CN108170570A - Circuit board systems and circuit board detection method under the full submerged conditions of liquid - Google Patents
Circuit board systems and circuit board detection method under the full submerged conditions of liquid Download PDFInfo
- Publication number
- CN108170570A CN108170570A CN201711430966.9A CN201711430966A CN108170570A CN 108170570 A CN108170570 A CN 108170570A CN 201711430966 A CN201711430966 A CN 201711430966A CN 108170570 A CN108170570 A CN 108170570A
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- circuit board
- master chip
- shell
- coolant
- display
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
- G06F11/26—Functional testing
- G06F11/261—Functional testing by simulating additional hardware, e.g. fault simulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Quality & Reliability (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The present invention provides the circuit board systems and circuit board detection method under the full submerged conditions of liquid.Circuit board systems include：Circuit board, including power panel and master chip；And shell, the shell accommodate coolant, wherein, the power panel is arranged on except the shell and the master chip is placed in a manner of submerging entirely in the coolant.The present invention provides the circuit board systems freezed using liquid coolant.Can fully it be freezed to master chip by the way that master chip is arranged in a manner of submerging in coolant, the temperature for avoiding master chip significantly increases.Power panel is arranged on except coolant to be adversely affected to avoid coolant caused by power panel.
Description
Technical field
This invention relates generally to field of computer technology and technical field of measurement and test, more specifically, circuit board systems and electricity
Road board measuring method.
Background technology
Liquid refrigeration technique is the change technology of Future Data center refrigeration modes, its social benefit and is reducing enterprise's fortune
There is the advantage of highly significant in terms of battalion's cost.So-called liquid is cold, refers to through certain liquid, for example, water, fluorination liquid or certain
Special nonconducting oil, it is to substitute air, the devices such as CPU, memory bar, chipset, expansion card are generated at runtime
Heat is taken away.The cold working method of full immersion liquid is that device even complete machine is immersed directly in liquid, then pass through liquid
Cycle leads out heat, completely without fan.
Full immersion system biggest advantage is that PUE is worth reducing, and PUE values refer to all energy and IT of data center's consumption
The ratio between energy of apparatus of load consumption.PUE values represent that the efficiency of data center is better closer to 1.0, and green degree is higher,
It is namely more energy saving.
At present there has been no the complete design method patent of the similar high-speed hardware board under full immersion system, only partly connect
The research of respective module that Jie Qi manufacturers, liquid manufacturer etc. do.
Current each manufacturer's board is designed for wind-cooling heat dissipating or cold plate heat dissipation, and full immersion liquid is directed to there is no a set of
Guide for method under body design conditions, immersion design are huge with traditional design difference, it is impossible to which immersion hardware board is developed
Play directive significance.
Invention content
The present invention provides the circuit board systems that can be solved the above problems for drawbacks described above in the presence of the prior art
And circuit board detection method.
According to an aspect of the present invention, a kind of circuit board systems are provided to include：Circuit board, including power panel and main core
Piece；And shell, the shell accommodate coolant, wherein, the power panel is arranged on except the shell and the master
Chip is placed in a manner of submerging entirely in the coolant.
Preferably, the shell includes the seal groove of setting on the housing, and the power panel passes through the seal groove
It extends to except the shell.
Preferably, it is provided with aluminum capacitor on the power panel.
Preferably, circuit board systems further include fluid sealant, for sealing the gap between the power panel and the shell.
Preferably, circuit board systems further include：Display/debugging module, be arranged on except shell and pass through seal nipple with
The master chip connection.
Preferably, the display/debugging module is connect by the interface being disposed thereon with display or debugging acid.
Preferably, the shell is the transparent outer cover of sealing in order to watching the circuit board.
Preferably, the master chip includes CPU, memory bar, chipset and expansion card.
Preferably, circuit board systems further include the reinforcing boiling cooling fin being arranged on the master chip.
According to another aspect of the present invention, it provides a kind of circuit board detection method and includes power panel and main core including providing
The circuit board of piece；The power panel is arranged on except shell and is arranged on the master chip in a manner of submerging entirely described
In shell, wherein, the shell accommodates coolant；And the master chip of the test circuit board is with the determining circuit board
Reliability.
