CN108198956A - Evaporation mask plate - Google Patents
Evaporation mask plate Download PDFInfo
- Publication number
- CN108198956A CN108198956A CN201711465247.0A CN201711465247A CN108198956A CN 108198956 A CN108198956 A CN 108198956A CN 201711465247 A CN201711465247 A CN 201711465247A CN 108198956 A CN108198956 A CN 108198956A
- Authority
- CN
- China
- Prior art keywords
- vapor deposition
- hole
- plate body
- evaporation mask
- opening size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention provides a kind of evaporation mask plates, including plate body, the plate body includes a vapor deposition face and the contact surface opposite with vapor deposition face, array is placed with the vapor deposition through-hole for vapor deposition on the plate body, it is the first occlusion part to be located at this part plate body between vapor deposition through-hole on the plate body, the vapor deposition through-hole runs through vapor deposition face and contact surface, the opening size of the vapor deposition through-hole is less than the opening size in organic LED panel between insulated column, so as to make that the second occlusion part is formed on vapor deposition through-hole.Compared with prior art, by the way that the opening size that through-hole is deposited to be designed as to the opening size for being less than isolation intercolumniation, so as to which the thickness for making the organic luminous layer positioned at organic luminous layer centre position is minimized, realize that thickness and the thickness close to insulated column position in centre position are relatively uniform, the uniformity of vapor deposition is improved, so as to improve the yield of product.
Description
Technical field
The present invention relates to a kind of display panel technology, particularly a kind of evaporation mask plate of display device.
Background technology
Organic light emitting diode device (OLED, Organic Light Emitting Diode) and traditional liquid crystal
Show that device is compared, there is lower power consumption, while also possess high brightness, high response speed and wide colour gamut, have become display field
Current mainstream device.
Different from liquid crystal display, OLED is selfluminous element, and the coloring mode of traditional OLED display pixel is
Red, green, blue threeway organic material are deposited on by way of vapor deposition on the corresponding location of pixels of substrate, in order to anti-
Only contact causes short circuit between mutual color, insulated column can be set to be isolated, need to use during the vapor deposition of organic material
A kind of vapor deposition mask plate (vapor deposition MASK), is deposited mask plate to open up vapor deposition through-hole on the position of respective pixel electricity, is in this
Ensure the effect of vapor deposition, the opening size that through-hole is deposited can be designed as to the opening size for being more than isolation intercolumniation, so as to ensure
Vapor deposition can be filled up completely on corresponding substrate position, but such vapor deposition mode exists, and since opening size is excessive, leads
The thickness among the organic luminous layer after being deposited on pixel position is caused to be more than the thickness close to insulated column, causes vapor deposition uneven
It is even, it is susceptible to the problem of product yield is low.
Invention content
In order to overcome the deficiencies of the prior art, the present invention provides a kind of vapor deposition with plate is buried, and improves the uniformity of vapor deposition, from
And improve the yield of product.
The present invention provides a kind of evaporation mask plate, including plate body, the plate body include a vapor deposition face and with vapor deposition
The opposite contact surface in face, array is placed with the vapor deposition through-hole for vapor deposition on the plate body, and vapor deposition through-hole is located on the plate body
Between this part plate body for the first occlusion part, the vapor deposition through-hole through vapor deposition face and contact surface, the vapor deposition through-hole
Opening size is less than the opening size between insulated column in organic LED panel, so as to make to be formed the on vapor deposition through-hole
Two occlusion parts.
Further, the hole wall of the vapor deposition through-hole is smooth surface.
Further, the opening size of a side opening that the vapor deposition through-hole is located at vapor deposition face is more than positioned at contact surface
The opening size of one side opening, Formation cross-section are the vapor deposition through-hole of inverted trapezoidal.
Further, the vapor deposition through-hole is stepped hole, and including the first hole and the second hole, first hole is set on vapor deposition
The side in face, the second hole are set on the side of contact surface, and the opening size in first hole is more than the opening size in the second hole.
Further, the hole wall of the vapor deposition face and vapor deposition through-hole is equipped with non-sticking lining.
Further, the material of the plate body is metal alloy.
Further, the metal alloy is any one in iron-nickel alloy, nickel cobalt (alloy) or ferrocobalt.
Further, the non-sticking lining is alumina ceramic membrane or titanium dioxide ceramic film.
Compared with prior art, the present invention by the way that the opening size that through-hole is deposited is designed as to be less than opening for isolation intercolumniation
Mouth size so as to which the thickness for making the organic luminous layer positioned at organic luminous layer centre position is minimized, realizes centre position
Thickness and the thickness close to insulated column position are relatively uniform, the uniformity of vapor deposition are improved, so as to improve the yield of product.
