CN108091597B - 一种硅片双面清洗机 - Google Patents
一种硅片双面清洗机 Download PDFInfo
- Publication number
- CN108091597B CN108091597B CN201810021342.XA CN201810021342A CN108091597B CN 108091597 B CN108091597 B CN 108091597B CN 201810021342 A CN201810021342 A CN 201810021342A CN 108091597 B CN108091597 B CN 108091597B
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- Prior art keywords
- support
- box
- cylinder
- servo motor
- clamping jaw
- Prior art date
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- 238000004140 cleaning Methods 0.000 title claims abstract description 66
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 60
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 60
- 239000010703 silicon Substances 0.000 title claims abstract description 60
- 235000012431 wafers Nutrition 0.000 title description 28
- 230000007246 mechanism Effects 0.000 claims abstract description 49
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000007921 spray Substances 0.000 claims abstract description 13
- 239000007788 liquid Substances 0.000 claims description 34
- 239000002699 waste material Substances 0.000 claims description 25
- 238000007664 blowing Methods 0.000 claims description 10
- 238000009826 distribution Methods 0.000 claims description 9
- 238000003466 welding Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000007599 discharging Methods 0.000 abstract description 13
- 239000000428 dust Substances 0.000 abstract description 5
- 238000005406 washing Methods 0.000 description 5
- 238000005201 scrubbing Methods 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810021342.XA CN108091597B (zh) | 2018-01-10 | 2018-01-10 | 一种硅片双面清洗机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810021342.XA CN108091597B (zh) | 2018-01-10 | 2018-01-10 | 一种硅片双面清洗机 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108091597A CN108091597A (zh) | 2018-05-29 |
CN108091597B true CN108091597B (zh) | 2023-11-24 |
Family
ID=62181875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810021342.XA Active CN108091597B (zh) | 2018-01-10 | 2018-01-10 | 一种硅片双面清洗机 |
Country Status (1)
Country | Link |
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CN (1) | CN108091597B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110190015A (zh) * | 2019-06-27 | 2019-08-30 | 西安奕斯伟硅片技术有限公司 | 一种晶圆清洗装置及晶圆清洗方法 |
CN112547615B (zh) * | 2020-10-26 | 2022-03-29 | 南京江川电子有限公司 | 一种pcb双面电路板的清洁设备及其清洁方法 |
CN112718691B (zh) * | 2020-12-07 | 2022-04-15 | 富乐德科技发展(大连)有限公司 | 一种半导体设备腔体内硅部件的自动清洗装置 |
CN112871928B (zh) * | 2021-01-09 | 2022-04-15 | 井冈山大学 | 一种生物制药用实验瓶清洗装置及其清洗方法 |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07130693A (ja) * | 1993-11-05 | 1995-05-19 | Tokyo Electron Ltd | 枚葉式両面洗浄装置 |
JPH11354475A (ja) * | 1998-06-03 | 1999-12-24 | Toshiba Mach Co Ltd | ウェーハ研磨装置 |
JP2001219391A (ja) * | 1999-12-01 | 2001-08-14 | Ses Co Ltd | 基板反転装置および基板洗浄システム |
CN203062625U (zh) * | 2012-12-14 | 2013-07-17 | 重庆诚硕科技有限公司 | 一种气缸推动的夹紧装置 |
CN204216011U (zh) * | 2014-10-23 | 2015-03-18 | 北京七星华创电子股份有限公司 | 硅片清洗装置 |
