CN108173019A - Communication interface structure and electronic equipment - Google Patents
Communication interface structure and electronic equipment Download PDFInfo
- Publication number
- CN108173019A CN108173019A CN201711417797.5A CN201711417797A CN108173019A CN 108173019 A CN108173019 A CN 108173019A CN 201711417797 A CN201711417797 A CN 201711417797A CN 108173019 A CN108173019 A CN 108173019A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- communication interface
- contact terminal
- board substrate
- connecting line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/727—Coupling devices presenting arrays of contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention relates to a kind of communication interface structures, it is connect for the communication interface with docking, including circuit board substrate, the edge of the circuit board substrate has connecting plate, contact terminal and connecting line are provided on the circuit board substrate, for being connect with the communication interface of the docking, and the contact terminal is arranged on the connecting plate, the connecting line is used to be correspondingly connected with the contact terminal contact terminal.The invention further relates to a kind of electronic equipment.The beneficial effects of the invention are as follows：Contact terminal is directly made on circuit board substrate, eliminates the tongue piece that plastic cement in the prior art makes, improve due to tongue piece made of plastic cement and caused by contact terminal the problem of being easily corroded or short circuit occurs.
Description
Technical field
The present invention relates to communication product manufacture technology field more particularly to a kind of communication interface structures and electronic equipment.
Background technology
The charging of USB (Universal Serial Bus, universal serial bus) and data transmission interface are all logical at present
Cross the mutual cooperation realization of USB socket and plug.As shown in Figure 1, socket includes shell 3, the tongue piece 2 being fixed in shell 3,
The contact terminal 1 being set on tongue piece, one end of contact terminal 1 pass through the shell 3 to be welded with the circuit board outside shell 3
It connects, has the following problems：
Tongue piece is generally plastic cement and is made, and tongue piece and is set between the contact terminal on tongue piece there may be gap, easily
Occur since liquid or foreign matter enter the gap, contact terminal is caused to be corroded or short circuit.
Invention content
In order to solve the above technical problem, the present invention provides a kind of communication interface structure and electronic equipments, improve contact jaw
Sub the problem of being easily corroded or short circuit occurs.
In order to achieve the above object, the technical solution adopted by the present invention is：A kind of communication interface structure, for docking
Communication interface connects；A kind of communication interface structure connect for the communication interface with docking, which is characterized in that including circuit board
Substrate, the edge of the circuit board substrate have connecting plate, contact terminal and connecting line are provided on the circuit board substrate,
The contact terminal with the communication interface of the docking for connecting, and the contact terminal is arranged on the connecting plate, institute
Connecting line is stated for being correspondingly connected with the contact terminal.
The beneficial effects of the invention are as follows：Contact terminal is directly made on circuit board substrate, is eliminated in the prior art
The tongue piece that plastic cement makes, improve due to tongue piece made of plastic cement and caused by the contact terminal be easily corroded or occur short
The problem of road.
Description of the drawings
Fig. 1 shows the side sectional views of communication interface socket in the prior art；
Fig. 2 represents the side sectional view of communication interface socket in one embodiment of the embodiment of the present invention；
Fig. 3 represents to set contact terminal connection diagram in one embodiment of the embodiment of the present invention on circuit board substrate；
Fig. 4 represents the side sectional view of communication interface socket in another embodiment of the embodiment of the present invention；
Fig. 5 represents to set the connection diagram of contact terminal in another embodiment of the embodiment of the present invention on circuit board substrate
One；
Fig. 6 represents to set the connection diagram of contact terminal in another embodiment of the embodiment of the present invention on circuit board substrate
Two；
Fig. 7 represents the side sectional view of Fig. 6.
Specific embodiment
The feature and principle of the present invention are described in detail below in conjunction with attached drawing, illustrated embodiment is only used for explaining this hair
It is bright, protection scope of the present invention is not limited with this.
