CN108174063A - Camera and with its electronic equipment - Google Patents
Camera and with its electronic equipment Download PDFInfo
- Publication number
- CN108174063A CN108174063A CN201711376201.1A CN201711376201A CN108174063A CN 108174063 A CN108174063 A CN 108174063A CN 201711376201 A CN201711376201 A CN 201711376201A CN 108174063 A CN108174063 A CN 108174063A
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- China
- Prior art keywords
- chip
- filter disc
- camera
- electronic equipment
- gold thread
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
Abstract
This application discloses a kind of camera and with its electronic equipment.Camera includes Lens assembly and chip assembly.Lens assembly has thang-kng channel, and chip assembly includes circuit board, chip, gold thread, filter disc and encapsulation part, and chip is set on circuit board.One end of gold thread is connect with chip, and the other end of gold thread is connect with circuit board.Encapsulation part encapsulates chip, filter disc and gold thread, and chip is spaced apart with filter disc and filter disc is between chip and Lens assembly, and Lens assembly is connect with encapsulation part, and the light irradiated out of thang-kng channel is irradiated in filter disc.According to the camera of the electronic equipment of the application, filter disc, chip and gold thread are packaged together using encapsulation part, filter disc and gold thread can be effectively prevent to be fallen off under external impacts, enhance the stability of filter disc work, the attached process of filter disc is omitted, it improves and is electrically connected stability between chip and circuit board, improve the assembly precision of chip assembly, reduce the volume and size of camera.
Description
Technical field
This application involves technical field of electronic equipment more particularly to a kind of camera and with its electronic equipment.
Background technology
In the relevant technologies, chip is encapsulated in circuit by CCD camera assembly by way of mold injection first in encapsulation
On plate, picture glue is then carried out on moulding, finally filter disc bonding on circuit boards, this process chip and filter disc are using independent
Encapsulation.Rear camera component is encapsulated under external impacts, layering is susceptible to and comes off, and the error of encapsulation process is larger, is imaged
Head assembly take pictures imaging when, be susceptible to reflective or light leakage situation.
Apply for content
The application is intended at least solve one of technical problem in the prior art.For this purpose, the application proposes a kind of electricity
The camera of sub- equipment, the camera overall dimensions of the electronic equipment are smaller, can effectively prevent coming off for filter disc.
The application also proposes a kind of electronic equipment, and the electronic equipment includes above-mentioned camera.
According to the camera of the electronic equipment of the embodiment of the present application, including：Lens assembly, the Lens assembly have thang-kng
Channel；Chip assembly, the chip assembly include circuit board, chip, gold thread, filter disc and encapsulation part, and the chip is set on described
Circuit board, one end of the gold thread are connect with the chip, and the other end of the gold thread is connect with the circuit board, the encapsulation
Portion encapsulates the chip, the filter disc and the gold thread, and the chip is spaced apart with the filter disc and the filter disc is located at institute
It states between chip and the Lens assembly, the Lens assembly is connect with the encapsulation part, is irradiated out of described thang-kng channel
Light be irradiated in the filter disc.
According to the camera of the electronic equipment of the embodiment of the present application, filter disc, chip and gold thread are encapsulated using encapsulation part
Integrated structure can be fixed and be protected filter disc using encapsulation part, filter disc can be effectively prevent to be fallen off under external impacts,
The stability of filter disc work is enhanced, effectively prevent chip assembly that layering occurs under external force and comes off, gold can also be avoided
Line comes off from circuit board, chip, and stability is electrically connected so as to improve circuit board and chip.Meanwhile eliminate correlation
In technology using stent by filter disc be fixed to chip assembly on structure, so as to reduce the components number of camera, contracting
The small volume and size of chip assembly.In addition, filter disc, chip and gold thread are configured to an overall structure, it is omitted
The attached process of filter disc is conducive to be promoted the assembly precision of chip assembly, reduces the rigging error of encapsulation process generation.
