CN108155164B - Micro-groove group heat sink and preparation method thereof - Google Patents
Micro-groove group heat sink and preparation method thereof Download PDFInfo
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- CN108155164B CN108155164B CN201810143983.2A CN201810143983A CN108155164B CN 108155164 B CN108155164 B CN 108155164B CN 201810143983 A CN201810143983 A CN 201810143983A CN 108155164 B CN108155164 B CN 108155164B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present disclosure provides a micro-groove group heat sink and a method of manufacturing the same, the micro-groove group heat sink comprising: the micro-groove group heat sink, the nano coating and the electrode, wherein the nano coating is generated on the surface of the micro-groove group heat sink and forms a micro-nano composite structure surface heat sink with the micro-groove group heat sink; the electrode is connected with a high-voltage power supply, and an electric field is applied to the liquid working medium on the heat sink on the surface of the micro-nano composite structure. According to the micro-groove group heat sink, through the hydrophilic nano coating on the surface, the surface energy and roughness of a liquid working medium in a micro-groove channel are enhanced, the surface wetting characteristic is improved, the directional traction effect is exerted on the liquid working medium through coulomb force, dielectrophoresis force and electric contraction force under the action of an electric field, the mass flow of the liquid working medium is increased, the thermal resistance is reduced, the capillary wetting length of the liquid working medium in the micro-groove channel is effectively increased, so that the heat sink continuously performs high-strength composite phase change heat exchange, and the heat exchange capacity of the heat sink is enhanced.
Description
Technical Field
The disclosure belongs to the field of enhanced heat exchange and electronic cooling, and in particular relates to a micro-groove group heat sink and a preparation method thereof.
Background
With the high-speed development of microelectronics and microelectromechanical systems, the integration level and performance of chips are continuously improved, so that the electronic equipment tends to be high-power and miniaturized. Therefore, the heating value of the device is also greatly increased, and if the heat cannot be timely discharged, the stability and the reliability of the device and the system are seriously reduced, and even the system is crashed. Heat dissipation is therefore a critical bottleneck in the design and manufacture of high power density power electronics. When the heat flux density exceeds 150W/cm < 2 >, the critical heat flux density of the conventional size surface for pool boiling phase change heat exchange is exceeded, the heat exchange process is called super heat exchange.
The micro-groove group composite phase change heat exchange technology is widely applied to high-power electronic equipment by the characteristics of high heat exchange coefficient, stable work and the like, and utilizes a composite phase change heat exchange mechanism of high-strength evaporation of an evaporation thin liquid film region near a three-phase contact line at an expansion meniscus formed by capillary force of a liquid working medium in a micro-groove and nuclear boiling of a thick liquid film region at an inherent meniscus to realize high-strength heat exchange capability, thereby being a novel high-performance microscale phase change heat exchange technology. However, under the condition of ultra-high heat flux density, the liquid working medium in the micro-groove group can be dried up from top to bottom along with the continuous increase of the heat flux density of the heat source, if the drying continuously occurs, the liquid working medium cannot be timely supplemented, high-strength evaporation on an expansion meniscus cannot occur, high-strength composite phase change heat exchange cannot be performed, and the heat exchange capability of the micro-groove group basic heat sink is greatly deteriorated. Therefore, the wetting length on the extended meniscus that can be achieved when the liquid working medium flows along the micro-grooves becomes critical to limit the heat transfer capability of the micro-groove group.
The micro-groove group composite phase change heat exchange technology and the technical device combined with the micro-groove group composite phase change heat exchange technology provided for the technical defects existing in the existing air cooling or liquid cooling heat exchange technology have certain effects on solving the heat dissipation problem of high-power electronic devices or systems, but have no obvious results. When the device receives larger and larger power and the heat flux density is higher and higher, the liquid working medium in the micro-groove is easy to dry up too early, so that the heat transfer is deteriorated. When the power of the heat source is larger, the heating power is larger, the heat flux density applied to the heating surface of the micro-groove group is larger, the liquid on the expansion meniscus in the micro-groove is heated and evaporated, the liquid film is gradually thinned, the flow resistance is increased, the wetting length is reduced, and the heat radiation capability is reduced.
