CN108177260A - Crystalline silicon rod Buddha's warrior attendant wire cutting method and device - Google Patents
Crystalline silicon rod Buddha's warrior attendant wire cutting method and device Download PDFInfo
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- CN108177260A CN108177260A CN201711279758.3A CN201711279758A CN108177260A CN 108177260 A CN108177260 A CN 108177260A CN 201711279758 A CN201711279758 A CN 201711279758A CN 108177260 A CN108177260 A CN 108177260A
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- crystalline silicon
- silicon rod
- adhesive
- buddha
- splicing seams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The present invention relates to crystalline silicon rod Buddha's warrior attendant wire cutting method and devices.Crystalline silicon rod Buddha's warrior attendant wire cutting method of the present invention, includes the following steps：It will at least two sections of crystalline silicon rods be bonded into a complete crystalline silicon rod；The complete crystalline silicon rod is placed in diamond wire to cut on the net.The application also provides a kind of crystalline silicon rod Buddha's warrior attendant wire-electrode cutting device, including：Fixed module, for crystalline silicon rod to be fixed on to the tablet for being coated with adhesive；Closed module, for closing the splicing seams between the crystalline silicon rod；Module is glued, for adhesive to be poured into the splicing seams between the crystalline silicon rod；Cutting module, for cutting the crystalline silicon rod.The crystalline silicon rod Buddha's warrior attendant wire cutting method and device that the application provides need not carry out separated time screen cloth line, improve the cutting efficiency and piece rate of crystalline silicon rod, so as to improve production capacity, reduce production cost.
Description
Technical field
The present invention relates to photovoltaic slice processing field, more particularly to a kind of crystalline silicon rod Buddha's warrior attendant wire cutting method and
Device.
Background technology
Solar-energy photo-voltaic cell manufacture in, by silicon single crystal rod or polycrystalline silicon rod cut into silicon chip be most critical technique it
One.Since diamond fretsaw cutting efficiency and cutting accuracy are higher, the cutting mode of silicon chip is cut by traditional mortar
Mode is cut to diamond fretsaw cutting mode to change.In order to further reduce processing cost, diamond wire graph thinning trend is apparent.Cause
Crystalline silicon rod cutting loss can be effectively reduced by becoming smaller for diamond wire line footpath, increased unit and gone out the piece number.
However, the reduction of diamond wire line footpath will cause its mechanical strength to reduce, impurities easily make thin Buddha's warrior attendant in crystalline silicon rod
Line breaks in process.Belong to great exception in broken string cutting on line process.Due to entire diamond gauze be by
A piece diamond wire is coiled into, therefore once occurs to break that thousands of meters of expensive diamond wires will be lost, and greatly improves production cost.This
Outside, it needs plenty of time processing abnormal after breaking, resumes production, seriously affect production capacity.Once processing is not good at also influencing
The whole process of crystalline silicon rod generates off standard, causes damages.
In order to solve the disconnection problem in diamond wire cutting process, need to carry out infra-red inspection to crystalline silicon rod in advance, it will be brilliant
Impure part is clipped in silicon rod, and the crystalline silicon rod of such 300~400mm will be cut into several stubs.Due to being cut into
The section of crystal bar after stub easily occurs in diamond fretsaw cutting process in section part it is difficult to ensure that absolutely smooth
Broken string.As shown in Figure 1, currently used settling mode be by gauze step to apart from crystal bar end about 2mm positions, get out of the way crystal bar with
Splicing seams between crystal bar are commonly called as the cutting of separated time net.
During stating technology in realization, inventor has found that at least there are following technical problems：
First, separated time network process is cumbersome to cause silicon chip cutting efficiency to decline, and influences to process production capacity.Second, the cutting of separated time net
When cloth is unable to crystal bar end due to gauze, and every stub both ends is made to have the sheet of about 2mm, crystal bar piece rate is caused to decline
1.0~3.0%, production capacity is caused to waste.It is also higher and higher to the quality requirements of crystalline silicon rod as diamond wire is tapered, crystal silicon
The quantity that stick is truncated into stub can be significantly increased, and separated time net cutting difficulty will also be multiplied, for production capacity, yield and slice
The influence of rate also highlights further.
Invention content
Based on this, it is necessary to cut the problem of wiring difficulty is big and piece rate is not high enough for separated time net, provide a kind of crystalline substance
Silicon rod Buddha's warrior attendant wire cutting method and device.
