CN108161253A - A kind of method of trepanning on double-sided copper-clad ceramic substrate single side copper foil - Google Patents
A kind of method of trepanning on double-sided copper-clad ceramic substrate single side copper foil Download PDFInfo
- Publication number
- CN108161253A CN108161253A CN201711116101.5A CN201711116101A CN108161253A CN 108161253 A CN108161253 A CN 108161253A CN 201711116101 A CN201711116101 A CN 201711116101A CN 108161253 A CN108161253 A CN 108161253A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- annulus
- single side
- trepanning
- inner ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 57
- 239000011889 copper foil Substances 0.000 title claims abstract description 51
- 239000000919 ceramic Substances 0.000 title claims abstract description 45
- 239000000758 substrate Substances 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims abstract description 9
- 238000005260 corrosion Methods 0.000 claims abstract description 17
- 230000007797 corrosion Effects 0.000 claims abstract description 17
- 238000005530 etching Methods 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 230000002093 peripheral effect Effects 0.000 claims abstract description 6
- 238000012937 correction Methods 0.000 claims description 6
- 238000013461 design Methods 0.000 claims description 6
- 239000006227 byproduct Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000000047 product Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4828—Etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The method that the present invention provides trepanning on a kind of double-sided copper-clad ceramic substrate single side copper foil, in deisgn product film drawing, is designed to that an annulus rather than a direct circle, annulus inner ring diameter change with copper thickness by the circular hole needed out on single side copper foil；Copper foil at annulus is etched away during corrosion, and annulus inner ring bottom does not etch with ceramics and is still connected.Etching solution will not flow into another side copper foil inner surface at annulus inner ring bottom through ceramic hole.After corrosion, annulus inner peripheral surface is touched with hand or tool, inner ring can disconnect and fall down with ceramics, and circular hole is formed on single side copper foil；Product yield and production efficiency are high.
Description
Technical field
The invention belongs to semiconductor manufacturing, LED, optical communication field, especially suitable for semiconductor cooler, LED, power half
The DBC substrate manufactures such as conductor.
Background technology
For certain special occasions double-sided copper-clad ceramic substrate (DBC) need to the trepanning on single side copper foil 1, another side copper foil
2 not trepannings, welding device 3 pass through hole on the copper foil of single side trepanning and ceramic wafer 5, are welded with the copper foil inner surface of another side not trepanning
Connect 4.See Fig. 1.It is relatively difficult that such product is made with common film design method：Etching solution can pass through single side copper foil during corrosion
Upper hole is flowed into another side copper foil inner surface, makes its surface corrosion, causes product rejection.
Invention content
In view of the problems of the existing technology, the present invention provides trepanning on a kind of double-sided copper-clad ceramic substrate single side copper foil
Method, by the design of film figure, the hole on single side copper foil can directly etch to obtain, the copper foil inner surface non-porous to another side
There is no any influence, production efficiency greatly improves.
The technical scheme is that：The method of trepanning, specific steps on a kind of double-sided copper-clad ceramic substrate single side copper foil
It is as follows：
Step 1: by product size requirement, the laser opening on ceramic wafer, the ceramic wafer Circularhole diameter opened up is d；
Step 2: it is covered with copper foil in the ceramic wafer positive and negative described in step 1；
Step 3: open the film size of circular hole on design single side copper foil, trepanning is designed to annulus, circle ring center position with
Ceramic wafer center of circular hole position is identical；Annulus inner ring diameter D is different with copper thickness and changes：
D (mm)=d+2* (corrodes correction amount in copper foil side)
Step 4: ensure that copper foil etching is clean at annulus, while annulus inner ring bottom does not etch still phase with ceramics during corrosion
Even；So that etching solution may not flow into another side copper foil inner surface, but annulus inner ring bottom and the ceramic thickness very book that is connected；
Step 5: touching annulus inner peripheral surface after corrosion, inner ring, which can be disconnected and be fallen down with ceramics, completes single side copper
Trepanning on foil.