Disclosure of Invention
First, the technical problem to be solved
The present disclosure provides a micro-groove group heat sink and a method for manufacturing the same, to at least partially solve the technical problems set forth above.
(II) technical scheme
According to one aspect of the present disclosure, there is provided a micro-groove group heat sink including:
a micro-groove group heat sink; the nano coating is generated on the surface of the micro-groove group heat sink and forms a micro-nano composite structure surface heat sink with the micro-groove group heat sink; and the electrode is connected with the high-voltage power supply and applies an electric field to the liquid working medium on the micro-nano composite structure surface heat sink.
In some embodiments of the present disclosure, the nanocoating is a nanoscale planar structure or nanoscale protrusions; the material of the nano coating is metal, metal oxide, metal fluoride, semiconductor material or organic high polymer coating; the thickness of the nano coating is 0-1000 nm.
In some embodiments of the present disclosure, the arrangement of electrodes is in the form of wire electrodes, mesh electrodes, plate electrodes, or needle electrodes.
In some embodiments of the present disclosure, the voltage of the high voltage power supply is 1 to 50kV.
In some embodiments of the present disclosure, the wire electrode has a radius of 0.001-1 mm, a length of 1-500 mm, and an axial perpendicular distance from the micro-groove group of 0.1-100 mm; the length and width of the reticular electrode are 1-100 mm, the thickness is 0.5-10 mm, the equivalent diameter of the mesh of the reticular electrode is 0.0001-1 mm, and the vertical distance between the reticular electrode and the axial direction of the micro groove group is 0.1-100 mm; the length and width of the plate electrode are 1-100 mm, the thickness is 0.5-10 mm, and the vertical spacing between the anode and the cathode of the plate electrode is 10-100 mm; the radius of curvature of the needle-shaped electrode tip is 0.01-1 mm, and the vertical distance between the needle-shaped electrode tip and the axial direction of the micro-groove group is 0.1-100 mm.
In some embodiments of the present disclosure, the liquid working medium of the micro-groove group heat sink of the wire electrode and the mesh electrode is an insulating working medium; the liquid working medium of the micro-groove group heat sink of the flat plate electrode and the needle electrode is insulating working medium or conductive working medium.
In some embodiments of the present disclosure, the insulating working fluid is FC72, R113, R123, R141, or n-pentane; the conductive working medium is distilled water or ethanol.
In some embodiments of the present disclosure, the surface structure of the micro-channel group heat sink is a micro-channel array structure, a nano-channel array structure, or a micro-nano composite channel array structure; the cross section of the micro-channel group heat sink is rectangular, triangular or trapezoidal, and the equivalent diameter is 10 -3 1000 μm; the surface material of the micro-groove group heat sink is metal, metal oxide, metal nitride, semiconductor material, glass or ceramic.
According to another aspect of the present disclosure, there is provided a method for preparing the micro-groove group heat sink, including the steps of:
step S1: preparing a micro-groove group heat sink;
step S2: preparing a nano coating and transferring the nano coating to the micro-groove group heat sink prepared in the step S1 to form a micro-nano composite structure surface heat sink;
step S3: and (3) switching on a power supply, and applying an electric field to the liquid working medium on the micro-nano composite structure surface heat sink prepared in the step (S2).
In some embodiments of the present disclosure, in step S2, the manner of transferring the nano-coating onto the micro-groove group base heat sink prepared in step S1 is spraying, sputtering or immersing.
In some embodiments of the present disclosure, the micro-nano composite structure surface heat sink has an included angle of 0 ° to 180 ° with the horizontal direction.