The application provides a kind of crystalline silicon rod Buddha's warrior attendant wire cutting method, includes the following steps：
It will at least two sections of crystalline silicon rods be bonded into a complete crystalline silicon rod；
The complete crystalline silicon rod is placed in diamond wire to cut on the net.
In the one embodiment provided in the application, it is described by least two sections of crystalline silicon rods bonding into complete crystalline silicon rod
Step includes：
At least two sections of crystalline silicon rods are fixed on the tablet for being coated with adhesive；
The splicing seams between the crystalline silicon rod are closed with adhesive tape, are not sealed on the upside of reserved splicing seams；
Adhesive is poured into the splicing seams between the crystalline silicon rod；
Cure described adhesive, the adhesive tape at the splicing seams is removed, form a complete crystalline silicon rod.
In the one embodiment provided in the application, step adhesive poured between the crystalline silicon rod in splicing seams
Suddenly include：
First adhesive is poured into the splicing seams, until the first adhesive liquid level presets height apart from splicing seams upper end
Degree；
The crystalline silicon rod is stood so that the bubble in the first adhesive is detached from；
Second adhesive is poured into the splicing seams, until the second adhesive liquid level is concordant with splicing seams upper end.
In the one embodiment provided in the application, the preset height is 10-350mm.
In the one embodiment provided in the application, described the step of making adhesive curing, includes：The splicing seams are filled
The crystalline silicon rod for entering adhesive moves into constant-temperature constant-humidity environment, places preset time.
In the one embodiment provided in the application, the preset time is 0.5-16 hours.
In the one embodiment provided in the application, which is characterized in that the adhesive tape is masking tape.
The crystalline silicon rod Buddha's warrior attendant wire cutting method that the application provides at least has the advantages that：
Separated time screen cloth line need not be carried out, gauze switching time when cutting different silicon rods is saved, improves crystalline silicon rod
Cutting efficiency and piece rate so as to improve production capacity, reduce production cost.
The application also provides a kind of crystalline silicon rod Buddha's warrior attendant wire-electrode cutting device, including：
Fixed module, for crystalline silicon rod to be fixed on to the tablet for being coated with adhesive；
Closed module, for closing the splicing seams between the crystalline silicon rod；
Module is glued, for adhesive to be poured into the splicing seams between the crystalline silicon rod；
Cutting module, for cutting the crystalline silicon rod.
In the one embodiment provided in the application, the crystalline silicon rod Buddha's warrior attendant wire-electrode cutting device further includes curing module, uses
It is solidified in making described adhesive.
In the one embodiment provided in the application, when the cutting module cuts the crystalline silicon rod, using Buddha's warrior attendant gauze
Cutting mode.
The short crystalline silicon rod of segmentation is spliced into complete crystalline silicon rod again by the crystalline silicon rod Buddha's warrior attendant wire-electrode cutting device that the application provides
It is cut, avoids the tedious steps of separated time screen cloth line, improve cutting efficiency, reduce production cost.
Description of the drawings
Fig. 1 is separated time net cutting schematic diagram；
Fig. 2 is the crystalline silicon rod Buddha's warrior attendant wire cutting method flow chart that one embodiment of the application provides；
Fig. 3 is spells stick cutting schematic diagram；
Fig. 4 is splicing seams Process of Applying Glue schematic diagram；
Fig. 5 is sizing efficiency schematic diagram.
101 diamond gauzes 201 spell sticklac
102 splicing seams, 202 masking tape
103 short 203 applicator guns of crystalline silicon rod
301 first adhesive, 302 second adhesive
Specific embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In attached drawing
Give the preferred embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose for providing these embodiments is to make the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The normally understood meaning of technical staff is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " including one or more phases
The arbitrary and all combination of the Listed Items of pass.
Diamond wire, i.e. diamond fretsaw are the methods using plating or resin-bonded, diamond abrasive are fixed on metal
It is formed on silk.The cardinal principle of diamond wire saw cut crystalline silicon rod is the diamond gauze that crystalline silicon rod vertically presses to high speed traveling
When, gauze is ground crystalline silicon rod by the diamond cut sword material adhered on the metal filament, so as to which whole crystalline silicon rod is processed into number
Thousand silicon chips being mutually parallel.Diamond gauze is to be wound on two or the more home rolls being mutually parallel to be formed by diamond wire,
The thousands of grooves being mutually parallel are provided on home roll to be used for fixing diamond wire.That is, whole diamond gauze is by one
What diamond wire was coiled into.Therefore, once breaking, thousands of meters of expensive diamond wires will be lost.