Further, in step 5, annulus inner peripheral surface is touched with hand after corrosion, inner ring can disconnect simultaneously with ceramics
It falls down.It is convenient and efficient.
Further, in step 3, copper foil side corrosion correction amount is specific as follows：
The beneficial effects of the invention are as follows：
1st, in deisgn product film drawing, the circular hole needed out on single side copper foil is designed to an annulus rather than straight
A circle is connect, annulus inner ring diameter changes with copper thickness.
Copper foil at annulus is etched away when the 2nd, corroding, and annulus inner ring bottom does not etch with ceramics and is still connected.Etching solution is not
At annulus inner ring bottom another side copper foil inner surface can be flowed into through ceramic hole.After corrosion, annulus is touched with hand or tool
Inner peripheral surface, inner ring can disconnect and fall down with ceramics, and circular hole is formed on single side copper foil.
3rd, product yield and production efficiency are high.
Description of the drawings
Fig. 1 be for certain special occasions double-sided copper-clad ceramic substrate (DBC) need to the trepanning on single side copper foil, another side
Copper foil not trepanning, welding device pass through hole on the copper foil and ceramic wafer of single side trepanning, the copper foil inner surface with another side not trepanning
The schematic diagram of welding.
Fig. 2 is the schematic diagram that trepanning is designed to annulus by film size；
Fig. 3 is the schematic diagram corroded after annulus, and annulus inner ring bottom is not etched with ceramics to be still connected, and etching solution will not flow
Enter another side copper foil inner surface, but annulus inner ring bottom and the ceramic thickness very book that is connected.
Specific embodiment
The present invention is described further below in conjunction with the accompanying drawings.
The present invention is the design and system of the present invention below to solve problem of open on double-sided copper-clad ceramic substrate single side copper foil
Make step:
1. by product size requirement, the laser opening on ceramic wafer 5.
2. ceramic wafer positive and negative is covered with copper foil 1 and 2.
3. opening the film size of circular hole on design single side copper foil 1, trepanning is designed to annulus, circle ring center position and ceramics
Hole center is identical on plate.Annulus inner ring diameter D is different with copper thickness and changes：
D (mm)=d+2* (corrodes correction amount in copper foil side), and d is ceramic wafer Circularhole diameter
Schematic diagram after annulus film graph exposure, is shown in Fig. 2, and 7 be dry film in Fig. 2.
Wherein, corrosion correction amount in copper foil side is specific as follows：
4. ensure that copper foil etching is clean at annulus, while 6 bottom of annulus inner ring does not etch with ceramics and is still connected, and loses during corrosion
It carves liquid and may not flow into another side copper foil inner surface, but annulus inner ring bottom and the ceramic thickness very book that is connected.See Fig. 3.
5. it can be disconnected and fallen down with ceramics with 6 surface of hand or tool touching annulus inner ring, inner ring after corrosion.
6. device is welded by the copper foil inner surface of hole on ceramic wafer, single side copper foil and another side not trepanning, obtain required
Product
By inventing above, so that it may solve problem of open on double-sided copper-clad ceramic substrate single side copper foil by corrosion, improve
Production efficiency.
The above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (3)
1. a kind of method of trepanning on double-sided copper-clad ceramic substrate single side copper foil, it is characterised in that：It is as follows：
Step 1: by product size requirement, the laser opening on ceramic wafer, the ceramic wafer Circularhole diameter opened up is d；
Step 2: it is covered with copper foil in the ceramic wafer positive and negative described in step 1；
Step 3: opening the film size of circular hole on design single side copper foil, trepanning is designed to annulus, circle ring center position and ceramics
Plate center of circular hole position is identical；Annulus inner ring diameter D is different with copper thickness and changes：
D (mm)=d+2* (corrodes correction amount in copper foil side)
Step 4: ensure that copper foil etching is clean at annulus, while annulus inner ring bottom does not etch with ceramics and is still connected during corrosion；
Step 5: touching annulus inner peripheral surface after corrosion, inner ring can be disconnected and be fallen down with ceramics and complete on single side copper foil
Trepanning.
