CN108091619A - Intelligent power module and its manufacturing method, air conditioner - Google Patents
Intelligent power module and its manufacturing method, air conditioner Download PDFInfo
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- CN108091619A CN108091619A CN201711315425.1A CN201711315425A CN108091619A CN 108091619 A CN108091619 A CN 108091619A CN 201711315425 A CN201711315425 A CN 201711315425A CN 108091619 A CN108091619 A CN 108091619A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inverter Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention discloses a kind of intelligent power module and its manufacturing method, air conditioner, which includes：Circuit substrate；High heat conductive insulating layer, arranged on the surface of circuit substrate, the material of high heat conductive insulating layer includes epoxy resin, aluminium oxide, high heat conduction packing material；Circuit-wiring layer, on high heat conductive insulating layer, circuit-wiring layer has the installation position that the electronic component for intelligent power module is installed；Power component and main control chip, main control chip and power component are respectively arranged on the installation position of corresponding circuit-wiring layer.The present invention solves to radiate not in time in the intelligent power module course of work, or heat dissipation effect is poor, and cause the operating temperature of main control chip excessively high and break down, make the control signal of the easy output error of master control chip, the upper and lower bridge arm of control inverter bridge simultaneously turns on, and cause short circuit, the problem of so as to burn intelligent power module.
Description
Technical field
The present invention relates to electronic circuit technology field, more particularly to a kind of intelligent power module and its manufacturing method, air-conditioning
Device.
Background technology
Intelligent power module, i.e. IPM (Intelligent Power Module) are a kind of by power electronics and integrated electricity
The power drive class product that road technique combines is generally used on the electric-controlled plates of equipment such as driving wind turbine, compressor.
At present, power component, driving circuit and MCU etc. are integrated on a substrate by intelligent power module mostly.Intelligent work(
When rate module works, than more serious, the heat that power component generates is passed easily by substrate to MCU chip for power component fever
It leads, once MCU operating temperatures are excessively high, is then easy to cause MCU failures, can not work normally.
The content of the invention
The main object of the present invention is to propose a kind of intelligent power module and its manufacturing method, air conditioner, it is intended to solve intelligence
It radiates not in time in the energy power module course of work or heat dissipation effect is poor, and cause the operating temperature of main control chip excessively high
And it breaking down so that the control signal of the easy output error of main control chip controls the upper and lower bridge arm of inverter bridge to simultaneously turn on, and
Cause short circuit, the problem of so as to burn intelligent power module.
To achieve the above object, the present invention proposes a kind of intelligent power module, and the intelligent power module includes：
Circuit substrate；
High heat conductive insulating layer, arranged on the surface of the circuit substrate, the material of the high heat conductive insulating layer includes asphalt mixtures modified by epoxy resin
Fat, aluminium oxide, high heat conduction packing material；
Circuit-wiring layer, on the high heat conductive insulating layer, the circuit-wiring layer, which has, supplies the intelligent power mould
The installation position of the electronic component installation of block；
(PCC) power, the (PCC) power are arranged on the installation position of the corresponding circuit-wiring layer.
Preferably, the material of the high heat conductive insulating layer further includes ferromagnetic packing material.
Preferably, the high heat conduction packing material is aluminium nitride/boron nitride material.
Preferably, the (PCC) power includes main control chip and power component, the power component and the main control chip
It is electrically connected respectively by metal wire installation position corresponding on the circuit-wiring layer.
Preferably, the intelligent power module further includes pin, and the pin is arranged on the circuit-wiring layer, and logical
Metal wire is crossed to be electrically connected with the power component and the main control chip.
Preferably, the power component is gallium nitride power element, Si bases power component or SiC base power components.
Preferably, the intelligent power module further includes driving circuit, and the driving circuit is arranged at the corresponding electricity
On the installation position of road wiring layer, the driving circuit is connected by metal wire with the power component and the main control chip respectively
It connects.
Preferably, the intelligent power module further includes encapsulating housing, the circuit substrate, circuit-wiring layer, high heat conduction
Insulating layer, (PCC) power and metal wire are packaged in the encapsulating housing.
