, by
In there are transversal cracks and longitudinal crack, therefore in the production of substrate subsequent technique, transversal crack by external force can further expansion,
As shown in figure 3, fragmentation even occurs when serious.
Summary of the invention
The present invention provides a kind of break bar, cutter device and cutting methods, and to solve, current substrate cut is undesirable to be asked
Topic.
To solve the above-mentioned problems, the invention discloses a kind of break bars, comprising: cutter shaft, break bar body, point of a knife and laser occur
Device；
The laser generator is split for cracking output laser at position in the point of a knife cutting object to described
Cutting object at line position is melted, to fill the crackle.
Optionally, the laser generator is arranged in the break bar body.
Optionally, the laser channeling being connected to the laser generator is provided in the point of a knife.
Optionally, the laser channeling has a plurality of, is symmetrically distributed in the point of a knife.
Optionally, the laser channeling inner wall is provided with high reflexed material.
Optionally, the high reflexed material is phosphorus pentoxide or silica.
Optionally, the cutting object is glass substrate.
Optionally, the point of a knife is using wolfram steel material or diamond or alloy material.
To solve the above-mentioned problems, the invention also discloses a kind of cutter devices, including any one of claims 1 to 8
The break bar.
To solve the above-mentioned problems, the invention also discloses a kind of cutting methods, comprising:
Laser generator cracks output laser at position in point of a knife cutting object；
The cutting object at crack position is melted using the laser, to fill the crackle.
Compared with prior art, the present invention includes the following advantages:
Break bar of the present invention includes: cutter shaft, break bar body, point of a knife and laser generator, by the way that laser is arranged in break bar
Device, the laser generator are used to crack at position output laser in point of a knife cutting object, to cutting at the crack position
Cut object to be melted, be expressed to glass colloidal sol in crackle by point of a knife, thus crackle is filled it is intact, to solve substrate
Cut bad problem.
Certainly, it implements any of the products of the present invention and is not necessarily required to reach all the above advantage simultaneously.
Detailed description of the invention
Fig. 1 is cutting wheel structure schematic diagram in the prior art；
Fig. 2 is the schematic diagram that transversal crack is generated in cutting process；
Fig. 3 is the schematic diagram after transversal crack stress；
Fig. 4 is a kind of structural schematic diagram of break bar described in the embodiment of the present invention one；
Fig. 5 is a kind of structural schematic diagram of break bar described in the embodiment of the present invention two；
Fig. 6 is a kind of flow chart of cutting method described in the embodiment of the present invention four.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing and specific real
Applying mode, the present invention is described in further detail.
Embodiment one
Referring to fig. 4, it illustrates a kind of cutting wheel structure schematic diagram described in the embodiment of the present invention one, which is specifically included:
Cutter shaft 2, break bar body 3, point of a knife 1 and laser generator 5.
Cutter shaft 2 is arranged 3 with the break bar, and the laser generator 5 is arranged in break bar body 3, and the laser occurs
Device 5 is connect with the point of a knife 1, for cracking output laser at position in 1 cutting object of point of a knife, to the crackle position
The cutting object at the place of setting is melted, to fill the crackle.
Cutter shaft 2 is arranged on the break bar body 3, drives the point of a knife 1, the laser generator 5 by the rotation of cutter shaft 2
With the break bar body 3, so that the point of a knife 1, the laser generator 5 and the break bar body 3 is moved to cutting object and need to cut
Position at.
It should be noted that the explanation that break bar is carried out as example is arranged in laser generator for the present embodiment, actually answering
In, there are a variety of possible settings for laser generator, such as: laser generator is arranged outside break bar body, will be swashed by optical fiber
The laser of optical generator output is output to cracks.
The laser generator 5 is connected by optical fiber with break bar body 3, and the laser is occurred by optical fiber for laser generator
The laser that device 5 exports is used to crack output laser at position in 1 cutting object of point of a knife, by laser to the crackle
Cutting object at position is melted, and is expressed to colloidal sol in crackle by point of a knife, to crackle is filled complete.
The present embodiment, break bar include: cutter shaft, break bar body, point of a knife and laser generator, are sent out by the way that laser is arranged in break bar
Raw device, which is used to crack output laser at position in point of a knife cutting object, at the crack position
Cutting object is melted, and is expressed to glass colloidal sol in crackle by point of a knife, thus crackle is filled it is intact, to solve base
Plate cuts bad problem.
Embodiment two
Referring to Fig. 5, it illustrates a kind of cutting wheel structure schematic diagram described in the embodiment of the present invention two, which is specifically included:
Cutter shaft 2, break bar body 3, point of a knife 1, laser generator 5 and laser channeling 6.
Cutter shaft 2 is arranged on the break bar body 3, and the laser generator 5 is arranged in break bar body 3, and the laser occurs
The laser channeling 6 being arranged in device 5 and the point of a knife 1 is connect, and is exported at position for cracking in 1 cutting object of point of a knife
Laser melts the cutting object at the crack position, to fill the crackle.
