CN108198868B - EVA (ethylene-vinyl acetate) tapping process for MWT (Metal wrap through) conductive core board - Google Patents
EVA (ethylene-vinyl acetate) tapping process for MWT (Metal wrap through) conductive core board Download PDFInfo
- Publication number
- CN108198868B CN108198868B CN201711399513.4A CN201711399513A CN108198868B CN 108198868 B CN108198868 B CN 108198868B CN 201711399513 A CN201711399513 A CN 201711399513A CN 108198868 B CN108198868 B CN 108198868B
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- Prior art keywords
- copper foil
- eva
- electrode point
- opening
- short edge
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- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 title claims abstract description 52
- 239000005038 ethylene vinyl acetate Substances 0.000 title claims abstract description 50
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000002184 metal Substances 0.000 title claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 5
- 238000010079 rubber tapping Methods 0.000 title claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 84
- 239000011889 copper foil Substances 0.000 claims abstract description 84
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 40
- 229910052742 iron Inorganic materials 0.000 claims abstract description 20
- 238000005476 soldering Methods 0.000 claims abstract description 17
- 239000002390 adhesive tape Substances 0.000 claims abstract description 15
- 239000004744 fabric Substances 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 238000007790 scraping Methods 0.000 claims abstract description 4
- 230000007306 turnover Effects 0.000 claims description 3
- 239000013072 incoming material Substances 0.000 claims description 2
- 238000009966 trimming Methods 0.000 claims description 2
- 238000000605 extraction Methods 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides an EVA (ethylene vinyl acetate) hole opening process for an MWT (metal wrap through) conductive core board, which is characterized by comprising the steps of sticking a high-temperature adhesive tape to a range near an electrode point, scraping bubbles between the adhesive tape and a copper foil, lifting and overturning the copper foil from an incoming work table by two hands to enable the copper foil to be placed on a hole opening work table, enabling the back of the copper foil to face upwards, lifting the copper foil to pad the high-temperature cloth below the electrode point of the copper foil for separating two copper foils, enabling the electrode point of the copper foil to be opened, overturning one side of the short edge of the copper foil to the other side, then padding the high-temperature cloth below the electrode point of the next copper foil, circulating in sequence, pressing 3 ~ 5S at a middle electrode point by using a soldering iron head with an electrode point overall outline tool, ensuring that two holes in the middle of the soldering iron head are opposite to two extraction points on the copper foil, slightly peeling the EVA and the copper foil at an opening position, and tearing the EVA from a copper foil joint to a broken part when the EVA is required.
Description
Technical Field
The invention relates to a photovoltaic module, in particular to an EVA (ethylene vinyl acetate) tapping process.
Background
The MWT battery pack is a leading technology in the field of new energy photovoltaic, a welding strip is omitted, the illuminated area of a battery piece is increased, and the generating efficiency of a unit area is effectively improved. The novel MWT battery board assembly mainly comprises a conductive core board, battery pieces, glass, related accessories and the like, wherein the conductive core board is composed of a solar back board, EVA (ethylene vinyl acetate) and copper foil, the EVA and the copper foil are bonded together through pretreatment in the previous process, and the quality of the conductive core board directly influences the related performance of the whole assembly. And holes are formed at corresponding positions of the EVA and the back plate because an external diode is required to be connected at the electrode point to lead out current. When the conductive core plate is produced, copper foil scraps are not left, the flatness of the copper foil is guaranteed, the copper foil is low in flatness, and hidden cracks and even breakage of battery pieces are easily caused in the back lamination process. This phenomenon is more prominent at the point where the electrode point of the copper foil is opened. When holes are formed in a traditional mode, the holes are directly formed in the stacked copper foil in a mode that a solid electric iron is used for applying pressure to melt EVA and tearing the EVA by hands, and the copper foil is easily wrinkled. In addition, in order to be easily torn off, the section of the torn-off EVA needs to have certain strength and toughness, so that the temperature and the time of the electric soldering iron need to be accurate enough, otherwise, the EVA cannot be lifted up at all after being completely melted for too long time after being heated for too high temperature, and the edge is extremely uneven due to the phenomenon of short adhesion at low temperature and time. This is great to inexperienced person's the degree of difficulty, and it is uneven to be heated uneven and irregular mode of operation very easily to make the trompil edge, has obvious granular sensation even, causes serious quality hidden danger to the subassembly.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to provide an EVA (ethylene-vinyl acetate) punching process for an MWT conductive core board aiming at the defects of the prior art, so that the hidden crack of a cell piece is effectively reduced, and the production efficiency is further improved.
