CN108212698A - A kind of double-colored temperature LED light source point glue equipment of flexibility - Google Patents
A kind of double-colored temperature LED light source point glue equipment of flexibility Download PDFInfo
- Publication number
- CN108212698A CN108212698A CN201810201326.9A CN201810201326A CN108212698A CN 108212698 A CN108212698 A CN 108212698A CN 201810201326 A CN201810201326 A CN 201810201326A CN 108212698 A CN108212698 A CN 108212698A
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- Prior art keywords
- led light
- double
- supporting plate
- light source
- steel disc
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- 239000003292 glue Substances 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 61
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 41
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 39
- 239000010959 steel Substances 0.000 claims abstract description 39
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 6
- 229920001342 Bakelite® Polymers 0.000 claims description 5
- 239000004637 bakelite Substances 0.000 claims description 5
- 239000002969 artificial stone Substances 0.000 claims description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000012827 research and development Methods 0.000 abstract description 2
- 238000005286 illumination Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 20
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000010411 cooking Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229920000715 Mucilage Polymers 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/023—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/04—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to opposite sides of the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The present invention provides a kind of double-colored temperature LED light source point glue equipments of flexibility, belong to LED illumination product manufacturing field.Wherein, a kind of double-colored temperature LED light source point glue equipment of flexibility by support positioning base, pick and place supporting plate and gluing steel disc forms.Support positioning base provides positioning and supporting role to pick and place pallet and gluing steel disc.The substrate that pallet is picked and placeed as flexible double-colored temperature LED light product-derived provides carrying and positioning action.Gluing steel disc provides accurate dispensing effect for flexible double-colored temperature LED light product-derived.The present apparatus makes simply, and cost is relatively low, is produced and used suitable for research and development early period of flexible double-colored temperature LED light product-derived and small lot.
Description
Technical field
The present invention relates to LED product manufacturing field, in particular to a kind of double-colored temperature LED light source manufacturing device of flexibility.
Background technology
Flexible LED light source has the characteristics that arbitrary bending moulding and specular removal, high brightness, becomes a perfect substitute and passes
The energy-saving product of system incandescent lamp tungsten filament.Such flexible LED light source applications can be brought in decorative kind lighting bulb to user
Splendid experience is even more to be liked deeply by user particularly in pseudo-classic decorative lighting North America in great demand and EU market.It is soft
Property LED light source basic technology is：Select material softness FPC that as base material then calendering copper electricity is set on FPC surfaces again first
Road, fixed LED wafer, coating fluorescent glue, last baking molding are final filament product.Common flexible LED light source because
It an only circuit and is only coated with a kind of fluorescent glue of special formulation and a kind of luminescent color can only be showed, therefore can not
It is full of the diversified demand of user.This those skilled in the art are devised with a kind of flexible LED light that can send out two kinds of color of light
Source.The design principle of such double-colored flexible LED light source is：2 LED line roads are set on FPC flexible base boards, in two lines road
LED wafer uses arranged crosswise, then coats the fluorescent glue of different formulations in the LED wafer on two lines road again and arrives finally
Product.LED wafer between two different circuits will reduce spacing as far as possible, to prevent LED wafer spacing excessive, in LED crystalline substances
There are serious granular sensation piece excites fluorescent glue and emits beam after lighting when, and customer experience is caused to reduce.Cause will be as far as possible
Reduction LED wafer between spacing, LED wafer spacing reduce after, because of spacing very little, in different circuits
Fluorescent glue is coated in LED wafer just becomes abnormal difficult.
Therefore, the present invention is provided based on the coating technique difficult point for the Two Colour Fluorescence glue for solving flexible dual-colored LED light source
A kind of special and simple possible, the painting mucilage binding of low cost for being exclusively used in the different types of double-colored flexible LED light source of Corporation R ＆ D
It puts.
Invention content
It is an object of the invention to create a kind of development ＆ production device of the dispensing processing procedure of the double-colored temperature LED light source of flexibility, this
Kind device can be the fluorescent glue that the very small LED wafer precision of two spacing of double-colored flexible LED light source coats different formulations
So as to obtain double-colored flexible LED light source.
The particular content of the present invention is as follows：
Agreement：Flexibility FPC substrates of the present invention, each mean and have completed to fix LED wafer on FPC substrates, wait for
The semifinished material of point fluorescent glue.
The purpose of the present invention is to provide a kind of research and development lifes of the dispensing processing procedure of the simple and practical double-colored temperature LED light source of flexibility
Device is produced, such process units can be that the very small LED wafer precision of two spacing of double-colored tenderness LED light source coats not
Fluorescent glue with formula is without there is adhesion.The device by support positioning base, pick and place supporting plate and gluing steel disc three
Part forms.