Preferably, display/debugging module except shell is connect with the master chip by seal nipple.
Preferably, it is provided with interface on the display/debugging module；By the interface by the display/debugging module
It is connect with display or debugging acid.
Preferably, the master chip is tested to determine that the reliability of the circuit board further comprises：In different time points
Place measures the impedance value for being previously positioned at the component in the coolant；It is obtained in a manner of curve graph or formula relative to every
The impedance value at a time point；And the impedance value of the component devices is predicted using interpolation fitting mode.
Preferably, the master chip of the circuit board is tested to determine that the reliability of the circuit board further comprises：Not
With the voltage magnitude and electric current for measuring each pin on the master chip at time point via the display/debugging module；With
Curve graph or the mode of formula obtain the voltage magnitude and electric current of each pin relative to each time point；And intended with interpolation
Conjunction mode predicts the voltage magnitude and electric current of each pin.
Preferably, circuit board detection method further comprises：It selects without impregnating the plank being precipitated as the circuit board
Plank.
Preferably, dielectric constant is replaced with to the dielectric constant of the coolant by emulation tool, to optimize component
Impedance and the master chip wires design.
The present invention provided by the present invention is that mainboard and its test method can be full submergence server under full submerged conditions
Mainboard or board provide design guidance and reference.
Description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Some bright embodiments, for those of ordinary skill in the art, without having to pay creative labor, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structure chart of circuit board according to an embodiment of the invention；
Fig. 2 is the design diagram of submergence circuit board according to an embodiment of the invention；
Fig. 3 is the schematic diagram that circuit board according to an embodiment of the invention is connect with display/debugging module；
Fig. 4 is the schematic diagram of power panel and master chip according to an embodiment of the invention；And
Fig. 5 is the flow chart of circuit board detection method according to an embodiment of the invention.
Specific embodiment
Purpose, technical scheme and advantage to make the embodiment of the present invention are clearer, below in conjunction with the embodiment of the present invention
In attached drawing, the technical solution in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
All other embodiments obtained without creative efforts shall fall within the protection scope of the present invention.
Fig. 1 is the structure chart of circuit board according to an embodiment of the invention.It hereinafter, will be with reference to Fig. 1, to circuit board systems
It is described.
With reference to Fig. 1, circuit board systems 100 according to an embodiment of the invention include：Circuit board 102, including power panel 106
With master chip 104；And shell 110, shell accommodate coolant 108, wherein, power panel 106 is arranged on except shell 110 simultaneously
And master chip 104 is placed in a manner of submerging entirely in coolant 108.
The present invention provides the circuit board systems freezed using liquid coolant.By by master chip in a manner of submerging
It is arranged in coolant and can fully freeze to master chip, the temperature for avoiding master chip significantly increases.Power panel is arranged on
It is adversely affected caused by power panel to avoid coolant except coolant.
Fig. 3 is the schematic diagram that circuit board according to an embodiment of the invention is connect with display/debugging module.Fig. 4 is basis
The power panel of the embodiment of the present invention and the schematic diagram of master chip.Hereinafter, it will be carried out with reference to Fig. 3-4 pairs of circuit board systems detailed
Description.
With reference to Fig. 4, circuit board systems according to an embodiment of the invention include：Circuit board (or pcb board) 410, including
Power panel 408 and master chip 404；And shell 400, shell 400 accommodate coolant (or liquid) 402, wherein, power panel
408 are arranged on except shell 400 and master chip 404 is placed in a manner of submerging entirely in coolant 402.Shell 400 includes
The seal groove 406 of setting on the shell, power panel 408 are extended to across seal groove 406 except shell 400.In Fig. 4, it seals
Slot is arranged on a side wall of shell.Seal groove is arranged on other positions (such as being arranged on side wall or the top of shell)
Embodiment within the scope of the present invention.Aluminum capacitor 412 is provided on power panel 408.For example, it is provided with four in Fig. 4
Aluminum capacitor.The aluminum capacitor of other quantity (for example, 1,8 or 3 etc.) is set within the scope of the present invention.Wherein, it is electric
Road plate system further includes fluid sealant, for sealing the gap between power panel and shell.
