CN108198870A - A kind of optical detector - Google Patents
A kind of optical detector Download PDFInfo
- Publication number
- CN108198870A CN108198870A CN201810019532.8A CN201810019532A CN108198870A CN 108198870 A CN108198870 A CN 108198870A CN 201810019532 A CN201810019532 A CN 201810019532A CN 108198870 A CN108198870 A CN 108198870A
- Authority
- CN
- China
- Prior art keywords
- light emitting
- plane
- light
- controller
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 40
- 239000011347 resin Substances 0.000 claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 238000001914 filtration Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 230000004913 activation Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 230000011514 reflex Effects 0.000 abstract description 2
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/09—Devices sensitive to infrared, visible or ultraviolet radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
- H01L31/02165—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors using interference filters, e.g. multilayer dielectric filters
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
The present invention provides a kind of optical detectors, and controller is encapsulated together with light emitting chip and light-receiving chip, and carry out mutual Isolated Shield using metallic plate, avoid additional the drawbacks of connecting controller；The reflex of first surface can enhance light emitting and light-receiving, can effectively capture weaker signal feedback sources；The coarse property of second surface, can enhance the adhesiveness with resin layer, avoid the problem that stripping, and whole plastic packaging is simple, cost-effective.
Description
Technical field
The present invention relates to detector fields, and in particular to a kind of optical detector be convenient for encapsulation and prevent crosstalk.
Background technology
Traditional optical detector generally comprises light emitting chip and light-receiving chip is mutually encapsulated into a plastic-sealed body, but
It is to need additional electrical connection controller that realization is gone to control respectively, if carrying out directly control chip and light emitting chip and light
It receives chip to be mutually encapsulated into together, can lead to its mutual crosstalk, also, (i.e. light-receiving chip connects for the signal of light feedback
The signal of receipts) it is general it is weaker be not easy to capture, need powerful light emitting chip that could solve the problems, such as this, this is detrimental to radiate
It is and energy-efficient.
Invention content
Based on solving the above problems, the present invention provides a kind of optical detector, including：
The metallic plate of " W " shape, the light emitting chamber and optical receiver cavity of the metallic plate including opening upwards and Open Side Down
Controller bearing cavity, the metallic plate has first surface and a second surface opposite with the first surface, described the
The part on one surface is located at the light emitting chamber and in the optical receiver cavity, the part of the second surface is located at the controller
In bearing cavity；Wherein, the first surface is smooth surface for light reflection, and the second surface is rough surface；
First resin layer, first resin layer be laminated structure, have the first plane and with first plane
The second opposite plane, first planar section are located in the light emitting chamber, optical receiver cavity and controller bearing cavity；Institute
The first plane for stating the first resin layer is equipped with first line layer, and the second plane is equipped with the second line layer, the first line
The part of layer is electrically connected to second line layer by running through the through-hole of first resin layer；
It is described first flat to be set to the light emitting intracavitary for light emitting chip and light-receiving chip, the light emitting chip
On face and the first line layer is electrically connected to, the light-receiving chip is set to first plane in the optical receiver cavity
It goes up and is electrically connected to the first line layer；
Light emitting controller and light-receiving controller may be contained within first plane in the controller bearing cavity
Above and the first line layer is respectively electrically connected to, the light emitting controller passes through first line layer and controls the light emitting core
Piece, the light-receiving controller control the light-receiving chip by first line layer；
Second resin layer, second resin layer are located in first plane, and at least fully wrapped around second table
The part do not wrapped up by first resin layer in face.
According to an embodiment of the invention, the bore of the optical receiver cavity is more than the bore of the light emitting chamber.
According to an embodiment of the invention, first resin layer include can laser activation resin material.
According to an embodiment of the invention, the metallic plate between the light emitting chamber and controller bearing cavity is flat positioned at first
Metallic plate between the position in face and the optical receiver cavity and controller bearing cavity is equipped with positioned at the position of the first plane
For first line layer by metal aperture.
According to an embodiment of the invention, second resin layer is transparent resin material, is also filled up in the light emitting
In chamber and the optical receiver cavity.
According to an embodiment of the invention, the of the opening of the opening and optical receiver cavity of the light emitting chamber
The first wave filtering layer and the second wave filtering layer are respectively arranged on two resin layers.
According to an embodiment of the invention, light emitting coating is coated on the first surface.
According to an embodiment of the invention, the first surface is the light reflective surface by polishing.
Advantages of the present invention is as follows：
(1) controller is encapsulated together with light emitting chip and light-receiving chip, and using metallic plate carry out it is mutual every
Off screen is covered, and avoids additional the drawbacks of connecting controller；
(2) reflex of first surface can enhance light emitting and light-receiving, can effectively capture weaker letter
Number feedback sources；
(3) the coarse property of second surface, can enhance the adhesiveness with resin layer, avoid the problem that stripping, and whole
Plastic packaging is simple, cost-effective.