As preferred designing scheme, support positioning base is made of bakelite material, soft in being provided at both ends with for pedestal
Property FPC substrates pilot pin and pick and place supporting plate, gluing steel disc positioning column.
As preferred designing scheme, pick and place supporting plate and made of artificial stone material, FPC bases are provided at both ends in supporting plate
Plate pilot pin via and pick and place supporting plate, gluing steel disc positioning column via.Strength magnetic pole is inlaid at the back side for picking and placeing supporting plate.Strongly
The effect of magnetic pole is absorption gluing steel disc.FPC substrates slot and metal end pilot trench are provided in the front surface region for picking and placeing supporting plate, and
FPC substrates groove depth is less than metal end pilot trench.
As preferred designing scheme, the thickness of gluing steel disc is chosen for 0.2mm, this thickness is repeatedly tested by designer's
The Rational Thickness demonstrate,proved and obtained.Steel disc both ends offer the via of steel disc positioning column and the pilot pin via of FPC substrates.In steel disc
Between the brush coating hole of 1.0mm × 1.0mm is opened up in FPC substrate high color temperature LED wafer circuit groups.
The application method of apparatus of the present invention is：
The first step：The corresponding pilot pin of supporting plate alignment will be picked and placeed and positioning column is placed on support positioning base.
Second step：FPC substrates are placed into and are picked and placeed on supporting plate, the location hole of FPC substrates, which is inserted in protrude from, picks and places supporting plate
Pilot pin, the FPC substrates of middle section are uniformly placed into FPC substrate locating slots.
Third walks：The corresponding pilot pin of location hole alignment of gluing steel disc is placed into and is picked and placeed on supporting plate.
4th step：The fluorescent glue of a layer specific formula is coated on gluing steel disc surface, is struck off using silica gel brush, then removed
Gluing steel disc.Fluorescent glue is will be left behind in the corresponding gluing hole portion position of gluing steel disc and be wrapped in selected alignment after removing gluing steel disc
The LED wafer on road.
5th step：After completing the 4th step, supporting plate will be picked and placeed and removed from support positioning base, together with picking and placeing on supporting plate
FPC substrates are sent into oven cooking cycle together makes fluorescence adhesive curing.
6th step：After the completion of curing, FPC substrates are attached on plain clamp, are coated with the fluorescent glue of an other circuit simultaneously
Baking-curing finally obtains final product.
The beneficial effects of the invention are as follows：
Since what the chip on two LED line roads on flexible base board used is intervally arranged, and coat the fluorescent glue of different formulations, no
Smaller, the generally 1.0-1.5mm with the LED spacing between circuit, using common dispenser syringe needle dispensing when, can not be by fluorescent glue
Point wraps up corresponding LED wafer into the hemispherical colloids of only 1.5mm.If dispensing needle head discharge colloid diameter in dispensing surpasses
1.5mm is crossed, then fluorescent glue will scatter to adjacent chip and cause product is photochromic deviation occur.Based on solving the problems, such as this, this hair
It is bright to provide a kind of glue spreading apparatus of simple double-colored tenderness LED light source, can be FPC substrates by the gluing steel disc on device
Upper specific LED wafer group coating fluorescent glue.The thickness of gluing steel disc is designed as 0.2mm simultaneously, gluing hole is designed and sized to
This design of 1.0mm × 1.0mm ensure that the fluorescent glue that LED wafer surface is covered in after glue dispensing there are certain thickness, and not
It can be diffused into adjacent LED wafer, solve the problems, such as the glue dispensing of extra small spacing with this.
Description of the drawings
In order to illustrate more clearly of technical scheme of the present invention, letter will be made to attached drawing needed in the embodiment below
It singly introduces, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as to range
It limits, it for those of ordinary skill in the art, without creative efforts, can also be according to these attached drawings
Obtain other relevant attached drawings.
Fig. 1 is flexibility FPC substrate schematic diagrams；
Fig. 2 is flexibility FPC base plate line structure diagrams；
Fig. 3 is support positioning base schematic diagram；
Fig. 4 shows right schematic side view for support positioning base；
Fig. 5 is activity pallet front schematic view；
Fig. 6 is activity pallet schematic rear view；
Fig. 7 is gluing steel disc schematic diagram.
Icon：1- flexibility FPC substrates；101- metal terminals；102- circuits；103-FPC substrate location holes；104-LED is brilliant
Piece；105- high color temperature circuits；The low colour temperature circuits of 106-；2- supports positioning base；201- positioning columns；202-FPC substrate pilot pins；
203- bakelite blocks；3- activity pallets；301- positioning column vias；302-FPC substrate pilot pin vias；303- metal end pilot trench；
304-FPC substrate locating slots；305- strength magnetic poles；4- gluing steel discs；401-FPC substrate pilot pin vias；402- positioning column mistakes
Hole；403- gluings hole；The distance of two nearest LED wafers between A- difference circuits；B-FPC substrate widths；Between the same circuits of C-
The distance of two nearest LED chips.