Line-outage contingency occurs in cutting process in order to prevent, needs crystalline silicon rod being cut into several sections of stubs to be eliminated as much as
Impure part.The end face that short crystalline silicon rod 103 is formed after interception has different degrees of inclination, when leading to metal wire cutting
Unbalance stress increases the risk of broken string and silicon wafer thickness unevenness instead.Therefore, make diamond wire frequently with separated time net cutting mode
Avoid the end face of short crystalline silicon rod 103.As shown in Figure 1, diamond gauze 101 is deployed to apart from two end faces of short crystalline silicon rod 103
The position of about 2mm ensures that diamond wire will not be sandwiched in the splicing seams 102 between short crystalline silicon rod 103, diamond wire is caused to break.So
And separated time screen cloth line is not only because of cumbersome influence cutting efficiency, but also greatly reduces piece rate, and production cost is caused to carry
It is high.
Fig. 2 is referred to, one embodiment of the application provides a kind of crystalline silicon rod Buddha's warrior attendant wire cutting method, including following step
Suddenly:
S100：It will at least two sections of crystalline silicon rods be bonded into a complete crystalline silicon rod.
Wherein, the crystalline silicon rod before bonding refers to whole silicon single crystal rod or polycrystalline silicon rod clips what is left behind impure part
Several sections short crystalline silicon rod 103.Adhesive is inserted into the gap between short crystalline silicon rod 103, so as to complete the bonding of crystalline silicon rod.
S200：Complete crystalline silicon rod is placed in diamond wire to cut on the net.
It is online that whole crystalline silicon rod for being bonded completion is placed on diamond wire.When mechanical arm at the uniform velocity presses to crystalline silicon rod at a high speed
During the diamond gauze 101 of traveling, gauze is cut into crystalline silicon rod by the diamond cut sword material that is attached on steel wire thousands of
The silicon chip that piece is mutually parallel.The thickness of silicon chip is corresponding with the gap of diamond wire.
As shown in figure 3, the crystalline silicon rod Buddha's warrior attendant wire cutting method that another embodiment of the application provides includes the following steps：
S100：It will at least two sections of crystalline silicon rods be bonded into a complete crystalline silicon rod.
Wherein, the crystalline silicon rod before bonding refers to whole silicon single crystal rod or polycrystalline silicon rod clips what is left behind impure part
Several sections short crystalline silicon rod 103.At least two sections of crystalline silicon rods were bonded into the step of complete crystalline silicon rod and are included：
S101：At least two sections of crystalline silicon rods are fixed on the tablet for being coated with adhesive.
Wherein, adhesive refers to spelling sticklac 201, can be glue or other solids or liquid with adhesive function.
Here tablet can be the plank of glass plate, steel plate or other materials.It, will using glue in the embodiment provided in the application
Short crystalline silicon rod 103 into section is fixed on a glass.Short crystalline silicon rod 103 is fixed on a glass primarily to convenient follow-up
Sizing operation.In detail, it will be sticked on the glass plate for being coated with glue, wait for 10 minutes into the short crystalline silicon rod 103 of section, until glue
Until water-setting is solid.At this point, short crystalline silicon rod 103 has fixed completion.
S102：The splicing seams 102 between crystalline silicon rod are closed with adhesive tape, reserved 102 upside of splicing seams is not sealed.
Wherein, adhesive tape can be masking tape 202.Masking tape 202 is using the crimped paper by resin dipping as base material
Self-adhering-type adhesive tape, be usually used in joint sealing and packaging.In the embodiment provided in the application, masking tape 202 primarily serves screening
The effect covered.When closing splicing seams 102 with adhesive tape, reserved upside is not sealed so that adhesive pours into splicing seams 102.In detail, it uses
Masking tape 202 closes the side of splicing seams between short crystalline silicon rod 103, when being glued on the upside of splicing seams, 202 energy of masking tape
Enough adhesive is avoided to be overflowed from splicing seams, so as to reduce the defect ratio of residue glue dirt piece.
S103：Adhesive is poured into the splicing seams between crystalline silicon rod.