CN104813438A (zh) * | 2012-11-28 | 2015-07-29 | 盛美半导体设备(上海)有限公司 | 半导体硅片的清洗方法和装置 |
CN105538690A (zh) * | 2016-01-15 | 2016-05-04 | 苏州富强科技有限公司 | 压紧载具 |
CN105609448A (zh) * | 2016-01-15 | 2016-05-25 | 上海华虹宏力半导体制造有限公司 | 刷片清洗机 |
CN106111607A (zh) * | 2016-08-30 | 2016-11-16 | 苏州市相城区姑苏线路板厂 | 一种旋转式pcb板自动清洗装置 |
CN206009322U (zh) * | 2016-08-30 | 2017-03-15 | 苏州市相城区姑苏线路板厂 | 一种旋转式pcb板自动清洗装置 |
CN106783683A (zh) * | 2016-12-19 | 2017-05-31 | 安徽天裕汽车零部件制造有限公司 | 一种晶圆扫描清洗摆臂装置 |
CN106971966A (zh) * | 2017-04-06 | 2017-07-21 | 安徽熙泰智能科技有限公司 | 一种半导体芯片清洗装置 |
CN107529286A (zh) * | 2017-09-12 | 2017-12-29 | 苏州市吴通电子有限公司 | 一种立式pcb板接触清洗装置 |
CN208225847U (zh) * | 2018-01-10 | 2018-12-11 | 苏州聚晶科技有限公司 | 一种硅片双面清洗机 |
-
2018
- 2018-01-10 CN CN201810021342.XA patent/CN108091597B/zh active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07130693A (ja) * | 1993-11-05 | 1995-05-19 | Tokyo Electron Ltd | 枚葉式両面洗浄装置 |
JPH11354475A (ja) * | 1998-06-03 | 1999-12-24 | Toshiba Mach Co Ltd | ウェーハ研磨装置 |
JP2001219391A (ja) * | 1999-12-01 | 2001-08-14 | Ses Co Ltd | 基板反転装置および基板洗浄システム |
CN104813438A (zh) * | 2012-11-28 | 2015-07-29 | 盛美半导体设备(上海)有限公司 | 半导体硅片的清洗方法和装置 |
CN203062625U (zh) * | 2012-12-14 | 2013-07-17 | 重庆诚硕科技有限公司 | 一种气缸推动的夹紧装置 |
CN204216011U (zh) * | 2014-10-23 | 2015-03-18 | 北京七星华创电子股份有限公司 | 硅片清洗装置 |
CN105538690A (zh) * | 2016-01-15 | 2016-05-04 | 苏州富强科技有限公司 | 压紧载具 |
CN105609448A (zh) * | 2016-01-15 | 2016-05-25 | 上海华虹宏力半导体制造有限公司 | 刷片清洗机 |
CN106111607A (zh) * | 2016-08-30 | 2016-11-16 | 苏州市相城区姑苏线路板厂 | 一种旋转式pcb板自动清洗装置 |
CN206009322U (zh) * | 2016-08-30 | 2017-03-15 | 苏州市相城区姑苏线路板厂 | 一种旋转式pcb板自动清洗装置 |
CN106783683A (zh) * | 2016-12-19 | 2017-05-31 | 安徽天裕汽车零部件制造有限公司 | 一种晶圆扫描清洗摆臂装置 |
CN106971966A (zh) * | 2017-04-06 | 2017-07-21 | 安徽熙泰智能科技有限公司 | 一种半导体芯片清洗装置 |
CN107529286A (zh) * | 2017-09-12 | 2017-12-29 | 苏州市吴通电子有限公司 | 一种立式pcb板接触清洗装置 |
CN208225847U (zh) * | 2018-01-10 | 2018-12-11 | 苏州聚晶科技有限公司 | 一种硅片双面清洗机 |
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CN108091597A (zh) | 2018-05-29 |
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Effective date of registration: 20231023 Address after: 247100 Building D1, Environmental Protection Industrial Park, High tech Zone, Chizhou City, Anhui Province Applicant after: CHIZHOU HAILIN CLOTHING CO.,LTD. Applicant after: SUZHOU JUKING TECHNOLOGY Co.,Ltd. Address before: 215000 Shunle Road, Jujin Industrial Park, Taiping Street, Xiangcheng District, Suzhou City, Jiangsu Province Applicant before: SUZHOU JUKING TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20240201 Address after: 247100 Building D1, Environmental Protection Industrial Park, High tech Zone, Chizhou City, Anhui Province Patentee after: CHIZHOU HAILIN CLOTHING CO.,LTD. Country or region after: China Address before: 247100 Building D1, Environmental Protection Industrial Park, High tech Zone, Chizhou City, Anhui Province Patentee before: CHIZHOU HAILIN CLOTHING CO.,LTD. Country or region before: China Patentee before: SUZHOU JUKING TECHNOLOGY Co.,Ltd. |
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