CN108133254B - Double-clamping structure - Google Patents
Double-clamping structure Download PDFInfo
- Publication number
- CN108133254B CN108133254B CN201810099729.7A CN201810099729A CN108133254B CN 108133254 B CN108133254 B CN 108133254B CN 201810099729 A CN201810099729 A CN 201810099729A CN 108133254 B CN108133254 B CN 108133254B
- Authority
- CN
- China
- Prior art keywords
- plate
- chip
- copper core
- supporting plate
- clamping seat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000007246 mechanism Effects 0.000 claims abstract description 75
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 230000010354 integration Effects 0.000 claims abstract 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 45
- 230000007704 transition Effects 0.000 claims description 26
- 238000003466 welding Methods 0.000 claims description 15
- 230000002146 bilateral effect Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
- G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Switch Cases, Indication, And Locking (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention discloses a double-clamping structure, which comprises a clamping seat, a sealing plate, a lapping mechanism, a guide rail, chip integration mechanisms and plugs, wherein one end of each lapping mechanism is connected with a coil, any chip integration mechanism is manually pushed to move towards the center of the clamping seat along a sliding groove until a ball head arranged on a supporting plate is inserted into a limit groove arranged on the guide rail, at the moment, pins of a chip are in contact with a pressing sheet, and as the pins of the chip have a certain height, after the pins of the chip are in contact with the pressing sheet, elastic sheets in the elastic mechanisms deform so as to counteract the chips, so that the pressing sheet is pressed against the pins of the chip, and at the moment, the chips are communicated with the coil for normal use. The device simple structure can switch 2 kinds of chips of different specifications wantonly, and the chip switches simple swiftly moreover, and the chip is fixed reliable.
Description
Technical Field
The present disclosure relates to mechanical devices, and particularly to a dual-clamping structure.
Background
The existing electronic chip card is composed of a card body and a chip arranged on the card body, wherein a sensing coil connected with the chip to form conduction is embedded in the card body, so that the electronic chip card is formed. Because more access cards are needed at present, for example, an access card is needed for entering a community, another access card is needed for entering a company, and more access cards often cause trouble to a user, so that the problem of taking the access cards by mistake often occurs. In view of the above drawbacks, it is necessary to design a dual-detent structure.
Disclosure of Invention
The invention aims to provide a double-clamping structure which can randomly switch 2 kinds of chips with different specifications, and the chip is simple and quick to switch, and is firm and reliable in fixation.
In order to solve the technical problems, the technical scheme of the invention is as follows: the utility model provides a double-clamping structure, includes cassette, shrouding, tilting mechanism, guide rail, chip integrated mechanism, end cap, the shrouding be located the cassette upper end, shrouding and cassette bonding link to each other, tilting mechanism stretch into the cassette and be located the shrouding lower extreme, tilting mechanism and shrouding bonding link to each other, tilting mechanism quantity be 2, follow the shrouding bilateral symmetry arranges, the cassette still be equipped with the spout, the spout do not run through the cassette, the guide rail be located the spout inboard, guide rail and cassette bonding link to each other, chip integrated mechanism be located the spout and run through by the guide rail, chip integrated mechanism can slide along the guide rail left and right directions, chip integrated mechanism quantity be 2, the end cap stretch into the spout inboard, end cap and cassette bonding link to each other;
the lapping mechanism also include main copper core, elastic mechanism, transition copper core, preforming, main copper core be located the shrouding lower extreme, main copper core and shrouding bond and link to each other, elastic mechanism be located main copper core lower extreme, elastic mechanism and main copper core welding link to each other, elastic mechanism quantity be 2, follow main copper core bilateral symmetry arranges, transition copper core be located the elastic mechanism lower extreme, transition copper core and elastic mechanism welding link to each other, the preforming be located transition copper core lower extreme, preforming and transition copper core welding link to each other, main copper core, elastic mechanism, transition copper core, the material of preforming are conductive material, constitute signal transmission path.
The invention is further improved as follows:
further, the preforming still be equipped with arc transition portion, arc transition portion and preforming an organic whole link to each other, the setting of arc transition portion is convenient for chip integrated mechanism to slide.