According to the electronic equipment of the application, including above-mentioned camera.
According to the electronic equipment of the application, filter disc, chip and gold thread are encapsulated into integrated knot by using encapsulation part
Structure can be fixed and be protected filter disc using encapsulation part, filter disc can be effectively prevent to be fallen off under external impacts, enhance filter disc
The stability of work, effectively prevent chip assembly occur under external force layering come off, can also avoid gold thread from circuit board,
It comes off on chip, stability is electrically connected so as to improve circuit board and chip.Meanwhile eliminate the utilization in the relevant technologies
Filter disc is fixed to the structure on chip assembly by stent, so as to reduce the components number of camera, reduces chip assembly
Volume and size.In addition, filter disc, chip and gold thread are configured to an overall structure, it is omitted the attaching work of filter disc
Sequence is conducive to be promoted the assembly precision of chip assembly, reduces the rigging error of encapsulation process generation.
Description of the drawings
Fig. 1 is the camera according to the embodiment of the present application；
Fig. 2 is the camera according to the embodiment of the present application；
Fig. 3 is the rearview according to the electronic equipment of the embodiment of the present application.
Reference numeral：
Electronic equipment 1000,
Camera 100, chip assembly 1,
Filter disc 11, chip 12, circuit board 13, encapsulation part 14, side wall surface 141, gold thread 123,
Electric elements 15,
Lens assembly 2.
Specific embodiment
Embodiments herein is described below in detail, the example of the embodiment is shown in the drawings.Below with reference to
The embodiment of attached drawing description is exemplary, it is intended to for explaining the application, and it is not intended that limitation to the application.
In the description of the present application, it is to be understood that the orientation or position of the instructions such as term " on ", " under ", "left", "right"
Put relationship be based on orientation shown in the drawings or position relationship, be for only for ease of description the application and simplify description rather than
Indicate or imply that signified device or element there must be specific orientation, with specific azimuth configuration and operation, therefore cannot
It is interpreted as the limitation to the application.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one this feature.In the description of the present application, " multiple " are meant that at least two, such as two, three
It is a etc., unless otherwise specifically defined.
In this application unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or integral；Can be that machinery connects
It connects or is electrically connected or can communicate each other；It can be directly connected, can also be indirectly connected by intermediary, it can be with
It is the interaction relationship of connection inside two elements or two elements, unless otherwise restricted clearly.For this field
For those of ordinary skill, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
As shown in Figure 1-Figure 3, according to the camera 100 of the electronic equipment of the embodiment of the present application 1000, including chip assembly 1
With Lens assembly 2.
Specifically, as depicted in figs. 1 and 2, Lens assembly 2 has thang-kng channel, and chip assembly 1 includes circuit board 13, core
Piece 12, gold thread 123, filter disc 11 and encapsulation part 14, chip 12 are set on circuit board 13, and one end of gold thread 123 is connect with chip 12, gold
The other end of line 123 is connect with circuit board 13, and encapsulation part 14 encapsulates chip 12, filter disc 11 and gold thread 123, chip 12 and filter disc
11 be spaced apart and filter disc 11 between chip 12 and Lens assembly 2, Lens assembly 2 is connect with encapsulation part 14, from thang-kng channel
The light inside irradiated can be irradiated in filter disc 11.
It is understood that as depicted in figs. 1 and 2, Lens assembly 2 can be located at the top of chip assembly 1 (such as Fig. 1 institutes
That shows is upper), light can be from the top of Lens assembly 2 by propagating to chip assembly 1 after Lens assembly 2.Chip assembly 1 includes
Circuit board 13, chip 12, gold thread 123, filter disc 11 and encapsulation part 14, on the direction of propagation of incident ray, Lens assembly 2, filter
Piece 11, chip 12 and circuit board 13 are arranged successively, for example, Lens assembly 2, filter disc 11, chip 12 and circuit board 13 can be successively
Arrangement stacked on top of one another, and be spaced apart between filter disc 11 and chip 12.Chip 12 can realize electricity with circuit board 13 by gold thread 123
Connection, one end of gold thread 123 are electrically connected with chip 12, and the other end of gold thread 123 is electrically connected with circuit board 13.Lens assembly 2 can
Incident ray is concentrated on same plane, further handled convenient for next stage.In addition, lens assembly 2 can be with can be real
The adjusting of existing focal length, and then obtain and be more clearly imaged.