Description of the drawings
Fig. 1 is the first structure diagram of evaporation mask plate of the present invention；
Fig. 2 is second of structure diagram of evaporation mask plate of the present invention；
Fig. 3 is the third structure diagram of evaporation mask plate of the present invention；
Fig. 4 is the 4th kind of structure diagram of evaporation mask plate of the present invention；
Fig. 5 is the 5th kind of structure diagram of evaporation mask plate of the present invention；
Fig. 6 is the 6th kind of structure diagram of evaporation mask plate of the present invention；
Fig. 7 is the schematic diagram that evaporation mask plate of the present invention is placed on substrate insulated column.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.
As shown in Figure 1, the first evaporation mask plate for the present invention, including plate body 1, the shape of plate body 1 is quadrangle
Metallic plate, the plate body 1 include a vapor deposition face 6 and with the opposite contact surface 3 in vapor deposition face 6, herein contact surface 3 be and base
The one side (shown in Fig. 7) that the insulated column 7 of plate contacts, array is placed with the vapor deposition through-hole 2 for vapor deposition, vapor deposition on the plate body 1
Through-hole 2 is the organic luminous layer for oled panel to be deposited, therefore is opened according to the installation position of different three colors of red, green, blue
Hole is not specifically limited herein；It is the first occlusion part 4 to be located at this part plate body 1 between vapor deposition through-hole 2 on the plate body 1,
First occlusion part 4 for the part for not needing to be deposited to be covered, the vapor deposition through-hole 2 through vapor deposition face 6 with
And contact surface 3, the opening size of the vapor deposition through-hole 2 are less than the open-mouth ruler in organic LED panel between insulated column
Very little, so as to make to be formed the second occlusion part 5 on vapor deposition through-hole 2, the width of the second occlusion part 5 only needs to ensure to be less than organic light emission
Opening size in diode panel between insulated column, is not specifically limited herein.
Aforesaid way is used, so that the opening size of vapor deposition through-hole 2 becomes smaller, ensure that the centre of organic luminous layer
The thickness of position is minimized, and realizes the whole uniformity of organic luminescent device layer thickness, so as to improve the yield of product.
In the first evaporation mask plate, plate body 1 is metal alloy, specially iron-nickel alloy, nickel cobalt (alloy) or iron
Any one in cobalt alloy, however, the present invention is not limited thereto, such as aluminium alloy or stainless steel material.
In order to ensure evaporation effect, the hole wall of vapor deposition through-hole 2 is smooth surface, so as to which organic material sticks when preventing vapor deposition
It is attached on vapor deposition through-hole 2.
As shown in Fig. 2, second of evaporation mask plate for the present invention, including plate body 1, the shape of plate body 1 is quadrangle
Metallic plate, the plate body 1 include a vapor deposition face 6 and with the opposite contact surface 3 in vapor deposition face 6, herein contact surface 3 be and base
The one side (shown in Fig. 7) that the insulated column 7 of plate contacts, array is placed with the vapor deposition through-hole 2 for vapor deposition, vapor deposition on the plate body 1
Through-hole 2 is the organic luminous layer for oled panel to be deposited, therefore is opened according to the installation position of different three colors of red, green, blue
Hole is not specifically limited herein；The opening size of a side opening that the vapor deposition through-hole 2 is located at vapor deposition face 6, which is more than, is located at contact
The opening size of one side opening in face 3, Formation cross-section are the vapor deposition through-hole 2 of inverted trapezoidal；It is located at vapor deposition through-hole 2 on the plate body 1
Between this part plate body 1 for the first occlusion part 4, first occlusion part 4 will not be for will need to the part being deposited progress
It covers, the vapor deposition through-hole 2 runs through vapor deposition face 6 and contact surface 3, and the opening size of the both-side opening of the vapor deposition through-hole 2 is equal
Less than the opening size between insulated column in organic LED panel, so as to make that the second occlusion part is formed on vapor deposition through-hole 2
5。
In above-mentioned second of evaporation mask plate, the hole wall of vapor deposition through-hole 2 is inclined-plane and the hole wall of vapor deposition through-hole 2
For smooth surface, by the way that hole wall is set as inclined-plane and is set as smooth surface, so as to further improve evaporation effect,
Prevent the problem of organic material sticks during vapor deposition.
In second of evaporation mask plate, plate body 1 is metal alloy, specially iron-nickel alloy, nickel cobalt (alloy) or iron
Any one in cobalt alloy, however, the present invention is not limited thereto, such as aluminium alloy or stainless steel material.