Optionally, the cutting object is glass substrate or other substrates, such as plastic base, is not done to this present invention
Concrete restriction.
In Fig. 5, when using break bar glass-cutting substrate of the invention, when point of a knife 1 streaks glass, it can generate and laterally split
Line is had an effect by laser channeling 6 with glass from the laser that laser generator 5 exports at this time, and the side of glass is melt into
Glass colloidal sol, the glass colloidal sol are expressed in the crackle of glass side by point of a knife 1, to crackle is filled completely, while in glass
Glass side forms one layer of glassivation.
Optionally, the laser channeling 6 has a plurality of, is symmetrically distributed in the point of a knife.
Optionally, 6 inner wall of laser channeling is provided with high reflexed material, and the laser exported in this way passes through laser channeling 6
With it photochemical and thermal reaction occurs for Shi Buhui, will not generate temperature, and then damage break bar itself or laser channeling.
In practical applications, the high reflexed material is phosphorus pentoxide or silica, or other materials.
Point of a knife 1 generally uses wolfram steel material or diamond or alloy material etc., and laser generator 5 generally uses
Miniature laser generator need to only meet after laser focuses in this way and reach glass melting point, and without reaching glass gasification, power is relatively general
Logical laser cutter is lower, is content with very little, and cost is relatively low,
The present embodiment, break bar include: cutter shaft, break bar body, point of a knife and laser generator, are sent out by the way that laser is arranged in break bar
Raw device, which is used to crack output laser at position in point of a knife cutting object, at the crack position
Cutting object is melted, and is expressed to glass colloidal sol in crackle by point of a knife, thus crackle is filled it is intact, to solve base
Plate cuts bad problem.
Embodiment three
The invention also discloses a kind of cutter devices, including break bar described in embodiment one and embodiment two.
The cutter device has the advantages that all of break bar in above-described embodiment one, two, and details are not described herein.
Example IV
Referring to Fig. 6, it illustrates a kind of flow charts of cutting method described in the embodiment of the present invention four, specifically include:
Step 601: laser generator cracks output laser at position in point of a knife cutting object.
Step 602: the cutting object at crack position being melted using the laser, to fill the crackle.
The present embodiment cracks output laser at position in point of a knife cutting object by laser generator, splits to described
Cutting object at line position is melted, and is expressed to glass colloidal sol in crackle by point of a knife, thus crackle is filled it is intact, from
And solve the problems, such as that substrate cut is bad.
It should be noted that for the aforementioned method embodiment, for simple description, therefore, it is stated as a series of
Combination of actions, but those skilled in the art should understand that, the present invention is not limited by the sequence of acts described, because according to
According to the present invention, some steps may be performed in other sequences or simultaneously.Secondly, those skilled in the art should also know that,
The embodiments described in the specification are all preferred embodiments, and related movement is not necessarily essential to the invention.
All the embodiments in this specification are described in a progressive manner, the highlights of each of the examples are with
The difference of other embodiments, the same or similar parts between the embodiments can be referred to each other.
It would have readily occurred to a person skilled in the art that: any combination application of above-mentioned each embodiment is all feasible, therefore
Any combination between above-mentioned each embodiment is all embodiment of the present invention, but this specification exists as space is limited,
This is not just detailed one by one.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise", include not only those elements, but also wrap
Include other elements that are not explicitly listed, or further include for this process, method, article or equipment intrinsic want
Element.In the absence of more restrictions, the element limited by sentence " including ... ", it is not excluded that including the element
There is also other identical elements in process, method, article or equipment.
Moreover, "and/or" expression above had both contained the relationship of "and" herein, the relationship of "or" is also contained,
In: if option A and option b are the relationships of "and", then it represents that can simultaneously include option A and option b in certain embodiment；If
Option A and option b are the relationships of "or", then it represents that can individually include option A in certain embodiment, or individually include option b.
Although preferred embodiments of the present invention have been described, it is created once a person skilled in the art knows basic
Property concept, then additional changes and modifications can be made to these embodiments.So it includes excellent that the following claims are intended to be interpreted as
It selects embodiment and falls into all change and modification of the scope of the invention.
It above to a kind of break bar provided by the present invention, cutter device and cutting method, is described in detail, herein
In apply that a specific example illustrates the principle and implementation of the invention, the explanation of above example is only intended to sides
Assistant solves method and its core concept of the invention；At the same time, for those skilled in the art, think of according to the present invention
Think, there will be changes in the specific implementation manner and application range, in conclusion the content of the present specification should not be construed as pair
Limitation of the invention.
Claims (7)
1. a kind of break bar characterized by comprising cutter shaft, break bar body, point of a knife and laser generator；
Cutter shaft is arranged with the break bar, drives the point of a knife, the laser generator and the knife by the rotation of cutter shaft
Body is taken turns, is moved to the point of a knife, the laser generator and the break bar body at cutting object position to be cut；
The laser generator, for cracking output laser at position in the point of a knife cutting object, to the crackle position
The cutting object at the place of setting is melted, to fill the crackle；
The laser generator is arranged in the break bar body；Be provided in the point of a knife be connected to the laser generator swash
Optical channel, the laser channeling inner wall are provided with high reflexed material.
