CN108109935A - Silicon chip inserting piece device, Wafer Cleaning equipment and silicon wafer cleaning method - Google Patents
Silicon chip inserting piece device, Wafer Cleaning equipment and silicon wafer cleaning method Download PDFInfo
- Publication number
- CN108109935A CN108109935A CN201611044801.3A CN201611044801A CN108109935A CN 108109935 A CN108109935 A CN 108109935A CN 201611044801 A CN201611044801 A CN 201611044801A CN 108109935 A CN108109935 A CN 108109935A
- Authority
- CN
- China
- Prior art keywords
- cleaning
- silicon chip
- unit
- inserted sheet
- inserting piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 177
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 142
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 137
- 239000010703 silicon Substances 0.000 title claims abstract description 137
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 29
- 230000005540 biological transmission Effects 0.000 claims abstract description 14
- 230000006835 compression Effects 0.000 claims description 12
- 238000007906 compression Methods 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 239000007921 spray Substances 0.000 claims description 5
- 238000005554 pickling Methods 0.000 claims 1
- 230000035611 feeding Effects 0.000 description 29
- 238000004519 manufacturing process Methods 0.000 description 8
- 206010057855 Hypotelorism of orbit Diseases 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002000 scavenging effect Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000012445 acidic reagent Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The silicon chip inserting piece device of the present invention, including the feeding unit material being connected and inserted sheet unit, silicon chip is transmitted to inserted sheet unit by feeding unit material piecewise, silicon chip inserting piece device further includes the cleaning unit between feeding unit material and inserted sheet unit, and cleaning unit into the silicon chip before inserted sheet unit to carrying out cleaning treatment.The Wafer Cleaning equipment of the present invention, including silicon chip cleaning device and silicon chip inserting piece device as described above.The silicon wafer cleaning method of the present invention, is cleaned using as above Wafer Cleaning equipment, including：Silicon chip is transmitted using feeding unit material；Silicon chip is cleaned using cleaning unit；Chip transmission after cleaning treatment to inserted sheet unit is subjected to inserted sheet；And utilize the silicon chip after silicon chip cleaning device cleaning inserted sheet.Silicon chip inserting piece device, Wafer Cleaning equipment and the silicon wafer cleaning method of the present invention will experienced cleaning treatment using cleaning unit into the silicon chip before inserted sheet unit so that surface is dirty to be reduced, and residence time of the silicon chip in rinse bath can be greatly reduced.
Description
Technical field
The invention belongs to solar battery sheet manufacturing technology fields, and in particular to a kind of silicon chip inserting piece device further relates to one
Wafer Cleaning equipment of the kind with the silicon chip inserting piece device, further relates to a kind of silicon wafer cleaning method.
Background technology
With the continuous development of world economy, modernization construction constantly increases high efficient energy sources demand.Photovoltaic generation conduct
A kind of main energy sources of green energy resource and human kind sustainable development are increasingly subject to the attention of countries in the world and are sent out energetically
Exhibition.Battery based on silicon chip is the main product of area of solar cell, needed for silicon chip be by square shaped or standard
Square silicon ingot or silicon rod after slice processing by obtaining.The multiple silicon chips obtained of cutting into slices are stacked together, it is necessary to be divided
Piece and inserted sheet are handled, multiple silicon chips in inserted sheet to Carrier box, it is convenient to be circulated to later process, such as be cleaned.
Current solar energy battery adopted silicon chip is mostly cleaned using slot type, and in groove-type cleaning machine, multiple silicon chips are held at one
It carries in box, by multiple rinse baths such as descaling bath and/or alkaline bath, potcher, completes cleaning process.In slot type cleaning
In, multiple silicon chips are arranged in parallel, and the gap between adjacent two silicon chips is limited so that acid reagent/base reagent is to silicon
The chemical attack cleaning action on piece surface, the pure water souring dirty to silicon chip surface are restricted.It is predetermined clear to reach
Effect is washed, Carrier box and silicon chip therein need the stay long enough in each rinse bath.In this way, it is unfavorable for cleaning again
Efficiency or the promotion for cleaning production capacity.
The content of the invention
It is an object of the invention to provide a kind of silicon chip inserting piece device, due to adjacent two when solving existing silicon chip inserted sheet
The problem of hypotelorism of a silicon chip causes cleaning performance bad.
The present invention also aims to provide a kind of Wafer Cleaning equipment, solve existing for existing Wafer Cleaning equipment
The shortcomings that needing to extend scavenging period due to silicon chip hypotelorism.