As shown in figure 4, adhesive is poured into the splicing seams between short crystalline silicon rod 103, to complete Process of Applying Glue, make into section
Short crystalline silicon rod 103 is bonded into whole crystalline silicon rod, includes the following steps：
S111：First adhesive 301 is poured into splicing seams, until 301 liquid level of first adhesive is pre- apart from splicing seams upper end
If height.
Wherein, first adhesive 301 refers to low viscosity one pack system glue.Described preset height is 10-350mm.In advance
If height can be 10mm.Preset height can be 20mm.Preset height can also be 350mm.Due to low viscosity single-component glue
Water quality it is diluter, mobility is preferable, therefore can preferably insert masking tape 202 and gap that silicon rod end face surrounds, to the greatest extent may be used
The presence of bubble can be reduced, so as to which short crystalline silicon rod 103 be avoided to be bonded loosely caused silicon wafer thickness is uneven, cutting accuracy reduces etc.
Cut abnormal problem.In addition, low viscosity one-component glue belongs to anaerobism glue, it is therefore desirable to which reserved space pours into second adhesive
302, so that low viscosity one-component glue and air insulated.
S112：Crystalline silicon rod is stood so that the bubble in first adhesive 301 is detached from.
In order to further discharge the bubble in adhesive, prevent bubble from causing to cut abnormal problem, crystalline silicon rod need to be stood
For a period of time, until the bubble floating in adhesive is detached from.
S113：Second adhesive 302 is poured into splicing seams 102, until on 302 liquid level of second adhesive and splicing seams 102
Hold level with both hands neat.
Wherein, second adhesive 302 refers to high viscosity two-component glue.It is solid comprising some in high viscosity two-component glue
Agent, catalyst component can play bonding effect after stirring evenly.High viscosity two component water quality it is more sticky and easily solid
Change, with applicator gun 203 by the gap that high viscosity two-component glue fills masking tape 202 and silicon rod end face surrounds, make adhesive
Liquid level is concordant with 102 upper end of splicing seams.Design sketch after crystalline silicon rod sizing is as shown in Figure 5.
S114：Make adhesive curing, the adhesive tape at splicing seams 102 is removed, form a complete crystalline silicon rod.
In order to facilitate the cutting of crystalline silicon rod after bonding, adhesive need to be made to congeal into solid.In detail, splicing seams 102 are poured into
The crystalline silicon rod of adhesive moves into constant-temperature constant-humidity environment, places preset time.Described preset time is 0.5-16 hours.When default
Between can be 0.5 hour.Preset time can be 3 hours.Preset time can also be 16 hours.To be bonded dose of curing is completed
Afterwards, the masking tape 202 at splicing seams 102 is removed, you can obtain a complete crystalline silicon rod.
S200：Crystalline silicon rod is placed in diamond wire to cut on the net.
It is online that whole crystalline silicon rod for being bonded completion is placed on diamond wire.When mechanical arm at the uniform velocity presses to crystalline silicon rod at a high speed
During the diamond gauze 101 of traveling, gauze is cut into crystalline silicon rod by the diamond cut sword material that is attached on steel wire thousands of
The silicon chip that piece is mutually parallel.The thickness of silicon chip is corresponding with the gap of diamond wire.
The crystalline silicon rod Buddha's warrior attendant wire cutting method that the application provides avoids the complicated behaviour of separated time screen cloth line by spelling stick cutting
Make, save switching time when cutting different silicon rods, improve cutting efficiency.Simultaneously as no longer need reserved crystalline silicon rod
The cutting nargin at both ends, improves piece rate, reduces production cost.
The application also provides a kind of crystalline silicon rod Buddha's warrior attendant wire-electrode cutting device, including：Fixed module, closed module, sizing module
And cutting module.Wherein, fixed module is used to for crystalline silicon rod to be fixed on the tablet for being coated with adhesive.Closed module is used to close
Splicing seams 102 between crystalline silicon rod.Closed module reserves 102 upper end of splicing seams in the splicing seams 102 between closing crystalline silicon rod
It does not seal.Sizing module is used to pour into adhesive in the splicing seams 102 between crystalline silicon rod.Cutting module is completed for cutting splicing
Crystalline silicon rod afterwards.When cutting module cuts crystalline silicon rod, using Buddha's warrior attendant gauze cutting mode.
In the one embodiment provided in the application, crystalline silicon rod Buddha's warrior attendant wire-electrode cutting device further includes curing module, for making
Adhesive.Curing module can will splice the crystalline silicon rod immigration constant-temperature constant-humidity environment completed, so as to which adhesive be promoted to congeal into
Solid.