Display/debugging module is described in below with reference to Fig. 3.Circuit board systems further include：Display/debugging module
308, it is arranged on except shell 300 and passes through seal nipple 306 and connect with master chip 304.Display/debugging (Debug) module 308
It is connect by the interface 310 being disposed thereon with display or debugging acid.Shell 300 is the transparent outer cover of sealing in order to seeing
See circuit board.Master chip includes CPU, memory bar, chipset and expansion card.In addition, circuit board systems, which further include, is arranged on main core
The reinforcing boiling cooling fin of on piece.
Hereinafter, it will be illustrated with reference to Fig. 2-4 pairs of circuit boards.Fig. 2 is submergence according to an embodiment of the invention
The design diagram of circuit board.It submerges in board designing scheme comprising following several parts：Immersion liquid type selecting 220, display/
Debug modules 202, component reliability 204, heat dissipation/Power Management Design 206, signal testing 208, PCB material type selecting 210, high speed
Wires design 212, connector customization optimization 214.Wherein, most crucial part is immersion liquid type selecting 220, because with other each
Module is all relevant, so needing to consider carefully.
Because be full submergence mode when high speed board designs, as outline border is the shell 300 of a sealing in Fig. 3, outside
Shell is designed to that pellucidity can observe internal liquid submergence situation.It can be master chip 304 additionally by seal nipple 306
Debug/UART mouthfuls/VGA, which is picked out, to be come, and the debugging work of display or respective chip is got involved in by display/Debug modules 308
On tool.
Heat dissipation design scheme：Heat sink conception needs to consider that master chip is directly immersed into liquid the solution that whether can directly radiate
Certainly, if not all right need to add reinforcing boiling heat sink design, ensure that there is no problem for the heat dissipation of chip (Die) temperature.
Power Management Design scheme：Due to 412 characteristic of aluminum capacitor, easily outflow electrolytic liquid is impregnated, causes capacitance bigger than normal excessive
Even fail.So in Power Management Design scheme, pcb board 410 is individually stretched out a part, aluminum capacitor 412 is placed on full submergence
400 outside of casing, since the capacitance of aluminum capacitor 412 is especially big, filter radius coverage area is very big, can cover pcb board 410
It is internal.So dexterously solving aluminum capacitor impregnates easily outflow electrolytic liquid risk.
Fig. 5 is the flow chart of circuit board detection method according to an embodiment of the invention.It hereinafter, will be to circuit board testing
Method is described.
With reference to Fig. 5, circuit board detection method 500 according to an embodiment of the invention includes：In step 502, packet is provided
Include the circuit board of power panel and master chip；In step 504, power panel is arranged on except shell and soaks master chip entirely
Mode not is set inside the shell, wherein, shell accommodates coolant；And in step 506, the master chip of test circuit plate
To determine the reliability of circuit board.
Display/debugging module except shell is connect with master chip by seal nipple.On display/debugging module
It is provided with interface；Display/debugging module is connect with display or debugging acid by interface.The other configurations of circuit board with it is upper
Circuit board systems described in text are identical, and which is not described herein again.
Specifically, test master chip is further comprised with the reliability of determining circuit board：Place measures pre- in different time points
First it is placed on the impedance value of the component in coolant；The resistance relative to each time point is obtained in a manner of curve graph or formula
Anti- value；And the impedance value of component devices is predicted using interpolation fitting mode.Specifically, the master chip of test circuit plate is with true
The reliability for determining circuit board further comprises：Place measures each on master chip via display/debugging module in different time points
The voltage magnitude and electric current of pin；The voltage of each pin relative to each time point is obtained in a manner of curve graph or formula
Amplitude and electric current；And predict the voltage magnitude of each pin and electric current in a manner of interpolation fitting.In addition, circuit board testing side
Method further comprises：Select the plank without impregnating the plank being precipitated as circuit board.It is in addition, by emulation tool that dielectric is normal
Number replaces with the dielectric constant of coolant, to optimize the wires design of the impedance of component and master chip.
Component reliability testing scheme：
Need the reliability of component in abundant test liquid soaking process, by chip and, the immersions such as capacitance-resistance in a liquid 1
It a month, 3 months, 6 months and is taken out after 12 months, remeasures capacitance-resistance capacitance, check whether to change, and depicted respectively every
The capacitance at a time point, then capacitance is changed according to capacitor's capacity after piecewise interpolation fit approach prediction 3-5.