(III) beneficial effects
According to the technical scheme, the micro-groove group heat sink and the preparation method thereof have at least one of the following beneficial effects:
(1) The hydrophilic nano coating on the surface of the micro-nano composite structure has ultrahigh surface energy to strengthen the surface energy and roughness of the liquid working medium in the micro-channel and improve the surface wetting characteristic, so that the heat sink can perform continuous high-strength composite phase change heat exchange, and the heat exchange capacity of the heat sink is strengthened;
(2) The liquid working medium is subjected to directional traction through coulomb force, dielectrophoresis force and electric contraction force under the action of an electric field, so that the mass flow of the liquid working medium is increased, the thermal resistance is reduced, and the capillary wetting length of the liquid working medium in a micro-channel is effectively prolonged;
(3) The wetting length of the work of the micro-groove group is improved, the liquid working medium in the micro-groove channel is effectively and timely supplemented, the situation that the flow of the liquid working medium is blocked and dried under the condition of higher heat flux is prevented, the liquid film distribution is optimized, the high-strength evaporation heat exchange performance of the liquid working medium with an expansion meniscus in the micro-groove group is further enhanced, and the unstable heat exchange and deterioration caused by drying are avoided.
Drawings
Fig. 1 is a schematic diagram of a micro-groove group heat sink in a first embodiment of the disclosure.
Fig. 2 is a diagram of a group of micro-grooves with a nano-scale planar structure of a nano-coating according to a first embodiment of the present disclosure.
Fig. 3 is a diagram of a micro-groove group structure in which the nano-coating is a nano-scale protrusion in a first embodiment of the present disclosure.
Fig. 4 is a schematic view of a wire electrode in a first embodiment of the present disclosure.
Fig. 5 is a schematic view of a line array electrode in a first embodiment of the present disclosure.
Fig. 6 is an effect diagram of the heat sink wetting characteristics and heat exchange performance of the EHD reinforced micro-nano composite structure surface in a closed cavity in a first embodiment of the present disclosure.
Fig. 7 is a method for preparing a micro-groove group heat sink according to a first embodiment of the present disclosure.
Fig. 8 is a schematic diagram of a micro-groove cluster heat sink in a second embodiment of the disclosure.
Fig. 9 is a schematic diagram of a micro-groove cluster heat sink in a third embodiment of the disclosure.
Fig. 10 is a schematic diagram of a micro-groove cluster heat sink in a fourth embodiment of the disclosure.
[ in the drawings, the main reference numerals of the embodiments of the present disclosure ]
10-a micro-nano composite structure surface heat sink;
11-micro-groove group heat sink; 12-nanoscale planar structures;
13-nanoscale protrusions;
20-electrodes;
21-wire electrode; 22-line array electrodes;
23-plate/mesh electrode; 24-needle electrodes;
25-plate electrodes;
30-a heat source surface;
40-liquid working medium;
50-a closed cavity of the radiator;
60-high voltage power supply.
Detailed Description
The present disclosure provides a micro-groove group heat sink and a method of manufacturing the same, the micro-groove group heat sink comprising: the micro-groove group heat sink, the nano coating and the electrode, wherein the nano coating is generated on the surface of the micro-groove group heat sink and forms a micro-nano composite structure surface heat sink with the micro-groove group heat sink; the electrode is connected with a high-voltage power supply, and an electric field is applied to the liquid working medium on the heat sink on the surface of the micro-nano composite structure. According to the micro-groove group heat sink, through the hydrophilic nano coating on the surface, the surface energy and roughness of a liquid working medium in a micro-groove channel are enhanced, the surface wetting characteristic is improved, the directional traction effect is exerted on the liquid working medium through coulomb force, dielectrophoresis force and electric contraction force under the action of an electric field, the mass flow of the liquid working medium is increased, the thermal resistance is reduced, the capillary wetting length of the liquid working medium in the micro-groove channel is effectively increased, so that the heat sink continuously performs high-strength composite phase change heat exchange, and the heat exchange capacity of the heat sink is enhanced.
For the purposes of promoting an understanding of the principles and advantages of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same.