As shown in figure 3, the third evaporation mask plate for the present invention, including plate body 1, the shape of plate body 1 is quadrangle
Metallic plate, the plate body 1 include a vapor deposition face 6 and with the opposite contact surface 3 in vapor deposition face 6, herein contact surface 3 be and base
The one side (shown in Fig. 7) that the insulated column 7 of plate contacts, array is placed with the vapor deposition through-hole 2 for vapor deposition, vapor deposition on the plate body 1
Through-hole 2 is the organic luminous layer for oled panel to be deposited, therefore is opened according to the installation position of different three colors of red, green, blue
Hole is not specifically limited herein；The vapor deposition through-hole 2 is stepped hole, specifically, described including the first hole 21 and the second hole 22
First hole 21 is set on the side in vapor deposition face 6, and the second hole 22 is set on the side of contact surface 3, and the aperture in first hole 21 is more than
The aperture in the second hole 22；This part plate body 1 being located on the plate body 1 between vapor deposition through-hole 2 is the first occlusion part 4, this first
For occlusion part 4 for the part for not needing to be deposited to be covered, the vapor deposition through-hole 2 runs through vapor deposition face 6 and contact surface
3, the opening size in 21 and second hole 22 of the first hole is respectively less than in organic LED panel the opening between insulated column
Size, so as to make that the second occlusion part 5 is formed on vapor deposition through-hole 2.
In the third above-mentioned evaporation mask plate, it is light that vapor deposition through-hole 2, which is stepped hole and the hole wall of through-hole 2 is deposited,
Sliding surface, so as to carry out the organic material of vapor deposition certain blocking, so as to further improve evaporation effect, prevents from being deposited
When organic material the problem of sticking and improve the uniformity of organic luminous layer integral thickness.
In second of evaporation mask plate, plate body 1 is metal alloy, specially iron-nickel alloy, nickel cobalt (alloy) or iron
Any one in cobalt alloy, however, the present invention is not limited thereto, such as aluminium alloy or stainless steel material.
As shown in figure 4, the structure diagram of the 4th kind of evaporation mask plate for the present invention, in the present embodiment, knot
Structure is on the basis of the first evaporation mask plate structure, is equipped with and does not glue on the hole wall of vapor deposition face 6 and vapor deposition through-hole 2
Coating 9, specifically, the thickness of non-sticking lining 9 is 0.1-0.5 μm；The non-sticking lining 9 is alumina ceramic membrane or titanium dioxide
Titanium ceramic membrane, however, the present invention is not limited thereto can also be aluminium oxide and the multi-layered ceramic material of titanium dioxide.
As shown in figure 5, the structure diagram of the 5th kind of evaporation mask plate for the present invention, in the present embodiment, knot
Structure is on the basis of second of evaporation mask plate structure, is equipped with and does not glue on the hole wall of vapor deposition face 6 and vapor deposition through-hole 2
Coating 9, specifically, the thickness of non-sticking lining 9 is 0.1-0.5 μm；The alumina ceramic membrane or titanium dioxide ceramic film, but
The present invention is not limited thereto, can also be the multi-layered ceramic material of aluminium oxide and titanium dioxide.
As shown in fig. 6, the structure diagram of the 6th kind of evaporation mask plate for the present invention, in the present embodiment, knot
Structure is on the basis of the third evaporation mask plate structure, is equipped with and does not glue on the hole wall of vapor deposition face 6 and vapor deposition through-hole 2
Coating 9, specifically, the thickness of non-sticking lining 9 is 0.1-0.5 μm；The alumina ceramic membrane or titanium dioxide ceramic film, but
The present invention is not limited thereto, can also be the multi-layered ceramic material of aluminium oxide and titanium dioxide.
As shown in fig. 7, when the organic material layer 8 of the evaporation mask plate progress substrate of the present invention is deposited, by plate
Body 1 is placed on the insulated column of substrate, makes contact surface 3 opposite with insulated column 7, at this time as can be seen that the second occlusion part 5 makes needs
Opening size between the insulated column 7 of the organic luminous layer of vapor deposition becomes smaller, logical so as to which the organic material after gasification be made to enter vapor deposition
The channel in hole 2 becomes smaller, and then reduces the thickness in the centre position of organic luminous layer 8, makes the integral thickness of organic luminous layer more
Uniformly, here it is worth noting that the organic luminous layer 8 in figure is only used as and illustrates, and organic light emitting diode device
The structure of panel is same as the prior art, and details are not described herein.
In the present invention, the shape that through-hole is deposited is adapted with the shape of pixel, generally rectangular cross-section, does not make to have herein
Body limits, and the present invention is subjectively changed to the size that through-hole is deposited, and the homogeneity question of vapor deposition is adjusted with this.
Although the present invention has shown and described with reference to specific embodiment, it should be appreciated by those skilled in the art that：
In the case where not departing from the spirit and scope of the present invention limited by claim and its equivalent, form can be carried out herein
With the various change in details.