The technical scheme is as follows: the invention provides an EVA (ethylene-vinyl acetate) tapping process for an MWT (Metal wrap through) conductive core board, which comprises the following steps of:
(1) Pasting a high-temperature adhesive tape: placing the copper foil with the cut wire on a feeding worktable, sticking a high-temperature adhesive tape to a range near an electrode point, and scraping bubbles between the adhesive tape and the copper foil; after one short edge close to the copper foil electrode point is pasted, the short edge of the copper foil is lifted to turn over towards the direction of the short edge of the other side, the next copper foil electrode point is exposed, and after the pasting, all the short edges are turned back to recover;
(2) Feeding: two workers respectively hold one corner of the short edge by hands to lift the copper foil and turn the copper foil to be placed on the hole-opening workbench from the incoming material workbench, so that the back of the copper foil faces upwards;
(3) opening a hole:
Firstly, an operator lifts the copper foil to pad high-temperature cloth below the electrode points of the copper foil for separating two copper foils on one side of the short edge of the copper foil, the electrode points of the copper foil are opened, the side of the short edge of the copper foil is turned over to the other side, and then the high-temperature cloth is padded below the next electrode point of the copper foil and is circulated in sequence;
Pressing 3 ~ 5S at the middle electrode point by using a soldering iron head with an electrode point overall outline tool to ensure that two holes in the middle of the soldering iron head are opposite to two leading-out points on the copper foil;
Thirdly, slightly stripping the EVA and the copper foil at the opening position by using a pair of tweezers, and tearing the EVA from the contact position with the copper foil to the disconnection position when the EVA is stripped;
(4) Blanking: after all the holes are opened, two workers respectively hold one corner of the short edge of the copper foil to lift the copper foil to a blanking workbench.
further, the length and width of the high-temperature adhesive tape are 70mm multiplied by 20 mm.
further, the number of the copper foil lifted in one time in the step (2) is not more than 5.
further, the electric soldering iron is used after the temperature of the electric soldering iron is stabilized at 200 ℃.
And step three, after stripping is finished, confirming whether EVA residues are not left in the EVA opening, whether the opening outline is continuous and flat or not, and trimming the opening by using scissors in order if the opening has knots and tearing phenomena.
Has the advantages that: the invention has the advantages that the efficiency is improved greatly by adopting a mode of firstly integrally turning over and then perforating, the tool of the electric iron abandons the mode of melting all the EVA to be torn off before, only the edge part of the EVA to be torn off is melted, the hollow part of the electric iron is not contacted with the EVA, the toughness and the strength of the torn-off EVA are ensured, the EVA can be torn off instantly by using tweezers conveniently, the efficiency is greatly improved, the edge is neat, and the problem of uneven perforating of the EVA is effectively reduced or even avoided.
Drawings
FIG. 1 is a schematic view of a high temperature tape range near an electrode point;
FIG. 2 is a schematic view of the position of the opening of the electrode point;
Fig. 3 is a schematic outline diagram of an electric soldering iron tool.
Detailed Description
the technical solution of the present invention is described in detail below, but the scope of the present invention is not limited to the embodiments.
the EVA (ethylene-vinyl acetate) tapping process flow of the MWT conductive core board is as follows:
(1) Pasting a high-temperature adhesive tape: placing the copper foil with the cut wire on a feeding worktable, pasting high-temperature adhesive tapes with the length and width of 70mm multiplied by 20mm to the labeling range near the electrode points, as the marks of a square box 1 in the figure 1, and scraping bubbles between the adhesive tapes and the copper foil; the personnel sit in the minor face one side that is close to the copper foil electrode point, after pasting one, lift the copper foil minor face and overturn to the opposite side minor face direction, expose next copper foil electrode point department can, need to pay attention to the action should be too fast too urgent in order to avoid the fold, after pasting, all overturn and return and recover.
(2) Feeding: two workers respectively hold one corner of the short side by two hands to lift up no more than 5 copper foils and turn over the copper foils to be buckled on the hole-opening workbench, so that the back surfaces of the copper foils (electrode points) are upward; the person who has punched the hole is also unchanged on the short side. The process is that the copper foil is integrally turned to another workbench, and is different from partial turning on the feeding workbench when the high-temperature adhesive tape is pasted.
(3) opening a hole:
firstly, when the copper foil is placed on a hole-opening workbench, the back of the copper foil is upward, the copper foil is lifted to pad high-temperature cloth below the electrode points of the copper foil for separating two copper foils, the electrode points of the copper foil are opened, one side of the short edge of the copper foil is turned over to the other side, then the high-temperature cloth is padded below the next electrode point of the copper foil, and the process is circulated in sequence (the process is the same as the process of sticking adhesive tapes).
Secondly, setting the temperature of the electric soldering iron to be 200 ℃, after the temperature of the electric soldering iron is stable, lightly pressing 3 ~ 5S at the middle electrode point by using a soldering iron head with a tool shown in figure 3, ensuring that two holes in the middle of the soldering iron head are opposite to two leading-out points on the copper foil as shown in figure 2, and then lifting the electric soldering iron along the vertical direction to be placed on a frame.
And thirdly, slightly stripping the EVA (ethylene-vinyl acetate copolymer) at the opening position from the conductive foil by using a pair of tweezers, and tearing the EVA from the contact part with the copper foil to the disconnection part when the EVA is stripped. After stripping is finished, whether EVA residues are left in the EVA opening or not and whether the opening contour is continuous and flat or not is confirmed, if the opening contour is continuous and flat, knots and tearing phenomena exist at the opening, and if the openings exist, the openings are trimmed tidily by using scissors.
(4) blanking: after all the holes are opened, two persons respectively hold one corner of the short edge of the copper foil to lift the copper foil to a blanking workbench.