Certain embodiments of the present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments are shown. Indeed, various embodiments of the disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements.
In a first exemplary embodiment of the present disclosure, a micro-groove cluster heat sink and a method of manufacturing the same are provided.
Fig. 1 is a schematic diagram of a micro-groove group heat sink in a first embodiment of the disclosure. As shown in fig. 1, the micro-groove group heat sink includes: the micro-groove group heat sink 11, the nano coating 12 and the electrode 20, wherein the nano coating 12 is generated on the surface of the micro-groove group heat sink 11 and forms a micro-nano composite structure surface heat sink 10 with the micro-groove group heat sink 11; the electrode 20 is a wire electrode, which is connected with a high-voltage power supply to apply an electric field to the liquid working medium on the micro-nano composite structure surface heat sink 10.
The parts of the micro groove group heat sink of the present embodiment are described in detail below, respectively.
The surface structure of the micro-groove group heat sink 11 is a micro-groove array structure, a nano-groove array structure or a micro-nano composite groove array structure, and the structure of the micro-groove group heat sink 11 is shown in fig. 2.
The cross section of the micro channel group heat sink 11 is rectangular, triangular or trapezoidal; the equivalent diameter of the micro channel cross section of the micro channel group heat sink 11 is 10 -3 1000 μm; the surface material of the micro-groove group heat sink 11 is metal, metal oxide, metal nitride, semiconductor material, glass or ceramic.
The external dimension of the micro-groove group heat sink is 80-150 mm, and the width is 20-50 mm; the size of the channel is 0.05-1 mm of the depth of the channel, 0.05-1 mm of the width of the channel and 0.05-1 mm of the interval of the channel;
the nano-coating 12 is a nano-scale planar structure or nano-scale protrusion, wherein; the micro-groove group structure diagram of the nano coating with the nano level plane structure is shown in fig. 2, and the micro-groove group structure diagram of the nano coating with the nano level protrusion is shown in fig. 3. The nano coating is used for strengthening the hydrophilicity and roughness of the surface of the microstructure and increasing the surface energy of the microstructure.
The material of the nano coating 12 is metal, metal oxide, metal fluoride, semiconductor material or organic high polymer paint; the hydrophilic coating is aluminum oxide, titanium oxide or zinc oxide; the thickness of the nano-coating 12 is 10-300 nm.
In this embodiment, the electrode 20 is a wire electrode, which includes a single wire electrode shown in fig. 4 and a wire array electrode shown in fig. 5.
The characteristic of the arrangement of the wire electrode is that the wire electrode is used as a positive electrode, one end of the wire electrode is arranged above the liquid working medium, namely, the wire electrode is not contacted with the liquid working medium, and the other end of the wire electrode is immersed in the liquid working medium. The negative electrode is an array slot plate of a micro-nano composite structure or a shell of other electrified metal structures.
Referring to FIG. 4, the radius of the wire electrode is 0.3-1 mm, the length is 50-150 mm, the height of the liquid working medium which is over the wire electrode is 5-20 mm, and the vertical distance between the liquid working medium and the axial direction of the heat sink is 1-20 mm.
In this embodiment, the high voltage control is adjustable in the range of 2 to 20 kV.
The liquid working medium is an insulating liquid working medium and comprises FC72, R113, R123, R141, n-pentane and the like.
The closed cavity is under vacuum condition or normal pressure condition.
It should be noted that the electrode 20 may be a mesh electrode, a plate electrode, or a needle electrode.
According to yet another aspect of the present disclosure, a method of preparing a micro-groove group heat sink is also provided. Fig. 7 is a schematic diagram of a method for preparing a micro-groove group heat sink according to a first embodiment of the disclosure. As shown in fig. 7, the preparation method of the micro-groove group heat sink disclosed by the disclosure comprises the following steps:
step S1: preparing a micro-groove group heat sink;
step S2: preparing a nano coating and transferring the nano coating to the micro-groove group heat sink prepared in the step S1 to form a micro-nano composite structure surface heat sink;
step S3: and (3) switching on a high-voltage power supply, and applying an electric field to the liquid working medium on the micro-nano composite structure surface heat sink prepared in the step (S2) by using an EHD (electro-hydrodynamic effect).