Filter disc 11 may filter that variegated and polarisation, and then obtain preferable imaging effect.In addition, chip 12 can be at image
Device is managed, such as CMOS type or CCD type, extraneous light are transmitted to across filter disc 11 on chip 12, chip 12 can turn light
Become charge, digital signal is converted by analog-digital converter chip 12, last digital signal is after overcompression is handled by storing
Device preserves.Encapsulation part 14 can be used for filter disc 11, chip 12 and gold thread 123 being packaged together, at least part side of filter disc 11
Edge is packaged portion 14 and wraps up.
According to the camera 100 of the electronic equipment 1000 of the embodiment of the present application, using encapsulation part 14 by filter disc 11, chip 12
And gold thread 123 is packaged into integral structure, can fix and protect filter disc 11 using encapsulation part 14, can effectively prevent filter disc 11
It is fallen off under external impacts, enhances the stability of the work of filter disc 11, chip assembly 1 is effectively prevent to send out under external force
Layer estranged comes off, and gold thread 123 can also be avoided to come off from circuit board 13, chip 12, so as to improve circuit board 13 and core
The electrical connection stability of piece 12.Meanwhile eliminate in the relevant technologies using stent by filter disc be fixed to chip assembly on knot
Structure so as to reduce the components number of camera 100, reduces the volume and size of chip assembly 1.In addition, by filter disc 11,
Chip 12 and gold thread 123 are configured to an overall structure, are omitted the attached process of filter disc 11, are conducive to promote chipset
The assembly precision of part 1 reduces the rigging error of encapsulation process generation.
According to some embodiments of the present application, as depicted in figs. 1 and 2, electric elements 15, electricity can be equipped on circuit board 13
Device element 15 is packaged in encapsulation part 14.Electric elements 15 can be that chip 12 provides electric current and voltage, assist chip 12 to light
Signal, electric signal and digital signal are handled.Electric elements 15 are encapsulated in encapsulation part 14, encapsulation part 14 is to electric appliance member
Part 15 has protective effect, and electric elements 15 is avoided to be influenced the normal work of chip assembly 1 by external force collision.In addition, pass through
Electric elements 15, chip 12 and filter disc 11 are packaged together, the volume and size of camera 100 can be not only reduced, may be used also
To reduce the assembly process of camera 100, the assembly precision of chip assembly 1 is promoted.
Further, as depicted in figs. 1 and 2, at least part at the edge of filter disc 11 exceeds the edge of chip 12.With one
Determine the light of incident angle, after the broader filter disc 11 in edge, each section of chip 12 can be received by filter disc 11
Light improves the luminous flux of chip assembly 1 so that imaging effect more, reduces the noise in light, improves imaging
Clarity and resolution ratio.
Further, as depicted in figs. 1 and 2, electric elements 15 are between circuit board 13 and filter disc 11.In order to obtain compared with
Good imaging effect, needs circuit board 13 and filter disc 11 being spaced apart, by the way that electric elements 15 are arranged on circuit board 13 and filter
In the spaces that piece 11 is spaced, electric elements 15 are placed into without distributing additional space, reduce the size of chip assembly 1,
Realize the Miniaturization Design of chip assembly 1.
According to some embodiments of the present application, as depicted in figs. 1 and 2, encapsulation part 14 is between chip 12 and filter disc 11
Surface be side wall surface 141, at least partially inclined surface of side wall surface 141.As a result, in the clearance space of chip 12 and filter disc 11,
Partly mixed and disorderly reflection light or light leakage light is when being irradiated to inclined surface, inclined surface can by the reflection light received or
Light leakage light is reflected to one end (top as shown in Figure 1) far from chip 12, and then avoids reflection light or light leakage light
Into chip 12, and then the noise of imaging is reduced, improve the effect of imaging.