Further, the elastic mechanism also comprises a top plate, an elastic piece and a bottom plate, wherein the top plate is positioned at the lower end of the main copper core, the top plate is connected with the main copper core in a welding way, the elastic piece is positioned at the lower end of the top plate, the elastic piece is connected with the top plate in a welding way, the bottom plate is positioned at the lower end of the elastic piece, and the bottom plate is connected with the elastic piece in a welding way.
Further, the guide rail is also provided with a limit groove, and the limit groove penetrates through the guide rail.
Further, the chip integrated mechanism also include layer board, chip, outer arm-tie, the layer board be located the spout inboard and run through by the guide rail, the layer board can follow the guide rail and control the direction and slide, the chip be located the layer board top, chip and layer board bonding link to each other, outer arm-tie be located the layer board outside, outer arm-tie and layer board integrative link to each other, can drive the layer board and follow the guide rail and slide through pulling outer arm-tie.
Furthermore, the supporting plate is also provided with a clamping groove, and the clamping groove does not penetrate through the supporting plate main body.
Further, the supporting plate is also provided with a ball head, the ball head is positioned at the inner side of the clamping groove, and the ball head is integrally connected with the supporting plate.
Compared with the prior art, this double-clamping structure, during operation, with tilting mechanism one end and coil connection, manual promotion arbitrary chip integrated mechanical system is along spout to cassette center department removal, until the bulb that sets up on the layer board inserts establish on the guide rail in the spacing groove can, at this moment, the pin and the preforming contact of chip, because the pin of chip has certain height, after the pin and the preforming contact of chip, the shell fragment in the elastic mechanism produces deformation to reaction chip for the preforming compresses tightly with the pin of chip, at this moment, chip and coil intercommunication can normal use. The device simple structure can switch 2 kinds of chips of different specifications wantonly, and the chip switches simple swiftly moreover, and the chip is fixed reliable.
Drawings
FIG. 1 shows a front view of the present invention
FIG. 2 is a schematic view showing the structure of the lapping mechanism of the present invention
FIG. 3 is a schematic view showing the structure of the elastic mechanism of the present invention
FIG. 4 shows a top view of the chip-integrated mechanism of the present invention
FIG. 5 illustrates a side view of a chip-integrated mechanism of the present invention
In the figure: clamping seat 1, sealing plate 2, overlap joint mechanism 3, guide rail 4, chip integrated mechanism 5, plug 6, chute 101, main copper core 301, elastic mechanism 302, transition copper core 303, pressing sheet 304, arc transition part 305, top plate 306, elastic sheet 307, bottom plate 308, limit groove 401, supporting plate 501, chip 502, external pulling plate 503, clamping groove 504 and ball 505.
Detailed Description
As shown in fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, a double-clamping structure comprises a clamping seat 1, a sealing plate 2, a lapping mechanism 3, a guide rail 4, a chip integrated mechanism 5 and a plug 6, wherein the sealing plate 2 is positioned at the upper end of the clamping seat 1, the sealing plate 2 is in bonding connection with the clamping seat 1, the lapping mechanism 3 stretches into the clamping seat 1 and is positioned at the lower end of the sealing plate 2, the lapping mechanism 3 is in bonding connection with the sealing plate 2, the number of the lapping mechanisms 3 is 2, the two lapping mechanisms are symmetrically arranged along the sealing plate 2, the clamping seat 1 is also provided with a sliding groove 101, the sliding groove 101 does not penetrate through the clamping seat 1, the guide rail 4 is positioned at the inner side of the sliding groove 101, the guide rail 4 is in the sliding groove 101 and is penetrated by the guide rail 4, the chip integrated mechanism 5 can slide along the left and right directions of the guide rail 4, the number of the chip integrated mechanism 5 is 2, the plug 6 stretches into the inner side of the sliding groove 101, and the bonding connection between the chip integrated mechanism 6 and the clamping seat 1 and the plug 1. The lap joint mechanism 3 also comprises a main copper core 301, an elastic mechanism 302, a transition copper core 303 and a pressing sheet 304, wherein the main copper core 301 is positioned at the lower end of the sealing plate 2, the main copper core 301 is connected with the sealing plate 2 in an adhering way, the elastic mechanism 302 is positioned at the lower end of the main copper core 301, the elastic mechanism 302 is connected with the main copper core 301 in a welding way, the number of the elastic mechanisms 302 is 