Description of the drawings
Fig. 1 is the sectional view of the optical detector of the present invention；
Fig. 2 is the vertical view of the optical detector of the present invention.
Specific embodiment
Referring to Fig. 1 and 2, the first optical detector of the invention, including：
The metallic plate 1 of " W " shape, light emitting chamber 8 and optical receiver cavity 9 and opening of the metallic plate 1 including opening upwards
Downward controller bearing cavity 18, the metallic plate 1 have first surface 10 and opposite with the first surface 10 second
Surface 11, the part of the first surface 10 are located in the light emitting chamber 8 and the optical receiver cavity 9, the second surface 11
Part be located in the controller bearing cavity 18；Wherein, the first surface 10 is smooth surface for light reflection, and described
Second surface 11 is rough surface；
First resin layer 2, first resin layer 2 are laminated structure, have the first plane and with it is described first flat
The second opposite plane of face, first planar section are located at the light emitting chamber 8, optical receiver cavity 9 and controller bearing cavity
In 18；First plane of first resin layer 2 is equipped with first line layer 14, and the second plane is equipped with the second line layer 15,
The part of the first line layer 14 is electrically connected to second line layer by running through the through-hole 16 of first resin layer 2
15；
Light emitting chip 4 and light-receiving chip 5, the light emitting chip 4 are set to described in the light emitting chamber 8
In one plane and the first line layer 14 is electrically connected to, the light-receiving chip 5 is set to described in the optical receiver cavity 9
In first plane and it is electrically connected to the first line layer 14；
Light emitting controller 6 and light-receiving controller 7 may be contained within described first in the controller bearing cavity 18
In plane and the first line layer 14 is respectively electrically connected to, the light emitting controller 6 controls institute by first line layer 14
Light emitting chip 4 is stated, the light-receiving controller 7 controls the light-receiving chip 5 by first line layer 14；
Second resin layer 3, second resin layer 3 are located in first plane, and at least fully wrapped around described second
The part do not wrapped up by first resin layer 2 on surface 11.
Wherein, the bore of the optical receiver cavity 9 is more than the bore of the light emitting chamber 8, and first resin layer 2 includes can
Laser activation resin material, metallic plate 1 between the light emitting chamber 8 and controller bearing cavity 18 positioned at the position of the first plane
Put and metallic plate 1 between the optical receiver cavity 9 and controller bearing cavity 18 be all provided with positioned at the position of the first plane it is useful
In first line layer 14 by metal aperture 17.
According to an embodiment of the invention, second resin layer 3 is transparent resin material, is also filled up in the light emitting
In chamber 8 and the optical receiver cavity 9.In the second tree of the opening of the opening and optical receiver cavity 9 of the light emitting chamber 8
The first wave filtering layer 12 and the second wave filtering layer 13 are respectively arranged in lipid layer 3.
In order to enhance reflection, light emitting coating (not shown) is coated on the first surface 10, alternatively, first table
Face 10 is the light reflective surface by polishing.
Finally it should be noted that：Obviously, the above embodiment is merely an example for clearly illustrating the present invention, and simultaneously
The non-restriction to embodiment.For those of ordinary skill in the art, it can also do on the basis of the above description
Go out other various forms of variations or variation.There is no necessity and possibility to exhaust all the enbodiments.And thus drawn
The obvious changes or variations that Shen goes out are still in the protection scope of this invention.
Claims (8)
1. a kind of optical detector, including：
The metallic plate of " W " shape, the light emitting chamber and optical receiver cavity of the metallic plate including opening upwards and the control that Open Side Down
Device bearing cavity processed, the metallic plate have first surface and the second surface opposite with the first surface, first table
The part in face is located at the light emitting chamber and in the optical receiver cavity, the part of the second surface is located at controller carrying
Intracavitary；Wherein, the first surface is smooth surface for light reflection, and the second surface is rough surface；
First resin layer, first resin layer are laminated structure, have the first plane and opposite with first plane
The second plane, first planar section be located at the light emitting chamber, optical receiver cavity and controller bearing cavity in；Described
First plane of one resin layer is equipped with first line layer, and the second plane is equipped with the second line layer, the first line layer
Part is electrically connected to second line layer by running through the through-hole of first resin layer；
Light emitting chip and light-receiving chip, the light emitting chip are set in first plane of the light emitting intracavitary
And be electrically connected to the first line layer, the light-receiving chip be set in first plane in the optical receiver cavity and
It is electrically connected to the first line layer；
Light emitting controller and light-receiving controller, may be contained in first plane in the controller bearing cavity and
The first line layer is respectively electrically connected to, the light emitting controller controls the light emitting chip by first line layer,
The light-receiving controller controls the light-receiving chip by first line layer；
Second resin layer, second resin layer are located in first plane, and at least fully wrapped around second surface
The part do not wrapped up by first resin layer.
2. optical detector according to claim 1, it is characterised in that：The bore of the optical receiver cavity is more than the light emitting
The bore of chamber.