Claims (5)
1. An EVA (ethylene-vinyl acetate) tapping process for an MWT (Metal wrap through) conductive core board is characterized in that: the method comprises the following steps:
(1) Pasting a high-temperature adhesive tape: placing the copper foil with the cut wire on a feeding worktable, sticking a high-temperature adhesive tape to a range near an electrode point, and scraping bubbles between the adhesive tape and the copper foil; after one short edge close to the copper foil electrode point is pasted, the short edge of the copper foil is lifted to turn over towards the direction of the short edge of the other side, the next copper foil electrode point is exposed, and after the pasting, all the short edges are turned back to recover;
(2) Feeding: two workers respectively hold one corner of the short edge by hands to lift the copper foil and turn the copper foil to be placed on the hole-opening workbench from the incoming material workbench, so that the back of the copper foil faces upwards;
(3) Opening a hole:
Firstly, the operator lifts the copper foil to pad high-temperature cloth below the electrode points of the copper foil to separate two copper foils on one side of the short edge of the copper foil, turns the short edge of the copper foil to the other side, pads the high-temperature cloth below the next electrode point of the copper foil, and circulates in sequence;
Pressing 3 ~ 5s at the middle electrode point by using a soldering iron head with an electrode point overall outline tool to ensure that two holes in the middle of the soldering iron head are opposite to two leading-out points on the copper foil;
slightly peeling off the EVA at the opening position from the copper foil by using a pair of tweezers, and tearing off the EVA from the contact position with the copper foil to the disconnection position when the EVA is required to be peeled off, so that the opening of the electrode point of the copper foil is finished;
(4) blanking: after all the holes are opened, two workers respectively hold one corner of the short edge of the copper foil to lift the copper foil to a blanking workbench.
2. the EVA opening process of claim 1, wherein: the length and the width of the high-temperature adhesive tape are respectively 70mm and 20 mm.
3. the EVA opening process of claim 1, wherein: and (3) the number of the copper foil lifted in one time in the step (2) is not more than 5.
4. The EVA opening process of claim 1, wherein: and step two, the electric soldering iron is used after the temperature of the electric soldering iron is stabilized at 200 ℃.
5. the EVA opening process of claim 1, wherein: and step three, after stripping is finished, confirming whether EVA residues are not left in the EVA opening and whether the opening outline is continuous and flat, and trimming the opening by using scissors to be tidy if the opening has knots and tearing phenomena.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711399513.4A CN108198868B (en) | 2017-12-22 | 2017-12-22 | EVA (ethylene-vinyl acetate) tapping process for MWT (Metal wrap through) conductive core board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711399513.4A CN108198868B (en) | 2017-12-22 | 2017-12-22 | EVA (ethylene-vinyl acetate) tapping process for MWT (Metal wrap through) conductive core board |
Publications (2)
| Publication Number | Publication Date |
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| CN108198868A CN108198868A (en) | 2018-06-22 |
| CN108198868B true CN108198868B (en) | 2019-12-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711399513.4A Active CN108198868B (en) | 2017-12-22 | 2017-12-22 | EVA (ethylene-vinyl acetate) tapping process for MWT (Metal wrap through) conductive core board |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109980024B (en) * | 2018-12-29 | 2021-06-25 | 江苏日托光伏科技股份有限公司 | Technology for improving open hole hidden cracking of MWT photovoltaic module |
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| CN104538461A (en) * | 2015-01-16 | 2015-04-22 | 浙江晶科能源有限公司 | MWT solar energy battery piece |
| CN206650096U (en) * | 2017-03-13 | 2017-11-17 | 南京日托光伏科技股份有限公司 | A kind of MWT back-contact photovoltaic module adhesive-spill-preventing frock |
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2017
- 2017-12-22 CN CN201711399513.4A patent/CN108198868B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102610666A (en) * | 2011-01-20 | 2012-07-25 | 无锡尚德太阳能电力有限公司 | MWT (metal wrap through) back-contact solar cell, preparation method and module thereof |
| CN102510584A (en) * | 2011-09-14 | 2012-06-20 | 中国航空工业第六一八研究所 | Manufacturing method of bonded heating sheets |
| CN202855789U (en) * | 2012-08-09 | 2013-04-03 | 连云港神舟新能源有限公司 | Lamination template for crystalline silica solar cell module |
| CN102810604A (en) * | 2012-09-13 | 2012-12-05 | 英利能源（中国）有限公司 | Manufacturing method of back contact battery photovoltaic module |
| CN103258888A (en) * | 2013-05-22 | 2013-08-21 | 中节能太阳能科技（镇江）有限公司 | WMT solar cell module and preparation method thereof |
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| CN108198868A (en) | 2018-06-22 |
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Address after: 214028 Xishi Road, Xinwu District, Wuxi City, Jiangsu Province Applicant after: Jiangsu Rituo Photovoltaic Technology Co., Ltd. Address before: 211800 No. 29 Buyue Road, Pukou Economic Development Zone, Nanjing City, Jiangsu Province Applicant before: Nanjing day care PV Polytron Technologies Inc |
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