The present invention also proposes a kind of manufacturing method of intelligent power module, comprises the following steps：
Prepare circuit substrate, high heat conductive insulating layer material, copper foil, power component, main control chip and multiple pins, electronics member
Part；The material of the high heat conductive insulating layer includes epoxy resin, aluminium oxide, high heat conduction packing material, ferromagnetic packing material；
Make high heat conductive insulating layer；
The high heat conductive insulating layer material is laid in circuit substrate, to form high heat conductive insulating layer；
Circuit-wiring layer is formed on high heat conductive insulating layer, and configuration supplies intelligent power module on the circuit-wiring layer
Electronic component installation installation position；
The power component, main control chip and electronic component of intelligent power module are installed on the circuit-wiring layer pair
On the installation position answered；
Multiple pins are welded in the corresponding position of the circuit-wiring layer, and multiple pins pass through the first circuit cloth
Line layer and the second circuit wiring layer are connected with corresponding electronic component, to form wiring board；
Encapsulating housing is formed by wiring board described in plastic-packaged, obtains intelligent power module.
The present invention also proposes a kind of air conditioner, and the air conditioner includes intelligent power module as described above, the intelligence
Power module includes circuit substrate；High heat conductive insulating layer, arranged on the surface of the circuit substrate, the material of the high heat conductive insulating layer
Material includes epoxy resin, aluminium oxide, high heat conduction packing material；Circuit-wiring layer, on the high heat conductive insulating layer, the electricity
Road wiring layer has the installation position that the electronic component for the intelligent power module is installed；(PCC) power, the (PCC) power are set
It is placed on the installation position of the corresponding circuit-wiring layer.
In the present embodiment, during intelligent power module works, main control chip exports corresponding control signal, with control
Corresponding power component conducting is made, so as to output driving electric energy, is worked with driving motor even load.Wherein, power component, master control
The heat generated when other electronic components work in chip and intelligent power module by by epoxy resin, aluminium oxide,
High heat conductive insulating layer made from the materials such as boron nitride or aluminium nitride is conducted to circuit substrate, then by circuit substrate by heat
Conduction is on encapsulating housing, so as to carry out rapid cooling, to improve the radiating rate of power component, due to doped with boron nitride or
The heat-conducting effect of the high heat conductive insulating layer of the materials such as person's aluminium nitride is preferable, is dissipated so as to solve in the intelligent power module course of work
Heat is not in time or heat dissipation effect is poor, and causes the operating temperature of main control chip excessively high and break down so that main control chip
The control signal of easy output error, controls the upper and lower bridge arm of inverter bridge to simultaneously turn on, and causes short circuit, so as to burn intelligent work(
The problem of rate module.
Description of the drawings
It in order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Structure according to these attached drawings obtains other attached drawings.
Fig. 1 is the structure diagram of one embodiment of intelligent power module of the present invention；
Fig. 2 is the partial enlarged view at A in Fig. 1；
Fig. 3 is the structure diagram of another embodiment of intelligent power module of the present invention；
Fig. 4 is the flow diagram of one embodiment of manufacturing method of intelligent power module of the present invention.
Drawing reference numeral explanation：
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only the part of the embodiment of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art obtained without creative efforts it is all its
His embodiment, belongs to the scope of protection of the invention.
If it is to be appreciated that related in the embodiment of the present invention directionality instruction (such as up, down, left, right, before and after ...),
Then directionality instruction be only used for explaining relative position relation under a certain particular pose (as shown in drawings) between each component,
Motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes correspondingly.
If in addition, relating to the description of " first ", " second " etc. in the embodiment of the present invention, " first ", " second " etc. are somebody's turn to do
Description be only used for description purpose, and it is not intended that instruction or implying its relative importance or implicit indicating indicated skill
The quantity of art feature." first " is defined as a result, and the feature of " second " can be expressed or implicitly includes at least one spy
Sign.In addition, the technical solution between each embodiment can be combined with each other, but must be with those of ordinary skill in the art's energy
Based on enough realizations, the knot of this technical solution is will be understood that when the combination appearance of technical solution is conflicting or can not realize
Conjunction is not present, also not the present invention claims protection domain within.
The present invention proposes a kind of intelligent power module.