The short crystalline silicon rod 103 of segmentation is spliced into complete crystalline silicon rod by the crystalline silicon rod Buddha's warrior attendant wire-electrode cutting device that the application provides
It is cut again, without carrying out separated time screen cloth line, improves cutting efficiency and piece rate, increase production capacity.
For the ease of more fully understanding the application, the concrete application scene of the application is described below：
The process that the short progress of crystalline silicon rod 103 separated time net cutting is segmented due to being directed to is cumbersome, and the application provides a kind of spelling stick and cuts
The mode cut improves cutting efficiency and piece rate.First, silicon rod is sticked on the glass plate for being coated with glue, cures 10min.So
Afterwards, the side of splicing seams 102 between crystalline silicon rod is closed with masking tape 202, the adhesive in splicing seams 102 is avoided to overflow, it is dirty
Silicon rod is contaminated, influences Si wafer quality.Then, low viscosity one-component glue is poured into masking tape 202 and silicon rod end with applicator gun 203
The gap that face surrounds.The liquid level of low viscosity one-component glue is apart from 102 upper end 20mm of splicing seams.Due to low viscosity one-component glue
Belong to anaerobism glue, it is therefore desirable to reserved space pours into second adhesive 302 so that low viscosity one-component glue and air every
From.A period of time is stood, after bubble floating in glue is detached from, is expired 102 envelope of splicing seams with high viscosity bi-component glue.It will spell
The crystalline silicon rod that seam 102 fills glue moves into constant-temperature constant-humidity environment 3 hours, it is ensured that the glue in splicing seams 102 is fully cured.Most
Afterwards, the masking tape 202 of 102 side of splicing seams is removed, the cutting of crystalline silicon rod is completed on the net in complete diamond wire.Work as machinery
When crystalline silicon rod is at the uniform velocity pressed to the diamond gauze 101 of high speed traveling by arm, gauze passes through the diamond cutting that is attached on steel wire
It cuts sword material and crystalline silicon rod is cut into the thousands of silicon chips being mutually parallel.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Embodiment described above only expresses the several embodiments of the present invention, and description is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that those of ordinary skill in the art are come
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of crystalline silicon rod Buddha's warrior attendant wire cutting method, which is characterized in that include the following steps：
It will at least two sections of crystalline silicon rods be bonded into a complete crystalline silicon rod；
The complete crystalline silicon rod is placed in diamond wire to cut on the net.
2. crystalline silicon rod Buddha's warrior attendant wire cutting method according to claim 1, which is characterized in that it is described will at least two sections of crystalline silicon rods
The step of being bonded into a complete crystalline silicon rod includes：
At least two sections of crystalline silicon rods are fixed on the tablet for being coated with adhesive；
The splicing seams between the crystalline silicon rod are closed with adhesive tape, are not sealed on the upside of reserved splicing seams；
Adhesive is poured into the splicing seams between the crystalline silicon rod；
Cure described adhesive, the adhesive tape at the splicing seams is removed, form a complete crystalline silicon rod.
3. crystalline silicon rod Buddha's warrior attendant wire cutting method according to claim 2, which is characterized in that it is described adhesive is poured into it is described
Step between crystalline silicon rod in splicing seams includes：
First adhesive is poured into the splicing seams, until the first adhesive liquid level is apart from splicing seams upper end preset height；
The crystalline silicon rod is stood so that the bubble in the first adhesive is detached from；
Second adhesive is poured into the splicing seams, until the second adhesive liquid level is concordant with splicing seams upper end.
4. crystalline silicon rod Buddha's warrior attendant wire cutting method according to claim 3, which is characterized in that the preset height is 10-
350mm。
5. crystalline silicon rod Buddha's warrior attendant wire cutting method according to claim 2, which is characterized in that the step for making adhesive curing
Suddenly include：The crystalline silicon rod that the splicing seams are poured into adhesive moves into constant-temperature constant-humidity environment, places preset time.
6. crystalline silicon rod Buddha's warrior attendant wire cutting method according to claim 5, which is characterized in that the preset time is 0.5-16
Hour.
7. the crystalline silicon rod Buddha's warrior attendant wire cutting method described in any one in claim 2-6, which is characterized in that the glue
Band is masking tape.