Here the inclined direction of side wall surface 141 is not specifically limited, in some embodiments of the present application, from such as Fig. 1
Shown upper side direction is upward to lower side as shown in Figure 1, and side wall surface 141 is gradually tilted to the radially inner side of chip 12, i.e.,
Upward from upper side direction as shown in Figure 1 to lower side as shown in Figure 1, side wall surface 141 is gradually to the radially inner side of chip 12
Offset.In other words, in the space limited by side wall surface 141, in the section in upper and lower directions as shown in Figure 1
On, the sectional area in the space is gradually reduced from top to bottom.In other embodiments of the application, side wall surface 141 is gradually to core
The radial outside of piece 12 tilts, i.e., upward from upper side direction as shown in Figure 1 to lower side as shown in Figure 1, side wall surface 141 by
Gradually deviated to the radial outside of chip 12.In other words, in the space limited by side wall surface 141, perpendicular to as shown in Figure 1
Upper and lower directions on section on, the sectional area in the space gradually increases from top to bottom.
According to some embodiments of the present application, as depicted in figs. 1 and 2, encapsulation part 14 is between chip 12 and filter disc 11
Surface is side wall surface 141, and at least part of side wall surface 141 is coated with the first viscous layer.Chip assembly 1 is partly dropped into as a result,
Internal dust or little particle, can be adsorbed, and then dust or little particle is avoided to fall on chip 12 by the first viscous layer,
Influence imaging effect.In addition, by the first viscous layer, chip 12 and filter disc 11 can preferably be fitted in the side wall of encapsulation part 14
On face 141, in order to avoid being subjected to displacement or shaking under external force, and then ensure preferable imaging effect.
According to some embodiments of the present application, as depicted in figs. 1 and 2, encapsulation part 14 is made of having sticking material
Adhesive encapsulation portion 14.To increase the viscous power of being stained between chip 12 or filter disc 11 and encapsulation part 14, mostly smeared using in contact position
Dispensing.The dust or little particle inside chip assembly 1 are partly dropped into as a result, can be adsorbed by the encapsulation part 14 of viscosity, into
And dust or little particle is avoided to fall on chip 12, influence imaging effect.The encapsulation part 14 of viscosity reduces use for dispensing glue,
And then reduce the whole height of chip assembly 1.In addition, adhesive encapsulation portion 14 enables chip 12 and filter disc 11 preferably to paste
It closes in encapsulation part 14, in order to avoid chip 12 or filter disc 11 are subjected to displacement or shake under external force, and then ensures preferable
Imaging effect.
According to some embodiments of the present application, as depicted in figs. 1 and 2, the thang-kng region of filter disc 11 is workspace, remaining part
It is divided into nonclient area, the surface being located in nonclient area of filter disc 11 is coated with the second viscous layer.Chip is partly dropped into as a result,
Dust or little particle inside component 1 can be adsorbed, and then dust or little particle is avoided to fall in chip by the second viscous layer
On 12, imaging effect is influenced.In addition, by the second viscous layer, filter disc 11 can preferably be fitted in the side wall surface of encapsulation part 14
On 141, in order to avoid being subjected to displacement or shaking under external force, and then imaging effect is promoted.
Below with reference to Fig. 1-Fig. 3 descriptions according to the electronic equipment 1000 of the embodiment of the present application.