The intelligent power module suitable for the frequency converter and various inverters of driving motor, with realize frequency control,
The functions such as metallurgical machinery, electric propulsion, servo-drive.It is particularly suitable for the motor work of the compressors such as driving air-conditioning, refrigerator.
During applied in convertible frequency air-conditioner, due to frequency conversion drive, in most cases its algorithm has been cured substantially, in order to save volume, carry
High anti-jamming capacity mitigates the automatically controlled version design efforts would in periphery, can be integrated into master controller on one wiring board, forms intelligent work(
Rate module.When intelligent power module works, power component fever is than more serious, in order to accelerate to radiate, mostly using aluminum metal
Substrate radiates, but since the high heat conduction of aluminum metal substrate base material acts on, the heat that power component generates can pass through base
Plate is conducted to main control chip (MCU) so that power component nearly reaches identical temperature with MCU.And the ideal working temperature of MCU
It is typically below 85 DEG C, and IGBT constant power element manipulation temperature is up to 100 DEG C or more, therefore, once intelligent power module dissipates
Heat is not in time or heat dissipation effect is poor, excessively high and break down by the operating temperature for causing MCU so that MCU easily exports mistake
Control signal, controls the upper and lower bridge arm of inverter bridge to simultaneously turn on by mistake, and causes short circuit, so as to burn intelligent power module.
The present invention proposes a kind of intelligent power module.
The intelligent power module suitable for the frequency converter and various inverters of driving motor, with realize frequency control,
The functions such as metallurgical machinery, electric propulsion, servo-drive.It is particularly suitable for the motor work of the compressors such as driving air-conditioning, refrigerator.
During applied in convertible frequency air-conditioner, due to frequency conversion drive, in most cases its algorithm has been cured substantially, in order to save volume, carry
High anti-jamming capacity mitigates the automatically controlled version design efforts would in periphery, can be integrated into master controller on one wiring board, forms intelligent work(
Rate module.When intelligent power module works, power component 42 generates heat than more serious, in order to accelerate to radiate, mostly using aluminium gold
Belong to substrate to radiate, but since the high heat conduction of aluminum metal substrate base material acts on, the heat that power component 42 generates can lead to
It crosses substrate to conduct to main control chip 41 (MCU) so that power component 42 and MCU nearly reaches identical temperature.And the ideal of MCU
Operating temperature is typically below 85 DEG C, and 42 operating temperature of IGBT constant powers element is up to 100 DEG C or more, therefore, once intelligence
Power module heat dissipation is not in time or heat dissipation effect is poor, excessively high and break down by the operating temperature for causing MCU so that MCU
The control signal of easy output error, controls the upper and lower bridge arm of inverter bridge to simultaneously turn on, and causes short circuit, so as to burn intelligent work(
Rate module.
To solve the above-mentioned problems, referring to figs. 1 to Fig. 3, in an embodiment of the present invention, which includes：
Circuit substrate 10；
High heat conductive insulating layer 20, arranged on the surface of the circuit substrate 10, the material of the high heat conductive insulating layer 20 includes
Epoxy resin 21, aluminium oxide 22, high heat conduction packing material 23；
Circuit-wiring layer 30, on the low high heat conductive insulating layer 20, the circuit-wiring layer 30, which has, supplies the intelligence
The installation position of the electronic component installation of energy power module；
(PCC) power 40, the (PCC) power 40 are arranged on the installation position of the corresponding circuit-wiring layer 30.
In the present embodiment, (PCC) power 40 includes main control chip 41 and power component 42, wherein, power component 42 can be
Gallium nitride (GaN) power component 42, Si bases power component 42 or SiC bases power component 42, the present embodiment preferably use gallium nitride
(GaN) power component 42.Multiple power components 42, generally six, form power inverting bridge circuit, for driving motor, pressure
Contracting machine even load works, and main control chip 41 is arranged on the installation position of circuit-wiring layer 30, passes through the conductive materials such as scolding tin and electricity
Road wiring layer 30 realizes electrical connection, and forms current loop.Power component 42 is arranged on high heat conductive insulating layer 20, and passes through height
Thermally conductive insulating layer 20 is conducted heat in circuit substrate 10, is radiated by circuit substrate 10.Circuit substrate 10 can adopt
It is realized with the substrate made by the materials such as lead frame, cardboard, half glass-fiber-plate, glass-fiber-plate, the present embodiment preferably uses glass-fiber-plate
To realize.The shape of circuit substrate 10 can be according to other in circuit-wiring layer 30, main control chip 41 and intelligent power module
The specific location and size of electronic component determine, can be square, but be not limited to square.