The present invention also aims to provide a kind of silicon wafer cleaning method.
A kind of technical solution of the present invention is：Silicon chip inserting piece device, including the feeding unit material and inserted sheet being connected
Silicon chip is transmitted to inserted sheet unit by unit, feeding unit material piecewise, and silicon chip inserting piece device is further included positioned at feeding unit material and inserted sheet list
Cleaning unit between member, cleaning unit into the silicon chip before inserted sheet unit to carrying out cleaning treatment.
The features of the present invention also resides in,
Cleaning unit includes at least one cleaning section, and each cleaning section includes the cleaning transfer structure and brush that are oppositely arranged
Structure is washed, cleaning transfer structure receives and transmits the silicon chip from feeding unit material to inserted sheet unit, and the scrub structure is to described
Silicon chip surface carries out scrub piecewise and handles.
Scrubbing structure includes multiple spaced brush rolls, and brush roll includes rotating roller and the brush set around rotating roller
Head.
Cleaning section further includes the hydrojet structure being oppositely arranged with cleaning transfer structure, and hydrojet structure includes at least one hydrojet
Pipe, sparge pipe are arranged alternately with brush roll.
The sparge pipe one side opposite with cleaning transfer structure is equipped with spray hole, and sparge pipe can be rotated around the axis of its own.
Cleaning section further includes multiple compression rollers, and each compression roller is disposed adjacent with brush roll.
Cleaning unit includes at least two cleaning sections set gradually, and in adjacent two cleaning sections, a cleaning section is used
In the first surface of cleaning silicon wafer, another cleaning section is for the cleaning silicon wafer second surface opposite with first surface.
Another technical solution of the present invention is：Wafer Cleaning equipment, including silicon chip cleaning device and as above institute
The silicon chip inserting piece device stated, silicon chip cleaning device are slot type cleaning device.
The features of the present invention also resides in,
Silicon chip cleaning device includes descaling bath and/or alkaline bath and pure water slot.
Another technical solution of the present invention is：Silicon wafer cleaning method is set using Wafer Cleaning as described above
It is standby that silicon chip is cleaned, including step：
Silicon chip is transmitted piecewise using feeding unit material；
Cleaning treatment is carried out to silicon chip using cleaning unit；
Chip transmission after cleaning treatment to the inserted sheet unit is subjected to inserted sheet；
And utilize silicon chip cleaning device cleaning inserted sheet treated silicon chip.
The beneficial effects of the invention are as follows：Silicon chip inserting piece device, Wafer Cleaning equipment and the silicon wafer cleaning method of the present invention
Solve the problems, such as that existing cleaning equipment and technique cleaning efficiency or cleaning production capacity are promoted and be limited.The silicon chip inserting piece device of the present invention
Automatic inserted sheet is carried out using feeding unit material and inserted sheet unit, is conducive to improve inserted sheet efficiency and yield；The silicon chip inserting piece device is also
Further comprise the cleaning unit between feeding unit material and inserted sheet unit, cleaning is experienced into the silicon chip before inserted sheet unit
The cleaning treatment of unit, the dirty of surface are reduced, and can mitigate the burden of process before feeding, and are conducive to road after being promoted and clean
The efficiency of process promotes Wafer Cleaning production capacity；The Wafer Cleaning equipment of the present invention includes silicon chip inserting piece device as described above, warp
The silicon chip of the silicon chip inserting piece device experienced that scrub cleaning treatment, Superficial Foreign Body etc. are dirty to be reduced, in silicon chip cleaning device
In, residence time of the silicon chip in descaling bath and/or alkaline bath, pure water slot can be greatly reduced, so as to promote cleaning efficiency and clear
Wash production capacity.The silicon wafer cleaning method of the present invention by cleaning again after carrying out scrub processing to silicon chip so that silicon chip surface is clear
Cleanliness greatly improves, and so as to reduce scavenging period, improves cleaning efficiency.
Description of the drawings
Fig. 1 is the structure diagram of the silicon chip inserting piece device of the present invention；
Fig. 2 is the structure diagram of the Wafer Cleaning equipment of the present invention.