According to the electronic equipment 1000 of the embodiment of the present application, including above-mentioned camera 100.It should be noted that as
This " electronic equipment 1000 " for using includes, but are not limited to be configured to connect (such as via public exchange electricity via Wireline
Telephone network (PSTN), digital subscriber line (DSL), digital cable, Direct cable connection and/or another data connection/net
Network) and/or via (for example, for cellular network, WLAN (WLAN), such as digital TV network of DVB-H networks,
Satellite network, AM-FM broadcasting transmitter and/or another communication electronic equipment 1000) wireless interface reception/transmission communication
The device of signal.It is configured to be referred to as " wirelessly communicating eventually by the communication electronic equipment 1000 of radio interface communication
End ", " wireless terminal " and/or " mobile terminal ".The example of mobile terminal includes, but are not limited to satellite or cellular phone；It can
With combination cellular radio telephone and PCS Personal Communications System (PCS) terminal of data processing, fax and communication ability；It can
It is fixed to include radio telephone, pager, the Internet/intranet access, Web browser, memo pad, calendar and/or the whole world
The PDA of position system (GPS) receiver；And conventional laptop and/or palmtop receiver or including radiotelephone transceiver
Other electronic equipments 1000.
According to the electronic equipment 1000 of the embodiment of the present application, by encapsulation part 14 by 123 envelope of filter disc 11, chip 12 and gold thread
It is fitted together, can improve and be electrically connected stability between gold thread 123 and chip 12 and circuit board 13, core can also be effectively prevent
Piece component 1 occurs layering and comes off under external force, reduces the volume and size of chip assembly 1, the patch of filter disc 11 is omitted
Attached process reduces the error of encapsulation process generation.
In the embodiment of the present application, which can various can obtain data and to the data from outside
The equipment handled, alternatively, the electronic equipment 1000 can various be built-in with battery, and can obtain electric current pair from outside
The equipment that the battery charges, for example, mobile phone, tablet computer, computing device or device for display of message etc..
Below with reference to Fig. 1-Fig. 3 descriptions according to the electronic equipment 1000 of one specific embodiment of the application.It is worth what is understood
It is, it is described below to be merely illustrative rather than the concrete restriction to the application.
The electronic equipment 1000 that the application is applicable in is introduced by taking mobile phone as an example.In the embodiment of the present application, electronics
Equipment 1000 can include camera 100, radio circuit, memory, input unit, Wireless Fidelity (WiFi, wireless
Fidelity) the components such as module, sensor, display unit, voicefrequency circuit, processor, fingerprint recognition component, battery.
As shown in Figure 1-Figure 3, the camera 100 of the embodiment of the present application, including：Lens assembly 2 and chip assembly 1.Wherein,
Chip assembly 1 is located at the lower section (lower section as shown in Figure 2) of Lens assembly 2, and chip assembly 1 is connect with lens assembly 2.
As shown in Figure 1, chip assembly 1 includes circuit board 13, chip 12, gold thread 123, filter disc 11 and encapsulation part 14.Wherein,
The edge of filter disc 11 at least partly exceeds the edge of chip 12.
As depicted in figs. 1 and 2, circuit board 13, chip 12 and filter disc 11 are stacked, and circuit board 13 is located under chip 12
Side (downside as shown in Figure 1), filter disc 11 is located at the upside (upside as shown in Figure 1) of chip 12, between filter disc 11 and chip 12
It is separated with certain space.The thang-kng region of filter disc 11 is workspace, and rest part is nonclient area, and filter disc 11 is located at nonclient area
Interior surface is coated with the second viscous layer.
As depicted in figs. 1 and 2, circuit board 13 is equipped with electric elements 15, and electric elements 15 are located at circuit board 13 and filter disc
Between 11, electric elements 15 are connected with chip 12, and electric elements 15 are provided with two groups altogether, and are respectively distributed to a left side for chip 12
Side (left side as shown in Figure 1) and right side (right side as shown in Figure 1).
As depicted in figs. 1 and 2, encapsulation part 14 is with cohesive material by being made, and encapsulation part 14 is by filter disc 11, chip 12 and gold
Line 123 is packaged together, and the part edge of filter disc 11 is packaged portion 14 and wraps up, and electric elements 15 are encapsulated in encapsulation part 14
It is interior.Surface of the encapsulation part 14 between chip 12 and filter disc 11 is side wall surface 141, and the part of side wall surface 141 is inclined surface.Tool
Body, inclined surface is formed by connecting by vertical plane and with plane of the vertical plane there are certain angle, and the part surface of inclined surface applies
It is covered with the first viscous layer.