Circuit-wiring layer 30 according to the circuit design of intelligent power module, formed in circuit substrate 10 corresponding circuit with
And the installation position installed for each electronic component, i.e. pad are corresponded to, specifically, high heat conductive insulating layer 20 is set in circuit substrate 10
Afterwards, copper foil is laid on high heat conductive insulating layer 20, and the copper foil is etched according to default circuit design, so as to form circuit
Wiring layer 30.
When intelligent power module works, main control chip 41 exports corresponding control signal, to control corresponding power member
Part 42 turns on, and so as to output driving electric energy, is worked with driving motor even load.
High heat conductive insulating layer 20 is made of materials such as epoxy resin 21, aluminium oxide 22, high heat conduction packing materials 23, wherein,
High heat conduction packing material 23 can be boron nitride, nitridation aluminium material, and the insulating properties of aluminium nitride and boron nitride is preferable, and thermal conductivity compared with
Height, heat resistance and heat conductivity are preferable so that aluminium nitride and boron nitride have higher heat-transfer capability.Making high heat conductive insulating layer
When 20, can the materials such as epoxy resin 21, aluminium oxide 22, boron nitride or aluminium nitride be subjected to batch mixing, then will mixed
20 material of high heat conductive insulating layer is heated；After cooling, 20 material of high heat conductive insulating layer is crushed, then work is molded with ingot grain
20 material of high heat conductive insulating layer is carried out roll forming by skill, to form the high heat conductive insulating layer 20.
In the present embodiment, during intelligent power module works, main control chip 41 exports corresponding control signal, with
Corresponding power component 42 is controlled to turn on, so as to output driving electric energy, is worked with driving motor even load.Wherein, power component
42nd, the heat generated when other electronic components work in main control chip 41 and intelligent power module passes through by asphalt mixtures modified by epoxy resin
High heat conductive insulating layer 20 made from the materials such as fat 21, aluminium oxide 22, boron nitride or aluminium nitride is conducted to circuit substrate 10, then
It is conducted heat to by circuit substrate 10 on encapsulating housing 70, so as to carry out rapid cooling, to improve dissipating for power component 42
Thermal velocity, since the heat-conducting effect of the high heat conductive insulating layer 20 doped with materials such as boron nitride or aluminium nitride is preferable, so as to solve
It radiates in intelligent power module of the having determined course of work not in time or heat dissipation effect is poor, and cause the work of main control chip 41
Temperature is excessively high and breaks down so that the control signal of 41 easy output error of main control chip controls the upper and lower bridge arm of inverter bridge
It simultaneously turns on, and causes short circuit, the problem of so as to burn intelligent power module.
Referring to figs. 1 to Fig. 3 in a preferred embodiment, the material of the high heat conductive insulating layer 20 further includes ferromagnetic filling material
Material 24.
It should be noted that in the semiconductor device for communication equipment, the requirement to electromagnetic shielding is very high, thus must
It must inhibit the Electromagnetic Interferences such as EMI (Electro Magnetic Interference, electromagnetic interference).And existing inhibition electricity
The method of magnetic disturbance be usually used plating, sputtering method, conductive paste rubbing method the methods of along sealing resin layer upper table
Conductive shielding material is covered in packaging body surface by face and side, so as to form conductive shield.
And the step of above method is used to form conductive shield, is various, and complexity, such as plating just have pretreatment
Step, plating processing step, the post-processing step etc. as washing, the rubbing method of conductive paste also have to sealing resin layer side
Application step etc., thus the manufacture cost of semiconductor device is higher, and work efficiency is low.