In figure, 10. silicon chip inserting piece devices, 1. feeding unit materials, 2. cleaning units, 3. inserted sheet units, 11. feedings transmission list
Member, cleaning section on 21., 22. times cleaning sections, 23. cleaning transfer structures, 240. brush rolls, 241. rotating rollers, 242. brush heads,
250. sparge pipes, 251. spray holes, 26. compression rollers, 30. basket supports, 31. inserted sheet transmission units, 100. Wafer Cleaning equipment, 101.
Silicon chip cleaning device.
Specific embodiment
The present invention is described in detail with reference to the accompanying drawings and detailed description.
Referring to Fig. 1, first embodiment of the invention provides a kind of silicon chip inserting piece device 10, including be connected feeding unit material 1,
Cleaning unit 2 and inserted sheet unit 3.Silicon chip is transmitted to inserted sheet unit 3 by feeding unit material 1 piecewise.Cleaning unit 2 is located at feeding unit material
Between 1 and inserted sheet unit 3, to carrying out cleaning treatment into the silicon chip before inserted sheet unit 3.
Feeding unit material 1 has the feeding transmission unit 11 being connected with cleaning unit 2.Feeding unit material 1 can be the prior art
Feeding structure, silicon chip is transmitted to feeding transmission unit 11 piecewise.
Cleaning unit 2 includes at least one cleaning section, and specifically, cleaning unit 2 may include multiple cleanings set gradually
Portion, in adjacent two cleaning sections, a cleaning section is used for the first surface of cleaning silicon wafer, another cleaning section is for cleaning silicon
The piece second surface opposite with first surface.In the present embodiment, cleaning unit 2 includes two cleaning sections being disposed adjacent, respectively
For upper cleaning section 21 and lower cleaning section 22.Preferably, the cleaning unit 2 of the silicon chip inserting piece device 10 of the technical program embodiment with
It is movable docking between feeding unit material 1 and inserted sheet unit 3.When pending silicon chip surface is dirty serious, it is convenient to will
Cleaning unit 2 is placed between feeding unit material 1 and inserted sheet unit 3.It, can be rapidly in the case where silicon chip surface clean level is fine
Cleaning unit 2 is removed.
Each cleaning section includes a cleaning transfer structure 23, scrub structure (not shown), a hydrojet structures
(not shown).Cleaning transfer structure 23 is connected with feeding transmission unit 11, receives and transmits the silicon chip from feeding unit material 1 extremely
Inserted sheet unit 3.Each cleaning section further includes multiple compression rollers 26.Scrub structure, hydrojet structure and multiple compression rollers 26 with clearly
Clean transfer structure 23 is oppositely arranged.
It scrubs structure and the processing of scrub piecewise is carried out to silicon chip, including multiple spaced brush rolls 240.The present embodiment
In, scrub structure includes two spaced brush rolls 240.Each brush roll 240 includes equal rotating roller 241 and around rotation
The brush head 242 that roller 241 is set.Rotating roller 241 is rotatably arranged with drive brush head 242 rotates and scrubs silicon chip surface.
Hydrojet structure includes at least one sparge pipe 250.Sparge pipe 250 is arranged alternately with brush roll 240.The present embodiment
In, sparge pipe 250 is one, and the gap between two brush rolls 240 of face is set.Specifically, sparge pipe 250 is located at brush roll
240 one sides away from cleaning transfer structure 23.The one side opposite with cleaning transfer structure 23 of sparge pipe 250 is equipped with spray hole 251,
And sparge pipe 250 can turn an angle around the axis of its own, so that 251 face of spray hole cleaning transfer structure, 23 surface
Different parts, liquid will be scrubbed and be sprayed in a certain range on cleaning transfer structure 23 surface.
Each compression roller 26 is disposed adjacent with brush roll 240.In the present embodiment, each brush roll 240 is two corresponding
Compression roller 26, two compression rollers 26 are located at the opposite both sides of brush roll 240 respectively.Compression roller 26 rotatably arranged with, for pair
The silicon chip of the scrub processing of brush roll 240 is positioned.
Inserted sheet unit 3 can be the plate-inserting structure of the prior art, and the silicon chip entered piecewise is sequentially inserted into basket support 30.Inserted sheet
Unit 3 has the inserted sheet transmission unit 31 being connected with cleaning unit 2.