Radio circuit can be used for receive and send messages or communication process in, signal sends and receivees, particularly, by base station
After downlink information receives, processor processing is given；In addition, the data of 1000 uplink of electronic equipment are sent to base station.In general, radio frequency
Circuit includes but not limited to antenna, at least one amplifier, transceiver, coupler, low-noise amplifier, duplexer etc..This
Outside, radio circuit can also communicate with network and other equipment by radio communication.
Memory can be used for storage software program and module, and processor is stored in the software program of memory by operation
And module, so as to perform the various function application of electronic equipment 1000 and data processing.Memory can mainly include storage
Program area and storage data field, wherein, storing program area can storage program area, the application program needed at least one function
(such as sound-playing function, image player function) etc.；Storage data field can be stored to be created according to using for electronic equipment 1000
Data (such as audio data, phone directory) built etc..In addition, memory can include high-speed random access memory, it can be with
Including nonvolatile memory, for example, at least a disk memory, flush memory device or other volatile solid-states
Part.
Input unit can be used for receiving the number inputted or character information and the user of generation and electronic equipment 1000 sets
It puts and key signals that function control is related.Specifically, input unit may include touch panel and other input equipments.Touch-control
Panel, also referred to as touch screen, collect user on it or neighbouring touch operation (for example user is appointed using finger, stylus etc.
What operation of suitable object or attachment on touch panel or near touch panel), and driven according to preset formula
Move corresponding attachment device.
Optionally, touch panel may include both touch detecting apparatus and touch controller.Wherein, touch detection fills
The touch orientation of detection user is put, and detects the signal that touch operation is brought, transmits a signal to touch controller；Touch control
Device receives touch information from touch detecting apparatus, and is converted into contact coordinate, then gives processor, and can reception processing
Order that device is sent simultaneously is performed.Furthermore, it is possible to using multiple types such as resistance-type, condenser type, infrared ray and surface acoustic waves
Type realizes touch panel.In addition to touch panel, input unit can also include other input equipments.Specifically, other inputs are set
It is standby to can include but is not limited to physical keyboard, function key (such as volume control button, switch key etc.), trace ball, mouse, behaviour
Make one or more in bar etc..
WiFi belongs to short range wireless transmission technology, and electronic equipment 1000 can help user to receive and dispatch electricity by WiFi module
Sub- mail, browsing webpage and access streaming video etc., it has provided wireless broadband internet to the user and has accessed.But it can manage
Solution, WiFi module are simultaneously not belonging to must be configured into for electronic equipment 1000, can not change application as needed completely
It is omitted in the range of essence.
In addition, mobile phone may also include at least one sensor, such as attitude transducer, optical sensor and other sensings
Device.
Specifically, attitude transducer is referred to as motion sensor, also, as one kind of the motion sensor, can
To enumerate gravity sensor, cantilevered shifter is made using elastic sensing element, and using the sensitive member of elasticity in gravity sensor
Energy-stored spring made of part drives electric contact, so as to fulfill Gravity changer to be converted into the variation of electric signal.
As the another kind of motion sensor, accelerometer sensor can be enumerated, accelerometer sensor can detect all directions
Upper (generally three axis) acceleration magnitude, can detect that size and the direction of gravity, can be used to identify mobile phone posture when static
It (for example pedometer, is struck using (such as horizontal/vertical screen switching, dependent game, magnetometer pose calibrating), Vibration identification correlation function
Hit) etc..
In the embodiment of the present application, it is first as aftermentioned " attitude parameter " is obtained that motion sensor listed above may be used
Part, but it's not limited to that, and other sensors that can obtain " attitude parameter " are each fallen in the protection domain of the application, example
Such as, gyroscope etc., also, the operation principle of the gyroscope and data handling procedure can be similar to the prior art, here, in order to
It avoids repeating, description is omitted.