To solve the above-mentioned problems, the conductive shielding materials such as ferromagnetic packing material 24 are entrained in height by the present embodiment
In thermally conductive insulating layer 20, when making high heat conductive insulating layer 20, the conductive shielding materials such as graphite, copper powder are mixed into epoxy resin
21st, in the materials such as aluminium oxide 22, boron nitride or aluminium nitride, then the high material for making insulating layer mixed is added
Heat；After cooling, the insulating layer material is crushed, then is rolled into 20 material of high heat conductive insulating layer with ingot grain moulding process
Shape, to form high heat conductive insulating layer 20.By in this present embodiment, by when making high heat conductive insulating layer 20, will have graphite,
The conductive shielding material such as copper powder can inhibit EMI etc. with making to be made after the material of high heat conductive insulating layer 20 is mixed
The high heat conductive insulating layer 20 of Electromagnetic Interference, without forming conductive shield using the above method, without increasing other works
Skill advantageously reduces the technological process for making semiconductor device, so as to reduce the manufacture cost of semiconductor device, improves and makes half
The work efficiency of conductor device is low.
Referring to figs. 1 to Fig. 3, in a preferred embodiment, the power component 42 and the main control chip 41 pass through respectively
The installation position electrical connection corresponding on the circuit-wiring layer 30 of metal wire 50.
In the present embodiment, metal wire 50 can be aluminum steel or gold thread, and main control chip 41 passes through metal with power component 42
Line 50 and circuit-wiring layer 30 realize electrical connection so that the control signal that main control chip 41 exports can be transmitted to each power member
Part 42, so as to control corresponding 42 conduction and cut-off of power component.It is understood that in the present embodiment, each power component 42 with
Main control chip 41 so as to reduce the required precision of metal wire 50, and reduces the manufacture of intelligent power module in being horizontally disposed with
Technology difficulty, improves the production qualification rate of intelligent power module, while also reduces the production cost of intelligent power module.
Referring to figs. 1 to Fig. 3, in a preferred embodiment, the intelligent power module further includes pin 60, the pin 60
It is arranged on the circuit-wiring layer 30, and passes through 41 electricity of the metal wire 50 and the power component 42 and the main control chip
Connection.
In the present embodiment, gull aerofoil profile or direct plugging-in may be employed in the pin 60, and pin 60 is welded on circuit substrate 10
On, the pad locations on 30 corresponding installation position of circuit-wiring layer, and pass through metal wire 50 and power component 41, main control chip 42
Realize electrical connection.
Referring to figs. 1 to Fig. 3, in a preferred embodiment, the intelligent power module further includes driving circuit, and (figure is not marked
Show), the driving circuit is arranged on the installation position of the corresponding circuit-wiring layer 30, and the driving circuit passes through metal wire
50 are connected respectively with the power component 42 and the main control chip 41.
It should be noted that driving circuit can be driving chip or discrete by plate resistor, sheet capacitor etc.
The driving circuit of element composition, the present embodiment is preferably driving chip, in order to improve the driving force to power device, driving electricity
It after the control signal that main control chip 41 exports is amplified by road, exports to corresponding power device, to drive corresponding power member
Part 42 works.
Referring to figs. 1 to Fig. 3, in a preferred embodiment, the intelligent power module further includes encapsulating housing 70, the electricity
Base board 10, circuit-wiring layer 30, low thermal resistance insulating trip, power component 42, main control chip 41 and metal wire 50 are packaged in described
In encapsulating housing 70.
In the present embodiment, encapsulating housing 70 can be the resin scaffold of 21 mold compound of epoxy resin, encapsulating housing 70
It can be formed by any one of thermosets, thermoplastic material.
In above-described embodiment, the encapsulating housing 70 is preferably used and is made of the thermosetting material for being filled with silica.
The present invention also proposes a kind of manufacturing method of intelligent power module.
With reference to Fig. 4, in the present invention one is real-time, the manufacturing method of the intelligent power module comprises the following steps：
S1, circuit substrate, high heat conductive insulating layer material, copper foil, power component, main control chip and multiple pins, electricity are prepared
Subcomponent；The material of the high heat conductive insulating layer includes epoxy resin, aluminium oxide, high heat conduction packing material and ferromagnetic filling material
Material；
In the present embodiment, intelligent power module mainly by circuit substrate, high heat conductive insulating layer material, copper foil, power component,
Main control chip and multiple pins, electronic component composition；Wherein, the material of the high heat conductive insulating layer specifically include epoxy resin,
Aluminium oxide, high heat conduction packing material and ferromagnetic packing material.