It should be noted that in step S2, the nano coating is transferred to the micro-groove group base heat sink prepared in step S1 by spraying, sputtering or immersing.
It should be noted that the included angle between the micro-nano composite structure surface heat sink and the horizontal direction is 0-180 degrees.
So far, the micro-groove group heat sink and the preparation method of the micro-groove group heat sink are introduced.
Of course, according to actual needs, the preparation method of the display device of the present disclosure further includes other processes and steps, which are not related to the innovations of the present disclosure, and will not be described herein.
Fig. 6 is an effect diagram of EHD reinforced micro-nano composite structure surface heat sink wetting characteristics and heat exchange performance in a closed cavity. As shown in fig. 6, the micro-groove group heat sink in the embodiment of the present disclosure realizes super heat exchange by:
(1) And preparing a nano coating on the micro-groove group heat sink to form the micro-nano composite structure surface heat sink 10. The nano coating has hydrophilicity and stability, and the nano coating has the functions of improving the capillary wettability of the micro-groove group by strengthening the wettability of the heat sink surface of the micro-groove group, so that the capillary wettability of the micro-nano composite structure heat sink is higher when the micro-nano composite structure heat sink is placed at an inclined angle or even vertically, the realization effect is shown in figure 6,
when the heat source 30 is connected with high heat conductivity materials such as heat conduction silicone grease, heat conduction silica gel and graphene, heat is conducted to the micro-groove group heat sink, the micro-nano composite structure heat sink 10 which is vertically placed and applied is firstly subjected to capillary action of the micro-nano composite structure, the liquid working medium 40 climbs to a certain wetting height along the array micro-groove channel of the micro-nano composite structure, when the ultrahigh heat flow density emitted by the heat source 40 is input in the direction perpendicular to the heat sink, most of the heat exchange surface area of the heat sink is wetted, and at the moment, high-strength composite phase change heat exchange of expanding evaporation of a thin liquid film area on a meniscus and nuclear boiling of a thick liquid film occurs in the micro-groove, so that the heat exchange performance of the liquid working medium 40 is enhanced. While heat is transferred to the heat sink surface outside of the closed cavity 50 for heat dissipation. In the closed cavity 50, the vapor subjected to the composite phase change heat exchange is condensed on the peripheral wall surface, and condensed liquid drops reenter the liquid working medium to realize circulation.
(2) The EHD effect is generated on the surface of the micro-nano composite structure heat sink on the electric field applied to the liquid working medium, and the effect achieved by the EHD effect is shown in fig. 6.
When the micro-nano composite structure is applied, the EHD effect is under the combined action of coulomb force, dielectrophoresis force and electric shrinkage force of an electric field, once local dryness occurs in a micro-channel under the ultrahigh heat flux density, various different forms of electrodes 20 arranged on the opposite surface of the channel act on the liquid working medium 40 on the micro-nano composite structure surface 10, on one hand, the liquid working medium timely pulls up the existing wetting height under the action of the generated electric field force, and on the other hand, the ultrahigh surface energy of the hydrophilic nano coating on the micro-nano composite structure surface can further strengthen the wetting characteristic of the micro-channel, so that the heat sink continuously generates high-strength composite phase change heat exchange, the heat exchange capability of the heat sink is enhanced, the critical heat flux density endured by the heat sink is improved, the heat dissipation problem of power electronic components with high power and ultrahigh heat flux density can be solved, and further, the released heat is transferred to the outside of a closed cavity for heat dissipation and cooling. The timely liquid supplementing capability of the heat sink ensures the reliability of the heat sink with super heat exchange performance.