2. the method for trepanning on a kind of double-sided copper-clad ceramic substrate single side copper foil according to claim 1, it is characterised in that：
In step 5, annulus inner peripheral surface is touched with hand after corrosion, inner ring can disconnect and fall down with ceramics.
3. the method for trepanning on a kind of double-sided copper-clad ceramic substrate single side copper foil according to claim 1, it is characterised in that：
In step 3, copper foil side corrosion correction amount is specific as follows：
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711116101.5A CN108161253B (en) | 2017-11-13 | 2017-11-13 | A kind of method of aperture on double-sided copper-clad ceramic substrate single side copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711116101.5A CN108161253B (en) | 2017-11-13 | 2017-11-13 | A kind of method of aperture on double-sided copper-clad ceramic substrate single side copper foil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108161253A true CN108161253A (en) | 2018-06-15 |
| CN108161253B CN108161253B (en) | 2019-10-15 |
Family
ID=62527032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711116101.5A Active CN108161253B (en) | 2017-11-13 | 2017-11-13 | A kind of method of aperture on double-sided copper-clad ceramic substrate single side copper foil |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108161253B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004006584A (en) * | 2001-11-16 | 2004-01-08 | Mitsui Mining & Smelting Co Ltd | Method of manufacturing flexible printed wiring board and flexible printed wiring board obtained with the same method |
| CN101990372A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Method for manufacturing ceramic-based interconnected rigid circuit board |
| CN101990370A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Making method of ceramic matrix flex-rigid multilayer circuit board |
| CN101990371A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Manufacture method of ceramic-based interconnection flexible circuit board |
| CN101990373A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Method for manufacturing ceramic-based interconnected rigid flexible combined multilayer circuit board |
| CN104582293A (en) * | 2014-12-19 | 2015-04-29 | 泰州市金鼎电子有限公司 | Manufacturing method of ceramic-based circuit board |
| CN104602464A (en) * | 2015-01-23 | 2015-05-06 | 江门崇达电路技术有限公司 | Manufacturing method of copper-cladded ladder hole of circuit board ladder surface and application of manufacturing method |
| CN106658958A (en) * | 2015-10-28 | 2017-05-10 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
-
2017
- 2017-11-13 CN CN201711116101.5A patent/CN108161253B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004006584A (en) * | 2001-11-16 | 2004-01-08 | Mitsui Mining & Smelting Co Ltd | Method of manufacturing flexible printed wiring board and flexible printed wiring board obtained with the same method |
| CN101990372A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Method for manufacturing ceramic-based interconnected rigid circuit board |
| CN101990370A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Making method of ceramic matrix flex-rigid multilayer circuit board |
| CN101990371A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Manufacture method of ceramic-based interconnection flexible circuit board |
| CN101990373A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Method for manufacturing ceramic-based interconnected rigid flexible combined multilayer circuit board |
| CN104582293A (en) * | 2014-12-19 | 2015-04-29 | 泰州市金鼎电子有限公司 | Manufacturing method of ceramic-based circuit board |
| CN104602464A (en) * | 2015-01-23 | 2015-05-06 | 江门崇达电路技术有限公司 | Manufacturing method of copper-cladded ladder hole of circuit board ladder surface and application of manufacturing method |
| CN106658958A (en) * | 2015-10-28 | 2017-05-10 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108161253B (en) | 2019-10-15 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20201104 Address after: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Patentee after: JIANGSU FULEDE SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Address before: 200444 Baoshan District, Baoshan City Industrial Park Road, No., Hill Road, No. 181 Patentee before: SHANGHAI SHENHE THERMO-MAGNETICS ELECTRONICS Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |
Address after: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Patentee after: Jiangsu fulehua Semiconductor Technology Co.,Ltd. Address before: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Patentee before: JIANGSU FULEDE SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
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