As illustrated in figs. 2-7, the present embodiment provides a kind of communication interface structures, are connect for the communication interface with docking；Packet
Circuit board substrate 4 is included, the edge of the circuit board substrate 4 has connecting plate 41, is provided with and is used on the circuit board substrate 4
The contact terminal 1 being connect with the communication interface of the docking and the connecting line 2 being correspondingly connected with the contact terminal 1, it is described to connect
Contravention is arranged on the connecting plate 41.
The connecting plate 41 and the circuit board substrate 4 are integral structures, and the contact terminal 1 is set to the connecting plate
On 41, that is to say, that the contact terminal 1 is directly made on circuit board substrate 4, eliminates what plastic cement in the prior art made
Tongue piece, improve due to tongue piece made of plastic cement and caused by the contact terminal 1 the problem of being easily corroded or short circuit occurs,
And reduce cost of manufacture.
The communication interface structure further includes shell 3, and the shell 3 includes being used for being inserted into for the communication interface of the docking
Openend and the blind end that is oppositely arranged with the openend, the shell 3 cover at outside the connecting plate 41.It is described outer
The setting of shell 3 defines the space that the communication interface of docking is inserted into, conducive to the connection of the communication interface of docking.
The circuit board substrate 4 is structure as a whole with the connecting plate 41, and the circuit board substrate 4 is located at the shell 3
Outside.
In one embodiment of the present embodiment, the circuit board substrate 4 is equipped with circuit, and the contact terminal 1 is by described
Connecting line 2 is connect with the circuit on the circuit board substrate 4.That is, the circuit board of the circuit board substrate 4 and electronic equipment integrates
It is structure as a whole, that is to say, that the circuit board substrate 4 directly uses the circuit board of electronic equipment, the communication interface structure
It directly makes and is formed on the circuit board of electronic equipment, as shown in Figures 2 and 3.
The circuit board substrate 4 includes the first surface and second surface that are disposed opposite to each other, according to actual needs, described first
The contact terminal 1 and the connecting line 2 are provided on surface or the second surface, that is, only in the side of circuit board substrate 4
Surface sets the contact terminal and the connecting line 2；Alternatively, it is respectively provided on the first surface and the second surface
State contact terminal 1 and the connecting line 2.
The contact terminal 1 and the connecting line 2 on the same surface of the circuit board substrate 4 are using etching mode
The integral structure of formation, but be not limited thereto.
In another embodiment of the present embodiment, it is additionally provided on the circuit board substrate 4 for the electricity with electronic equipment
The solder pad 5 of road plate welding, one end of the connecting line 2 are correspondingly connected with the contact terminal 1, the connecting line 2 it is another
End is correspondingly connected with the solder pad 5, as shown in figure 4, the solder pad 5 is set to the outside of the shell 3.
The circuit board of the circuit board substrate 4 and electronic equipment is separate structure, and the circuit board substrate 4 is independently arranged,
I.e. described communication interface structure is separately set with corresponding electronic equipment, when communication interface structure is damaged, only needs to change phase
The communication interface structure answered, the whole circuit board without replacing electronic equipment, easy to repair and replacement, and reduce cost.
As shown in figure 5, the circuit board substrate 4 includes the first surface and second surface that are disposed opposite to each other, first table
The contact terminal 1, the connecting line 2 and the solder pad 5, the solder pad 5 and the connecting line 2 are provided on face
It is correspondingly connected with, alternatively,
The contact terminal 1, the connecting line 2 and the solder pad 5, the welding are provided on the second surface
Pad 5 is correspondingly connected with the connecting line 2.
As shown in Figure 6 and Figure 7, the circuit board substrate 4 includes the first surface and second surface that are disposed opposite to each other, and described the
The contact terminal 1 and the connecting line 2 are both provided on one surface and the second surface,
The solder pad 5 includes the first weld part 6 and the second weld part 7, and first weld part 6 is arranged on described the
On one surface, and first weld part 6 is correspondingly connected with the connecting line 2 on the first surface, and second weld part 7 is set
It puts on the first surface, and second weld part 7 is arranged at intervals with first weld part 6, the circuit board substrate 4
On the 7 corresponding position of the second weld part is being provided with through-hole, second weld part 7 passes through the through-hole and described the
Connecting line 2 on two surfaces is correspondingly connected with.