Specific embodiment
To make the technical solution of the embodiment of the present invention, below in conjunction with the attached drawing in the embodiment of the present invention, to of the invention real
The technical solution applied in example is clearly and completely described, it is clear that and described embodiment is part of the embodiment of the present invention,
Instead of all the embodiments.
Therefore, below the detailed description of the embodiment of the present invention to providing in the accompanying drawings be not intended to limit it is claimed
The scope of the present invention, but be merely representative of the present invention selected embodiment.Based on the embodiments of the present invention, this field is common
Technical staff's all other embodiments obtained without making creative work belong to the model that the present invention protects
It encloses.
It should be noted that：Similar label represents similar terms in following attached drawing, therefore, once a certain Xiang Yi attached drawing
In be defined, then do not need to that it is further defined and explained in subsequent attached drawing.
Please refer to Fig. 1, Fig. 2.Fig. 1 is flexibility FPC substrate schematic diagrams, and Fig. 2 is flexibility FPC base plate line structure diagrams.
Flexible FPC substrates（1）By the layers of copper circuit made on flexible base board（102）And metal terminal（101）Composition, in flexible FPC bases
Plate（1）Upper is high color temperature circuit respectively（105）With low colour temperature circuit（106）Two lines road.Arranged for interval has LED between two lines road
Chip（104）.The spacing of a nearest chip between different-colour circuit（A）For 1.5mm.Flexible FPC substrate widths（B）For
1.5mm.The present embodiment will have been completed the fixed flexibility FPC substrates of LED wafer based on this and carry out gluing operation.
Please refer to Fig. 3, Fig. 4.Fig. 3 is support positioning base schematic diagram, and Fig. 4 shows that right side regards signal for support positioning base
Figure.In support positioning base（2）Bakelite block（203）Four corners on be provided with the positioning column of 4 a diameter of 3.0mm
（201）.In bakelite block（203）Two long side directions be provided at both ends with FPC substrates（1）Pilot pin（202）, pilot pin
（202）Diameter and FPC substrate location holes（103）Diameter it is equal.Pilot pin（202）Spacing and FPC substrate location holes
（103）Spacing it is equal.Pilot pin（202）And positioning column（201）Height be 3.0mm.
Please continue to refer to figure, 5 and Fig. 6, Fig. 5 be activity pallet front schematic view, Fig. 6 is activity pallet reverse side schematic diagram.
In activity pallet（3）Front, FPC substrate locating slots are disposed with according to the arrangement of FPC substrates（304）, FPC substrate locating slots
（304）Depth for 0.08mm, FPC substrate locating slots（304）Width and FPC substrate widths（B）It is equal.Determine in FPC substrates
Position slot（304）Be provided at both ends with metal end pilot trench（303）, metal terminal locating slot（303）Depth for 0.2mm, FPC substrates
Locating slot（304）There are the difference in height of 0.12mm between metal terminal locating slot, this difference in height is that flexibility is placed in pilot pin
Mechanical force is provided after FPC substrates, is that FPC substrates are exceptionally straight.In metal end pilot trench（303）Outer ledge be provided with FPC substrates and determine
Position needle（202）FPC substrate pilot pin vias（302）.In activity pallet（2）Four corners be provided with positioning column（201）'s
Positioning column via（301）.FPC substrate pilot pin vias（302）With positioning column via（301）Relative position with support positioning bottom
Seat（2）On FPC substrate pilot pins（202）And positioning column（201）It is corresponding.In movable tray（3）The back side inlay rear diameter
Strength magnetic pole for 2.0mm（305）, strength magnetic pole（305）Embedded movable tray（3）It is interior, but activity pallet is not penetrated just
Face, strength magnetic pole（305）Outer drain surface and movable tray（2）The surface at the back side flushes.Activity pallet（2）Thickness be
2.0mm。
Fig. 7 is please referred to, Fig. 7 is gluing steel disc schematic diagram.Gluing steel disc（4）On offer FPC substrate pilot pin vias
（401）With positioning column via（402）.FPC substrate pilot pin vias（401）With positioning column via（402）Relative position and branch
Support positioning base（2）On FPC substrate pilot pins（202）And positioning column（201）It is corresponding.Aperture size corresponds to corresponding positioning
Needle and positioning column diameter.In gluing steel disc（2）Intermediate position gluing hole is offered according to the trend of FPC circuits（403）, gluing
The size in hole is 1.0mm × 1.0mm, the distance of two nearest LED chips between the spacing in gluing hole and same circuit（C）Phase
Deng.Gluing steel disc uses the steel after 0.2mm to be fabricated.