S2, high heat conductive insulating layer is made；
Wherein, high heat conductive insulating layer is made to specifically include：
Epoxy resin, aluminium oxide, high heat conduction packing material are mixed, form the first batch mixing；
First batch mixing is successively heated and cooling treatment；
First batch mixing after cooling is crushed；
First batch mixing is carried out by roll forming with ingot grain moulding process, to form the high heat conductive insulating layer.
S3, the high heat conductive insulating layer material is laid in circuit substrate, to form high heat conductive insulating layer；
By setting high heat conductive insulating layer so that during intelligent function power module works, power component, master control
The heat generated when other electronic components work in chip and intelligent power module passes through by epoxy resin, aluminium oxide, nitrogen
High heat conductive insulating layer made from changing the materials such as boron or aluminium nitride is conducted to circuit substrate, so as to accelerate intelligent power module
Heat dissipation.
S4, circuit-wiring layer is formed on high heat conductive insulating layer, and configuration supplies intelligent power on the circuit-wiring layer
The installation position of the electronic component installation of module；
Circuit-wiring layer forms corresponding electric current on high heat conductive insulating layer and walks according to the circuit design of intelligent power module
Line and the installation position of corresponding power component installation, i.e. pad.
Specifically, copper foil is laid in the upper surface of the high heat conductive insulating layer, and institute is etched according to default circuit design
Copper foil is stated, to form circuit-wiring layer.
S5, the power component, main control chip and electronic component of intelligent power module are installed on the circuit-wiring layer
On corresponding installation position；
Power component can be gallium nitride (GaN) power component, step Si bases power component or step SiC bases power member
Part, in the present embodiment, using gallium nitride (GaN) power component, structure is planar structure, thus source, leakage, grid three-level be located at it is same
Power component and main control chip weldering by chip mounter can be arranged on the installation position of circuit-wiring layer, and pass through electricity by one plane
Corresponding cabling and realization electrical connection on the wiring layer of road, main control chip is with power component or using reverse installation process weldering arranged on electricity
On the corresponding installation position of road wiring layer.
S6, multiple pins are welded in the corresponding position of the circuit-wiring layer, and multiple pins pass through the circuit cloth
Line layer and metal wire are connected with corresponding electronic component, to form wiring board；
Metal wire can be aluminum steel or gold thread, and main control chip is realized with power component by metal wire and circuit-wiring layer
Electrical connection so that the control signal of main control chip output can be transmitted to each power component, so as to control corresponding power member
Part conduction and cut-off.
S7, encapsulating housing is formed by wiring board described in plastic-packaged, obtains intelligent power module.
In the present embodiment, encapsulating housing can be the resin scaffold of epoxy resin mould produced compounds, and encapsulating housing can be by
The low heat-conducting substrate, each circuit-wiring layer, low-heat are blocked in the formation of any one of thermosets, thermoplastic material
Embolium, power component and main control chip are by being packaged in encapsulating housing so that intelligent power module, which is integrally formed, to be set.So
Afterwards, in encapsulating housing peripheral hardware to pin, power component, main control chip are electrically connected with the pin and is by the first circuit-wiring layer, and drawn
Foot extends outwardly from the side wall of encapsulating housing.
In the present embodiment, during intelligent power module works, main control chip exports corresponding control signal, with control
Corresponding power component conducting is made, so as to output driving electric energy, is worked with driving motor even load.Wherein, power component, master control
The heat generated when other electronic components work in chip and intelligent power module by by epoxy resin, aluminium oxide,
High heat conductive insulating layer made from the materials such as boron nitride or aluminium nitride is conducted to circuit substrate, then by circuit substrate by heat
Conduction is on encapsulating housing, so as to carry out rapid cooling, to improve the radiating rate of power component, due to doped with boron nitride or
The heat-conducting effect of the high heat conductive insulating layer of the materials such as person's aluminium nitride is preferable, is dissipated so as to solve in the intelligent power module course of work
Heat is not in time or heat dissipation effect is poor, and causes the operating temperature of main control chip excessively high and break down so that main control chip
The control signal of easy output error, controls the upper and lower bridge arm of inverter bridge to simultaneously turn on, and causes short circuit, so as to burn intelligent work(
The problem of rate module.