Master chip needs to measure the amplitude and current conditions of specific each pin, also need 1 month, 3 months, 6 months,
It measures respectively within 12 months and makes interpolative prediction.
Signal testing designing scheme：Respective chip test pin is drawn by display/Debug interfaces, it is corresponding such as JTAG mouthfuls
The corresponding HDT circuits of XDP, AMD CPU platforms of server field such as Intel platforms are drawn, and it is abundant can to measure concrete signal
It spends (Margin).
PCB material selecting type scheme：It needs to do immersion test with liquid, pcb board material cannot occur to impregnate precipitation problem.Separately
Outside, the green oil of covering pcb board material needs verification of individually doing experiment, and guarantee will not generate chemical reaction.
High-speed wire-layout designing scheme：Work is emulated by HFSS (High Frequency Structure Simulator) etc.
Dk is designed to liquid D k, re-optimization impedance and the design of PCB circuits by tool from the airhood of normal state simulation, wherein, Dk is opposite
Dielectric constant has filled certain medium and the in a vacuum ratio of capacitance in same capacitor, represents that dielectric stores in the electric field
The relative ability of electrostatic energy.
Connector customization/optimization design：Connector is the Dk=1 in vacuum, so connector according to conceptual design in vacuum
It needs to readjust pin delay (pin delay) and impedance, and do corresponding compensation deals on pcb board.
The present invention is a kind of motherboard design method under full submerged conditions, with this solution idiographic flow and method, Ke Yiwei
Full submergence server master board or board provide design guidance and reference.Specifically, the present invention includes following advantage：Provide entirety
The method of module design and each module item specifically design；Display/Debug modules and interface thinking propose；Component can
By property test method；Aluminum capacitor avoids submergence design method；And hardware board technology and liquid in the case of new full submergence
Dk values decline, and stability improves.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe is described in detail the present invention with reference to foregoing embodiments, it will be understood by those of ordinary skill in the art that：Its according to
Can so modify to the technical solution recorded in foregoing embodiments either to which part or all technical features into
Row equivalent replacement；And these modifications or replacement, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (16)
1. a kind of circuit board systems, which is characterized in that including：
Circuit board, including power panel and master chip；And
Shell, the shell accommodate coolant, wherein, the power panel is arranged on except the shell and the master chip
It is placed in a manner of submerging entirely in the coolant.
2. circuit board systems according to claim 1, which is characterized in that the shell includes setting on the housing
Seal groove, the power panel are extended to across the seal groove except the shell.
3. circuit board systems according to claim 1, which is characterized in that be provided with aluminum capacitor on the power panel.
4. circuit board systems according to claim 2, which is characterized in that fluid sealant is further included, for sealing the power supply
Gap between plate and the shell.
5. circuit board systems according to claim 1, which is characterized in that further include：Display/debugging module is arranged on outer
Except shell and pass through seal nipple and connect with the master chip.
6. circuit board systems according to claim 5, which is characterized in that the display/debugging module is by being arranged on it
On interface connect with display or debugging acid.
7. circuit board systems according to claim 1, which is characterized in that the shell be sealing transparent outer cover in order to
Watch the circuit board.
8. circuit board systems according to claim 1, which is characterized in that the master chip includes CPU, memory bar, chip
Group and expansion card.
9. circuit board systems according to claim 1, which is characterized in that further include the reinforcing being arranged on the master chip
Boil cooling fin.
10. a kind of circuit board detection method, which is characterized in that including：
The circuit board for including power panel and master chip is provided；
The power panel is arranged on except shell and the master chip is arranged in a manner of submerging entirely in the shell,
Wherein, the shell accommodates coolant；And
The master chip of the circuit board is tested to determine the reliability of the circuit board.
11. circuit board detection method according to claim 10, which is characterized in that by seal nipple will be located at shell it
Outer display/debugging module is connect with the master chip.
12. circuit board detection method according to claim 11, which is characterized in that
Interface is provided on the display/debugging module；
Display/the debugging module is connect with display or debugging acid by the interface.