In a second exemplary embodiment of the present disclosure, a micro-groove cluster heat sink is provided. Fig. 8 is a schematic structural diagram of a micro-groove group heat sink according to a second embodiment of the disclosure. As shown in fig. 8, compared with the micro groove group heat sink and the manufacturing method thereof of the first embodiment, the micro groove group heat sink and the manufacturing method thereof of the present embodiment are different in that:
the electrode is a mesh electrode 23. The electrode is arranged in such a way that the electrode acts as a positive electrode, one end of which is above the liquid working medium, i.e. is not in contact with the liquid working medium, and the other end of which is immersed in the liquid working medium. The negative electrode is an array slot plate of a micro-nano composite structure or a shell of other electrified metal structures.
The external dimension of the mesh electrode is 80-150 mm, the width is 20-50 mm (if the mesh electrode is used, the equivalent diameter of the mesh is 0.5-1 mm), the height of the liquid working medium which is not passed through the mesh electrode is 5-20 mm, and the vertical distance between the liquid working medium and the axial direction of the heat sink is adjusted within the range of 1-20 mm.
Under the drive of the micro-nano composite capillary structure, a part of liquid working medium enters the micro-channel and climbs to a certain height. The mesh electrode of figure 8 is arranged on the surface opposite to the micro-channel, the liquid working medium is driven to timely climb to a higher wetting height along the micro-channel under the action of the electric field force of the positive high voltage, and the composite phase transformation heat effect of ultrahigh-strength evaporation and boiling occurs.
For the sake of brevity, any description of the technical features of embodiment 1 that can be applied identically is incorporated herein, and the same description is not repeated.
Thus, the introduction of the micro-groove group heat sink is completed in the second embodiment of the disclosure.
In a third exemplary embodiment of the present disclosure, a micro-groove cluster heat sink is provided.
Fig. 9 is a schematic structural diagram of a micro-groove group heat sink according to a third embodiment of the present disclosure. As shown in fig. 9, compared with the micro groove group heat sink and the manufacturing method thereof of the first embodiment, the micro groove group heat sink and the manufacturing method thereof of the present embodiment are different in that:
the electrode is a needle electrode 24, the electrode is in a suspension arrangement as an anode, and the cathode is an array groove plate of a micro-nano composite structure or a shell of other electrified metal structures.
The radius of curvature of the needle electrode tip is 0.05-0.5 mm, and the axial vertical distance between the needle electrode tip and the heat sink can be adjusted within the range of 1-20 mm.
The liquid working medium can be insulating liquid working medium, including FC72, R113, R123, R141, n-pentane and the like; and can also be conductive working medium including distilled water, ethanol, etc.
The enclosed cavity is under normal pressure.
Under the drive of the micro-nano composite capillary structure, a part of liquid working medium enters the micro-channel and climbs to a certain height. The needle-shaped electrode shown in fig. 9 is arranged on the surface opposite to the micro-channel, and generates suction force through ionized air, and the liquid working medium with a certain height in the array channel structure is lifted in time, so that the wetting height is further lifted, and the composite phase transformation heat effect of ultrahigh-strength evaporation and boiling occurs.
For the sake of brevity, any description of the technical features of embodiment 1 that can be applied identically is incorporated herein, and the same description is not repeated.
Thus, the introduction of the micro-groove group heat sink is completed in the third embodiment of the present disclosure.
In a fourth exemplary embodiment of the present disclosure, a micro-groove cluster heat sink is provided.
Fig. 10 is a schematic structural diagram of a micro-groove group heat sink according to a third embodiment of the present disclosure. As shown in fig. 10, compared with the micro groove group heat sink and the manufacturing method thereof of the first embodiment, the micro groove group heat sink and the manufacturing method thereof of the present embodiment are different in that:
the electrode is a flat plate electrode 25, and the electrode arrangement is characterized in that the electrode is taken as a positive electrode, the liquid working medium is soaked in the closed cavity, and the negative electrode is fixed at the upper end of the vertical groove plate.