Using the silicon chip inserting piece device 10 of the technical program first embodiment, silicon chip is transmitted to by feeding unit material 1 piecewise
Expect transmission unit 11, scrub cleaning treatment is carried out into cleaning unit 2, then inserted through inserted sheet transmission unit 31 and inserted sheet unit 3
Enter basket support 30.Automatic inserted sheet is carried out using feeding unit material 1 and inserted sheet unit 3, is conducive to improve inserted sheet efficiency and yield.Into insert
Silicon chip before blade unit 3 experienced scrub cleaning treatment, and the dirty of surface is reduced.The burden of process before feeding can be mitigated,
And be conducive to the efficiency of road cleaning process after being promoted, promote Wafer Cleaning production capacity.
Referring to Fig. 2, second embodiment of the invention provides a kind of Wafer Cleaning equipment 100, including 101 He of silicon chip cleaning device
Silicon chip inserting piece device 10 as described above.Silicon chip cleaning device 101 is slot type cleaning device, including descaling bath and/or alkaline bath,
Pure water slot.The silicon chip that inserted sheet is completed through silicon chip inserting piece device 10 is placed in basket support 30, sequentially enters the acid of silicon chip cleaning device 101
It is cleaned in washing trough and/or alkaline bath, pure water slot.
The Wafer Cleaning equipment 100 of second embodiment of the invention, it is clear that the silicon chip through silicon chip inserting piece device 10 experienced scrub
Clean processing, Superficial Foreign Body etc. are dirty to be reduced.In silicon chip cleaning device 101, carry the basket support 30 of silicon chip descaling bath and/
Or the residence time in alkaline bath, pure water slot can be greatly reduced, so as to promote cleaning efficiency and cleaning production capacity.
Third embodiment of the invention provides a kind of silicon wafer cleaning method, it may include following steps：
First, Wafer Cleaning equipment 100 as described above is provided；
Then, silicon chip is transmitted piecewise using feeding unit material 1.Specifically, silicon chip is transmitted to feeding biography by feeding unit material 1 piecewise
Unit 11 is sent, and silicon chip is transmitted using feeding transmission unit 11.
Secondly, cleaning treatment is carried out to silicon chip using cleaning unit 2.Specifically, cleaning unit 2 utilizes upper 21 He of cleaning section
Lower cleaning section 22 distinguishes two opposite surfaces of cleaning silicon wafer.In upper cleaning section 21 and lower cleaning section 22, transmitted using cleaning
Structure 23 transmits silicon chip, and utilizes brush roll 240, by sparge pipe 250 and compression roller 26, silicon chip is carried out at scrub cleaning
Reason.
Again, the chip transmission after cleaning treatment to inserted sheet unit 3 is subjected to inserted sheet.Specifically, transmitted by inserted sheet single
After member 31 transmits silicon chip, silicon chip is inserted into basket support 30 by inserted sheet unit 3.
Finally, the silicon chip of inserted sheet processing is cleaned using silicon chip cleaning device 101.
The silicon wafer cleaning method of third embodiment of the invention, the silicon chip through silicon chip inserting piece device 10 experienced at scrub cleaning
Reason, Superficial Foreign Body etc. are dirty to be reduced.In silicon chip cleaning device 101, the basket support 30 of silicon chip is carried in descaling bath and/or alkali
Residence time in washing trough, pure water slot can be greatly reduced, so as to fulfill high efficiency and high production capacity Wafer Cleaning.
Claims (10)
1. silicon chip inserting piece device, including the feeding unit material (1) being connected and inserted sheet unit (2), the feeding unit material (1) is by silicon chip
The inserted sheet unit (3) is transmitted to piecewise, which is characterized in that the silicon chip inserting piece device is further included positioned at the feeding unit material
(1) cleaning unit (2) between the inserted sheet unit (3), before the cleaning unit (2) is to entering the inserted sheet unit (3)
Silicon chip carry out cleaning treatment.
2. silicon chip inserting piece device as described in claim 1, which is characterized in that the cleaning unit (2) includes at least one clear
Clean portion, each cleaning section include the cleaning transfer structure (23) being oppositely arranged and scrub structure, the cleaning transmission knot
Structure (23) receives and transmits the silicon chip from the feeding unit material (1) to the inserted sheet unit (3), and the scrub structure is to described
Silicon chip surface carries out scrub piecewise and handles.
3. silicon chip inserting piece device as claimed in claim 2, which is characterized in that the scrub structure includes multiple spaced
Brush roll (240), the brush roll (240) include rotating roller (241) and the brush head set around the rotating roller (241)
(242)。
4. silicon chip inserting piece device as claimed in claim 3, which is characterized in that the cleaning section is further included to be transmitted with the cleaning
The hydrojet structure that structure (23) is oppositely arranged, the hydrojet structure include at least one sparge pipe (250), the sparge pipe
(250) it is arranged alternately with the brush roll (240).