13. circuit board detection method according to claim 11, which is characterized in that
The master chip is tested to determine that the reliability of the circuit board further comprises：
Place measures the impedance value for being previously positioned at the component in the coolant in different time points；
The impedance value relative to each time point is obtained in a manner of curve graph or formula；And
The impedance value of the component devices is predicted using interpolation fitting mode.
14. circuit board detection method according to claim 11, which is characterized in that test the master chip of the circuit board with
Determine that the reliability of the circuit board further comprises：
In different time points place measured via the display/debugging module each pin on the master chip voltage magnitude and
Electric current；
The voltage magnitude and electric current of each pin relative to each time point are obtained in a manner of curve graph or formula；And
The voltage magnitude and electric current of each pin are predicted in a manner of interpolation fitting.
15. circuit board detection method according to claim 10, which is characterized in that further comprise：
Select the plank without impregnating the plank being precipitated as the circuit board.
16. circuit board detection method according to claim 10, which is characterized in that replaced dielectric constant by emulation tool
The dielectric constant of the coolant is changed to, to optimize the wires design of the impedance of component and the master chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711430966.9A CN108170570B (en) | 2017-12-26 | 2017-12-26 | Circuit board system and circuit board testing method under liquid full immersion condition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711430966.9A CN108170570B (en) | 2017-12-26 | 2017-12-26 | Circuit board system and circuit board testing method under liquid full immersion condition |
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| Publication Number | Publication Date |
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| CN108170570A true CN108170570A (en) | 2018-06-15 |
| CN108170570B CN108170570B (en) | 2021-08-10 |
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| CN201711430966.9A Active CN108170570B (en) | 2017-12-26 | 2017-12-26 | Circuit board system and circuit board testing method under liquid full immersion condition |
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Cited By (8)
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| CN109372590A (en) * | 2018-08-17 | 2019-02-22 | 曙光信息产业(北京)有限公司 | Dissipated heat recovery device and method |
| CN110971008A (en) * | 2018-09-28 | 2020-04-07 | 威刚科技股份有限公司 | Wireless charging device with heat dissipation function |
| CN111366838A (en) * | 2020-03-16 | 2020-07-03 | 华北电力大学 | Power device characteristic testing cavity in immersion cooling environment |
| CN111948513A (en) * | 2020-07-24 | 2020-11-17 | 武汉锐科光纤激光技术股份有限公司 | Chip temperature control equipment |
| CN111965520A (en) * | 2020-07-24 | 2020-11-20 | 武汉锐科光纤激光技术股份有限公司 | Chip testing equipment |
| CN111965519A (en) * | 2020-07-24 | 2020-11-20 | 武汉锐科光纤激光技术股份有限公司 | Chip testing equipment |
| CN112255474A (en) * | 2020-09-10 | 2021-01-22 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Chip near-field scanning system and method |
| WO2022095457A1 (en) * | 2020-11-05 | 2022-05-12 | 华为技术有限公司 | Electronic apparatus, vehicle-mounted heat dissipation system and vehicle |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109372590B (en) * | 2018-08-17 | 2022-02-25 | 曙光信息产业(北京)有限公司 | Heat dissipation recovery device and method |
| CN110971008A (en) * | 2018-09-28 | 2020-04-07 | 威刚科技股份有限公司 | Wireless charging device with heat dissipation function |
| CN111366838A (en) * | 2020-03-16 | 2020-07-03 | 华北电力大学 | Power device characteristic testing cavity in immersion cooling environment |
| CN111948513A (en) * | 2020-07-24 | 2020-11-17 | 武汉锐科光纤激光技术股份有限公司 | Chip temperature control equipment |
| CN111965520A (en) * | 2020-07-24 | 2020-11-20 | 武汉锐科光纤激光技术股份有限公司 | Chip testing equipment |
| CN111965519A (en) * | 2020-07-24 | 2020-11-20 | 武汉锐科光纤激光技术股份有限公司 | Chip testing equipment |
| CN112255474A (en) * | 2020-09-10 | 2021-01-22 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Chip near-field scanning system and method |
| WO2022095457A1 (en) * | 2020-11-05 | 2022-05-12 | 华为技术有限公司 | Electronic apparatus, vehicle-mounted heat dissipation system and vehicle |
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