The present invention also proposes a kind of air conditioner, and the air conditioner includes intelligent power module as described above.The intelligence work(
The detailed construction of rate module can refer to above-described embodiment, and details are not described herein again；It is understood that due in air conditioner of the present invention
In used above-mentioned intelligent power module, therefore, the embodiment of air conditioner of the present invention includes above-mentioned power module whole embodiments
Whole technical solutions, and the technique effect reached is also identical, and details are not described herein.
The foregoing is merely the preferred embodiment of the present invention, are not intended to limit the scope of the invention, every at this
The equivalent structure transformation made under the inventive concept of invention using description of the invention and accompanying drawing content or directly/utilization indirectly
It is included in other related technical areas in the scope of patent protection of the present invention.
Claims (10)
1. a kind of intelligent power module, which is characterized in that the intelligent power module includes：
Circuit substrate；
High heat conductive insulating layer, arranged on the surface of the circuit substrate, the material of the high heat conductive insulating layer includes epoxy resin, oxygen
Change aluminium, high heat conduction packing material；
Circuit-wiring layer, on the high heat conductive insulating layer, the circuit-wiring layer has for the intelligent power module
The installation position of electronic component installation；
(PCC) power, the (PCC) power are arranged on the installation position of the corresponding circuit-wiring layer.
2. intelligent power module as described in claim 1, which is characterized in that the material of the high heat conductive insulating layer further includes iron
Magnetic packing material.
3. intelligent power module as described in claim 1, which is characterized in that the high heat conduction packing material is aluminium nitride/nitrogen
Change boron material.
4. intelligent power module as described in claim 1, which is characterized in that the (PCC) power includes main control chip and power
Element, the power component and the main control chip pass through metal wire installation position electricity corresponding on the circuit-wiring layer respectively
Connection.
5. intelligent power module as claimed in claim 4, which is characterized in that the intelligent power module further includes pin, institute
It states pin to be arranged on the circuit-wiring layer, and is electrically connected by metal wire with the power component and the main control chip.
6. intelligent power module as described in claim 1, which is characterized in that the power component for gallium nitride power element,
Si bases power component or SiC base power components.
7. intelligent power module as described in claim 1, which is characterized in that the intelligent power module further includes driving electricity
Road, the driving circuit are arranged on the installation position of the corresponding circuit-wiring layer, and the driving circuit passes through metal wire point
It is not connected with the power component and the main control chip.
8. the intelligent power module as described in claim 1 to 7 any one, which is characterized in that the intelligent power module is also
Including encapsulating housing, the circuit substrate, circuit-wiring layer, high heat conductive insulating layer, (PCC) power and metal wire are packaged in described
In encapsulating housing.
9. a kind of manufacturing method of intelligent power module, which is characterized in that comprise the following steps：
Prepare circuit substrate, high heat conductive insulating layer material, copper foil, power component, main control chip and multiple pins, electronic component；
The material of the high heat conductive insulating layer includes epoxy resin, aluminium oxide, high heat conduction packing material, ferromagnetic packing material；
Make high heat conductive insulating layer；
The high heat conductive insulating layer material is laid in circuit substrate, to form high heat conductive insulating layer；
Circuit-wiring layer is formed on high heat conductive insulating layer, and configuration supplies the electricity of intelligent power module on the circuit-wiring layer
The installation position of subcomponent installation；
It is corresponding that the power component, main control chip and electronic component of intelligent power module are installed on the circuit-wiring layer
On installation position；
Multiple pins are welded in the corresponding position of the circuit-wiring layer, and multiple pins pass through first circuit-wiring layer
It is connected with the second circuit wiring layer with corresponding electronic component, to form wiring board；
Encapsulating housing is formed by wiring board described in plastic-packaged, obtains intelligent power module.