5. silicon chip inserting piece device as claimed in claim 4, which is characterized in that the sparge pipe (250) and cleaning transfer structure
(23) opposite one side is equipped with spray hole (251), and the sparge pipe (250) can rotate around the axis of its own.
6. silicon chip inserting piece device as claimed in claim 3, which is characterized in that the cleaning section further includes multiple compression rollers
(26), each compression roller (26) is disposed adjacent with the brush roll (25).
7. the silicon chip inserting piece device as any one of claim 2-6, which is characterized in that the cleaning unit is included at least
Two cleaning sections set gradually, in adjacent two cleaning sections, a cleaning section is used for the first surface of cleaning silicon wafer, another
A cleaning section is for the cleaning silicon wafer second surface opposite with first surface.
8. Wafer Cleaning equipment, which is characterized in that including silicon chip cleaning device (101) and as described in claim any one of 1-7
Silicon chip inserting piece device, the silicon chip cleaning device (101) be slot type cleaning device.
9. Wafer Cleaning equipment as claimed in claim 8, which is characterized in that the silicon chip cleaning device (101) includes pickling
Slot and/or alkaline bath and pure water slot.
10. silicon wafer cleaning method, which is characterized in that carried out using Wafer Cleaning equipment as claimed in claim 8 or 9 to silicon chip
Cleaning, including step：
Silicon chip is transmitted piecewise using the feeding unit material (1)；
Cleaning treatment is carried out to the silicon chip using the cleaning unit (2)；
Chip transmission after the cleaning treatment to the inserted sheet unit (3) is subjected to inserted sheet；
And clean inserted sheet treated silicon chip using the silicon chip cleaning device (101).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611044801.3A CN108109935A (en) | 2016-11-24 | 2016-11-24 | Silicon chip inserting piece device, Wafer Cleaning equipment and silicon wafer cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611044801.3A CN108109935A (en) | 2016-11-24 | 2016-11-24 | Silicon chip inserting piece device, Wafer Cleaning equipment and silicon wafer cleaning method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108109935A true CN108109935A (en) | 2018-06-01 |
Family
ID=62203752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611044801.3A Pending CN108109935A (en) | 2016-11-24 | 2016-11-24 | Silicon chip inserting piece device, Wafer Cleaning equipment and silicon wafer cleaning method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108109935A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110660646A (en) * | 2019-10-01 | 2020-01-07 | 张家港市超声电气有限公司 | Silicon wafer cleaning method |
| CN112349614A (en) * | 2019-08-06 | 2021-02-09 | 天津创昱达光伏科技有限公司 | Photovoltaic silicon wafer cleaning equipment |
| WO2021208550A1 (en) * | 2020-04-17 | 2021-10-21 | 天津环博科技有限责任公司 | Vertical feeding and wafer inserting integrated machine |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11233585A (en) * | 1998-02-18 | 1999-08-27 | Shin Meiwa Ind Co Ltd | Wafer processor |
| JP2000012667A (en) * | 1998-06-23 | 2000-01-14 | Tokyo Electron Ltd | Device and method for washing and drying chuck for holding substrate |
| JP2010141070A (en) * | 2008-12-11 | 2010-06-24 | Toyota Motor Corp | Cleaning device of semiconductor wafer |
| CN202803656U (en) * | 2012-08-29 | 2013-03-20 | 常州捷佳创精密机械有限公司 | Cleaning system for solar silicon wafer |
| CN104813438A (en) * | 2012-11-28 | 2015-07-29 | 盛美半导体设备（上海）有限公司 | Method and apparatus for cleaning semiconductor wafer |
| CN105529290A (en) * | 2015-12-07 | 2016-04-27 | 天津中环半导体股份有限公司 | Inserting full-automatic and cleaning device and cleaning technological process for silicon wafers |
| CN205609493U (en) * | 2016-03-23 | 2016-09-28 | 天津创昱达科技有限公司 | Silicon chip washs basket automatic feeding machine |
| CN205609557U (en) * | 2016-03-23 | 2016-09-28 | 天津创昱达科技有限公司 | Full -automatic silicon chip insert machine of linear type |