A kind of design of the double-colored temperature LED light source point glue equipment of flexibility is completed after completion above step.
The specifically used method of this covering device is as follows：
The first step：Supporting plate will be picked and placeed（3）It is directed at corresponding pilot pin（202）And positioning column（201）It is placed into support positioning base
（2）On.
Second step：By flexible FPC substrates（1）It is placed into and picks and places supporting plate（3）On, the location hole of FPC substrates（103）It is inserted in prominent
For picking and placeing supporting plate（2）FPC pilot pin vias（302）The FPC substrate pilot pins at place（202）On, and by metal terminal（101）
It is pressed into metal end pilot trench（303）In.The FPC substrates of middle section are uniformly placed into FPC substrate locating slots（304）In.
Third walks：By gluing steel disc（4）Location hole be directed at corresponding pilot pin and be placed into and pick and place supporting plate（3）On.
4th step：In gluing steel disc（4）Surface coats the fluorescent glue of a layer specific formula, is struck off using silica gel brush, then
Remove gluing steel disc（4）.It removes after gluing steel disc in gluing steel disc（2）Corresponding gluing hole（403）Position will be left behind fluorescent glue
And it is wrapped in the LED wafer on selected alignment road（104）Around.
5th step：After completing the 4th step, supporting plate will be picked and placeed（2）From support positioning base（1）On remove, together with picking and placeing supporting plate
（2）On FPC substrates（1）Being sent into oven cooking cycle together makes fluorescence adhesive curing.
6th step：After the completion of curing, FPC substrates（1）It is attached on plain clamp, is coated with the fluorescent glue of an other circuit
And baking-curing, finally obtain final product.
Claims (5)
1. a kind of double-colored temperature LED light source point glue equipment of flexibility by support positioning base, pick and place three parts of supporting plate and gluing steel disc
Composition, support positioning base are made of bakelite material and are provided at both ends with flexible FPC substrates pilot pin what pedestal was determined in support
With pick and place supporting plate, gluing steel disc positioning column, pick and place supporting plate using artificial stone material make, picking and placeing being provided at both ends with for supporting plate
FPC substrate pilot pin vias and supporting plate, gluing steel disc positioning column via being picked and placeed, the back side for picking and placeing supporting plate is inlaid with strength magnetic pole,
The front surface region for picking and placeing supporting plate is provided with FPC substrates slot and metal end pilot trench, and FPC substrates groove depth is less than metal end pilot trench,
The thickness of gluing steel disc is chosen for 0.2mm, and gluing steel disc both ends offer the via of steel disc positioning column and the pilot pin of FPC substrates
Via.
2. the double-colored temperature LED light source point glue equipment of a kind of flexibility according to claim 1, it is characterized in that, described one kind is soft
The gluing steel disc of the double-colored temperature LED light source point glue equipment of property uses thickness to be made for the steel disc of 0.2mm.
3. the double-colored temperature LED light source point glue equipment of a kind of flexibility according to claim 1, it is characterized in that, described one kind is soft
Property double-colored temperature LED light source point glue equipment the back for picking and placeing supporting plate be inlaid with magnetic pole, the surface of magnetic pole and the back for picking and placeing supporting plate
Surface flushes.
4. the double-colored temperature LED light source point glue equipment of a kind of flexibility according to claim 1, it is characterized in that, described one kind is soft
Property double-colored temperature LED light source point glue equipment the intermediate position in supporting plate front that picks and places be provided with the width locating slot consistent with FPC substrates,
The positive two side portions for picking and placeing supporting plate are provided with FPC substrate metal terminal position slots, the wherein depth of metal terminal locating slot
More than the depth of FPC substrate locating slots.
5. the double-colored temperature LED light source point glue equipment of a kind of flexibility according to claim 1, it is characterized in that, described one kind is soft
The support positioning base of the double-colored temperature LED light source point glue equipment of property is provided with the pilot pin for picking and placeing supporting plate and gluing steel disc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810201326.9A CN108212698A (en) | 2018-03-12 | 2018-03-12 | A kind of double-colored temperature LED light source point glue equipment of flexibility |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810201326.9A CN108212698A (en) | 2018-03-12 | 2018-03-12 | A kind of double-colored temperature LED light source point glue equipment of flexibility |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108212698A true CN108212698A (en) | 2018-06-29 |
Family
ID=62658370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810201326.9A Pending CN108212698A (en) | 2018-03-12 | 2018-03-12 | A kind of double-colored temperature LED light source point glue equipment of flexibility |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111890815A (en) * | 2020-07-09 | 2020-11-06 | 苏州工业园区客临和鑫电器有限公司 | Flexible filament double-color-temperature fluorescent powder printing process |
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