2, the elastic mechanisms 301 are symmetrically arranged left and right along the main copper core 301, the transition copper core 303 is positioned at the lower end of the elastic mechanism 302, the transition copper core 303 is connected with the elastic mechanism 302 in a welding way, the pressing sheet 304 is positioned at the lower end of the transition copper core 303, the pressing sheet 304 is connected with the transition copper core 303 in a welding way, the materials of the main copper core 301, the elastic mechanism 302, the transition copper core 303 and the pressing sheet 304 are all conductive materials to form a signal transmission path, the pressing sheet 304 is also provided with an arc-shaped transition part 305, the arc-shaped transition part 305 is integrally connected with the pressing sheet 304, the arc transition part 305 is convenient for the chip integrated mechanism 5 to slide, the elastic mechanism 302 also comprises a top plate 306, a spring 307 and a bottom plate 308, the top plate 306 is positioned at the lower end of the main copper core 301, the top plate 306 is connected with the main copper core 301 in a welding way, the spring 307 is positioned at the lower end of the top plate 306, the spring 307 is connected with the top plate 306 in a welding way, the bottom plate 308 is positioned at the lower end of the spring 307, the bottom plate 308 is connected with the spring 307 in a welding way, the guide rail 4 is also provided with a limit groove 401, the limit groove 401 penetrates through the guide rail 4, the chip integrated mechanism 5 also comprises a supporting plate 501, a chip 502 and an external pulling plate 503, the supporting plate 501 is positioned at the inner side of the guide rail 101 and penetrated by the guide rail 4, the supporting plate 501 can slide along the left and right directions of the guide rail 4, the chip 502 is positioned at the top of the supporting plate 501, the chip 502 is connected with the supporting plate 501 in an adhesive way, the external pulling plate 503 is located outside the supporting plate 501, the external pulling plate 503 is integrally connected with the supporting plate 501, the supporting plate 501 can be driven to slide along the guide rail 4 by pulling the external pulling plate 503, the supporting plate 501 is also provided with a clamping groove 504, the clamping groove 504 does not penetrate through the main body of the supporting plate 501, the supporting plate 501 is also provided with a ball head 505, the ball head 505 is located inside the clamping groove 504, the ball head 505 is integrally connected with the supporting plate 501, the double-clamping structure is used, one end of the lap joint mechanism 3 is connected with a coil, any chip integrating mechanism 5 is manually pushed to move towards the center of the clamping seat 1 along the sliding groove 101 until the ball head 505 arranged on the supporting plate 501 is inserted into the limiting groove 401 arranged on the guide rail 4, at this moment, pins of the chip 502 are in contact with the pressing piece 304, and after the pins of the chip 502 are in contact with the pressing piece 304, the elastic piece 307 in the elastic mechanism 302 deforms, so that the pressing pin of the chip 502 and the chip 502 is counteracted, at this moment, the chip 502 is normally communicated with the coil. The device simple structure can switch 2 kinds of chips of different specifications wantonly, and the chip switches simple swiftly moreover, and the chip is fixed reliable.
The present invention is not limited to the above-described specific embodiments, and various modifications may be made by those skilled in the art without inventive effort from the above-described concepts, and are within the scope of the present invention.
Claims (7)
1. The double-clamping structure is characterized by comprising a clamping seat, a sealing plate, a lap joint mechanism, guide rails, chip integration mechanisms and plugs, wherein the sealing plate is positioned at the upper end of the clamping seat, the sealing plate is connected with the clamping seat in an adhering mode, the lap joint mechanism stretches into the clamping seat and is positioned at the lower end of the sealing plate, the lap joint mechanism is connected with the sealing plate in an adhering mode, the number of the lap joint mechanisms is 2, the lap joint mechanisms are symmetrically arranged left and right along the sealing plate, the clamping seat is further provided with a sliding groove, the sliding groove does not penetrate through the clamping seat, the guide rails are positioned at the inner sides of the sliding groove, the guide rails are connected with the clamping seat in an adhering mode, the chip integration mechanisms are positioned in the sliding groove and penetrated by the guide rails, the chip integration mechanisms can slide along the left and right directions of the guide rails, the number of the chip integration mechanisms is 2, the plugs stretch into the inner sides of the sliding groove, and the plugs are connected with the clamping seat in an adhering mode.