The welding being correspondingly connected with corresponding connecting line 2 is set respectively on the first surface and the second surface
Portion, due to being respectively provided with weld part in the first surface of circuit board substrate 4 and the second surface, manufacture craft difficulty is high,
In order to reduce manufacture craft difficulty, in the present embodiment, first weld part 6 and second weld part 7 are set to same table
On face, first weld part 6 is connected with the 11 corresponding connecting line 2 of the first contact terminal being set on the first surface,
Second weld part, the 7 corresponding position is being provided with through-hole on the circuit board substrate 4, second weld part 7 passes through
The through-hole is correspondingly connected with the 12 corresponding connecting line 2 of the second contact terminal on the second surface.
Above structure is provided with conducive to the design of special USB contact terminals, and such as by Vbus, (one in contact terminal connects
Contact) with other contact point designs in contact terminal in different sides, solving Vbus, (one in contact terminal contacts with D-
Point) between problems of electromigration, and improve and be located at connecing on two opposite surfaces of tongue piece on Type-c USB (c-type UCB interfaces)
Short circuit problem between contravention.
In order to realize being correspondingly connected with for second weld part 7 and the connecting line 2 on the second surface, the through-hole
Conductive layer 9 is provided on side wall, according to actual needs, one end of the conductive layer 9, which extends outwardly, is covered in second welding
At the periphery of the through-hole in portion 7, the other end of the conductive layer 9 extend outwardly be covered in it is described on the second surface
At the periphery of through-hole.
In the present embodiment, the contact terminal 1 and the connecting line 2 on the same surface of the circuit board substrate 4 are
The integral structure formed using etching mode.
In the present embodiment, the contact terminal 1, the connecting line 2 and first weld part 6 on the first surface
For the integral structure formed using etching mode.
In the present embodiment, the circuit board 4 is printing board PCB or flexible circuit board FPC.
The above is present pre-ferred embodiments, it should be noted that those skilled in the art,
Under the premise of not departing from principle of the present invention, several improvements and modifications can also be made, these improvements and modifications also should be regarded as
The scope of the present invention.
Claims (10)
1. a kind of communication interface structure connect for the communication interface with docking, which is characterized in that including circuit board substrate, institute
Stating the edge of circuit board substrate has connecting plate, and contact terminal and connecting line are provided on the circuit board substrate, described to connect
Contravention with the communication interface of the docking for connecting, and the contact terminal is arranged on the connecting plate, the connection
Line is used to be correspondingly connected with the contact terminal.
2. communication interface structure according to claim 1, which is characterized in that the communication interface structure further includes shell,
The jacket is set on outside the connecting plate, and the enclosure has the space that the communication interface for docking is inserted into, institute
State the outside that circuit board substrate is located at the shell.
3. communication interface structure according to claim 1, which is characterized in that the circuit board substrate is equipped with circuit, institute
Contact terminal is stated to connect with the circuit on the circuit board substrate by the connecting line.
4. communication interface structure according to claim 3, which is characterized in that the connecting plate includes be disposed opposite to each other first
The contact terminal and the connection are both provided on surface and second surface, the first surface and/or the second surface
Line.
5. communication interface structure according to claim 4, which is characterized in that on the same surface of the circuit board substrate
The contact terminal and the connecting line are the integral structure formed using etching mode.
6. communication interface structure according to claim 2, which is characterized in that be additionally provided with and be used on the circuit board substrate
With the solder pad of the welding circuit board of electronic equipment, one end of the connecting line connects the contact terminal, the connecting line
The other end connect the solder pad.
7. communication interface structure according to claim 6, which is characterized in that the circuit board substrate includes what is be disposed opposite to each other
First surface and second surface are provided with the contact terminal, the connecting line and the solder pad on the first surface,
The solder pad is correspondingly connected with the connecting line, alternatively,
Be provided with the contact terminal, the connecting line and the solder pad on the second surface, the solder pad with
The connecting line is correspondingly connected with.
