CN108196424A - A kind of mask-making technology of solid photopolymer plate - Google Patents
A kind of mask-making technology of solid photopolymer plate Download PDFInfo
- Publication number
- CN108196424A CN108196424A CN201711461376.2A CN201711461376A CN108196424A CN 108196424 A CN108196424 A CN 108196424A CN 201711461376 A CN201711461376 A CN 201711461376A CN 108196424 A CN108196424 A CN 108196424A
- Authority
- CN
- China
- Prior art keywords
- photopolymer plate
- solid photopolymer
- exposure
- mask
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
Abstract
The invention discloses a kind of mask-making technology of solid photopolymer plate, including being coated with, exposing, rinsing, drying, post-processing, post-exposure, heat cure handle seven steps.The version base of solid photopolymer plate is polyester film chip base, and the thickness of photosensitive resin layer is 0.85 1mm, and the layer protecting film for being covered in photosensitive resin layer surface is polyester film, and the thickness of protective film is 0.1 0.2mm, and thermosetting treatment time is 2 2.5min.Preparation process of the present invention is simple, can give full play to the superiority such as solid photopolymer plate thickness evenness is good, tolerance is big, shrinkage is small, press resistance rate is high.The present invention carries out heat cure processing to solid photopolymer plate so that polyvinyl alcohol resin is dehydrated, and improves the hardness of plank.
Description
Technical field
The present invention relates to printing technology, specifically, being to be related to a kind of mask-making technology of solid photopolymer plate.
Background technology
With the continuous development of printing technology, people to printing product have higher requirement, required on color it is bright-coloured,
On level, the shade of reflection planes is needed not only to, and needs relief level, letterpress can increase product
Add relief level.Light-sensitive resin relief printing plate is using photoresist as material, by the photo-polymerization type for exposing, rinsing preparation
Relief printing plate, it is combined with phototypesetting, computer composition technology, has not only improved plate-making speed, but also thoroughly discarded metal
Printing plate makes " cold row " more perfect, and new way has been started for letterpress.At present, some manufacturers are in solid photopolymer plate
It is operated in preparation process inappropriate, it is impossible to give full play to the superiority of solid photopolymer plate.
Therefore, in the prior art, some manufacturers operate inappropriate in solid photopolymer plate preparation process, it is impossible to
The problems such as giving full play to the superiority of solid photopolymer plate designs a kind of mask-making technology of solid photopolymer plate, is current
The technical issues that need to address.
Invention content
Goal of the invention：It is in view of the drawbacks of the prior art and insufficient, it solves there are some manufacturers in solid photopolymer plate
It is operated in preparation process inappropriate, it is impossible to which the problems such as giving full play to the superiority of solid photopolymer plate, applicant is by multiple
Practice improves, and devises a kind of mask-making technology of solid photopolymer plate.
Technical solution：In order to achieve the above-mentioned object of the invention, a kind of mask-making technology of solid photopolymer plate, including following several
A step：
A) it is coated with：In version base, polyvinyl alcohol photosensitive resin is coated with, forms photosensitive resin layer；Then in photosensitive resin
Layer protecting film is set on layer；
B) it exposes：On the basis of step a), before exposure, the protective film of photosensitive resin is taken off, applies last layer talcum
Powder exposes after then the emulsion side of positive Yin Shi pieces is in close contact with solid photopolymer plate again on the printer vacuumized
Light, time for exposure 8-10min, using the abundant high-pressure mercury-vapor lamp of ultraviolet light as exposure light source；
C) it rinses：On the basis of step b), the solid photopolymer plate after exposure is put into washer, utilizes 45-
50 DEG C of warm water carries out development flushing, and hydraulic pressure general control is in 0.2-0.3Mpa, and time control is in 15-20min；
D) it dries：On the basis of step c), by the solid photopolymer plate rinsed be put into infrared baking case into
Row drying, drying box temperature are controlled in the range of 85-90 DEG C, drying time 15-20min；
E) it post-processes：On the basis of step d), it will be remained on solid photopolymer plate surface with clean organic solvent
Monomer wipe, 5min is dried after wiping clean again；
F) post-exposure：On the basis of step e), solid photopolymer plate is subjected to re-expose, time for exposure 5-
6min；
G) heat cure is handled：On the basis of step f), by the solid photopolymer plate of post-exposure, 120-125 DEG C is put into
Drying box in, carry out heat cure processing.
Preferably, the version base is polyester film chip base.
Preferably, the thickness of the photosensitive resin layer is 0.85-1mm.
Preferably, the protective film is polyester film, the thickness of the protective film is 0.1-0.2mm.
Preferably, the thermosetting treatment time is 2-2.5min.
Advantageous effect：Compared with prior art, the present invention advantage is：
1st, preparation process of the present invention is simple, can give full play to that solid photopolymer plate thickness evenness is good, tolerance is big, receives
The superiority such as contracting amount is small, press resistance rate is high.
2nd, the present invention carries out heat cure processing to solid photopolymer plate so that polyvinyl alcohol resin is dehydrated, and improves plank
Hardness.
Specific embodiment
Below by a most preferred embodiment, the technical program is described in detail, but protection scope of the present invention
It is not limited to the embodiment.