10. a kind of air conditioner, which is characterized in that the air conditioner includes the intelligent work(as described in claim 1 to 8 any one
Rate module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201711315425.1A CN108091619A (en) | 2017-12-08 | 2017-12-08 | Intelligent power module and its manufacturing method, air conditioner |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711315425.1A CN108091619A (en) | 2017-12-08 | 2017-12-08 | Intelligent power module and its manufacturing method, air conditioner |
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| CN108091619A true CN108091619A (en) | 2018-05-29 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711315425.1A Pending CN108091619A (en) | 2017-12-08 | 2017-12-08 | Intelligent power module and its manufacturing method, air conditioner |
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| CN108831838A (en) * | 2018-06-26 | 2018-11-16 | 张军 | A kind of IPM encapsulating structure and preparation method thereof |
| CN108847409A (en) * | 2018-06-25 | 2018-11-20 | 张军 | A kind of intelligent power module and preparation method thereof |
| CN108878383A (en) * | 2018-06-26 | 2018-11-23 | 张军 | A kind of High Performance IP M package module and preparation method thereof |
| CN109194243A (en) * | 2018-10-31 | 2019-01-11 | 广东美的制冷设备有限公司 | Electric appliance and intelligent power module |
| CN110112111A (en) * | 2019-05-23 | 2019-08-09 | 广东美的制冷设备有限公司 | Intelligent power module, electric-controlled plate and air conditioner |
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| CN110601550A (en) * | 2018-06-13 | 2019-12-20 | 重庆美的制冷设备有限公司 | High-integration intelligent power module and air conditioner |
| CN110594986A (en) * | 2018-06-13 | 2019-12-20 | 广东美的制冷设备有限公司 | Air conditioner and integrated air conditioner controller |
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| CN110594986B (en) * | 2018-06-13 | 2023-09-12 | 广东美的制冷设备有限公司 | Air conditioner and integrated air conditioner controller |
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| CN110594986A (en) * | 2018-06-13 | 2019-12-20 | 广东美的制冷设备有限公司 | Air conditioner and integrated air conditioner controller |
| CN110601549A (en) * | 2018-06-13 | 2019-12-20 | 重庆美的制冷设备有限公司 | High-integration intelligent power module and electrical equipment |
| CN110601551A (en) * | 2018-06-13 | 2019-12-20 | 重庆美的制冷设备有限公司 | High-integration intelligent power module and air conditioner |
| CN108847409A (en) * | 2018-06-25 | 2018-11-20 | 张军 | A kind of intelligent power module and preparation method thereof |
| CN108878383A (en) * | 2018-06-26 | 2018-11-23 | 张军 | A kind of High Performance IP M package module and preparation method thereof |
| CN108831838B (en) * | 2018-06-26 | 2020-04-24 | 乐清海创智能科技有限公司 | IPM packaging structure and preparation method thereof |
| CN108878383B (en) * | 2018-06-26 | 2020-04-17 | 乐清海创智能科技有限公司 | High-performance IPM packaging module and preparation method thereof |
| CN108831838A (en) * | 2018-06-26 | 2018-11-16 | 张军 | A kind of IPM encapsulating structure and preparation method thereof |
| CN110753486A (en) * | 2018-07-24 | 2020-02-04 | 广东美的制冷设备有限公司 | High-integration intelligent power module and air conditioner |
| CN110753486B (en) * | 2018-07-24 | 2024-02-20 | 广东美的制冷设备有限公司 | High-integration intelligent power module and air conditioner |
| CN109194243A (en) * | 2018-10-31 | 2019-01-11 | 广东美的制冷设备有限公司 | Electric appliance and intelligent power module |
| CN110112111A (en) * | 2019-05-23 | 2019-08-09 | 广东美的制冷设备有限公司 | Intelligent power module, electric-controlled plate and air conditioner |
| CN110148594A (en) * | 2019-05-30 | 2019-08-20 | 广东美的制冷设备有限公司 | Intelligent power module and air conditioner |
| CN110138249A (en) * | 2019-05-30 | 2019-08-16 | 广东美的制冷设备有限公司 | Intelligent power module and air conditioner |
| CN110138249B (en) * | 2019-05-30 | 2021-05-28 | 广东美的制冷设备有限公司 | Intelligent power module and air conditioner |
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