Claims (8)
1. a kind of evaporation mask plate, it is characterised in that：Including plate body (1), the plate body (1) including one vapor deposition face (6) and
With vapor deposition face (6) opposite contact surface (3), array is placed with the vapor deposition through-hole (2) for vapor deposition on the plate body (1), described
It is the first occlusion part (4) to be located at this part plate body (1) between vapor deposition through-hole (2) on plate body (1), and the vapor deposition through-hole (2) is passed through
Vapor deposition face (6) and contact surface (3) are worn, the opening size of the vapor deposition through-hole (2) is less than organic LED panel interval
From the opening size between column, so as to make that the second occlusion part (5) is formed on vapor deposition through-hole (2).
2. evaporation mask plate according to claim 1, it is characterised in that：The hole wall of the vapor deposition through-hole (2) is light
Sliding surface.
3. evaporation mask plate according to claim 1 or 2, it is characterised in that：The vapor deposition through-hole (2) is positioned at vapor deposition face
(6) opening size of a side opening is more than the opening size of the side opening positioned at contact surface (3), and Formation cross-section is inverted trapezoidal
Vapor deposition through-hole (2).
4. evaporation mask plate according to claim 1 or 2, it is characterised in that：The vapor deposition through-hole (2) is stepped hole,
Including the first hole (21) and the second hole (22), first hole (21) is set on the side of vapor deposition face (6), and the second hole (22) are set on connecing
The side of contacting surface (3), the opening size of first hole (21) are more than the opening size of the second hole (22).
5. evaporation mask plate according to claim 1, it is characterised in that：The vapor deposition face (6) and vapor deposition through-hole (2)
Hole wall be equipped with non-sticking lining (9).
6. the evaporation mask plate according to right will go 1, it is characterised in that：The material of the plate body (1) is metal alloy.
7. evaporation mask plate according to claim 6, it is characterised in that：The metal alloy is iron-nickel alloy, nickel cobalt
Any one in alloy or ferrocobalt.
8. evaporation mask plate according to claim 5, it is characterised in that：The non-sticking lining (9) is aluminium oxide ceramics
Film or titanium dioxide ceramic film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711465247.0A CN108198956A (en) | 2017-12-28 | 2017-12-28 | Evaporation mask plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711465247.0A CN108198956A (en) | 2017-12-28 | 2017-12-28 | Evaporation mask plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108198956A true CN108198956A (en) | 2018-06-22 |
Family
ID=62585887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711465247.0A Pending CN108198956A (en) | 2017-12-28 | 2017-12-28 | Evaporation mask plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108198956A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113416925A (en) * | 2021-06-22 | 2021-09-21 | 合肥维信诺科技有限公司 | Mask plate, forming method and method for forming OLED cathode pattern |
| CN116162894A (en) * | 2023-02-28 | 2023-05-26 | 京东方科技集团股份有限公司 | Mask plate and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102978568A (en) * | 2012-12-25 | 2013-03-20 | 唐军 | OLED (organic light-emitting diode) evaporation cover and processing method thereof |
| CN104425219A (en) * | 2013-09-10 | 2015-03-18 | 三星显示有限公司 | Method of manufacturing metal mask and metal mask formed thereby |
| CN105449126A (en) * | 2015-12-22 | 2016-03-30 | 上海天马有机发光显示技术有限公司 | Evaporation mask plate and manufacturing method thereof |
| CN105714249A (en) * | 2016-04-19 | 2016-06-29 | 上海和辉光电有限公司 | Mask plate, evaporation device and evaporation method |
-
2017
- 2017-12-28 CN CN201711465247.0A patent/CN108198956A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102978568A (en) * | 2012-12-25 | 2013-03-20 | 唐军 | OLED (organic light-emitting diode) evaporation cover and processing method thereof |
| CN104425219A (en) * | 2013-09-10 | 2015-03-18 | 三星显示有限公司 | Method of manufacturing metal mask and metal mask formed thereby |
| CN105449126A (en) * | 2015-12-22 | 2016-03-30 | 上海天马有机发光显示技术有限公司 | Evaporation mask plate and manufacturing method thereof |
| CN105714249A (en) * | 2016-04-19 | 2016-06-29 | 上海和辉光电有限公司 | Mask plate, evaporation device and evaporation method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113416925A (en) * | 2021-06-22 | 2021-09-21 | 合肥维信诺科技有限公司 | Mask plate, forming method and method for forming OLED cathode pattern |
| CN116162894A (en) * | 2023-02-28 | 2023-05-26 | 京东方科技集团股份有限公司 | Mask plate and manufacturing method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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Application publication date: 20180622 |