3. optical detector according to claim 1 or 2, it is characterised in that：First resin layer includes can laser activation
Resin material.
4. according to claim 1-3 any one of them optical detectors, it is characterised in that：The light emitting chamber is carried with controller
The metallic plate between the position of the first plane and the optical receiver cavity and controller bearing cavity of metallic plate between chamber
Positioned at the position of the first plane be equipped with for first line layer by metal aperture.
5. according to claim 1-4 any one of them optical detectors, it is characterised in that：Second resin layer is transparent resin
Material is also filled up in the light emitting chamber and the optical receiver cavity.
6. optical detector according to claim 5, it is characterised in that：Opening and the light in the light emitting chamber
The first wave filtering layer and the second wave filtering layer are respectively arranged on second resin layer of the opening of receiving cavity.
7. optical detector according to claim 1, it is characterised in that：Light emitting coating is coated on the first surface.
8. optical detector according to claim 1, it is characterised in that：The first surface is the light reflection table by polishing
Face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810019532.8A CN108198870B (en) | 2018-01-09 | 2018-01-09 | A kind of optical detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810019532.8A CN108198870B (en) | 2018-01-09 | 2018-01-09 | A kind of optical detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108198870A true CN108198870A (en) | 2018-06-22 |
| CN108198870B CN108198870B (en) | 2019-10-22 |
Family
ID=62588904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810019532.8A Active CN108198870B (en) | 2018-01-09 | 2018-01-09 | A kind of optical detector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108198870B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005241340A (en) * | 2004-02-25 | 2005-09-08 | Sharp Corp | Multi-range finding device |
| CN101187670A (en) * | 2006-11-24 | 2008-05-28 | 安华高科技Ecbuip(新加坡)私人有限公司 | Optical encoder with pollutant detection function |
| CN101777602A (en) * | 2008-11-04 | 2010-07-14 | 罗姆股份有限公司 | Reflection-type photointerrupter |
| US7842957B2 (en) * | 2007-03-08 | 2010-11-30 | Avago Technologies Ecbu Ip (Singapore) Pte, Ltd. | Optical transceiver with reduced height |
| US8502151B2 (en) * | 2010-01-31 | 2013-08-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optical proximity sensor package with lead frame |
| KR101336781B1 (en) * | 2012-11-09 | 2013-12-04 | (주)신오전자 | Optical proximity sensor with ambient light sensor and method of making the same |
| CN104752416A (en) * | 2013-12-27 | 2015-07-01 | 菱生精密工业股份有限公司 | Micro optical packaging structure with filter layer and manufacturing method thereof |
| US9165913B2 (en) * | 2008-05-26 | 2015-10-20 | Osram Opto Semiconductors Gmbh | Semiconductor component, reflected-light barrier and method for producing a housing therefor |
| CN105895595A (en) * | 2015-02-13 | 2016-08-24 | 台医光电科技股份有限公司 | Optical sensing module group, optical sensing accessory and optical sensing device |
-
2018
- 2018-01-09 CN CN201810019532.8A patent/CN108198870B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005241340A (en) * | 2004-02-25 | 2005-09-08 | Sharp Corp | Multi-range finding device |
| CN101187670A (en) * | 2006-11-24 | 2008-05-28 | 安华高科技Ecbuip(新加坡)私人有限公司 | Optical encoder with pollutant detection function |
| US7842957B2 (en) * | 2007-03-08 | 2010-11-30 | Avago Technologies Ecbu Ip (Singapore) Pte, Ltd. | Optical transceiver with reduced height |
| US9165913B2 (en) * | 2008-05-26 | 2015-10-20 | Osram Opto Semiconductors Gmbh | Semiconductor component, reflected-light barrier and method for producing a housing therefor |
| CN101777602A (en) * | 2008-11-04 | 2010-07-14 | 罗姆股份有限公司 | Reflection-type photointerrupter |
| US8502151B2 (en) * | 2010-01-31 | 2013-08-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optical proximity sensor package with lead frame |
| KR101336781B1 (en) * | 2012-11-09 | 2013-12-04 | (주)신오전자 | Optical proximity sensor with ambient light sensor and method of making the same |
| CN104752416A (en) * | 2013-12-27 | 2015-07-01 | 菱生精密工业股份有限公司 | Micro optical packaging structure with filter layer and manufacturing method thereof |
| CN105895595A (en) * | 2015-02-13 | 2016-08-24 | 台医光电科技股份有限公司 | Optical sensing module group, optical sensing accessory and optical sensing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108198870B (en) | 2019-10-22 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190926 Address after: 101149 Beili 142 Building, Tongzhou District, Beijing 7247 Applicant after: Beijing Yongan Multispectral Detection Technology Co., Ltd. Address before: 262500 Shandong city of Weifang province Qingzhou City Road No. 8979 Weifang yunmenshan engineering Career Academy Applicant before: Peng Su Zhen |
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| TA01 | Transfer of patent application right |