In addition, in the embodiment of the present application, as sensor, it can also configure barometer, hygrometer, thermometer and infrared ray
The other sensors such as sensor, details are not described herein.
Optical sensor may include ambient light sensor and proximity sensor, wherein, ambient light sensor can be according to ambient light
The light and shade of line adjusts the brightness of display panel, proximity sensor can when mobile phone is moved in one's ear, close display panel and/or
Backlight.
Display unit can be used for display by information input by user or be supplied to the information of user and respectively planting vegetables for mobile phone
It is single.Display unit may include display panel, optionally, liquid crystal display (LCD, Liquid Crystal may be used
Display), display surface is configured in the forms such as Organic Light Emitting Diode (OLED, Organic Light-Emitting Diode)
Plate.Further, touch panel can cover display panel, when touch panel is detected on it or after neighbouring touch operation,
Processor is sent to determine the type of touch event, device is followed by subsequent processing and is provided on a display panel according to the type of touch event
Corresponding visual output.
Voicefrequency circuit, loud speaker and microphone can provide the audio interface between user and electronic equipment 1000.Audio-frequency electric
The transformed electric signal of the audio data received can be transferred to loud speaker by road, and voice signal output is converted to by loud speaker；
On the other hand, the voice signal of collection is converted to electric signal by microphone, and audio data is converted to after being received by voicefrequency circuit, then
After the processing of audio data output processor, through radio circuit to be sent to such as another electronic equipment 1000 or by audio
Data export to memory to be further processed.
Processor is the control centre of electronic equipment 1000, and processor is mounted on circuit board assemblies, utilizes various interfaces
The various pieces of electronic equipment 1000 entire with connection, by running or performing the software program being stored in memory
And/or module and calling are stored in the data in memory, perform the various functions of electronic equipment 1000 and processing data,
So as to carry out integral monitoring to electronic equipment 1000.Optionally, processor may include one or more processing units；Preferably,
Processor can integrate application processor and modem processor, wherein, the main processing operation system of application processor, Yong Hujie
Face and application program etc., modem processor mainly handle wireless communication.
Power supply can be logically contiguous with processor by power-supply management system, is managed so as to be realized by power-supply management system
The functions such as charging, electric discharge and power managed.Although being not shown, electronic equipment 1000 can also include bluetooth module, sensor
(such as attitude transducer, optical sensor, can also configure barometer, hygrometer, thermometer and infrared ray sensor etc. other sensing
Device) etc., details are not described herein.
It should be noted that mobile phone is only the citing of a kind of electronic equipment 1000, the application is simultaneously not particularly limited, the application
The electronic equipments such as mobile phone, tablet computer 1000 are can be applied to, the application does not limit this.
In the description of this specification, reference term " one embodiment ", " example ", " is specifically shown " some embodiments "
The description of example " or " some examples " etc. means specific features, structure, material or the spy for combining the embodiment or example description
Point is contained at least one embodiment or example of the application.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It is combined in an appropriate manner in one or more embodiments or example.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the different embodiments or examples described in this specification and the feature of different embodiments or examples
It closes and combines.
Although embodiments herein has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to the limitation to the application is interpreted as, those of ordinary skill in the art within the scope of application can be to above-mentioned
Embodiment is changed, changes, replacing and modification.
Claims (9)
1. the camera of a kind of electronic equipment, which is characterized in that including：
Lens assembly, the Lens assembly have thang-kng channel；
Chip assembly, the chip assembly include circuit board, chip, gold thread, filter disc and encapsulation part, and the chip is set on the electricity
Road plate, one end of the gold thread are connect with the chip, and the other end of the gold thread is connect with the circuit board, the encapsulation part
The chip, the filter disc and the gold thread are encapsulated, the chip is spaced apart with the filter disc and the filter disc is positioned at described
Between chip and the Lens assembly, the Lens assembly is connect with the encapsulation part, is irradiated out of described thang-kng channel
Light is irradiated in the filter disc.