The lapping mechanism also include main copper core, elastic mechanism, transition copper core, preforming, main copper core be located the shrouding lower extreme, main copper core and shrouding bond and link to each other, elastic mechanism be located main copper core lower extreme, elastic mechanism and main copper core welding link to each other, elastic mechanism quantity be 2, follow main copper core bilateral symmetry arranges, transition copper core be located the elastic mechanism lower extreme, transition copper core and elastic mechanism welding link to each other, the preforming be located transition copper core lower extreme, preforming and transition copper core welding link to each other.
2. The double-detent structure according to claim 1, wherein said pressing piece is further provided with an arc-shaped transition portion integrally connected with said pressing piece.
3. The double-clamping structure of claim 1, wherein the elastic mechanism further comprises a top plate, a spring plate and a bottom plate, the top plate is positioned at the lower end of the main copper core, the top plate is welded with the main copper core, the spring plate is positioned at the lower end of the top plate, the spring plate is welded with the top plate, the bottom plate is positioned at the lower end of the spring plate, and the bottom plate is welded with the spring plate.
4. The double-detent structure according to claim 1, wherein the guide rail is further provided with a limit groove, and the limit groove penetrates the guide rail.
5. The double-clamping structure of claim 1, wherein the chip integration mechanism further comprises a supporting plate, a chip and an outer pulling plate, the supporting plate is positioned at the inner side of the chute and penetrated by the guide rail, the supporting plate can slide along the left and right directions of the guide rail, the chip is positioned at the top of the supporting plate, the chip is adhered and connected with the supporting plate, the outer pulling plate is positioned at the outer side of the supporting plate, and the outer pulling plate is integrally connected with the supporting plate.
6. The double-detent structure according to claim 5, wherein said support plate is further provided with a detent, said detent not penetrating through the support plate body.
7. The double-clamping structure of claim 5, wherein the supporting plate is further provided with a ball head, the ball head is positioned at the inner side of the clamping groove, and the ball head is integrally connected with the supporting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810099729.7A CN108133254B (en) | 2018-02-01 | 2018-02-01 | Double-clamping structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810099729.7A CN108133254B (en) | 2018-02-01 | 2018-02-01 | Double-clamping structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108133254A CN108133254A (en) | 2018-06-08 |
| CN108133254B true CN108133254B (en) | 2024-04-02 |
Family
ID=62430104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810099729.7A Active CN108133254B (en) | 2018-02-01 | 2018-02-01 | Double-clamping structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108133254B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980025918U (en) * | 1996-11-06 | 1998-08-05 | 조희재 | Chip card connector |
| JP2000076407A (en) * | 1998-08-29 | 2000-03-14 | Star Engineering Kk | Method and device manufacturing noncontact ic card sheet |
| CN103022807A (en) * | 2012-12-12 | 2013-04-03 | 京东方科技集团股份有限公司 | Self-eject port fixing device |
| CN104463049A (en) * | 2014-12-21 | 2015-03-25 | 广州市明森机电设备有限公司 | Card entry locating mechanism and method of smart card chip-writing device |
| CN106229746A (en) * | 2016-07-08 | 2016-12-14 | 恒宝股份有限公司 | A kind of chip deck and communicator |
| CN207764831U (en) * | 2018-02-01 | 2018-08-24 | 梵利特智能科技（苏州）有限公司 | A kind of double card bit architecture |
-
2018
- 2018-02-01 CN CN201810099729.7A patent/CN108133254B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980025918U (en) * | 1996-11-06 | 1998-08-05 | 조희재 | Chip card connector |
| JP2000076407A (en) * | 1998-08-29 | 2000-03-14 | Star Engineering Kk | Method and device manufacturing noncontact ic card sheet |
| CN103022807A (en) * | 2012-12-12 | 2013-04-03 | 京东方科技集团股份有限公司 | Self-eject port fixing device |
| CN104463049A (en) * | 2014-12-21 | 2015-03-25 | 广州市明森机电设备有限公司 | Card entry locating mechanism and method of smart card chip-writing device |
| CN106229746A (en) * | 2016-07-08 | 2016-12-14 | 恒宝股份有限公司 | A kind of chip deck and communicator |
| CN207764831U (en) * | 2018-02-01 | 2018-08-24 | 梵利特智能科技（苏州）有限公司 | A kind of double card bit architecture |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108133254A (en) | 2018-06-08 |
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