The length and width of the positive electrode and the negative electrode of the flat plate electrode are 10-30 mm, the positive electrode is immersed in the liquid working medium, and the axial distance between the positive electrode and the negative electrode is 40-100 mm.
The liquid working medium can be insulating liquid working medium, and comprises FC72, R113, R123, R141 and n-pentane; and can also be conductive working medium including distilled water and ethanol.
The closed cavity is under vacuum condition or normal pressure condition.
Under the drive of the micro-nano composite capillary structure, a part of liquid working medium enters the micro-channel and climbs to a certain height. The flat plate electrode shown in fig. 10 is arranged on the surface opposite to the micro-channel, and the positive plate is arranged in the liquid working medium, so that the liquid working medium is driven to timely climb to a certain wetting height along the micro-channel under the action of the electric field force of positive high voltage, and the composite phase transformation heat effect of ultrahigh-strength evaporation and boiling occurs.
For the sake of brevity, any description of the technical features of embodiment 1 that can be applied identically is incorporated herein, and the same description is not repeated.
Thus, the introduction of the micro-groove group heat sink is completed in the fourth embodiment of the present disclosure.
Thus, embodiments of the present disclosure have been described in detail with reference to the accompanying drawings. From the foregoing description, those skilled in the art will clearly recognize the micro-groove group heat sink and the manufacturing method thereof of the present invention.
It should be noted that, in the drawings or the text of the specification, implementations not shown or described are all forms known to those of ordinary skill in the art, and not described in detail. Furthermore, the above definitions of the elements and methods are not limited to the specific structures, shapes or modes mentioned in the embodiments, and may be simply modified or replaced by those of ordinary skill in the art.
In summary, the present disclosure provides a micro-groove group heat sink and a method for preparing the same, the micro-groove group heat sink includes: the micro-groove group heat sink, the nano coating and the electrode, wherein the nano coating is generated on the surface of the micro-groove group heat sink and forms a micro-nano composite structure surface heat sink with the micro-groove group heat sink; the electrode is connected with a high-voltage power supply, and an electric field is applied to the liquid working medium on the heat sink on the surface of the micro-nano composite structure. According to the micro-groove group heat sink, through the hydrophilic nano coating on the surface, the surface energy and roughness of a liquid working medium in a micro-groove channel are enhanced, the surface wetting characteristic is improved, the directional traction effect is exerted on the liquid working medium through coulomb force, dielectrophoresis force and electric contraction force under the action of an electric field, the mass flow of the liquid working medium is increased, the thermal resistance is reduced, the capillary wetting length of the liquid working medium in the micro-groove channel is effectively increased, so that the heat sink continuously performs high-strength composite phase change heat exchange, and the heat exchange capacity of the heat sink is enhanced.
Unless otherwise known, numerical parameters in this specification and the appended claims are approximations that may vary depending upon the desired properties sought to be obtained by the present disclosure. In particular, all numbers expressing quantities of ingredients, reaction conditions, and so forth used in the specification and claims are to be understood as being modified in all instances by the term "about". In general, the meaning of expression is meant to include a variation of + -10% in some embodiments, a variation of + -5% in some embodiments, a variation of + -1% in some embodiments, and a variation of + -0.5% in some embodiments by a particular amount.
Furthermore, the word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements.
Furthermore, unless specifically described or steps must occur in sequence, the order of the above steps is not limited to the list above and may be changed or rearranged according to the desired design. In addition, the above embodiments may be mixed with each other or other embodiments based on design and reliability, i.e. the technical features of the different embodiments may be freely combined to form more embodiments.
Similarly, it should be appreciated that in the above description of exemplary embodiments of the disclosure, various features of the disclosure are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various disclosed aspects. However, the disclosed method should not be construed as reflecting the intention that: i.e., the claimed disclosure requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this disclosure.
While the foregoing embodiments have been described in some detail for purposes of clarity of understanding, it will be understood that the foregoing embodiments are merely illustrative of the invention and are not intended to limit the invention, and that any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the present disclosure are intended to be included within the scope of the present disclosure.