8. communication interface structure according to claim 6, which is characterized in that the circuit board substrate includes what is be disposed opposite to each other
The contact terminal and the connection are both provided on first surface and second surface, the first surface and the second surface
Line,
The solder pad includes the first weld part and the second weld part, and first weld part is arranged on the first surface
On, and first weld part is correspondingly connected with the connecting line on the first surface, second weld part is arranged on described
On first surface, and second weld part is arranged at intervals with first weld part,
Position corresponding with second weld part is provided with through-hole on the circuit board substrate, second weld part passes through
The through-hole is correspondingly connected with the connecting line on the second surface；
Conductive layer is provided on the side wall of the through-hole.
9. communication interface structure according to claim 8, which is characterized in that on the same surface of the circuit board substrate
The contact terminal and the connecting line are the integral structure formed using etching mode.
10. a kind of electronic equipment, which is characterized in that including communication interface structure as described in any one of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711417797.5A CN108173019B (en) | 2017-12-25 | 2017-12-25 | Communication interface structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711417797.5A CN108173019B (en) | 2017-12-25 | 2017-12-25 | Communication interface structure and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108173019A true CN108173019A (en) | 2018-06-15 |
| CN108173019B CN108173019B (en) | 2019-11-26 |
Family
ID=62520328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711417797.5A Active CN108173019B (en) | 2017-12-25 | 2017-12-25 | Communication interface structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108173019B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109586068A (en) * | 2019-01-08 | 2019-04-05 | 广东杰思通讯股份有限公司 | A kind of electric connector socket |
| CN110854573A (en) * | 2019-11-22 | 2020-02-28 | 维沃移动通信有限公司 | Plug of data transmission line and data transmission line |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5342208A (en) * | 1992-02-19 | 1994-08-30 | Nec Corporation | Package connector apparatus |
| CN204633058U (en) * | 2015-05-18 | 2015-09-09 | 特通科技有限公司 | USB Type-C connector modules |
| CN205693026U (en) * | 2016-06-03 | 2016-11-16 | 巧连科技股份有限公司 | Rigid circuit board connecting device |
| CN206340697U (en) * | 2016-11-23 | 2017-07-18 | 巧连科技股份有限公司 | USB attachment means |
| CN206674294U (en) * | 2017-03-09 | 2017-11-24 | 鹏鼎控股(深圳)股份有限公司 | USB Type C board structure of circuit and USB Type C connectors |
-
2017
- 2017-12-25 CN CN201711417797.5A patent/CN108173019B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5342208A (en) * | 1992-02-19 | 1994-08-30 | Nec Corporation | Package connector apparatus |
| CN204633058U (en) * | 2015-05-18 | 2015-09-09 | 特通科技有限公司 | USB Type-C connector modules |
| CN205693026U (en) * | 2016-06-03 | 2016-11-16 | 巧连科技股份有限公司 | Rigid circuit board connecting device |
| CN206340697U (en) * | 2016-11-23 | 2017-07-18 | 巧连科技股份有限公司 | USB attachment means |
| CN206674294U (en) * | 2017-03-09 | 2017-11-24 | 鹏鼎控股(深圳)股份有限公司 | USB Type C board structure of circuit and USB Type C connectors |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109586068A (en) * | 2019-01-08 | 2019-04-05 | 广东杰思通讯股份有限公司 | A kind of electric connector socket |
| CN109586068B (en) * | 2019-01-08 | 2024-02-20 | 广东杰思通讯股份有限公司 | Electric connector socket |
| CN110854573A (en) * | 2019-11-22 | 2020-02-28 | 维沃移动通信有限公司 | Plug of data transmission line and data transmission line |
| CN110854573B (en) * | 2019-11-22 | 2021-02-09 | 维沃移动通信有限公司 | Plug of data transmission line and data transmission line |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108173019B (en) | 2019-11-26 |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |