CN108110125A - Printed conductive structure, light emitting module including the same, and method of manufacturing the same - Google Patents
Printed conductive structure, light emitting module including the same, and method of manufacturing the same Download PDFInfo
- Publication number
- CN108110125A CN108110125A CN201710387355.4A CN201710387355A CN108110125A CN 108110125 A CN108110125 A CN 108110125A CN 201710387355 A CN201710387355 A CN 201710387355A CN 108110125 A CN108110125 A CN 108110125A
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- Prior art keywords
- pattern
- line pattern
- base material
- electrically conductive
- conductive ink
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/003—Printing processes to produce particular kinds of printed work, e.g. patterns on optical devices, e.g. lens elements; for the production of optical devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Abstract
The invention discloses a printed conductive structure, a light emitting module including the same, and a method of manufacturing the same. The printed conductive structure includes a substrate, a first circuit pattern, a second circuit pattern and a third circuit pattern. The first circuit pattern and the second circuit pattern are formed by first conductive ink printed on one surface of the substrate. A gap is formed between the first circuit pattern and the second circuit pattern. The third circuit pattern is formed by printing a second conductive ink on the surface of the substrate. The third line pattern directly connects the first line pattern and the second line pattern. The first conductive ink has a first resistivity, the second conductive ink has a second resistivity, and the second resistivity is greater than the first resistivity.
Description
Technical field
The present invention prints conductive structure, the light emitting module including printing conductive structure and printing conductive structure on a kind of
Manufacturing method, particularly it is a kind of have with mode of printing formed resistance printing conductive structure, include its light emitting module
And its manufacturing method.
Background technology
With consumer electrical product, such as mobile phone, tablet computer and laptop, demand is gradual in the market
Reach saturation, dealers start center of gravity to be placed in the appearance design of consumer electrical product, with oneself consumer electricity of expectation
Sub- product can show one's talent from consumer electrical products numerous in the market, obtain the favor of consumer.
In order to decorate the shell of the consumer electrical products such as mobile phone, tablet computer or laptop to promote its entirety
Texture, currently used design include light emitting module being arranged in shell so that the light that light emitting module is sent may pass through outer
Different visual effects is presented in pierced pattern on shell whereby.Existing light emitting module typically use printed circuit board (PCB) as
Supply line's structure, and on a printed circuit welding kesistance to regulate and control the supply voltage of supply line.However, in face of consumption
Property electronic product slimming and green production demand, exploitation without the use of micro image etching procedure, welding processing procedure or plating system
The problem of slimming supply line structure of journey has become current urgent need to resolve.
The content of the invention
The present invention on a kind of printing conductive structure, including its light emitting module and its manufacturing method, by with
The printing conductive structure for the resistance that mode of printing is formed, micro image etching procedure, welding processing procedure or electricity need to be used by solving light emitting module
The problem of plating the printed circuit board (PCB) prepared by processing procedure.
A kind of printing conductive structure of one embodiment of the invention, including a base material, a first line pattern, one second circuit
Pattern and a tertiary circuit pattern.First line pattern is led with the second line pattern by being printed in the one first of a surface of base material
Electric ink is formed.There is a gap between first line pattern and the second line pattern.Tertiary circuit pattern is by being printed in base
One second electrically conductive ink on the surface of material is formed.Tertiary circuit pattern is directly connected to first line pattern and the second line map
Case.First electrically conductive ink has a first resistor rate, and the second electrically conductive ink has a second resistance rate, and second resistance rate is more than
First resistor rate.
A kind of light emitting module of one embodiment of the invention, including foregoing printing conductive structure, a light-emitting component and one
Guide-lighting plate.Foregoing printing conductive structure further comprises one the 4th line pattern, and the 4th line pattern is located at base material.Hair
Optical element is arranged at the surface of base material and is electrically connected at the second line pattern and the 4th line pattern.Guide-lighting plate has one to hold
Put slot.Guide-lighting plate is arranged at base material, and light-emitting component is located in storage tank.
The manufacturing method of a kind of printing conductive structure of one embodiment of the invention, including one first electrically conductive ink of printing in one
Base material with formed one first electrically conductive ink pattern and one second electrically conductive ink pattern and printing one second electrically conductive ink in base material
To form one the 3rd electrically conductive ink pattern.First electrically conductive ink pattern and the second electrically conductive ink pattern pass through the 3rd electrically conductive ink figure
Case is connected.A baking is carried out to the first electrically conductive ink pattern, the second electrically conductive ink pattern and the 3rd electrically conductive ink pattern to divide
A first line pattern, one second line pattern and a tertiary circuit pattern are not formed.First line pattern and the second line map
There is a gap between case.First line pattern is connected with the second line pattern by tertiary circuit pattern.First conductive oil
Ink has a first resistor rate, and the second electrically conductive ink has a second resistance rate, and second resistance rate is more than first resistor rate.
Conductive structure is printed according to the invention described above, including its light emitting module and its manufacturing method, is led to
It crosses the tertiary circuit pattern for being printed and being formed by the second electrically conductive ink and is directly connected to oily first electrically conductive ink and print the First Line formed
Road pattern and the second line pattern, and the second resistance rate of the second electrically conductive ink is more than the first resistor rate of the first electrically conductive ink.
Thus, you can it obtains without the use of micro image etching procedure, welding processing procedure or electroplating process, and with control supply voltage work(
The slimming supply line structure of energy.
The explanation of explanation and implementation below above with respect to present invention to demonstrate and explain the present invention essence
God and principle, and claims of the present invention is provided and is further explained.
Description of the drawings
Fig. 1 is the three-dimensional exploded view of the light emitting module of first embodiment of the invention.
Fig. 2 is the sectional view of the light emitting module of first embodiment of the invention.
Fig. 3 is the top view of the printing conductive structure of the light emitting module of first embodiment of the invention.
Fig. 4 is sectional views of the Fig. 3 along 4-4 ' hatchings.
Fig. 5 is the manufacturing method flow chart of the light emitting module of first embodiment of the invention.
Fig. 6 to Fig. 8 is the manufacturing method schematic diagram of the printing conductive structure of the light emitting module of first embodiment of the invention.
Fig. 9 is the sectional view of the printing conductive structure of the light emitting module of second embodiment of the invention.
Wherein, reference numeral：
100 printing conductive structures
110 base materials
111 surfaces
120 first line patterns
130 second line patterns
140 tertiary circuit patterns
150 the 4th line patterns
160 first connection pads
170 second connection pads
180 protective layers
200 light-emitting components
300 guide-lighting plates
310 first surfaces
311 storage tanks
320 second surfaces
330 adhesive agents
400 design layers
410 light transmission pattern areas
G gaps
W width
S100~S800 steps 100~step 800
Specific embodiment
The detailed features and advantage of the narration present invention, content are enough to make any ability in detail in embodiments below
The technical staff in domain understands the technology contents of the present invention and implements according to this, and is wanted according to content disclosed in this specification, right
Protection domain and attached drawing are asked, any those skilled in the art can be readily understood upon the relevant purpose of the present invention and advantage.Below
Embodiment the viewpoint of the present invention is further described, it is but non-anyways to limit scope of the invention.
The printing conductive structure 100 of first embodiment of the invention and shining including printing conductive structure 100 are introduced first
Module refer to Fig. 1 to Fig. 4.Fig. 1 is the three-dimensional exploded view of the light emitting module of first embodiment of the invention.Fig. 2 is the present invention the
The sectional view of the light emitting module of one embodiment.Fig. 3 is bowing for the printing conductive structure of the light emitting module of first embodiment of the invention
View.Fig. 4 is sectional views of the Fig. 3 along 4-4 ' hatchings.As shown in Figures 1 to 4, the light emitting module bag of first embodiment of the invention
It includes one and draws brush conductive structure 100,300 and one design layer 400 of guide-lighting plate of a light-emitting component 200, one.
Printing conductive structure 100 includes a base material 110, a first line pattern 120, one second line pattern 130,1 the
Three line patterns 140, one the 4th line pattern 150, one first connection pad 160, one second connection pad 170 and a protective layer 180.Base material
110 have a surface 111.Base material 110 is, for example, plate body or flexible thin slice.Base material 110 is plastic material, such as may include to gather
Acid imide (Polyimide, PI), polyethylene terephthalate (Polyethylene Terephthalate, PET) gather
(ethylene naphthalate) (Polyethylene Naphthalate, PEN), polymethyl methacrylate (Polymethyl
Methacrylate, PMMA), polyethylene (PE), polypropylene (PP), polycyclic alkene resin (Polycycloolefin resin),
Polycarbonate resin (Polycarbonate resin), polyurethane resin (Polyurethane resin) or three vinegar
Acid cellulose (Triacetate Cellulose, TAC).
120 and second line pattern 130 of first line pattern is located at the surface 111 of base material 110.First line pattern 120
There is a clearance G between the second line pattern 130, the width W of clearance G is 0.1 millimeter (mm) to 1 millimeter (mm).First Line
Road pattern 120 with the second line pattern 130 is formed by the first electrically conductive ink for being printed in surface 111.First electrically conductive ink
For oil-based ink.For example include the powder of gold, silver, copper, platinum or other metal or alloy in first electrically conductive ink.First conductive oil
Ink has a first resistor rate, and first resistor rate is, for example, 10-4To 10-6Ohmcm (Ω cm).
Tertiary circuit pattern 140 is located at the surface 111 of base material 110, and tertiary circuit pattern 140 is directly connected to first line
120 and second line pattern 130 of pattern.Specifically, a part of tertiary circuit pattern 140 is stacked at first line pattern
120 one sides away from base material 110, a part of tertiary circuit pattern 140 is folded to set second line pattern 130 away from base material 110
One side, between the tertiary circuit pattern 140 of another part is located between 120 and second line pattern 130 of first line pattern
In gap G.Tertiary circuit pattern 140 is formed by one second electrically conductive ink for being printed in the surface 111 of base material 110.Second is conductive
Ink is oil-based ink.For example including carbon, the powder of graphene or carbon nanotubes in second electrically conductive ink.Second electrically conductive ink has
There is a second resistance rate, and second resistance rate is more than first resistor rate.Second resistance rate is, for example, 0.05 to 0.5 ohmcm
(Ω·cm)。
In the first embodiment of the invention, a part of tertiary circuit pattern 140 is stacked at first line pattern 120, separately
Between the tertiary circuit pattern 140 of a part is stacked at the second line pattern 120, then a part of tertiary circuit pattern 140 is located at
In gap G, but not limited to this.In other embodiments of the present invention, tertiary circuit pattern can be fully located in gap, and at the same time
Contact directly first line pattern and the second line pattern.
4th line pattern 150 is located at the surface 111 of base material 110.4th line pattern 150 is by being printed in surface 111
The first electrically conductive ink formed.First connection pad 160 and the second connection pad 170 are respectively positioned on the surface 111 of base material 110.First connection pad
160 are connected to the second line pattern 130, and the second connection pad 170 is connected to the 4th line pattern.In the first embodiment of the invention,
First connection pad 160 with the second connection pad 170 is formed by the first electrically conductive ink for being printed in surface 111, therefore first line
Pattern 120, the second line pattern 130, the 4th line pattern 150, the first connection pad 160 and the second connection pad 170 are in same system
The surface 111 of base material 110 is printed in journey step, but not limited to this.In other embodiments of the present invention, the first connection pad with
Second connection pad can be formed by different electrically conductive ink or conducting resinl, therefore can not be with first line pattern, the second line map
Case is formed on the surface of base material with the 4th line pattern together.First line pattern 120 separately has with the 4th line pattern 150
It is electrically connected the function of supply power supply (not illustrating) so that electric energy can be via 120 and the 4th line pattern 150 of first line pattern
It is supplied to light-emitting component 200.
Protective layer 180 covers the part surface of base material 110, and covers first line pattern 120, the second line map simultaneously
Case 130,140 and the 4th line pattern 150 of tertiary circuit pattern.The material of protective layer 180 is for example including thermosetting resin or heat
Plastic resin, such as polyurethane, vinyl chloride/vinyl acetate copolymer, polymethacrylates or epoxy resin etc..Pass through guarantor
The protection of sheath 180, can prevent printing conductive structure 100 on line pattern in the manufacturing process of light emitting module because friction or
It is contacted with viscose and impaired or rotten, and then influences the manufacturing yield of line pattern.
Light-emitting component 200 is arranged at the first connection pad 160 and the second connection pad 170 on the surface 111 of base material 110.Shine member
Part 200 is electrically connected with the second line pattern 130 with the 4th line pattern 150 respectively by the first connection pad 160 with the second connection pad 170
It connects.Light-emitting component 200 is, for example, light emitting diode.In the first embodiment of the invention, light-emitting component 200 is arranged at base material 110
Surface 111 on the first connection pad 160 and the second connection pad 170, but not limited to this.In other embodiments of the present invention, shine
Element also can run through base material to connect the first connection pad and the second connection pad.
Guide-lighting plate 300 has opposite a first surface 310 and a second surface 320 and a storage tank 311.Hold
Put the first surface 310 that slot 311 is located at guide-lighting plate 300.Guide-lighting plate 300 is set with first surface 310 towards base material 110
In the surface of base material 110 111, first line pattern 120, the second line pattern 130 is made to be located at base material with tertiary circuit pattern 140
Between 110 and guide-lighting plate 300.Light-emitting component 200 is located in storage tank 311.Pass through between guide-lighting plate 300 and base material 110
Adhesive agent 330 binds.The material of adhesive agent 330 is for example including ethylene-vinyl acetate copolymer (ethylene-vinyl
Acetate copolymer, EVA), polyurethane acryl resin or polyester acryl resin etc..
In the first embodiment of the invention, first line pattern 120, the second line pattern 130 and tertiary circuit pattern 140
Between base material 110 and guide-lighting plate 300, but not limited to this.In other embodiments of the present invention, first line pattern,
Second line pattern can be located at surface of the base material away from guide-lighting plate with tertiary circuit pattern, and light-emitting component runs through base material with even
Connect the first connection pad and the second connection pad.In the first embodiment of the invention, light-emitting component 200 is placed in the appearance of first surface 310
It puts in slot 311, but not limited to this.In other embodiments of the present invention, storage tank can be the first surface through guide-lighting plate
With the wears groove of second surface, and light-emitting component is placed in wears groove.
Design layer 400 is arranged at second surface 320 of the guide-lighting plate 300 away from base material 110.Design layer 400 has one thoroughly
Optical pattern area 410 so that the most of light advanced in guide-lighting plate 300 may pass through light transmission pattern area 410 and leave luminous mould
Block.Light transmission pattern area 410 in base material 110 rectangular projection and storage tank 311 in the rectangular projection sequence of base material 110, whereby
The light that light-emitting component 200 is released is avoided directly through light transmission pattern area 410, and then the brightness for promoting light transmission pattern area 410 is equal
Even property.In the first embodiment of the invention, design layer 400 is made of light tight material, and light transmission pattern area 410 is design layer
By the region of hollow out in 400, but not limited to this.In other embodiments of the present invention, design layer can be by low light transmission material institute structure
Into, and light transmission pattern area can be then made of high light-transmitting materials.
When the first electrically conductive ink includes silver powder, the first line pattern formed and the second line pattern length are 5
Centimetre (cm), width are 1 millimeter (mm), and thickness is 11 microns (μm), and the width of clearance G is 0.25 millimeter, the second electrically conductive ink
Include carbon dust, when tertiary circuit pattern thickness is 7 microns, the resistance between first line pattern and the second line pattern is 36
Ohm.When the width of the clearance G in above-mentioned condition is 0.35 millimeter, the electricity between first line pattern and the second line pattern
It hinders for 44 ohm.When the width of the clearance G in above-mentioned condition is 0.45 millimeter, first line pattern and the second line pattern it
Between resistance be 57 ohm.When the width of the clearance G in above-mentioned condition is 0.55 millimeter, first line pattern and the second circuit
Resistance between pattern is 63 ohm.
More than measurement data illustrates that the i.e. adjustable printing of welding kesistance is not required in printing conductive structure 100 of the invention
The resistance value of conductive structure.Thus, when the printing conductive structure 100 of the present invention is applied to light emitting module, supply can adjust
The voltage of light-emitting component 200 is the normal working voltage of light-emitting component 200, avoids enter into the voltage of printing conductive structure higher than hair
The normal working voltage of optical element 200 prevents light-emitting component 200 to be damaged due to overtension.
First line pattern 120, the second line pattern 130 and the 4th line pattern 150 in first embodiment of the invention
Direction of routing and the example of shape only to illustrate the invention, those skilled in the art can spirit according to the present invention with it is actual
Demand, which is adjusted, obtains suitable configuration.
The light emitting module of second embodiment of the invention will be illustrated next, refer to Fig. 9.Fig. 9 is second embodiment of the invention
Light emitting module printing conductive structure sectional view.It is real that the light emitting module of second embodiment of the invention is similar to the present invention first
The light emitting module of example is applied, the difference of the two is in first line pattern, the second line pattern and the 3rd in conductive structure is printed
The laminated layer sequence of line pattern.Add below only for the structure of first line pattern, the second line pattern and tertiary circuit pattern
With explanation, something in common just repeats no more herein.
Tertiary circuit pattern 140 is located at the surface 111 of base material 110.Tertiary circuit pattern 140 is by being printed in base material 110
One second electrically conductive ink on surface 111 is formed.Second electrically conductive ink is oil-based ink.In second electrically conductive ink for example including
Carbon, the powder of graphene or carbon nanotubes.Second electrically conductive ink has a second resistance rate, and second resistance rate is more than the first electricity
Resistance rate.Second resistance rate is, for example, 0.05 to 0.5 ohmcm (Ω cm).
120 and second line pattern 130 of first line pattern is located at the surface 111 of base material 110, and at least part of first
Line pattern is stacked at at least part of second line pattern on tertiary circuit pattern.In other words, at least part of first
Line pattern is stacked at one side of the tertiary circuit pattern away from base material 110 at least part of second line pattern.First line
There is a clearance G, the width W of clearance G is 0.1 millimeter (mm) to 1 millimeter (mm) between 120 and second line pattern 130 of pattern.
At least part of tertiary circuit pattern 140 is exposed in clearance G, and tertiary circuit pattern 140 is directly connected to first line pattern
120 and second line pattern 130.120 and second line pattern 130 of first line pattern is by being printed in the first of surface 111
Electrically conductive ink is formed.First electrically conductive ink is oil-based ink.In first electrically conductive ink for example including gold, silver, copper, platinum or other
The powder of metal or alloy.First electrically conductive ink has a first resistor rate, and first resistor rate is, for example, 10-4To 10-6Ohm
Centimetre (Ω cm).
The manufacturing method of the light emitting module of first embodiment of the invention will be illustrated next, refer to Fig. 2 and Fig. 5 to Fig. 8.Figure
5 be the manufacturing method flow chart of the light emitting module of first embodiment of the invention.Fig. 6 to Fig. 8 is the hair of first embodiment of the invention
The manufacturing method schematic diagram of the printing conductive structure of optical module.The manufacturing method of the light emitting module of first embodiment of the invention includes
Following steps (S100 to S800).
First, print the first electrically conductive ink in base material with formed the first electrically conductive ink pattern, the second electrically conductive ink pattern with
4th electrically conductive ink pattern (S100).
Specifically, using screen painting, intaglio printing, letterpress or the mode of ink jet printing by the first electrically conductive ink
The surface of base material 110 is printed in obtain the first electrically conductive ink pattern, the second electrically conductive ink pattern and the 4th electrically conductive ink pattern.
There is the gap that width is 0.1 millimeter to 1 millimeter between first electrically conductive ink pattern and the second electrically conductive ink pattern.Base material 110
For example, plate body or flexible thin slice.Base material 110 is plastic material, such as may include polyimides (Polyimide, PI), gathers
Ethylene glycol terephthalate (Polyethylene Terephthalate, PET), polyethylene naphthalate
(Polyethylene Naphthalate, PEN), polymethyl methacrylate (Polymethyl Methacrylate,
PMMA), polyethylene (PE), polypropylene (PP), polycyclic alkene resin (Polycycloolefin resin), polycarbonate resin
(Polycarbonate resin), polyurethane resin (Polyurethane resin) or Triafol T
(Triacetate Cellulose, TAC).First electrically conductive ink is, for example, to include gold, silver, copper, platinum or other metal or alloy
Powder oil-based ink.First electrically conductive ink has first resistor rate, and first resistor rate is, for example, 10-4To 10-6Ohm li
Rice (Ω cm).In section Example of the present invention, when using screen painting, the speed of printing is every 1 to 5 second printing length
20 centimetres of electrically conductive ink pattern is in the surface of base material.In another part embodiment of the present invention, when using screen painting, print
The speed of brush is the electrically conductive ink pattern of every 20 centimetres of 3.3 seconds printing lengths in the surface of base material.It is real in another part of the present invention
It applies in example, when using intaglio printing or letterpress, speed the leading for 70 centimetres to 90 centimetres of printing length per second of printing
Electric ink logo is in the surface of base material.In another part embodiment of the present invention, when using intaglio printing or letterpress, print
The speed of brush is the electrically conductive ink pattern of 83 centimetres of printing length per second in the surface of base material.In another part embodiment of the present invention
In, when using ink jet printing, the speed of printing for 5 millimeters to 50 millimeters of printing length per second electrically conductive ink pattern in base material
Surface.In another part embodiment of the present invention, when using ink jet printing, the speed of printing is 1 li of printing length per second
The electrically conductive ink pattern of rice is in the surface of base material.
Then, the first electrically conductive ink pattern, the second electrically conductive ink pattern and the 4th electrically conductive ink pattern are toasted with
Form first line pattern, the second line pattern and the 4th line pattern (S200).
Specifically, with the temperature of Celsius 60 to 80 degree to the first electrically conductive ink pattern, the second electrically conductive ink pattern and the
Four electrically conductive ink patterns are toasted, and the time span of baking is 5 to 15 minutes.The first electrically conductive ink figure is removed by toasting
Solvent in case, the second electrically conductive ink pattern and the 4th electrically conductive ink pattern is to form first line pattern 120, the second line map
130 and the 4th line pattern 150 of case.The width W of clearance G between 120 and second line pattern 130 of first line pattern is
0.1 millimeter to 1 millimeter.During when baking temperature is excessively high or baking time is long and using nonrefractory base material, base material is easily heated
Deformation.
Then, the second electrically conductive ink is printed in base material to form the 3rd electrically conductive ink pattern (S300).
Specifically, using screen painting, intaglio printing, letterpress or the mode of ink jet printing by the second electrically conductive ink
The surface of base material is printed in obtain the 3rd electrically conductive ink pattern, and the 3rd electrically conductive ink pattern inserts the first electrically conductive ink pattern
In gap between the second electrically conductive ink pattern.First electrically conductive ink pattern and the second electrically conductive ink pattern are conductive by the 3rd
Ink logo is connected.Second electrically conductive ink is, for example, to include carbon, graphite, graphene, carbon nanotubes or other conductive carbon materials
The oil-based ink of powder.Second electrically conductive ink has second resistance rate, and second resistance rate is, for example, 0.05 to 0.5 ohmcm
(Ω·cm).In section Example of the present invention, when using screen painting, the speed of printing is every 1 to 5 second printing length 20
Centimetre electrically conductive ink pattern in the surface of base material.In another part embodiment of the present invention, when using screen painting, printing
Speed for every 20 centimetres of 3.3 seconds printing lengths electrically conductive ink pattern in the surface of base material.Implement in another part of the present invention
In example, when using intaglio printing or letterpress, the speed of printing is the conduction of 70 centimetres to 90 centimetres of printing length per second
Ink logo is in the surface of base material.In another part embodiment of the present invention, when using intaglio printing or letterpress, printing
Speed for 83 centimetres of printing length per second electrically conductive ink pattern in the surface of base material.In another part embodiment of the present invention
In, when using ink jet printing, the speed of printing for 5 millimeters to 50 millimeters of printing length per second electrically conductive ink pattern in base material
Surface.In another part embodiment of the present invention, when using ink jet printing, the speed of printing is 1 li of printing length per second
The electrically conductive ink pattern of rice is in the surface of base material.
Then, the 3rd electrically conductive ink pattern is toasted to form tertiary circuit pattern (S400).
Specifically, the 3rd electrically conductive ink pattern is toasted with the temperature of Celsius 80 to 150 degree, the time of baking is long
It spends for 15 to 45 minutes.Solvent in 3rd electrically conductive ink pattern is removed by baking to form tertiary circuit pattern 140.First
Line pattern 120 is connected with the second line pattern 130 by tertiary circuit pattern 140.
Then, protective layer is formed in base material and covering first line pattern, the second line pattern, tertiary circuit pattern and the
Four line patterns (S500).
Specifically, in the surface of base material 110 in a manner of screen painting, intaglio printing, letterpress or ink jet printing
111 form protective layer 180, and protective layer 180 covers first line pattern 120, the second line pattern 130, tertiary circuit pattern
140 and the 4th line pattern 150.The material of protective layer can be thermosetting resin or thermoplastic resin, such as polyurethane, chloroethene
Alkene/vinyl acetate copolymer, polymethacrylates or epoxy resin etc., but not limited to this.
Then, light-emitting component is set in base material and is electrically connected the second line pattern and the 4th line pattern (S600).
Specifically, light-emitting component 200 is, for example, light emitting diode.Light-emitting component 200 is fixed on base material by conducting resinl
110 surface 111, and by the first connection pad 160 and second-order pad 170 be electrically connected in the second line pattern 130 with
4th line pattern 150.Conducting resinl is, for example, polyester resin elargol or solvent-free epoxy resin elargol.It is real in part of the invention
It applies in example, after light-emitting component also can be fixed on substrate surface by viscose, then with conducting resinl electric connection light-emitting component in first
Line pattern and the 4th line pattern.In another part embodiment of the present invention, light-emitting component can also run through base material, then with conduction
Glue is electrically connected light-emitting component in first line pattern and the 4th line pattern.
Then, guide-lighting plate is set in base material (S700).
Specifically, being coated with adhesive agent 330 has the first surface 310 of storage tank 311 in guide-lighting plate 300 or applies
Cloth adhesive agent 330 is in the surface 111 of the base material 110 where line pattern and light-emitting component 200.Then it is glutinous by adhesive agent 330
Close guide-lighting plate 300 and base material 110 so that first line pattern 120, the second line pattern 130, tertiary circuit pattern 140 with
4th line pattern 150 is located between base material 110 and guide-lighting plate 300, and light-emitting component 200 is located in storage tank 311.It is guide-lighting
The material of plate 300 is, for example, polyethylene terephthalate (Polyethylene Terephthalate, PET), poly- first
Base methyl acrylate (Polymethyl Methacrylate, PMMA) or makrolon (Polycarbonate).Adhesive agent 330
Material for example including ethylene-vinyl acetate copolymer (ethylene-vinyl acetate copolymer, EVA), poly-
Urethane acryl resin or polyester acryl resin.In the present embodiment, first line pattern 120, the second line pattern 130,
140 and the 4th line pattern 150 of tertiary circuit pattern is located between base material 110 and guide-lighting plate 300, and but not limited to this.
In other embodiments of the invention, first line pattern, the second line pattern, tertiary circuit pattern and the 4th line pattern are located at base
Surface of the material away from guide-lighting plate.
Then, design layer is set in surface (S800) of the guide-lighting plate away from base material.
Specifically, in a manner of spraying, rotary coating, screen painting, intaglio printing, letterpress or ink jet printing in
The second surface 320 of guide-lighting plate 300 forms the design layer 400 with light transmission pattern area 410.Light transmission pattern area 410 is in base material
110 rectangular projection is with storage tank 311 in the rectangular projection sequence of base material 110.The material of design layer 400 is, for example, poly- to benzene
Naphthalate (Polyethylene Terephthalate, PET), polymethyl methacrylate (Polymethyl
Methacrylate, PMMA) or makrolon (Polycarbonate).In other embodiments of the present invention, design layer also can be
Pattern paste paper.
Thus, it can be prepared by according to aforementioned steps of manufacture without the use of micro image etching procedure, welding processing procedure or plating
Processing procedure, and there is the slimming supply line structure for controlling supply voltage and be thinned supply line's structure including this
Light emitting module.
In the manufacturing method of the light emitting module of first embodiment of the invention, after electrically conductive ink pattern is printed in substrate,
It is first toasted to form line pattern, then another electrically conductive ink pattern is printed in substrate and toasts to be formed another
Line pattern, but not limited to this.In the manufacturing method of the light emitting module of other embodiments of the invention, first whole can be led
After electric ink logo is printed in substrate, again property toast form line pattern.
The light emitting module of second embodiment of the invention is similar to the light emitting module of first embodiment of the invention due to structure,
Manufacturing method is also similar to the manufacturing method of first embodiment.The manufacturer of the light emitting module of first embodiment and second embodiment
Difference between method is exchanged for process sequence, is just repeated no more herein.
In conclusion print conductive structure, including its light emitting module and its system according to the invention described above
Method is made, is directly connected to oily first electrically conductive ink and prints formed by printing the tertiary circuit pattern formed by the second electrically conductive ink
First line pattern and the second line pattern, and the second resistance rate of the second electrically conductive ink be more than the first electrically conductive ink first
Resistivity so that tertiary circuit pattern can be as the resistive element in printing conductive structure.Thus, you can obtain being not required to make
With micro image etching procedure, processing procedure or electroplating process are welded, and there is the slimming supply line structure for controlling supply voltage.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
It knows those skilled in the art and makes various corresponding changes and deformation, but these corresponding changes and change in accordance with the present invention
Shape should all belong to the protection domain of appended claims of the invention.
Claims (19)
1. a kind of printing conductive structure, which is characterized in that including：
One base material；
One first line pattern and one second line pattern, the one first electrically conductive ink institute shape on the surface by being printed in the base material
Into with a gap between the first line pattern and second line pattern；And
One tertiary circuit pattern is formed, the tertiary circuit figure by being printed in one second electrically conductive ink on the surface of the base material
Case is directly connected to the first line pattern and second line pattern；
Wherein, which has a first resistor rate, which has a second resistance rate, and this
Two resistivity are more than the first resistor rate.
2. printing conductive structure according to claim 1, which is characterized in that at least part of tertiary circuit pattern is located at
In the gap between the first line pattern and second line pattern.
3. printing conductive structure according to claim 2, which is characterized in that a part of tertiary circuit pattern is stacked at
The first line pattern, the tertiary circuit pattern of another part are stacked at second line pattern.
4. printing conductive structure according to claim 1, which is characterized in that at least part of first line pattern with extremely
Least a portion of second line pattern is stacked at the one side of the tertiary circuit pattern away from the base material.
5. printing conductive structure according to claim 1, which is characterized in that further comprise a protective layer, positioned at the base
The surface of material and cover the first line pattern, second line pattern and the tertiary circuit pattern.
6. printing conductive structure according to claim 1, which is characterized in that the base material is flexible substrate, and the base material
Material include polyimides, polyethylene terephthalate, polyethylene naphthalate, polymethyl methacrylate,
Polyethylene, polypropylene, polycyclic alkene resin, polycarbonate resin, polyurethane resin or Triafol T.
7. printing conductive structure according to claim 1, which is characterized in that the width in the gap is 0.1 to 1 centimetre.
8. printing conductive structure according to claim 1, which is characterized in that first electrically conductive ink and second conductive oil
Ink is oil-based ink.
9. a kind of light emitting module, which is characterized in that including：
Printing conductive structure according to any claim in claim 1 to 8, the printing conductive structure further comprise
One the 4th line pattern, the 4th line pattern are located at the base material；
One light-emitting component is arranged at the base material and is electrically connected at second line pattern and the 4th line pattern；And
One guide-lighting plate, has a storage tank, which is arranged at the base material, which is placed in the storage tank
In.
10. light emitting module according to claim 9, which is characterized in that further comprise a design layer, be arranged at the leaded light
Plate and the separate base material, the design layer is with a light transmission pattern area.
11. light emitting module according to claim 10, which is characterized in that the light transmission pattern area is in the rectangular projection of the base material
With the storage tank in the rectangular projection sequence of the base material.
12. light emitting module according to claim 9, which is characterized in that the first line pattern, second line pattern,
The tertiary circuit pattern and the 4th line pattern are located between the base material and the leaded light plate.
13. a kind of manufacturing method for printing conductive structure, which is characterized in that including：
One first electrically conductive ink is printed in a base material to form one first electrically conductive ink pattern and one second electrically conductive ink pattern, with
And one second electrically conductive ink of printing in the base material to form one the 3rd electrically conductive ink pattern, the first electrically conductive ink pattern with this
Two electrically conductive ink patterns are connected by the 3rd electrically conductive ink pattern；And
A baking is carried out to the first electrically conductive ink pattern, the second electrically conductive ink pattern and the 3rd electrically conductive ink pattern to divide
A first line pattern, one second line pattern and a tertiary circuit pattern, the first line pattern and second line are not formed
There is a gap, which is connected with second line pattern by the tertiary circuit pattern between the pattern of road；
Wherein, which has a first resistor rate, which has a second resistance rate, and this
Two resistivity are more than the first resistor rate.
14. the manufacturing method of printing conductive structure according to claim 13, which is characterized in that further comprise forming one
For protective layer in the base material, which covers the first line pattern, second line pattern and the tertiary circuit pattern.
15. the manufacturing method of printing conductive structure according to claim 13, which is characterized in that the base material is flexible base
Material, and the material of the base material includes polyimides, polyethylene terephthalate, polyethylene naphthalate, poly- methyl
Methyl acrylate, polyethylene, polypropylene, polycyclic alkene resin, polycarbonate resin, poly- ammonia amido formate resin or three acetic acid
Cellulose.
16. the manufacturing method of printing conductive structure according to claim 13, which is characterized in that the width in the gap is
0.1 to 1 centimetre.
17. the manufacturing method of printing conductive structure according to claim 13, which is characterized in that first electrically conductive ink contains
There are metal powder and resin, the resistivity of first electrically conductive ink is 10-4To 10-6Ohmcm.
18. the manufacturing method of printing conductive structure according to claim 13, which is characterized in that second electrically conductive ink contains
There are carbon and resin, the resistivity of second electrically conductive ink is 0.05 to 0.5 ohmcm.
19. the manufacturing method of printing conductive structure according to claim 13, which is characterized in that the temperature of the baking is to take the photograph
Family name 60 to 150 spends, and time span is 5 to 45 minutes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105138735 | 2016-11-24 | ||
| TW105138735A TWI629806B (en) | 2016-11-24 | 2016-11-24 | Ink-printed conductive structure, light emitting module including the same, and manufacturing methods thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108110125A true CN108110125A (en) | 2018-06-01 |
| CN108110125B CN108110125B (en) | 2024-04-02 |
Family
ID=61286066
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710387355.4A Active CN108110125B (en) | 2016-11-24 | 2017-05-26 | Printed conductive structure, light emitting module including the same, and method of manufacturing the same |
| CN201720603194.3U Withdrawn - After Issue CN206907790U (en) | 2016-11-24 | 2017-05-26 | Printed conductive structure and light emitting module including the same |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720603194.3U Withdrawn - After Issue CN206907790U (en) | 2016-11-24 | 2017-05-26 | Printed conductive structure and light emitting module including the same |
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| Country | Link |
|---|---|
| CN (2) | CN108110125B (en) |
| TW (1) | TWI629806B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111065219A (en) * | 2018-10-17 | 2020-04-24 | 昆山华冠商标印刷有限公司 | Decoration assembly |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI629806B (en) * | 2016-11-24 | 2018-07-11 | 正美企業股份有限公司 | Ink-printed conductive structure, light emitting module including the same, and manufacturing methods thereof |
| TWI658765B (en) * | 2018-09-28 | 2019-05-01 | 正美企業股份有限公司 | Conductive circuit structure and passive wireless sensing device using the same |
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- 2016-11-24 TW TW105138735A patent/TWI629806B/en active
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| KR20040036780A (en) * | 2002-10-24 | 2004-05-03 | 대덕전자 주식회사 | Method of manufacturing resistor-embedded printed circuit board |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN206907790U (en) | 2018-01-19 |
| TWI629806B (en) | 2018-07-11 |
| CN108110125B (en) | 2024-04-02 |
| TW201820658A (en) | 2018-06-01 |
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