Claims (8)
1. A micro-slot cluster heat sink, comprising:
a micro-groove group heat sink (11);
a nano coating (12) which is generated on the surface of the micro-groove group heat sink (11) and forms a micro-nano composite structure surface heat sink (10) with the micro-groove group heat sink (11); and
the electrode (20) is connected with a high-voltage power supply, is arranged at a position facing micro-channel of the micro-channel group heat sink (11) which is vertically arranged, applies an electric field to the liquid working medium on the micro-nano composite structure surface heat sink (10), and is suitable for enabling the liquid working medium to be lifted along the micro-channel;
the electrode (20) is a flat plate electrode or a needle electrode, and the liquid working medium is a conductive working medium;
under the condition that the electrode is the flat plate electrode, the positive electrode of the flat plate electrode is immersed in the liquid working medium, the negative electrode is fixed at the upper end of the micro-channel, the liquid working medium is driven to timely climb to a certain wetting height along the micro-channel under the action of the electric field force of the positive electrode high voltage, and the composite phase transformation heat effect of ultrahigh-strength evaporation and boiling occurs;
under the condition that the electrode is the needle electrode, the needle electrode is arranged on the surface, which is opposite to the micro-channel, of the needle electrode, and the needle electrode generates suction force through ionized air, so that liquid working medium with a certain height in the micro-channel is lifted in time, and the wetting height is further improved.
2. The micro-slot cluster heat sink of claim 1 wherein,
the nano coating (12) is a nano planar structure or a nano protrusion;
the material of the nano coating (12) is metal, metal oxide, metal fluoride, semiconductor material or organic high polymer coating;
the thickness of the nano coating (12) is 0-1000 nm.
3. The micro-slot cluster heat sink of claim 1 wherein,
the voltage of the high-voltage power supply is 1-50 kV.
4. The micro-slot cluster heat sink of claim 1 wherein,
the length and width of the plate electrode are 1-100 mm, the thickness is 0.5-10 mm, and the vertical spacing between the anode and the cathode of the plate electrode is 10-100 mm;
the curvature radius of the needle electrode tip is 0.01-1 mm, and the vertical distance between the needle electrode tip and the axial direction of the micro groove group is 0.1-100 mm.
5. The micro-slot cluster heat sink of claim 1 wherein,
the conductive working medium is distilled water or ethanol.
6. The micro-slot cluster heat sink of claim 1 wherein,
the surface structure of the micro-groove group heat sink (11) is a micro-groove array structure, a nano-groove array structure or a micro-nano composite groove array structure;
the cross section of the micro-channel group heat sink (11) is rectangular, triangular or trapezoidal, and the equivalent diameter is 10 -3 ～1000μm；
The surface material of the micro-groove group heat sink (11) is metal, metal oxide, metal nitride, semiconductor material, glass or ceramic.
7. A method of preparing the micro-groove group heat sink of claims 1-6, comprising the steps of:
step S1: preparing a micro-groove group heat sink;
step S2: preparing a nano coating and transferring the nano coating to the micro-groove group heat sink prepared in the step S1 to form a micro-nano composite structure surface heat sink;
step S3: and (3) switching on a power supply, and applying an electric field to the liquid working medium on the micro-nano composite structure surface heat sink prepared in the step (S2).
8. The method for preparing a micro-groove group heat sink according to claim 7, wherein,
in the step S2, the mode of transferring the nano coating to the micro-groove group basic heat sink prepared in the step S1 is spraying, sputtering or immersing;
the included angle between the micro-nano composite structure surface heat sink and the horizontal direction is 0-180 degrees.
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| US20090056917A1 (en) * | 2005-08-09 | 2009-03-05 | The Regents Of The University Of California | Nanostructured micro heat pipes |
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| CN101252822A (en) * | 2008-04-11 | 2008-08-27 | 北京工业大学 | EHD intensification minitype heat radiating device |
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