2. the camera of electronic equipment according to claim 1, which is characterized in that the circuit board is equipped with electric appliance member
Part, the electric elements are packaged in the encapsulation part.
3. the camera of electronic equipment according to claim 2, which is characterized in that at least part at the edge of the filter disc
Beyond the edge of the chip.
4. the camera of electronic equipment according to claim 3, which is characterized in that the electric elements are located at the circuit
Between plate and the filter disc.
5. the camera of electronic equipment according to claim 1, which is characterized in that the encapsulation part is in the chip and institute
Surface between filter disc is stated as side wall surface, at least partially inclined surface of the side wall surface.
6. the camera of electronic equipment according to claim 1, which is characterized in that the encapsulation part is in the chip and institute
It is side wall surface to state the surface between filter disc, and at least part of the side wall surface is coated with the first viscous layer.
7. the camera of electronic equipment according to claim 1, which is characterized in that the encapsulation part is by having sticking material
Adhesive encapsulation portion made of material.
8. the camera of electronic equipment according to claim 1, which is characterized in that the thang-kng region of the filter disc is work
Area, rest part are nonclient area, and the surface being located in the nonclient area of the filter disc is coated with the second viscous layer.
9. a kind of electronic equipment, which is characterized in that including：
Camera, the camera are the camera according to any one of claim 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711376201.1A CN108174063A (en) | 2017-12-19 | 2017-12-19 | Camera and with its electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711376201.1A CN108174063A (en) | 2017-12-19 | 2017-12-19 | Camera and with its electronic equipment |
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| CN108174063A true CN108174063A (en) | 2018-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711376201.1A Pending CN108174063A (en) | 2017-12-19 | 2017-12-19 | Camera and with its electronic equipment |
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| CN (1) | CN108174063A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7180024B1 (en) | 2022-03-31 | 2022-11-29 | エーエーシー オプティックス （ナンネイ） カンパニーリミテッド | Driving mechanism, imaging device and portable electronic device |
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| CN105573020A (en) * | 2016-02-22 | 2016-05-11 | 宁波舜宇光电信息有限公司 | Camera module with dust catching structure |
| CN106873116A (en) * | 2017-04-06 | 2017-06-20 | 浙江舜宇光学有限公司 | Pick-up lens |
| CN206339766U (en) * | 2016-12-10 | 2017-07-18 | 瑞声科技(新加坡)有限公司 | Camera lens module |
| CN206743386U (en) * | 2017-05-06 | 2017-12-12 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
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| CN103700634A (en) * | 2013-11-06 | 2014-04-02 | 南昌欧菲光电技术有限公司 | Camera module, and encapsulating structure and encapsulating method thereof |
| CN105573020A (en) * | 2016-02-22 | 2016-05-11 | 宁波舜宇光电信息有限公司 | Camera module with dust catching structure |
| CN206339766U (en) * | 2016-12-10 | 2017-07-18 | 瑞声科技(新加坡)有限公司 | Camera lens module |
| CN106873116A (en) * | 2017-04-06 | 2017-06-20 | 浙江舜宇光学有限公司 | Pick-up lens |
| CN206743386U (en) * | 2017-05-06 | 2017-12-12 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7180024B1 (en) | 2022-03-31 | 2022-11-29 | エーエーシー オプティックス （ナンネイ） カンパニーリミテッド | Driving mechanism, imaging device and portable electronic device |
| JP2023150456A (en) * | 2022-03-31 | 2023-10-16 | エーエーシー オプティックス （ナンネイ） カンパニーリミテッド | Driving mechanism, imaging device, and portable electronic device |
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| PB01 | Publication | ||
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| CB02 | Change of applicant information |
Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180615 |
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| RJ01 | Rejection of invention patent application after publication |