8. a kind of crystalline silicon rod Buddha's warrior attendant wire-electrode cutting device, which is characterized in that including：
Fixed module, for crystalline silicon rod to be fixed on to the tablet for being coated with adhesive；
Closed module, for closing the splicing seams between the crystalline silicon rod；
Module is glued, for adhesive to be poured into the splicing seams between the crystalline silicon rod；
Cutting module, for cutting the crystalline silicon rod.
9. crystalline silicon rod Buddha's warrior attendant wire-electrode cutting device according to claim 8, which is characterized in that further include curing module, be used for
Solidify described adhesive.
10. crystalline silicon rod Buddha's warrior attendant wire-electrode cutting device according to claim 8, which is characterized in that the cutting module cuts institute
When stating crystalline silicon rod, using Buddha's warrior attendant gauze cutting mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201711279758.3A CN108177260B (en) | 2017-12-06 | 2017-12-06 | Diamond wire cutting method for crystal silicon rod |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711279758.3A CN108177260B (en) | 2017-12-06 | 2017-12-06 | Diamond wire cutting method for crystal silicon rod |
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| CN108177260A true CN108177260A (en) | 2018-06-19 |
| CN108177260B CN108177260B (en) | 2020-08-18 |
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| CN112192773A (en) * | 2019-07-08 | 2021-01-08 | 洛阳阿特斯光伏科技有限公司 | Method for reducing single-chip wire consumption of diamond wire cutting polycrystalline silicon rod |
| CN112757509A (en) * | 2021-02-09 | 2021-05-07 | 常州时创能源股份有限公司 | Diamond wire cutting method for splicing silicon materials |
| CN112776195A (en) * | 2019-11-01 | 2021-05-11 | 苏州阿特斯阳光电力科技有限公司 | Silicon wafer processing method, grooving main roller and slicing equipment |
| CN112793021A (en) * | 2019-10-28 | 2021-05-14 | 洛阳阿特斯光伏科技有限公司 | Silicon rod splicing method, spliced silicon rod and cutting method of spliced silicon rod |
| CN112809949A (en) * | 2021-01-21 | 2021-05-18 | 常州时创能源股份有限公司 | Rod splicing method suitable for small monocrystalline silicon blocks and application |
| CN112844978A (en) * | 2019-11-27 | 2021-05-28 | 内蒙古中环光伏材料有限公司 | Gluing template for wafer bar splicing and gluing method thereof |
| CN112847862A (en) * | 2021-02-09 | 2021-05-28 | 常州时创能源股份有限公司 | Cutting method suitable for small monocrystalline silicon blocks |
| CN112920751A (en) * | 2021-02-09 | 2021-06-08 | 常州时创能源股份有限公司 | UV adhesive film for splicing and cutting small monocrystalline silicon blocks and preparation method and application thereof |
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| CN112793021A (en) * | 2019-10-28 | 2021-05-14 | 洛阳阿特斯光伏科技有限公司 | Silicon rod splicing method, spliced silicon rod and cutting method of spliced silicon rod |
| CN112776195A (en) * | 2019-11-01 | 2021-05-11 | 苏州阿特斯阳光电力科技有限公司 | Silicon wafer processing method, grooving main roller and slicing equipment |
| CN112844978A (en) * | 2019-11-27 | 2021-05-28 | 内蒙古中环光伏材料有限公司 | Gluing template for wafer bar splicing and gluing method thereof |
| CN112809949A (en) * | 2021-01-21 | 2021-05-18 | 常州时创能源股份有限公司 | Rod splicing method suitable for small monocrystalline silicon blocks and application |
| CN112757509A (en) * | 2021-02-09 | 2021-05-07 | 常州时创能源股份有限公司 | Diamond wire cutting method for splicing silicon materials |
| CN112920751A (en) * | 2021-02-09 | 2021-06-08 | 常州时创能源股份有限公司 | UV adhesive film for splicing and cutting small monocrystalline silicon blocks and preparation method and application thereof |
| CN112847862A (en) * | 2021-02-09 | 2021-05-28 | 常州时创能源股份有限公司 | Cutting method suitable for small monocrystalline silicon blocks |
| WO2022170761A1 (en) * | 2021-02-09 | 2022-08-18 | 常州时创能源股份有限公司 | Diamond wire cutting method for spliced silicon material |
| CN112920751B (en) * | 2021-02-09 | 2022-12-27 | 常州时创能源股份有限公司 | UV adhesive film for splicing and cutting small monocrystalline silicon blocks and preparation method and application thereof |
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