2. break bar according to claim 1, which is characterized in that the laser channeling has a plurality of, is symmetrically distributed in the knife
In point.
3. break bar according to claim 1, which is characterized in that the high reflexed material is phosphorus pentoxide or titanium dioxide
Silicon.
4. break bar according to claim 1, which is characterized in that the cutting object is glass substrate.
5. break bar according to claim 1-4, which is characterized in that the point of a knife uses wolfram steel material or Buddha's warrior attendant
Stone material or alloy material.
6. a kind of cutter device, which is characterized in that including break bar described in any one of claims 1 to 5.
7. a kind of cutting method characterized by comprising
Point of a knife, laser generator and break bar body are driven by the rotation of cutter shaft, makes the point of a knife, the laser generator and described
Break bar body is moved at cutting object position to be cut；
Laser generator cracks output laser at position in point of a knife cutting object；
The cutting object at crack position is melted using the laser, to fill the crackle, the laser generator
It is arranged in the break bar body；The laser channeling being connected to the laser generator is provided in the point of a knife, the laser is logical
Road inner wall is provided with high reflexed material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810002689.XA CN108214593B (en) | 2018-01-02 | 2018-01-02 | A kind of break bar, cutter device and cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810002689.XA CN108214593B (en) | 2018-01-02 | 2018-01-02 | A kind of break bar, cutter device and cutting method |
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| Publication Number | Publication Date |
|---|---|
| CN108214593A CN108214593A (en) | 2018-06-29 |
| CN108214593B true CN108214593B (en) | 2019-11-29 |
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| CN201810002689.XA Active CN108214593B (en) | 2018-01-02 | 2018-01-02 | A kind of break bar, cutter device and cutting method |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112428327B (en) * | 2020-10-23 | 2022-06-07 | Oppo广东移动通信有限公司 | Processing method, processing equipment, display panel and electronic equipment |
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|---|---|---|---|---|
| CN1271646A (en) * | 1998-11-06 | 2000-11-01 | 肖特玻璃制造厂 | Method and apparatus for cutting laminated products made of hard brittle material and plastics |
| CN1473354A (en) * | 2001-09-10 | 2004-02-04 | ������������ʽ���� | Apparatus for repairing defect of substrate |
| CN1703770A (en) * | 2002-12-03 | 2005-11-30 | 浜松光子学株式会社 | Method for cutting semiconductor substrate |
| CN200991967Y (en) * | 2006-12-19 | 2007-12-19 | 劲钻科技股份有限公司 | Cutter wheel for fragile board material |
| CN101486202A (en) * | 2008-01-15 | 2009-07-22 | 三星钻石工业股份有限公司 | Cutting method for laminated body and cutting knife used therein |
| CN101709468A (en) * | 2009-12-10 | 2010-05-19 | 南昌航空大学 | Method for rapidly preparing gradient metal ceramic composite material by laser induction hybrid cladding |
| CN101734850A (en) * | 2008-11-26 | 2010-06-16 | 株式会社日本制钢所 | Knife wheel |
| CN102403466A (en) * | 2011-11-18 | 2012-04-04 | 上海大学 | Laser bonding method for packaging of photoelectric device |
| CN106735587A (en) * | 2016-12-27 | 2017-05-31 | 重庆市永川区益锐机械有限责任公司 | Connecting rod cutter sweep |
-
2018
- 2018-01-02 CN CN201810002689.XA patent/CN108214593B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1271646A (en) * | 1998-11-06 | 2000-11-01 | 肖特玻璃制造厂 | Method and apparatus for cutting laminated products made of hard brittle material and plastics |
| CN1473354A (en) * | 2001-09-10 | 2004-02-04 | ������������ʽ���� | Apparatus for repairing defect of substrate |
| CN1703770A (en) * | 2002-12-03 | 2005-11-30 | 浜松光子学株式会社 | Method for cutting semiconductor substrate |
| CN200991967Y (en) * | 2006-12-19 | 2007-12-19 | 劲钻科技股份有限公司 | Cutter wheel for fragile board material |
| CN101486202A (en) * | 2008-01-15 | 2009-07-22 | 三星钻石工业股份有限公司 | Cutting method for laminated body and cutting knife used therein |
| CN101734850A (en) * | 2008-11-26 | 2010-06-16 | 株式会社日本制钢所 | Knife wheel |
| CN101709468A (en) * | 2009-12-10 | 2010-05-19 | 南昌航空大学 | Method for rapidly preparing gradient metal ceramic composite material by laser induction hybrid cladding |
| CN102403466A (en) * | 2011-11-18 | 2012-04-04 | 上海大学 | Laser bonding method for packaging of photoelectric device |
| CN106735587A (en) * | 2016-12-27 | 2017-05-31 | 重庆市永川区益锐机械有限责任公司 | Connecting rod cutter sweep |
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| Publication number | Publication date |
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| CN108214593A (en) | 2018-06-29 |
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