A kind of mask-making technology of solid photopolymer plate, including following steps：
A) it is coated with：In version base, polyvinyl alcohol photosensitive resin is coated with, forms photosensitive resin layer；Then in photosensitive resin
Layer protecting film is set on layer；
B) it exposes：On the basis of step a), before exposure, the protective film of photosensitive resin is taken off, applies last layer talcum
Powder exposes after then the emulsion side of positive Yin Shi pieces is in close contact with solid photopolymer plate again on the printer vacuumized
Light, time for exposure 8-10min, using the abundant high-pressure mercury-vapor lamp of ultraviolet light as exposure light source；
C) it rinses：On the basis of step b), the solid photopolymer plate after exposure is put into washer, utilizes 45-
50 DEG C of warm water carries out development flushing, and hydraulic pressure general control is in 0.2-0.3Mpa, and time control is in 15-20min；
D) it dries：On the basis of step c), by the solid photopolymer plate rinsed be put into infrared baking case into
Row drying, drying box temperature are controlled in the range of 85-90 DEG C, drying time 15-20min；
E) it post-processes：On the basis of step d), it will be remained on solid photopolymer plate surface with clean organic solvent
Monomer wipe, 5min is dried after wiping clean again；
F) post-exposure：On the basis of step e), solid photopolymer plate is subjected to re-expose, time for exposure 5-
6min；
G) heat cure is handled：On the basis of step f), by the solid photopolymer plate of post-exposure, 120-125 DEG C is put into
Drying box in, carry out heat cure processing.
The version base is polyester film chip base.
The thickness of the photosensitive resin layer is 0.85-1mm.
The protective film is polyester film, and the thickness of the protective film is 0.1-0.2mm.
The thermosetting treatment time is 2-2.5min.
The above is only the preferred embodiment of the present invention, it should be pointed out that：For the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (5)
1. a kind of mask-making technology of solid photopolymer plate, including following steps：
A) it is coated with：In version base, polyvinyl alcohol photosensitive resin is coated with, forms photosensitive resin layer；Then on photosensitive resin layer
Layer protecting film is set；
B) it exposes：On the basis of step a), before exposure, the protective film of photosensitive resin is taken off, applies last layer talcum powder, so
The emulsion side of positive Yin Shi pieces and solid photopolymer plate are in close contact post-exposure, exposure again on the printer vacuumized afterwards
Time is 8-10min, using the abundant high-pressure mercury-vapor lamp of ultraviolet light as exposure light source；
C) it rinses：On the basis of step b), the solid photopolymer plate after exposure is put into washer, utilizes 45-50 DEG C
Warm water carry out development flushing, hydraulic pressure general control is in 0.2-0.3Mpa, and time control is in 15-20min；
D) it dries：On the basis of step c), the solid photopolymer plate rinsed is put into infrared baking case and is dried
Dry, drying box temperature is controlled in the range of 85-90 DEG C, drying time 15-20min；
E) it post-processes：On the basis of step d), with clean organic solvent by list remaining on solid photopolymer plate surface
Substratess are wiped, and dry 5min after wiping clean again；
F) post-exposure：On the basis of step e), solid photopolymer plate is subjected to re-expose, time for exposure 5-6min；
G) heat cure is handled：On the basis of step f), by the solid photopolymer plate of post-exposure, 120-125 DEG C of baking is put into
In dry case, heat cure processing is carried out.
2. a kind of mask-making technology of solid photopolymer plate according to claim 1, it is characterised in that：The version base is poly-
Ester film chip base.
3. a kind of mask-making technology of solid photopolymer plate according to claim 1, it is characterised in that：The photosensitive resin
The thickness of layer is 0.85-1mm.
4. a kind of mask-making technology of solid photopolymer plate according to claim 1, it is characterised in that：The protective film is
Polyester film, the thickness of the protective film is 0.1-0.2mm.
5. a kind of mask-making technology of solid photopolymer plate according to claim 1, it is characterised in that：At the heat cure
The reason time is 2-2.5min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711461376.2A CN108196424A (en) | 2017-12-28 | 2017-12-28 | A kind of mask-making technology of solid photopolymer plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711461376.2A CN108196424A (en) | 2017-12-28 | 2017-12-28 | A kind of mask-making technology of solid photopolymer plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108196424A true CN108196424A (en) | 2018-06-22 |
Family
ID=62585703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711461376.2A Pending CN108196424A (en) | 2017-12-28 | 2017-12-28 | A kind of mask-making technology of solid photopolymer plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108196424A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020182543A1 (en) * | 2000-10-13 | 2002-12-05 | Hirotatsu Fujii | Method and apparatus for developing photosensitive resin relief printing plate |
| CN102591141A (en) * | 2012-02-20 | 2012-07-18 | 武汉虹之彩包装印刷有限公司 | Method for preparing bottom die for flexible resin plates |
-
2017
- 2017-12-28 CN CN201711461376.2A patent/CN108196424A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020182543A1 (en) * | 2000-10-13 | 2002-12-05 | Hirotatsu Fujii | Method and apparatus for developing photosensitive resin relief printing plate |
| CN102591141A (en) * | 2012-02-20 | 2012-07-18 | 武汉虹之彩包装印刷有限公司 | Method for preparing bottom die for flexible resin plates |
Non-Patent Citations (2)
| Title |
|---|
| 王新城: "固体树脂常遇到的故障与解决办法", 《印刷质量与标准化》 * |
| 齐晓堃 等: "《印刷工艺学》", 28 February 2007 * |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180622 |