| CN106098602A (en) * | 2016-08-24 | 2016-11-09 | 高佳太阳能股份有限公司 | Automatic machine for inserting silicon wafers film releasing frock |
-
2016
- 2016-11-24 CN CN201611044801.3A patent/CN108109935A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11233585A (en) * | 1998-02-18 | 1999-08-27 | Shin Meiwa Ind Co Ltd | Wafer processor |
| JP2000012667A (en) * | 1998-06-23 | 2000-01-14 | Tokyo Electron Ltd | Device and method for washing and drying chuck for holding substrate |
| JP2010141070A (en) * | 2008-12-11 | 2010-06-24 | Toyota Motor Corp | Cleaning device of semiconductor wafer |
| CN202803656U (en) * | 2012-08-29 | 2013-03-20 | 常州捷佳创精密机械有限公司 | Cleaning system for solar silicon wafer |
| CN104813438A (en) * | 2012-11-28 | 2015-07-29 | 盛美半导体设备（上海）有限公司 | Method and apparatus for cleaning semiconductor wafer |
| CN105529290A (en) * | 2015-12-07 | 2016-04-27 | 天津中环半导体股份有限公司 | Inserting full-automatic and cleaning device and cleaning technological process for silicon wafers |
| CN205609493U (en) * | 2016-03-23 | 2016-09-28 | 天津创昱达科技有限公司 | Silicon chip washs basket automatic feeding machine |
| CN205609557U (en) * | 2016-03-23 | 2016-09-28 | 天津创昱达科技有限公司 | Full -automatic silicon chip insert machine of linear type |
| CN106098602A (en) * | 2016-08-24 | 2016-11-09 | 高佳太阳能股份有限公司 | Automatic machine for inserting silicon wafers film releasing frock |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112349614A (en) * | 2019-08-06 | 2021-02-09 | 天津创昱达光伏科技有限公司 | Photovoltaic silicon wafer cleaning equipment |
| CN110660646A (en) * | 2019-10-01 | 2020-01-07 | 张家港市超声电气有限公司 | Silicon wafer cleaning method |
| WO2021208550A1 (en) * | 2020-04-17 | 2021-10-21 | 天津环博科技有限责任公司 | Vertical feeding and wafer inserting integrated machine |
| US11915956B2 (en) | 2020-04-17 | 2024-02-27 | Tianjin Huanbo Science And Technology Co., Ltd | Vertical feeding and wafer inserting integrated machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108109935A (en) | Silicon chip inserting piece device, Wafer Cleaning equipment and silicon wafer cleaning method | |
| CN107755311B (en) | Horizontal cleaning device for silicon wafer | |
| CN207103242U (en) | A kind of silicon chip cleaning device and chain type board | |
| CN103225088B (en) | Welding wire cleaning device and method using device for cleaning welding wire | |
| CN107658246A (en) | A kind of solar silicon wafers cleaning | |
| CN203076260U (en) | Copper belt ultrasonic cleaning device | |
| CN207446789U (en) | Suitable for the electrostatic dust collection equipment of plastic-aluminum combined thermal insulation board production | |
| CN206432240U (en) | Silicon chip inserting piece device and Wafer Cleaning equipment | |
| CN106733876B (en) | A kind of cleaning method of the crystal silicon chip of Buddha's warrior attendant wire cutting | |
| CN102212832A (en) | Silicon material cleaning technology | |
| CN207183226U (en) | A kind of silicon solar cell wet etching water washing device | |
| CN207767488U (en) | A kind of fruit washer | |
| CN207308428U (en) | A kind of bearing fixes feeding cleaning system automatically | |
| CN203304220U (en) | Silicon wafer cleaning equipment | |
| CN206481962U (en) | A kind of Cauliflower cleaning machine | |
| CN216655516U (en) | Time-saving water-saving graphite boat cleaning machine | |
| CN205270194U (en) | Glass cleaning device | |
| CN207220100U (en) | A kind of automatic cleaning hair removing apparatus of wild peach | |
| CN206103941U (en) | Active carbon pickling water circle device | |
| CN201755722U (en) | Stripping and washing machine for aluminium welding wire | |
| CN106733881A (en) | A kind of sonic cleaning system | |
| CN204335683U (en) | Ocean fish automatic impurity removing equipment | |
| CN207993884U (en) | A kind of manual turn-over cleaning device of solar battery sheet | |
| CN205833672U (en) | A kind of wire rod Quick cleaning device | |
| CN203076261U (en) | Copper belt heating cleaning device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180601 |
|
| RJ01 | Rejection of invention patent application after publication |